CN203840636U - PCB pad - Google Patents
PCB pad Download PDFInfo
- Publication number
- CN203840636U CN203840636U CN201420204305.XU CN201420204305U CN203840636U CN 203840636 U CN203840636 U CN 203840636U CN 201420204305 U CN201420204305 U CN 201420204305U CN 203840636 U CN203840636 U CN 203840636U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- pcb
- arc edge
- groove
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000011889 copper foil Substances 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 abstract 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- -1 20b Chemical compound 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Dental Tools And Instruments Or Auxiliary Dental Instruments (AREA)
Abstract
The utility model discloses a PCB pad, and relates to the technical field of PCB circuits. The PCB pad comprises a copper foil which is surface-mounted on a PCB substrate. The copper foil comprises an arc edge. The arc edge is in a toothed structure. The toothed structure is composed of a number of grooves which are distributed on the arc edge. The PCB pad provided by the utility model has the advantages of strong copper foil adhesion and strong tensile ability, and does not easily fall off from the PCB substrate.
Description
Technical field
The utility model relates to PCB circuit engineering field, particularly a kind of PCB pad.
Background technology
PCB (Printed Circuit Board, printed circuit board (PCB)) be one of vitals of electronics industry, almost every kind of electronic equipment, little of electronic watch, calculator, large to computer, communication electronic device, military armament systems etc., as long as there are the electronic devices and components such as integrated circuit, for the electric interconnection between them, all can use PCB.PCB can realize the automatic plug-in mounting of electronic devices and components or mount, automatic tin soldering, automatically detects etc., has ensured the quality of electronic equipment, has improved labor productivity, has reduced production cost, therefore PCB has obtained general application in existing electronic equipment.
Upper for electronic devices and components being fixed and are connected electrically in PCB, normally on PCB base material, mount Copper Foil as pad, then on Copper Foil, apply tin cream, by tin cream, electronic devices and components are electrically connected and are fixed on PCB.The edge of the Copper Foil on existing pad uses arc transition, as shown in Figure 1, Copper Foil 20a is mounted on PCB base material 10, the outer ledge of Copper Foil 20a is arc edge, the Copper Foil 20a of this kind of structure PCB pad and the contact area of PCB base material 10 are less, the adhesive force of Copper Foil is less, makes Copper Foil be started and come off from PCB base material easily, thereby causes PCB circuit malfunction.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of PCB pad, and the strong adhesion of this PCB pad Copper Foil can not come off from PCB base material easily.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of PCB pad, comprises the Copper Foil being mounted on PCB base material, and described Copper Foil comprises an arc edge, and described arc edge is dentalation, and described dentalation is made up of the multiple grooves that are distributed on described arc edge.
As a kind of execution mode, described groove is semi-circular recesses.
As another kind of execution mode, described groove is triangular groove.
As another execution mode, described groove is rectangular recess.
Wherein, described Copper Foil comprises two described Copper Foils that are mounted on described PCB base material, and two described Copper Foils are symmetrical arranged, the described arc edge of two described Copper Foils away from.
Adopted after technique scheme, the beneficial effects of the utility model are:
Because the utility model PCB pad comprises the Copper Foil being mounted on PCB base material, Copper Foil comprises an arc edge, and arc edge is dentalation, and dentalation is made up of the multiple grooves that are distributed on arc edge.The Copper Foil edge of dentalation has effectively increased the effective length at Copper Foil edge, thereby increase the contact area between Copper Foil and PCB base material, tin cream can be combined closely with the side of Copper Foil and the PCB base material of groove simultaneously simultaneously, effectively raise the adhesive force of Copper Foil, Copper Foil can not come off from PCB base material easily, increased the resistance to tension of pad.
Brief description of the drawings
Fig. 1 is the structural representation of PCB pad in prior art;
Fig. 2 is the structural representation of the utility model PCB pad embodiment mono-;
Fig. 3 is the A portion enlarged drawing of Fig. 2;
Fig. 4 is the partial structurtes schematic diagram of the utility model PCB pad embodiment bis-;
Fig. 5 is the partial structurtes schematic diagram of the utility model PCB pad embodiment tri-;
Wherein: 10, PCB base material, 20a, Copper Foil, 20b, Copper Foil, 20c, Copper Foil, 20d, Copper Foil, 30b, groove, 30c, groove, 30d, groove, 32b, tooth portion.
Embodiment
Below in conjunction with drawings and Examples, further set forth the utility model.
Embodiment mono-:
As shown in Figure 2, a kind of PCB pad, comprise the Copper Foil being mounted on PCB base material 10, Copper Foil comprises the complete disjunct two Copper Foil 20b that are mounted on PCB base material 10, two Copper Foil 20b are equipped with two approximately perpendicular linear edges and an arc edge, two Copper Foil 20b are symmetrical arranged, the arc edge of two Copper Foil 20b away from, two Copper Foil 20b are common forms an approximate half-circular.
As shown in Fig. 2 and Fig. 3 are common, the arc edge of two Copper Foil 20b is dentalation, and dentalation is made up of the multiple groove 30b that are distributed on arc edge, forms the 32b of tooth portion between two groove 30b.Groove 30b is semi-circular recesses, and groove 30b lacks material by Copper Foil edge and forms.The Copper Foil edge of dentalation has effectively increased the effective length at Copper Foil edge, thereby increase the contact area between Copper Foil and PCB base material, tin cream can be combined closely with the side of Copper Foil and the PCB base material of groove simultaneously simultaneously, effectively raise the adhesive force of pad, Copper Foil can not come off from PCB base material easily, increased the resistance to tension of pad.
Embodiment bis-:
As shown in Figure 4, present embodiment and embodiment mono-are basic identical, and its difference is:
Groove 30c on the arc edge of Copper Foil 20c is triangular groove.
Embodiment tri-:
As shown in Figure 5, present embodiment and embodiment mono-are basic identical, and its difference is:
Groove 30d on the arc edge of Copper Foil 20d is rectangular recess.
Above-described embodiment be only taking the pad structure shown in Fig. 2 as the detailed elaboration of example inventive concept of the present utility model; in practical application, the technical solution of the utility model can be adapted in the pad of any structure; therefore as long as pad is provided with arc transition edge; and be the adhesive force that dentalation is used for strengthening Copper Foil at edge, to prevent that the PCB pad product that Copper Foil comes off from PCB base material from all dropping in protection range of the present utility model.
Above-described embodiment be only taking groove structure as semicircle, triangle and rectangle as the detailed elaboration of example inventive concept of the present utility model; the structure of practical application further groove is not limited to above-mentioned three kinds, as long as the groove structure that can make arc edge form dentalation all drops in protection range of the present utility model.
The utility model is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion of having done, within all dropping on protection range of the present utility model.
Claims (5)
1.PCB pad, comprises the Copper Foil being mounted on PCB base material, it is characterized in that, described Copper Foil comprises an arc edge, and described arc edge is dentalation, and described dentalation is made up of the multiple grooves that are distributed on described arc edge.
2. PCB pad according to claim 1, is characterized in that, described groove is semi-circular recesses.
3. PCB pad according to claim 1, is characterized in that, described groove is triangular groove.
4. PCB pad according to claim 1, is characterized in that, described groove is rectangular recess.
5. according to the PCB pad described in the arbitrary claim of claim 2 to 4, it is characterized in that, described Copper Foil comprises two described Copper Foils that are mounted on described PCB base material, and two described Copper Foils are symmetrical arranged, the described arc edge of two described Copper Foils away from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420204305.XU CN203840636U (en) | 2014-04-24 | 2014-04-24 | PCB pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420204305.XU CN203840636U (en) | 2014-04-24 | 2014-04-24 | PCB pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203840636U true CN203840636U (en) | 2014-09-17 |
Family
ID=51518427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420204305.XU Expired - Lifetime CN203840636U (en) | 2014-04-24 | 2014-04-24 | PCB pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203840636U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792511A (en) * | 2016-03-30 | 2016-07-20 | 努比亚技术有限公司 | Pad compatible structure and PCB |
-
2014
- 2014-04-24 CN CN201420204305.XU patent/CN203840636U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105792511A (en) * | 2016-03-30 | 2016-07-20 | 努比亚技术有限公司 | Pad compatible structure and PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200609 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140917 |
|
| CX01 | Expiry of patent term |