CN106163096A - The impedance plate of a kind of high evenness and production method thereof - Google Patents
The impedance plate of a kind of high evenness and production method thereof Download PDFInfo
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- CN106163096A CN106163096A CN201610731496.9A CN201610731496A CN106163096A CN 106163096 A CN106163096 A CN 106163096A CN 201610731496 A CN201610731496 A CN 201610731496A CN 106163096 A CN106163096 A CN 106163096A
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- impedance
- plate
- choked flow
- copper
- encirclement
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses the impedance plate of a kind of high evenness and production method thereof and control method thereof, and including multi-layer sheet pressing working procedure, described multi-layer sheet pressing working procedure includes that a. provides two panels Type B plate, some c-type plates and D template；The most pre-lamination and lamination；C. PE punching is carried out in multilayer circuit board edge；D. fuse；E. riveted；F. pressing.The present invention progressively reinforces multilayer circuit board by the way of fusion, riveted in pressing working procedure and final utilization adds hot pressing and makes multilayer line sheet metal forming, effectively solve the problem that during multilayer circuit board pressing, easy genetic horizon is inclined, be particularly suited for the production of the multilayer circuit board of high level；Present invention contracting to inner plating by the way of multilayer circuit board edge is carried out PE punching simultaneously is risen abnormal compensating, prevents in pressing working procedure genetic horizon between inner plating inclined further, reduces product fraction defective, improve the precision of multilayer circuit board.
Description
Technical field
The present invention relates to wiring board art, be specifically related to the impedance plate of a kind of high evenness and production method thereof and control thereof
Method.
Background technology
Notebook host plate needs supporting different central layer modules, both need to ensure impedance in consistent scope, if both deposit
In difference, easily cause the bad phenomenon such as system not start.PCB typically uses in producing and designs impedance strip outside unit, simulation
Impedance in unit, in order to produce management and control；When impedance strip design is at edges of boards, at bonding processes due to the height of impedance strip
, easily there is the phenomenon of gummosis, causes dielectric thickness on the low side, impedance exists deviation in difference.The especially production process of multilayer circuit board
In, the wiring board number of plies is the most, the most easily occurs the phenomenon of gummosis during pressing, and dielectric thickness is more difficult to control.The industry competition of current PC B
More severe, improve availability ratio of the armor plate, production efficiency, reducing production cost is each PCB enterprise problems faced；When sheet material profit
When conflicting with the existence of impedance strip position by rate, for making full use of sheet material, impedance strip can only be designed at edges of boards, the most how to ensure
Dielectric thickness, becomes PCB enterprise urgent problem.
Summary of the invention
In view of this, the present invention discloses the impedance plate of a kind of high evenness and production method thereof and control method thereof, can show
The degree of depth of the boring shown, convenient use.
The purpose of the present invention is achieved through the following technical solutions:
A kind of impedance plate of high evenness, the wiring board being sequentially overlapped including multilamellar, described wiring board include A template, Type B plate and
C-type plate, in the number of plies of described wiring board, secondary lamina rara externa uses c-type plate, and odd number number of plies plate uses Type B plate, and even number number of plies plate uses
D template.
Described Type B plate includes outside the unit of wiring board edges of boards, is provided with the B choked flow of multiple point-like outside described unit
PAD；Described B choked flow PAD uniformly and is equally spaced outside unit.
Described c-type plate includes outside the unit of wiring board edges of boards, includes the C resistance being provided with C impedance strip outside described unit
C choked flow district beyond anti-district and C impedance area, periphery, described C impedance area is provided with the C copper sheet ring of encirclement, and described C choked flow district is provided with
Around the C copper bar choked flow district outside unit, described C copper bar choked flow district is evenly arranged with some C air guide ports；Described C copper bar choked flow
District, the C copper sheet ring of encirclement and C impedance strip height are equal；Described C copper sheet ring of encirclement opposite sides is respectively arranged with C flow-guiding mouth, described
The C copper sheet ring of encirclement be provided with the either side of C flow-guiding mouth not with wiring board sides aligned parallel.
By arranging the C copper sheet ring of encirclement in periphery, C impedance area, change medium and flow to, it is to avoid media flow is obstructed in C impedance
Bar edge is piled up and is excessively impacted；It is provided with C copper bar choked flow district simultaneously in C choked flow district, is solved because of C by C copper bar choked flow district
There is the problem of difference in height in impedance strip, makes medium to flow gently；The effect of choked flow can not only play in C copper bar choked flow district, and
And the C air guide port in C copper bar choked flow district can quickly discharge gas, prevent pressing cavity.The C copper sheet ring of encirclement arranges C water conservancy diversion
Mouth plays the effect of water conservancy diversion, inducing QI, and medium can be made to flow in the C copper sheet ring of encirclement, it is to avoid forms cavity impact and combines.C flow-guiding mouth
Either side not with wiring board sides aligned parallel, it is possible to be prevented effectively from medium and flow into the excessive velocities in the C copper sheet ring of encirclement, be conducive to
Control the uniformity of C impedance strip surrounding medium.
Described D template includes outside the unit of wiring board edges of boards, includes the D resistance being provided with D impedance strip outside described unit
D choked flow district beyond anti-district and D impedance area, periphery, described D impedance area is provided with the D copper sheet ring of encirclement, and described D choked flow district is provided with
The choked flow PAD of multiple point-like.Described D choked flow PAD uniformly and is equally spaced in D choked flow district；Described D choked flow PAD, D copper sheet surrounds
Circle and D impedance strip height are equal；Described D copper sheet ring of encirclement opposite sides is respectively arranged with D flow-guiding mouth, the described D copper sheet ring of encirclement
Be provided with the either side of D flow-guiding mouth not with wiring board sides aligned parallel.
By arranging the D copper sheet ring of encirclement in periphery, D impedance area, change medium and flow to, it is to avoid media flow is obstructed in D impedance
Bar edge is piled up and is excessively impacted；It is provided with D choked flow PAD simultaneously, solves to there is difference in height because of D impedance strip by D choked flow PAD
Problem, make medium to flow gently；Not only D choked flow PAD can play the effect of choked flow, and between the D choked flow PAD of point-like
Gap form effective air guide port, quickly discharge gas.Owing to D choked flow PAD is for choked flow and inducing QI, uniform and equidistant divides
Cloth is more beneficial for improving the uniformity of medium, improves the precision of dielectric thickness.The D copper sheet ring of encirclement arrange D flow-guiding mouth play water conservancy diversion,
The effect of inducing QI, can make medium flow in the D copper sheet ring of encirclement, it is to avoid forms cavity impact and combines.The either side of D flow-guiding mouth not with
Wiring board sides aligned parallel, it is possible to be prevented effectively from medium and flow into the excessive velocities in the D copper sheet ring of encirclement, is conducive to controlling D impedance strip
The uniformity of surrounding medium.
The impedance plate production method of a kind of high evenness, including multi-layer sheet pressing working procedure, it is characterised in that: described multi-layer sheet
Pressing working procedure includes
A., two panels Type B plate, some c-type plates and D template are provided；
The most pre-lamination and lamination；
C. PE punching is carried out in multilayer circuit board edge；
D. fusion；
E. riveted；
F. pressing；
Type B plate, c-type plate and D template the inner plating that overlapped are carried out fusing by the present invention successively, riveted with add hot pressing, make
Inner plating gradually strong bonded.Fusion process can make inner plating tentatively combine, to avoid multilayer circuit board plate in riveted operation
Genetic horizon is inclined.The then reinforcing further to multilayer circuit board of riveted operation so that it is high temperature, high pressure heating pressing working procedure in do not send out
Generating layer final pressing success partially.Carry out PE punching in multilayer circuit board edge, on the one hand can be follow-up fusion, riveted and
On the other hand add hot pressing and hole, location is provided, can compensate for the contracting that inner plating produces in the course of processing and rise exception, the most in advance
During anti-multilayer circuit board pressing, genetic horizon is inclined.
Described fusion is to carry out at a temperature of 230-290 DEG C；The described fusion persistent period is 80-120S.
The drilling operating carried out after also including multi-layer sheet pressing working procedure；Its lower cutter speed of described drilling operating is 45-
60IPM；Its time cutter speed of described drilling operating is 750-850IPM.
Owing to the fusion process of the present invention its objective is to reinforce and non-immediate pressing multilayer circuit board, for preventing when fusion
Heat and between too quickly inner plating, occur that contracting rises by exception and layer is inclined, designer the temperature of fusion process is reduced the temperature of fusion process with
Its time of Shi Yanchang.So it is not only able to meet the present invention and tentatively fixes the purpose of multilayer circuit board, also can farthest prevent
Only offset between inner plating.
Described drilling operating institute boring aperture is 0 .2-0 .4mm.
The aperture that drilling operating is holed by the present invention is contracted to 0 .2-0 .4mm, reduces burr further, ailhead goes out
Existing probability, improves boring smoothness, improves product quality.
Further, a copper facing operation and secondary copper facing operation are also included；A described copper facing operation and secondary plating
Copper process is to carry out under 8-12ASF electric current density.
A length of 30-120min when a described copper facing operation and secondary copper facing operation.
By reducing electroplating current, extending electroplating time, it is possible to increase plating grout ability, reduce hole obstructed inclined with hole copper
The quality problem such as thin, it is ensured that product conduction is good.
The beneficial effects of the present invention is:
The pressing working procedure that the present invention is directed to multilayer circuit board is provided with three kinds of templates such as Type B plate, c-type plate and D template, and to every kind
Template is made corresponding pressing optimization and is processed, it is to avoid the scene of gummosis occurs in pressing, and when being each template pressing, dielectric thickness is more
Uniformly, and Type B plate and D template use and intersect the more full and uniform pressure force of mode stacked, and make to be subject to during multilayer circuit board pressing
To power be more uniformly distributed.
Accompanying drawing explanation
Fig. 1 is Type B plate structure schematic diagram of the present invention.
Fig. 2 is c-type plate structure schematic diagram of the present invention.
Fig. 3 is D shaping plate structure schematic diagram of the present invention.
Detailed description of the invention
The present invention is described in further detail below in conjunction with embodiment for the ease of it will be appreciated by those skilled in the art that:
Embodiment 1
The present embodiment provides a kind of 12 sandwich circuit board production methods, as Figure 1-3, including following operation:
Pressing；
Boring；
Copper facing；
Outer layer dry film；
Secondary copper facing；
Erosion copper；
Anti-welding.
Above-mentioned pressing working procedure includes
A., two panels Type B plate, some c-type plates and D template are provided；
The most pre-lamination and lamination；
C. PE perforating press is used to carry out PE punching in 12 sandwich circuit board edges；
D. by above-mentioned PE punching, 12 sandwich circuit boards are positioned, use Heat sealing machine to carry out contact point-like at 12 sandwich circuit board edges of boards
Fusion, fusion temperature is 260 DEG C, and the fusion time is 99s；
E. use above-mentioned PE punching to 12 sandwich circuit board rivetings, location riveted on lock seaming machine；
F. on pressing machine, 12 sandwich circuit boards reinforced through fusion, riveted are added hot pressing.
Above-mentioned drilling operating is in unit, carries out with the lower cutter speed of 50IPM, the cutter speed of returning of 800IPM, is holed
Footpath is 0 .3mm.
Reduce lower cutter speed, go back to cutter speed and reduced bore and all can reduce the probability that drilled edge burring machine ailhead occurs.
Additionally, the folded number that production bore limits, minimizing is holed reducing drill point used also can effectively reduce burr and the nail of drilled edge simultaneously
Head.
Described c-type plate includes outside the unit of wiring board edges of boards, includes the C being provided with C impedance strip C3 outside described unit
C choked flow district C2 beyond impedance area C1 and C impedance area C1, C1 periphery, described C impedance area is provided with C copper sheet ring of encirclement C6, described C
Choked flow district C2 is provided with and is evenly arranged with some C leads around the C copper bar choked flow district C4, described C copper bar choked flow district C4 outside unit
QI KOU C5.Described C copper bar choked flow district C4, C copper sheet ring of encirclement C6 and C impedance strip C3 are the most equal；Described C copper sheet ring of encirclement C6 phase
Both sides are respectively arranged with C flow-guiding mouth C7, described C copper sheet ring of encirclement C6 be provided with the either side of C flow-guiding mouth C7 not with wiring board
Sides aligned parallel.
Described Type B plate includes outside the unit of wiring board edges of boards, is provided with the B choked flow of multiple point-like outside described unit
PADB1.Described B choked flow PADB1 uniformly and is equally spaced outside unit.
Described D template includes outside the unit of wiring board edges of boards, includes the D being provided with D impedance strip D3 outside described unit
D choked flow district D2 beyond impedance area D1 and D impedance area D1, D1 periphery, described D impedance area is provided with D copper sheet ring of encirclement D4, described D
Choked flow district D2 is provided with the D choked flow PADD5 of multiple point-like；Described D choked flow PADD5 uniformly and is equally spaced in D choked flow district D2；
Described D choked flow PADD5, D copper sheet ring of encirclement D4 and D impedance strip D3 are the most equal；Described D copper sheet ring of encirclement D4 opposite sides is respectively
Be provided with D flow-guiding mouth D6, described D copper sheet ring of encirclement D4 be provided with the either side of D flow-guiding mouth D6 not with wiring board sides aligned parallel.
In the number of plies of described lamination operation, secondary lamina rara externa uses c-type plate, and odd number number of plies plate uses Type B plate, even number number of plies plate
Use D template.
In the present embodiment, an above-mentioned copper facing and its electroplating current electric current density of secondary copper facing operation are 11ASF, during plating
Between be 45MIN.
Above-mentioned outer layer dry film, erosion copper, the operation such as anti-welding all use conventional method to realize.
The present embodiment is for the characteristic of 12 sandwich circuit boards, to pressing working procedure, drilling operating and a copper facing, secondary copper facing work
The parameter of sequence is optimized, and not genetic horizon is inclined, drilled edge is smooth, on-state rate is good to make 12 produced sandwich circuit boards have
Advantage, thus realize reducing product fraction defective, the purpose of control production cost.The present embodiment is easily achieved simultaneously, all existing
Improve on production line, be particularly advantageous in large-scale promotion.
Embodiment 2
The present embodiment provides the production method of a kind of 16 sandwich circuit boards, and its operation is consistent with embodiment 1.
Its pressing working procedure includes
A., two panels c-type plate, some Type B plates and D template are provided；
The most pre-lamination and lamination；
C. PE perforating press is used to carry out PE punching in 16 sandwich circuit board edges；
D. by above-mentioned PE punching, 16 sandwich circuit boards are positioned, use Heat sealing machine to carry out contact point-like at 16 sandwich circuit board edges of boards
Fusion, fusion temperature is 235 DEG C, and the fusion time is 89s；
E. use above-mentioned PE punching to 16 sandwich circuit board rivetings, location riveted on lock seaming machine；
F. 16 sandwich circuit boards that alignment fusion, riveted are reinforced on pressing machine carry out adding hot pressing.
In the present embodiment, drilling operating is in perforating press, enters with the lower cutter speed of 45IPM, the cutter speed of returning of 760IPM
OK, institute's hole diameter is 0 .2mm.
In the present embodiment, an above-mentioned copper facing and its electroplating current electric current density of secondary copper facing operation are 9ASF, during plating
Between be 40MIN.
16 sandwich circuit boards that the present embodiment is provided are without the inclined phenomenon of layer, without gummosis, wiring board cross section thickness of dielectric layers
Uniformly without cavity, on-state rate is good.
Embodiment 3
The present embodiment provides the production method of a kind of 20 sandwich circuit boards, and its operation is consistent with embodiment 1.
Its pressing working procedure includes
A., two panels c-type plate, some Type B plates and D template are provided；
The most pre-lamination and lamination；
C. PE perforating press is used to carry out PE punching in 20 sandwich circuit board edges；
D. by above-mentioned PE punching, 20 sandwich circuit boards are positioned, use Heat sealing machine to carry out contact point-like at 20 sandwich circuit board edges of boards
Fusion, fusion temperature is 290 DEG C, and the fusion time is 115s；
E. use above-mentioned PE punching to 20 sandwich circuit board rivetings, location riveted on lock seaming machine；
F. on pressing machine, 20 sandwich circuit boards reinforced through fusion, riveted are added hot pressing.
In the present embodiment, drilling operating is in perforating press, enters with the lower cutter speed of 58IPM, the cutter speed of returning of 850IPM
OK, institute's hole diameter is 0 .4mm.
In the present embodiment, an above-mentioned copper facing and its electroplating current electric current density of secondary copper facing operation are 12ASF, during plating
Between be 40MIN.
20 sandwich circuit boards that the present embodiment is provided are without the inclined phenomenon of layer, without gummosis, wiring board cross section thickness of dielectric layers
Uniformly without cavity, on-state rate is good.
Being more than the wherein specific implementation of the present invention, it describes more concrete and detailed, but can not therefore manage
Solve as the restriction to the scope of the claims of the present invention.It should be pointed out that, for the person of ordinary skill of the art, without departing from
On the premise of present inventive concept, it is also possible to make some deformation and improvement, these obvious alternative forms belong to this
Bright protection domain.The ins and outs not described in detail in the present invention all can be by realizing any one of prior art.
Claims (8)
1. the impedance plate of a high evenness, it is characterised in that: include that the wiring board that multilamellar is sequentially overlapped, described wiring board include
Type B plate, c-type plate and D template, in the number of plies of described wiring board, secondary lamina rara externa uses c-type plate, and odd number number of plies plate uses Type B plate,
Even number number of plies plate uses D template；
Described Type B plate includes outside the unit of wiring board edges of boards, is provided with the B choked flow PAD of multiple point-like outside described unit；
Described c-type plate includes outside the unit of wiring board edges of boards, includes the C impedance area being provided with C impedance strip outside described unit
And the C choked flow district beyond C impedance area, periphery, described C impedance area is provided with the C copper sheet ring of encirclement, and described C choked flow district is provided with cincture
C copper bar choked flow district outside unit, described C copper bar choked flow district is evenly arranged with some C air guide ports；
Described D template includes outside the unit of wiring board edges of boards, includes the D impedance area being provided with D impedance strip outside described unit
And the D choked flow district beyond D impedance area, periphery, described D impedance area is provided with the D copper sheet ring of encirclement, and described D choked flow district is provided with multiple
The choked flow PAD of point-like.
The impedance plate of a kind of high evenness the most according to claim 1, it is characterised in that: described B choked flow PAD uniformly and etc.
Away from being distributed in outside unit.
The impedance plate of a kind of high evenness the most according to claim 1, it is characterised in that: described C copper bar choked flow district, C copper
Suitcase enclosure and C impedance strip height are equal；Described C copper sheet ring of encirclement opposite sides is respectively arranged with C flow-guiding mouth, described C copper sheet
The ring of encirclement be provided with the either side of C flow-guiding mouth not with wiring board sides aligned parallel.
The impedance plate of a kind of high evenness the most according to claim 1, it is characterised in that: described D choked flow PAD uniformly and etc.
Away from being distributed in D choked flow district；Described D choked flow PAD, D copper sheet ring of encirclement and D impedance strip height are equal；Described D copper sheet ring of encirclement phase
Both sides are respectively arranged with D flow-guiding mouth, and the described D copper sheet ring of encirclement is provided with the either side of D flow-guiding mouth and does not puts down with wiring board edge
OK.
5. an impedance plate production method for high evenness, including multi-layer sheet pressing working procedure, it is characterised in that: described multi-layer sheet pressure
Conjunction operation includes
A., two panels Type B plate, some c-type plates and D template are provided；
The most pre-lamination and lamination；
C. PE punching is carried out in multilayer circuit board edge；
D. fusion；
E. riveted；
F. pressing；
Described fusion is to carry out at a temperature of 230-290 DEG C；The described fusion persistent period is 80-120s；
The drilling operating carried out after also including multi-layer sheet pressing working procedure；Its lower cutter speed of described drilling operating is 45-60IPM；Institute
Stating its time cutter speed of drilling operating is 750-850IPM.
The impedance plate production method of a kind of high evenness the most according to claim 5, it is characterised in that: described drilling operating
Institute's boring aperture is 0 .2-0 .4mm.
The impedance plate production method of a kind of high evenness the most according to claim 5, it is characterised in that: also include once plating
Copper process and secondary copper facing operation；A described copper facing operation and secondary copper facing operation are to carry out under 8-12ASF electric current density.
The impedance plate production method of a kind of high evenness the most according to claim 7, it is characterised in that: a described copper facing
A length of 30-50min when operation and secondary copper facing operation.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610731496.9A CN106163096B (en) | 2016-08-26 | 2016-08-26 | A kind of impedance plate and its production method of high evenness |
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| CN201610731496.9A CN106163096B (en) | 2016-08-26 | 2016-08-26 | A kind of impedance plate and its production method of high evenness |
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| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
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| CN109874232A (en) * | 2019-03-05 | 2019-06-11 | 深圳崇达多层线路板有限公司 | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed |
| CN109922612A (en) * | 2019-03-22 | 2019-06-21 | 深圳明阳电路科技股份有限公司 | A kind of HDI board manufacturing method and HDI plate |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
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Effective date of registration: 20201224 Address after: 526070 no.435, building B, Zhaoqing New District Investment Development Co., Ltd., north 8 District, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: 516200 Changbu Village, Xinwei Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: AOSHIKONG PRECISION CIRCUIT (HUIZHOU) Co.,Ltd. |