CN203407011U - Microphone circuit board - Google Patents
Microphone circuit board Download PDFInfo
- Publication number
- CN203407011U CN203407011U CN201320515793.1U CN201320515793U CN203407011U CN 203407011 U CN203407011 U CN 203407011U CN 201320515793 U CN201320515793 U CN 201320515793U CN 203407011 U CN203407011 U CN 203407011U
- Authority
- CN
- China
- Prior art keywords
- pad
- hole
- substrate
- microphone circuit
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000001465 metallisation Methods 0.000 abstract 7
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Abstract
The utility model belongs to the electronic equipment circuit board technology field, in particular relates to a microphone circuit board. The microphone circuit board comprises a substrate, conductive layers arranged on the two surfaces of the substrate respectively, a metallization hole penetrating the substrate and used for connecting the conductive layers on the two surfaces, a pad arranged at one side of the metallization hole, and an electric connection member used for connecting the metallization hole and the pad. Because the metallization hole and the pad are arranged separately, the electric connection member is connected between the metallization hole and the pad, so that the metallization hole is not influenced when a product is carried out the reflow soldering or is impacted by a high temperature after being manufactured, the problem that the pad of the conventional microphone circuit board is arranged on the metallization hole directly is solved, and the problem that the routing is not firm is avoided.
Description
Technical field
The utility model belongs to electronic equipment wiring board technical field, relates in particular to a kind of microphone circuit plate.
Background technology
Wiring board is one of vitals of electronics industry, and every kind of electronic equipment almost littlely arrives greatly computer to electronic watch, calculator, and communication electronic device, as long as there is the capital of the electronic devices and components such as integrated circuit to use wiring board.
As shown in Figure 1, generally microphone circuit plate comprises: substrate 1, be separately positioned on the conductive layer on substrate 1 two sides, connect substrate 1 and for connecting the plated-through hole 2 of conductive layer on its two sides, in this plated-through hole 2, be filled with medium, at substrate 1, corresponding to the position of plated-through hole 2, be provided with pad 3; While producing microphone, need to be between pad 3 and microphone chip routing, because pad 3 is positioned at plated-through hole 2 places, when product is carried out rear Reflow Soldering excessively or is subject to high temperature impact, the media expansion that can cause plated-through hole 2 interior fillings, causes routing firmness very poor, or other reasons, such as the Copper Foil in metal aperture 2 itself is just softer, cause routing firmness very poor.
Utility model content
The purpose of this utility model is to provide a kind of microphone circuit plate, and the plated-through hole that is intended to solve existing microphone circuit plate is arranged on the problem on pad, avoids occurring the unstable problem of routing.
The utility model is to realize like this, a kind of microphone circuit plate, described microphone circuit plate comprises: substrate, be separately positioned on the conductive layer on described substrate two outer surfaces, connect described substrate and for connecting the plated-through hole of its above conductive layer of two outer surfaces, and being arranged on the pad on described outer surface of substrate, described pad divides and is arranged and is realized and being electrically connected to by electrical connector with described plated-through hole interval.
As a kind of improvement, described electrical connector and described pad are integral type structure.
As further improvement, described electrical connector is Copper Foil.
Owing to adopting technique scheme, while utilizing microphone circuit plate that the utility model provides to produce microphone, due to plated-through hole setting separated with pad, between plated-through hole and pad, be connected with electrical connector, when product is carried out rear Reflow Soldering excessively or is subject to high temperature impact like this, just can not exert an influence to plated-through hole, the pad that has solved existing microphone circuit plate is set directly at the problem on plated-through hole, avoids occurring the unstable problem of routing.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing microphone circuit plate;
Fig. 2 is the structural representation of the microphone circuit plate that provides of the utility model;
Fig. 3 is along the cutaway view of A-A line in Fig. 2;
Wherein, 1, substrate, 2, plated-through hole, 3, pad, 4, electrical connector.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Fig. 1 shows the structural representation of existing microphone circuit plate, Fig. 2 shows the structural representation of the microphone circuit plate that the utility model provides, Fig. 3 shows in Fig. 2 along the cutaway view of A-A line for convenience of explanation, has only provided the part relevant to the utility model in figure.
As shown in Figure 2, this microphone circuit plate comprises: substrate 1, be separately positioned on the conductive layer on substrate 1 two sides, connect substrate 1 for connecting the plated-through hole 2 of conductive layer on its two sides, in this plated-through hole 2, be provided with filled media, be arranged on the pad 3 of plated-through hole 2 one sides, and the electrical connector 4 of connection metal hole 2 and pad 3, in the present embodiment, electrical connector 4 is made by Copper Foil, and electrical connector 4 can be also the conductive layer Copper Foil of etching remainder when printed substrate certainly.
In the present embodiment, plated-through hole 2 and the separated setting of pad 3, between plated-through hole 2 and pad 3, be connected with electrical connector 4, when product is carried out rear Reflow Soldering excessively or is subject to high temperature impact like this, just can not exert an influence to plated-through hole 2, the pad that has solved existing microphone circuit plate is set directly at the problem on plated-through hole 2, avoids occurring the unstable problem of routing.
In the utility model, pad 3 is integral type structure with electrical connector 4, when printed substrate, makes during etching.
The microphone circuit plate that the utility model provides comprises: substrate, be separately positioned on the conductive layer on substrate two sides, connect substrate for connecting the plated-through hole of conductive layer on its two sides, be arranged on the pad of plated-through hole one side, and the electrical connector of connection metal hole and pad; Due to plated-through hole setting separated with pad, between plated-through hole and pad, be connected with electrical connector, when product is carried out rear Reflow Soldering excessively or is subject to high temperature impact like this, just can not exert an influence to plated-through hole, the pad that has solved existing microphone circuit plate is set directly at the problem on plated-through hole, avoids occurring the unstable problem of routing.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (3)
1. microphone circuit plate, comprise: substrate, be separately positioned on the conductive layer on described substrate two outer surfaces, connect described substrate and for connecting the plated-through hole of its above conductive layer of two outer surfaces, and be arranged on the pad on described outer surface of substrate, it is characterized in that, described pad divides and is arranged and is realized and being electrically connected to by electrical connector with described plated-through hole interval.
2. microphone circuit plate according to claim 1, is characterized in that, described electrical connector and described pad are integral type structure.
3. microphone circuit plate according to claim 1 and 2, is characterized in that, described electrical connector is Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320515793.1U CN203407011U (en) | 2013-08-22 | 2013-08-22 | Microphone circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320515793.1U CN203407011U (en) | 2013-08-22 | 2013-08-22 | Microphone circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203407011U true CN203407011U (en) | 2014-01-22 |
Family
ID=49942929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320515793.1U Expired - Lifetime CN203407011U (en) | 2013-08-22 | 2013-08-22 | Microphone circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203407011U (en) |
-
2013
- 2013-08-22 CN CN201320515793.1U patent/CN203407011U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200611 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140122 |