CN201797644U - Printed circuit board (PCB) with impedance module - Google Patents

Printed circuit board (PCB) with impedance module Download PDF

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Publication number
CN201797644U
CN201797644U CN2010205383746U CN201020538374U CN201797644U CN 201797644 U CN201797644 U CN 201797644U CN 2010205383746 U CN2010205383746 U CN 2010205383746U CN 201020538374 U CN201020538374 U CN 201020538374U CN 201797644 U CN201797644 U CN 201797644U
Authority
CN
China
Prior art keywords
impedance module
pcb
pcb board
impedance
process edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205383746U
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Chinese (zh)
Inventor
卢磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Tech great achievement circuit Science and Technology Ltd. of Shenzhen
Original Assignee
LEIXINDA ELECTRONICS (SHENZHEN) CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEIXINDA ELECTRONICS (SHENZHEN) CO Ltd filed Critical LEIXINDA ELECTRONICS (SHENZHEN) CO Ltd
Priority to CN2010205383746U priority Critical patent/CN201797644U/en
Application granted granted Critical
Publication of CN201797644U publication Critical patent/CN201797644U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a printed circuit board (PCB) with an impedance module, which comprises a PCB, a process edge, a cutting groove and a wave-shaped impedance module, wherein the process edge is arranged on the edge of the PCB, the cutting groove is arranged at a connecting part of the PCB and the process edge, the wave-shaped impedance module is arranged on the process edge, a row of impedance test holes are respectively and symmetrically arranged at both ends of the impedance module, and the process edge can be finally abandoned. Thereby, the impedance module is arranged on the process edge, and is simultaneously abandoned with the process edge after the test is completed. Thereby, the impedance module does not need to occupy other space of the PCB, further, the materials can be saved, and the cost can be reduced.

Description

A kind of pcb board that is provided with impedance module
Technical field
The utility model relates to a kind of pcb board, relates in particular to the structure that a kind of a plurality of pcb boards that will process are together separated fast.
Background technology
As electronic product substantially the most also is most crucial parts, pcb board extensively applies on each electronic product and main equipment and the device, usually, according to customer requirement, manufacturer need be laid in circuit on the substrate of pcb board, in process of production, need the impedance of test pcb board, therefore impedance module need be set on pcb board.
The utility model content
It is a kind of on pcb board technology limit but not in other positions of pcb board impedance module is set and is used to test impedance that the purpose of this utility model is to provide, thus economical with materials, the pcb board that reduces cost.
In order to achieve the above object, the technical scheme that the utility model adopted is: a kind of pcb board that is provided with impedance module, comprise pcb board, be located at the technology limit at pcb board edge, pcb board and junction, technology limit are provided with the cut-out groove, on the technology limit, be provided with the waveform impedance module,, respectively be provided with the anti-instrument connection of an exclusion symmetrically at the two ends of described impedance module.The technology limit finally can go out of use, and therefore, impedance module is located on the technology limit, and it is discarded with the technology limit to finish the test back, thereby impedance module does not need to take other spaces of pcb board, and then economical with materials, reduces cost.
Described a kind of novel pcb board, the anti-instrument connection of described every exclusion is four.
After adopting said structure, impedance module is located on the technology limit, it is discarded with the technology limit to finish the test back, thereby impedance module does not need to take other spaces of pcb board, and then economical with materials, reduces cost.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
In order to make those skilled in the art better understand the utility model, conjunction with figs. describes in detail now:
Please refer to shown in Figure 1, the utility model discloses a kind of pcb board that is provided with impedance module, comprise pcb board 1, be located at the technology limit 2 at pcb board 1 edge, pcb board 1 is provided with 2 junctions, technology limit and cuts off groove 3, on technology limit 2, be provided with waveform impedance module 4,, respectively be provided with the anti-instrument connection 5 of an exclusion symmetrically at the two ends of described impedance module 4.Technology limit 2 finally can go out of use, and therefore, impedance module 4 is located on the technology limit 2, and it is discarded with technology limit 2 to finish the test back, thereby impedance module 4 does not need to take other spaces of pcb board 1, and then economical with materials, reduces cost.
The anti-instrument connection 5 of described every exclusion is four.

Claims (2)

1. a pcb board that is provided with impedance module comprises pcb board, is located at the technology limit at pcb board edge, pcb board and junction, technology limit are provided with the cut-out groove, it is characterized in that, are provided with the waveform impedance module on the technology limit, at the two ends of described impedance module, respectively be provided with the anti-instrument connection of an exclusion symmetrically.
2. a kind of pcb board that is provided with impedance module as claimed in claim 1 is characterized in that, the anti-instrument connection of described every exclusion is four.
CN2010205383746U 2010-09-21 2010-09-21 Printed circuit board (PCB) with impedance module Expired - Fee Related CN201797644U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205383746U CN201797644U (en) 2010-09-21 2010-09-21 Printed circuit board (PCB) with impedance module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205383746U CN201797644U (en) 2010-09-21 2010-09-21 Printed circuit board (PCB) with impedance module

Publications (1)

Publication Number Publication Date
CN201797644U true CN201797644U (en) 2011-04-13

Family

ID=43852540

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205383746U Expired - Fee Related CN201797644U (en) 2010-09-21 2010-09-21 Printed circuit board (PCB) with impedance module

Country Status (1)

Country Link
CN (1) CN201797644U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106163096A (en) * 2016-08-26 2016-11-23 奥士康精密电路(惠州)有限公司 The impedance plate of a kind of high evenness and production method thereof
CN106255326A (en) * 2016-08-26 2016-12-21 奥士康精密电路(惠州)有限公司 A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip
CN106255327A (en) * 2016-08-26 2016-12-21 奥士康精密电路(惠州)有限公司 A kind of impedance plate thickness of dielectric layers control method
CN106855590A (en) * 2016-11-18 2017-06-16 深圳崇达多层线路板有限公司 A kind of PCB impedance modules structure and its detection method
CN109791176A (en) * 2017-06-28 2019-05-21 深圳市柔宇科技有限公司 Circuit board and multiple-printed-panel for circuit board

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106163096A (en) * 2016-08-26 2016-11-23 奥士康精密电路(惠州)有限公司 The impedance plate of a kind of high evenness and production method thereof
CN106255326A (en) * 2016-08-26 2016-12-21 奥士康精密电路(惠州)有限公司 A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip
CN106255327A (en) * 2016-08-26 2016-12-21 奥士康精密电路(惠州)有限公司 A kind of impedance plate thickness of dielectric layers control method
CN106255326B (en) * 2016-08-26 2019-12-03 奥士康精密电路(惠州)有限公司 A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip
CN106255327B (en) * 2016-08-26 2019-12-03 奥士康精密电路(惠州)有限公司 A kind of impedance plate thickness of dielectric layers control method
CN106163096B (en) * 2016-08-26 2019-12-03 奥士康精密电路(惠州)有限公司 A kind of impedance plate and its production method of high evenness
CN106855590A (en) * 2016-11-18 2017-06-16 深圳崇达多层线路板有限公司 A kind of PCB impedance modules structure and its detection method
CN109791176A (en) * 2017-06-28 2019-05-21 深圳市柔宇科技有限公司 Circuit board and multiple-printed-panel for circuit board

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20131128

Address after: 518104, No. two, No. 202, building 203, Xingye building, upper Star Industrial Zone, West Ring Road, Baoan District, Shenzhen, Guangdong

Patentee after: China Tech great achievement circuit Science and Technology Ltd. of Shenzhen

Address before: 518000 workshop No. 12, Fuhua Industrial Zone, Fuyong Town, Baoan District, Guangdong, Shenzhen

Patentee before: Leixinda Electronics (Shenzhen) Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110413

Termination date: 20140921

EXPY Termination of patent right or utility model