CN106163096B - A kind of impedance plate and its production method of high evenness - Google Patents
A kind of impedance plate and its production method of high evenness Download PDFInfo
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- CN106163096B CN106163096B CN201610731496.9A CN201610731496A CN106163096B CN 106163096 B CN106163096 B CN 106163096B CN 201610731496 A CN201610731496 A CN 201610731496A CN 106163096 B CN106163096 B CN 106163096B
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- impedance
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The present invention discloses the impedance plate and its production method and its control method of a kind of high evenness, including multi-layer board pressing working procedure, the multi-layer board pressing working procedure include that a. provides two panels Type B plate, several c-type plates and D template；B. pre- lamination and lamination；C. PE punching is carried out in multilayer circuit board edge；D. it fuses；E. riveted；F. it presses.The present invention is gradually reinforced multilayer circuit board by way of fusion, riveted in pressing working procedure and finally makes multilayer line sheet metal forming using heating pressing, effectively solve the problems, such as that easily generation layer is inclined when multilayer circuit board pressing, is particularly suitable for the production of high-rise multilayer circuit board；The present invention rises abnormal compensating to the contracting of inner plating by way of carrying out PE punching to multilayer circuit board edge simultaneously, and it is inclined to further prevent occurring between inner plating in pressing working procedure layer, reduces product defect rate, improves the precision of multilayer circuit board.
Description
Technical field
The present invention relates to wiring board arts, and in particular to the impedance plate and its production method of a kind of high evenness and its control
Method.
Background technique
Notebook host plate needs mating different core plate modules, and the two need to guarantee impedance in consistent range, if the two is deposited
In difference, system is be easy to cause the bad phenomenons such as not to be switched on.It is generally simulated using impedance strip is designed outside unit in PCB production
Impedance in unit, in order to produce control；When impedance strip design is in edges of boards, in bonding processes due to the height of impedance strip
Difference, causes dielectric thickness relatively low, there are deviations for impedance at the phenomenon that being easy to appear gummosis.The especially production process of multilayer circuit board
In, the phenomenon that wiring board number of plies is more, and when pressing is more easy to appear gummosis, dielectric thickness is more difficult to control.Current PC B industry competition
It is more severe, availability ratio of the armor plate, production efficiency are improved, reducing production cost is each PCB enterprise problems faced；When plate benefit
When being conflicted with rate with the presence of impedance strip position, to make full use of plate, impedance strip can only be designed in edges of boards, at this moment how to be guaranteed
Dielectric thickness becomes PCB enterprise urgent problem.
Summary of the invention
In view of this, the present invention discloses the impedance plate and its production method and its control method of a kind of high evenness, can show
The depth for the drilling shown is easy to use.
The purpose of the present invention is achieved through the following technical solutions:
A kind of impedance plate of high evenness, including the wiring board that multilayer is sequentially overlapped, the wiring board includes A template, Type B
Plate and c-type plate, in the number of plies of the wiring board, secondary lamina rara externa uses c-type plate, and odd number number of plies plate uses Type B plate, even number number of plies plate
Using D template.
The Type B plate includes that multiple dotted B choked flows are provided with outside the unit outside the unit of wiring board edges of boards
PAD；The B choked flow PAD is uniform and is equally spaced outside unit.
The c-type plate includes outside the unit of wiring board edges of boards, includes the C resistance for being provided with C impedance strip outside the unit
C choked flow area other than anti-area and the impedance area C, the impedance area C periphery are provided with the C copper sheet ring of encirclement, and C choked flow area is provided with
C copper bar choked flow area outside unit, the C copper bar choked flow area is evenly arranged with several C air guide ports；The C copper bar choked flow
Area, the C copper sheet ring of encirclement and C impedance strip height are equal；The C copper sheet ring of encirclement opposite sides is respectively arranged with C flow-guiding mouth, described
The C copper sheet ring of encirclement be provided with the either side of C flow-guiding mouth not with wiring board sides aligned parallel.
By the way that the C copper sheet ring of encirclement is arranged in the impedance area C periphery, changes medium flow direction, media flow is avoided to be obstructed in C impedance
The accumulation of edge excessively impacts；It is provided with C copper bar choked flow area in C choked flow area simultaneously, is solved by the copper bar choked flow area C because of C
There is difference in height in impedance strip, flow medium can gently；C copper bar choked flow area can not only play the effect of choked flow, and
And gas can be quickly discharged in the C air guide port in C copper bar choked flow area, prevent pressing cavity.C water conservancy diversion is arranged in the C copper sheet ring of encirclement
Mouth plays the role of water conservancy diversion, air guide, and medium can be made to flow into the C copper sheet ring of encirclement, and avoiding the formation of cavity influences to combine.C flow-guiding mouth
Either side not with wiring board sides aligned parallel, can effectively avoid medium flow into the C copper sheet ring of encirclement in excessive velocities, be conducive to
Control the uniformity of C impedance strip surrounding medium.
The D template includes outside the unit of wiring board edges of boards, includes the D resistance for being provided with D impedance strip outside the unit
D choked flow area other than anti-area and the impedance area D, the impedance area D periphery are provided with the D copper sheet ring of encirclement, and D choked flow area is provided with
Multiple dotted choked flow PAD.The D choked flow PAD is uniform and is equally spaced in D choked flow area；D choked flow PAD, D copper sheet surrounds
Circle and D impedance strip height are equal；The D copper sheet ring of encirclement opposite sides is respectively arranged with D flow-guiding mouth, the D copper sheet ring of encirclement
Be provided with the either side of D flow-guiding mouth not with wiring board sides aligned parallel.
By the way that the D copper sheet ring of encirclement is arranged in the impedance area D periphery, changes medium flow direction, media flow is avoided to be obstructed in D impedance
The accumulation of edge excessively impacts；It is provided with D choked flow PAD simultaneously, is solved by D choked flow PAD because there are differences in height for D impedance strip
The problem of, flow medium can gently；Not only D choked flow PAD can play the effect of choked flow, but also between dotted D choked flow PAD
Gap form effective air guide port, gas is quickly discharged.Since D choked flow PAD is used for choked flow and air guide, uniform and equidistant point
Cloth is more advantageous to the uniformity for improving medium, improves the precision of dielectric thickness.The D copper sheet ring of encirclement setting D flow-guiding mouth play water conservancy diversion,
The effect of air guide can be such that medium flows into the D copper sheet ring of encirclement, and avoiding the formation of cavity influences to combine.The either side of D flow-guiding mouth not with
Wiring board sides aligned parallel can effectively avoid medium from flowing into the excessive velocities in the D copper sheet ring of encirclement, be conducive to control D impedance strip
The uniformity of surrounding medium.
A kind of impedance plate producing process of high evenness, including multi-layer board pressing working procedure, it is characterised in that: the multi-layer board
Pressing working procedure includes
A., two panels Type B plate, several c-type plates and D template are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in multilayer circuit board edge；
D fusion；
E. riveted；
F. it presses；
The present invention is by Type B plate, c-type plate and D template and the inner plating overlapped successively fuses, riveted and heating are pressed
It closes, inner plating is firmly combined gradually.Fusion process can be such that inner plating tentatively combines, to avoid multilayer circuit board plate in riveted
It is inclined that layer occurs for process.Riveted process then further reinforces multilayer circuit board, make its high temperature, high pressure heating pressing working procedure in
Layer does not occur and finally presses success partially.PE punching is carried out in multilayer circuit board edge, on the one hand can be subsequent fusion, riveting
It closes and provides location hole with heating pressing, on the other hand can compensate for the contracting that inner plating generates in process and rise exception, into one
It is inclined that layer occurs when step prevention multilayer circuit board pressing.
The fusion is carried out at a temperature of 230-290 DEG C；The fusion duration is 80-120S.
It further include the drilling operating carried out after multi-layer board pressing working procedure；The drilling operating its cut speed be 45-
60IPM；Its time knife speed of the drilling operating is 750-850IPM.
Since fusion process of the invention is the purpose is to reinforce and indirect pressing multilayer circuit board, to prevent in fusion
It heats between too quickly inner plating and occurs that contracting rises by exception and layer is inclined, the temperature that the temperature of fusion process is reduced fusion process by designer is same
Its time of Shi Yanchang.It is so not only able to meet the purpose of the preliminary fixed multilayer circuit board of the present invention, also can farthest prevent
Only deviated between inner plating.
Drilling operating institute's boring aperture is 0 .2-0 .4mm.
The aperture that the present invention is drilled drilling operating is contracted to 0 .2-0 .4mm, further reduces burr, ailhead goes out
A possibility that existing, improves drilling smoothness, improves product quality.
It further, further include primary plating copper process and secondary plating copper process；The primary plating copper process and secondary plating
Copper process is carried out under 8-12ASF current density.
The primary plating copper process and secondary plating copper process duration are 30-120min.
By reducing electroplating current, extending electroplating time, it can be improved plating grout ability, it is obstructed inclined with hole copper to reduce hole
The quality problems such as thin, it is ensured that product conduction is good.
The beneficial effects of the present invention are:
The present invention is provided with three kinds of templates such as Type B plate, c-type plate and D template for the pressing working procedure of multilayer circuit board, and right
Every kind of template makes corresponding pressing optimization processing, and pressing is avoided the scene of gummosis occur, dielectric thickness when being the pressing of each template
More uniformly, and Type B plate and D template using intersect stack by the way of more full and uniform pressure force, press multilayer circuit board
When the power that is subject to it is more uniform.
Detailed description of the invention
Fig. 1 is Type B plate structural schematic diagram of the present invention.
Fig. 2 is c-type plate structural schematic diagram of the present invention.
Fig. 3 is D shaping plate structure schematic diagram of the present invention.
Specific embodiment
In order to facilitate the understanding of those skilled in the art, below in conjunction with embodiment, present invention is further described in detail:
Embodiment 1
The present embodiment provides a kind of 12 sandwich circuit board production methods, as shown in Figure 1-3, include following process:
Pressing；
Drilling；
Copper facing；
Outer layer dry film；
Secondary copper facing；
Lose copper；
It is anti-welding.
Above-mentioned pressing working procedure includes
A., two panels Type B plate, several c-type plates and D template are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in 12 sandwich circuit board edges using PE perforating press；
D. 12 sandwich circuit boards are positioned by above-mentioned PE punching, carries out contact in 12 sandwich circuit board edges of boards using Heat sealing machine
Dotted fusion, fusion temperature are 260 DEG C, and the fusion time is 99s；
E. 12 sandwich circuit boards riveted on lock seaming machine using above-mentioned PE punching, position simultaneously riveted；
F. heating pressing is carried out to 12 sandwich circuit boards reinforced through fusion, riveted on pressing machine.
Above-mentioned drilling operating, with time knife speed progress for cutting speed, 800IPM of 50IPM, is drilled in unit
Diameter is 0 .3mm.
Reduction, which cuts speed, go back to knife speed and reduced bore, can reduce the probability of drilled edge burring machine ailhead appearance.
In addition, the burr and nail of drilled edge can also be effectively reduced by reducing the production bore limit of drill point used, reduction while the folded number of drilling
Head.
The c-type plate includes outside the unit of wiring board edges of boards, includes the C for being provided with C impedance strip C3 outside the unit
C choked flow area C2 other than the C1 of the impedance area impedance area C1 and C, the impedance area the C periphery C1 is provided with the C copper sheet ring of encirclement C6, the C
Choked flow area C2 is provided with the C copper bar choked flow area C4 outside the unit, and the C copper bar choked flow area C4 is evenly arranged with several C and leads
Port C5.The choked flow of C copper bar area C4, C copper sheet ring of encirclement C6 and C impedance strip C3 height is equal；The C copper sheet ring of encirclement C6 phase
C flow-guiding mouth C7 is respectively arranged with to two sides, the C copper sheet ring of encirclement C6 be provided with the either side of C flow-guiding mouth C7 not with wiring board
Sides aligned parallel.
The Type B plate includes that multiple dotted B choked flows are provided with outside the unit outside the unit of wiring board edges of boards
PADB1.The B choked flow PADB1 is uniform and is equally spaced outside unit.
The D template includes outside the unit of wiring board edges of boards, includes the D for being provided with D impedance strip D3 outside the unit
D choked flow area D2 other than the D1 of the impedance area impedance area D1 and D, the impedance area the D periphery D1 is provided with the D copper sheet ring of encirclement D4, the D
Choked flow area D2 is provided with multiple dotted D choked flow PADD5；The D choked flow PADD5 is uniform and is equally spaced in D choked flow area D2；
D choked flow PADD5, D copper sheet ring of encirclement D4 and D impedance strip D3 height is equal；The D copper sheet ring of encirclement D4 opposite sides difference
Be provided with D flow-guiding mouth D6, the D copper sheet ring of encirclement D4 be provided with the either side of D flow-guiding mouth D6 not with wiring board sides aligned parallel.
In the number of plies of the lamination process, secondary lamina rara externa uses c-type plate, and odd number number of plies plate uses Type B plate, even number number of plies plate
Using D template.
In the present embodiment, an above-mentioned copper facing and secondary its electroplating current current density of plating copper process are 11ASF, when plating
Between be 45MIN.
The processes such as above-mentioned outer layer dry film, erosion copper, anti-welding can be realized using conventional method.
The present embodiment is directed to the characteristic of 12 sandwich circuit boards, to pressing working procedure, drilling operating and a copper facing, secondary plating coppersmith
The parameter of sequence optimizes, and has 12 sandwich circuit board produced and layer is inclined, drilled edge is smooth, on-state rate is good etc. does not occur
Advantage, to realize the purpose for reducing product defect rate, controlling production cost.The present embodiment is easily achieved simultaneously, existing
It is improved on production line, is particularly advantageous to large-scale promotion.
Embodiment 2
The present embodiment provides a kind of production method of 16 sandwich circuit boards, process is consistent with embodiment 1.
Its pressing working procedure includes
A., two panels c-type plate, several Type B plates and D template are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in 16 sandwich circuit board edges using PE perforating press；
D. 16 sandwich circuit boards are positioned by above-mentioned PE punching, carries out contact in 16 sandwich circuit board edges of boards using Heat sealing machine
Dotted fusion, fusion temperature are 235 DEG C, and the fusion time is 89s；
E. 16 sandwich circuit boards riveted on lock seaming machine using above-mentioned PE punching, position simultaneously riveted；
F. 16 sandwich circuit boards that alignment fusion, riveted are reinforced on pressing machine carry out heating pressing.
In the present embodiment, drilling operating be in perforating press, with 45IPM cut speed, 760IPM return knife speed into
Row, institute's hole diameter are 0 .2mm.
In the present embodiment, an above-mentioned copper facing and secondary its electroplating current current density of plating copper process are 9ASF, when plating
Between be 40MIN.
16 sandwich circuit boards provided by the present embodiment are without the inclined phenomenon of layer, no gummosis, wiring board section thickness of dielectric layers
Uniformly without cavity, on-state rate is good.
Embodiment 3
The present embodiment provides a kind of production method of 20 sandwich circuit boards, process is consistent with embodiment 1.
Its pressing working procedure includes
A., two panels c-type plate, several Type B plates and D template are provided；
B. pre- lamination and lamination；
C. PE punching is carried out in 20 sandwich circuit board edges using PE perforating press；
D. 20 sandwich circuit boards are positioned by above-mentioned PE punching, carries out contact in 20 sandwich circuit board edges of boards using Heat sealing machine
Dotted fusion, fusion temperature are 290 DEG C, and the fusion time is 115s；
E. 20 sandwich circuit boards riveted on lock seaming machine using above-mentioned PE punching, position simultaneously riveted；
F. heating pressing is carried out to 20 sandwich circuit boards reinforced through fusion, riveted on pressing machine.
In the present embodiment, drilling operating be in perforating press, with 58IPM cut speed, 850IPM return knife speed into
Row, institute's hole diameter are 0 .4mm.
In the present embodiment, an above-mentioned copper facing and secondary its electroplating current current density of plating copper process are 12ASF, when plating
Between be 40MIN.
20 sandwich circuit boards provided by the present embodiment are without the inclined phenomenon of layer, no gummosis, wiring board section thickness of dielectric layers
Uniformly without cavity, on-state rate is good.
The above are wherein specific implementations of the invention, and the description thereof is more specific and detailed, but can not therefore manage
Solution is limitations on the scope of the patent of the present invention.It should be pointed out that for those of ordinary skill in the art, not departing from
Under the premise of present inventive concept, various modifications and improvements can be made, these obvious alternative forms belong to this hair
Bright protection scope.The technical detail being not described in detail in the present invention can be realized by any one of prior art.
Claims (8)
1. a kind of impedance plate of high evenness, it is characterised in that: including the wiring board that multilayer is sequentially overlapped, the wiring board includes
Type B plate, c-type plate and D template, in the number of plies of the wiring board, secondary lamina rara externa uses c-type plate, and odd number number of plies plate uses Type B plate,
Even number number of plies plate uses D template；The Type B plate includes being provided with outside the unit multiple outside the unit of wiring board edges of boards
Dotted B choked flow PAD；The c-type plate includes outside the unit of wiring board edges of boards, includes being provided with C impedance outside the unit
The impedance area C of item and the C choked flow area other than the impedance area C, the impedance area C periphery are provided with the C copper sheet ring of encirclement, the C choked flow
Area is provided with the C copper bar choked flow area outside unit, and the C copper bar choked flow area is evenly arranged with several C air guide ports；The D
Template includes outside the unit of wiring board edges of boards, includes the impedance area D and the impedance area D for being provided with D impedance strip outside the unit
D choked flow area in addition, the impedance area D periphery are provided with the D copper sheet ring of encirclement, and D choked flow area is provided with multiple dotted D resistances
Flow PAD.
2. a kind of impedance plate of high evenness according to claim 1, it is characterised in that: the B choked flow PAD is uniform and waits
Away from being distributed in outside unit.
3. a kind of impedance plate of high evenness according to claim 1, it is characterised in that: the C copper bar choked flow area, C copper
Suitcase enclosure and C impedance strip height are equal；The C copper sheet ring of encirclement opposite sides is respectively arranged with C flow-guiding mouth, the C copper sheet
The ring of encirclement be provided with the either side of C flow-guiding mouth not with wiring board sides aligned parallel.
4. a kind of impedance plate of high evenness according to claim 1, it is characterised in that: the D choked flow PAD is uniform and waits
Away from being distributed in D choked flow area；D choked flow PAD, D copper sheet ring of encirclement and D impedance strip height are equal；The D copper sheet ring of encirclement is opposite
Two sides are respectively arranged with D flow-guiding mouth, the D copper sheet ring of encirclement be provided with the either side of D flow-guiding mouth not with wiring board sides aligned parallel.
5. a kind of impedance plate producing process of any one of claim 1-4 high evenness, including multi-layer board pressing working procedure,
Be characterized in that: the multi-layer board pressing working procedure includes that a. provides two panels Type B plate, several c-type plates and D template；B. pre- lamination and folded
Plate；C. PE punching is carried out in multilayer circuit board edge；D. it fuses；E. riveted；F. it presses；The fusion is in 230-290 DEG C of temperature
Degree is lower to carry out；The fusion duration is 80-120s；It further include the drilling operating carried out after multi-layer board pressing working procedure；It is described
Drilling operating its cut speed be 45-60IPM；Its time knife speed of the drilling operating is 750-850IPM.
6. a kind of impedance plate producing process of high evenness according to claim 5, it is characterised in that: the drilling operating
Institute's boring aperture is 0.2-0.4mm.
7. a kind of impedance plate producing process of high evenness according to claim 5, it is characterised in that: further include once plating
Copper process and secondary plating copper process；The primary plating copper process and secondary plating copper process are carried out under 8-12ASF current density.
8. a kind of impedance plate producing process of high evenness according to claim 7, it is characterised in that: a copper facing
Process and secondary plating copper process duration are 30-50min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610731496.9A CN106163096B (en) | 2016-08-26 | 2016-08-26 | A kind of impedance plate and its production method of high evenness |
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|---|---|---|---|
| CN201610731496.9A CN106163096B (en) | 2016-08-26 | 2016-08-26 | A kind of impedance plate and its production method of high evenness |
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| CN106163096B true CN106163096B (en) | 2019-12-03 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109874232A (en) * | 2019-03-05 | 2019-06-11 | 深圳崇达多层线路板有限公司 | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed |
| CN109922612A (en) * | 2019-03-22 | 2019-06-21 | 深圳明阳电路科技股份有限公司 | A kind of HDI board manufacturing method and HDI plate |
| CN110099507B (en) * | 2019-05-29 | 2022-04-05 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
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| CN201797644U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Printed circuit board (PCB) with impedance module |
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| CN205305222U (en) * | 2016-01-13 | 2016-06-08 | 深圳市迅捷兴电路技术有限公司 | Impedance arrangement structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201797644U (en) * | 2010-09-21 | 2011-04-13 | 磊鑫达电子(深圳)有限公司 | Printed circuit board (PCB) with impedance module |
| CN102458033A (en) * | 2010-10-18 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Inner-layer plate side structure of thick-copper printed circuit board |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN103596361A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Flow choking strip for printed circuit board |
| CN204859745U (en) * | 2015-08-04 | 2015-12-09 | 金禄（清远）精密科研投资有限公司 | PCB board of high reliability |
| CN205305222U (en) * | 2016-01-13 | 2016-06-08 | 深圳市迅捷兴电路技术有限公司 | Impedance arrangement structure |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
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| CN106163096A (en) | 2016-11-23 |
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Effective date of registration: 20201224 Address after: 526070 no.435, building B, Zhaoqing New District Investment Development Co., Ltd., north 8 District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: 516200 Changbu Village, Xinwei Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |