CN203788553U

CN203788553U - Printed circuit board

Info

Publication number: CN203788553U
Application number: CN201420045849.6U
Authority: CN
Inventors: 廖志勇
Original assignee: Fukui Precision Component Shenzhen Co Ltd; Zhending Technology Co Ltd
Current assignee: Peng Ding Polytron Technologies Inc; Avary Holding Shenzhen Co Ltd
Priority date: 2014-01-24
Filing date: 2014-01-24
Publication date: 2014-08-20
Anticipated expiration: 2024-01-24

Abstract

A printed circuit board comprises an insulating basal layer and a conductive line layer formed on the surface of the basal layer, and the conductive line layer comprises a pad, a plurality of first conductive lines and a second conductive line. The length and width of the pad are far greater than the widths of the first and second conductive lines, the plurality of first conductive lines and the pad are in smooth connection and phase-electricity conduction, and the second conductive line and the plurality of first conductive lines are in smooth connection and phase-electricity conduction. The pad of the printed circuit board provided by the utility model can relieve the rapid variation of the physical strength effectively, and is not easy to generate the stress concentration, thereby reducing the line breaking risks.

Description

Printed circuit board (PCB)

Technical field

The utility model relates to a kind of printed circuit board (PCB).

Background technology

In circuit board, generally by pad, realize the electrical connection of the conducting wire in element and circuit board.Generally, board pads is wider than conducting wire, and the copper face of the junction of pad and conducting wire is attenuated by wide suddenly, when affected by external force, can in junction, form stress and concentrate, may be in pad and the fracture of junction, conducting wire when serious.

Utility model content

Therefore, the utility model provides a kind of printed circuit board (PCB) of rupture of line risk of the junction that can reduce pad and conducting wire.

A printed circuit board (PCB), comprises the basalis of insulation and is formed at the conducting wire layer on described basalis surface; Described conducting wire layer comprises a pad, many first conducting wires and second conducting wire; The length of described pad and width are much larger than the width of described first and second conducting wire, described many first conducting wires also conduct mutually with described pad smooth connection, and described the second conducting wire also conducts mutually with described many first conducting wire smooth connections.

One end of every first conducting wire of the pad of the printed circuit board (PCB) that the utility model provides and the side smooth connection of pad, the other end and the second conducting wire smooth connection, can effectively slow down the situation of the physical strength sudden turn of events, be not easy to produce stress and concentrate, thereby reduce rupture of line risk.

Accompanying drawing explanation

Fig. 1 is the schematic top plan view of a kind of state of printed circuit board (PCB).

Fig. 2 is the generalized section of the printed circuit board (PCB) shown in Fig. 1.

Fig. 3 is the schematic top plan view of the another kind of state of the printed circuit board (PCB) shown in Fig. 1.

Main element symbol description

Printed circuit board (PCB) 10

Basalis 11

Conducting wire layer 12

Pad 121

The first conducting wire 122

The second conducting wire 123

The 3rd conducting wire 124

Welding resisting layer 13

Anti-welding opening 131

Following embodiment further illustrates the utility model in connection with above-mentioned accompanying drawing.

Embodiment

Below in conjunction with drawings and Examples, the utility model is described further a kind of structure of printed circuit board (PCB).

Refer to Fig. 1 and Fig. 2, a kind of printed circuit board (PCB) 10, comprise insulation basalis 11, be formed at described basalis 11 surfaces conducting wire layer 12, be formed at the welding resisting layer 13 on layer 12 surface, described conducting wire.

In the present embodiment, described printed circuit board (PCB) 10 is single-sided circuit board, and in other embodiments, described printed circuit board (PCB) 10 can be also double-sided PCB or multilayer circuit board.

The material of described basalis 11 is selected from polyimides (polyimide, PI), PETG (Polyethylene Terephthalate, PET) a kind of or in the material such as PEN (Polyethylene Naphthalate, PEN).

In the present embodiment, by screen painting, exposure, development, the flow process such as solidify and form described welding resisting layer 13 in the surface of described conducting wire layer 12.Described welding resisting layer 13 has anti-welding opening 131.In other embodiments, described welding resisting layer 13 can also be formed in the mode of pressing the surface of described conducting wire layer 12.

Described conducting wire layer 12 can form by the following method: first, at the relative two surperficial pressing Copper Foils of described basalis 11, then, by image transfer and etch process, Copper Foil is made to described conducting wire layer 12.Described conducting wire layer 12 also can be made by additive method, as electroplating process or ink jet printing processing procedure etc., is not limited to the present embodiment.

Described conducting wire layer 12 comprises a pad 121, many first conducting wire 122, the second conducting wire 123 and one article of the 3rd conducting wire 124.The shape of described pad 121 is not limit, and can be roughly circle, square etc., and in the present embodiment, described pad 121 is square, and the length of described pad 121 and width are all much larger than the width of described first, second and third conducting wire 122,123,124.

Described pad 121 is positioned at described anti-welding opening 131, and interior out exposed from described anti-welding opening 131, and the surface of described pad 121 is coated with a kind of of the torpescence metals such as Ni, Pd or Au.

In the present embodiment, one end of every described first conducting wire 122 all also conducts mutually with a side smooth connection of described pad 121, the other end of every described first conducting wire 122 all also conducts mutually with the smooth connection of described the 3rd conducting wire 124, and every described first conducting wire 122 is all connected in the diverse location of described the 3rd conducting wire 124, be that described the first conducting wire 122 is connected in described the 3rd conducting wire 124 at intervals, the end of described the 3rd conducting wire 124 also conducts mutually with described the second conducting wire 123 smooth connections.

In other embodiments, two or more described the first conducting wire 122 also can evenly be connected in the same position of described the 3rd conducting wire 124; Described the 3rd conducting wire 124 also can also conduct with described the second conducting wire 123 smooth connections mutually in other positions except end.

In other embodiments, described the 3rd conducting wire 124 also can be set, refer to Fig. 3, one end away from described pad side of described many first conducting wires 122 smoothly pools one point union and also conducts mutually with one end smooth connection of described second conducting wire 123.

One end of every first conducting wire of the pad of the described printed circuit board (PCB) that the utility model provides also conducts mutually with pad smooth connection, the other end also conducts by the 3rd conducting wire or direct smooth connection mutually with the second conducting wire, can effectively slow down the situation of the physical strength sudden turn of events, be not easy to produce stress and concentrate, thereby avoid rupture of line to lose efficacy.

Be understandable that, above embodiment is only used for illustrating the utility model, not with the restriction of the present utility model of opposing.For the person of ordinary skill of the art, other various corresponding changes and distortion of according to technical conceive of the present utility model, making, within all dropping on the protection range of the utility model claim.

Claims

1. a printed circuit board (PCB), comprises the basalis of insulation and is formed at the conducting wire layer on described basalis surface; Described conducting wire layer comprises a pad, many first conducting wires and second conducting wire; The length of described pad and width are much larger than the width of described first and second conducting wire, described many first conducting wires also conduct mutually with described pad smooth connection, and described the second conducting wire also conducts mutually with described many first conducting wire smooth connections.

2. printed circuit board (PCB) as claimed in claim 1, is characterized in that, also comprises the welding resisting layer that is formed at layer surface, described conducting wire, and described welding resisting layer has anti-welding opening, and described pad is from out exposed in described anti-welding opening.

3. printed circuit board (PCB) as claimed in claim 1, is characterized in that, described bond pad surface is coated with a kind of of the torpescence metals such as Ni, Pd or Au.

4. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described conducting wire layer also comprises the 3rd conducting wire, one end of described many first conducting wires all with a side smooth connection of described pad, the other end of every described first conducting wire all with the smooth connection of described the 3rd conducting wire.

5. printed circuit board (PCB) as claimed in claim 4, is characterized in that, the end of described the 3rd conducting wire also conducts mutually with described the second conducting wire smooth connection.

6. printed circuit board (PCB) as claimed in claim 4, is characterized in that, described the first conducting wire is connected in described the 3rd conducting wire at intervals.

7. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, two or more described the first conducting wire also can evenly be connected in the same position of described the 3rd conducting wire, and described the 3rd conducting wire also can also conduct with described the second conducting wire smooth connection mutually in other positions except end.

8. printed circuit board (PCB) as claimed in claim 1, it is characterized in that, described many first conducting wires smoothly pool a bit away from one end of described pad side, and conduct mutually in second conducting wire described in this smooth connection and with described the second conducting wire.