CN102458033A - Inner-layer plate side structure of thick-copper printed circuit board - Google Patents
Inner-layer plate side structure of thick-copper printed circuit board Download PDFInfo
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- CN102458033A CN102458033A CN201010510494XA CN201010510494A CN102458033A CN 102458033 A CN102458033 A CN 102458033A CN 201010510494X A CN201010510494X A CN 201010510494XA CN 201010510494 A CN201010510494 A CN 201010510494A CN 102458033 A CN102458033 A CN 102458033A
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- circuit board
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- copper
- side structure
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Abstract
The invention relates to an inner-layer plate side structure of a thick-copper printed circuit board. The inner-layer plate side structure of the thick-copper printed circuit board comprises a plurality of square current-limiting copper blocks which respectively form a unified angle with plate sides; and a gap is formed between every two square current-limiting copper blocks. Compared with the prior art, glue flowing channels are reduced by setting the unified square current-limiting copper blocks, so that the problem that the glue excessively flows in the board pressing process is avoided; and in addition, the phenomena of hickie on the inner layer, non-uniformity of board thickness, layering, board separation, board sliding and the like are avoided.
Description
Technical field
The present invention relates to a kind of circuit board internal layer edges of boards structure, especially relate to a kind of thick copper printed circuit board internal layer edges of boards structure.
Background technology
Along with the electronics industry develop rapidly, the demand in fields such as automobile, industrial equipment, electronic communications to the printed wiring board of high voltage, big electric current is more and more, and the application of the thick copper printed board of multilayer is also just more and more.Thick copper coin described here refers to that copper is thick in the above printed wiring board of 105um.At present; During internal layer in producing multi-layer sheet; The internal layer edges of boards usually carry out choked flow with the point-like choker bar, but when processing this type of thick copper coin, the glue of interlayer is easy to flow out from the passage between the point-like choker bar; Thereby be directed at figure filler deficiency in the plate, produce phenomenons such as thickness of slab is inhomogeneous, plate bursting, hickie, slide plate.
Summary of the invention
The object of the invention is exactly for the defective that overcomes above-mentioned prior art existence a kind of internal layer hickie that reduces in process of production to be provided, and avoids the uneven thick copper printed circuit board internal layer edges of boards structure of thickness of slab after the moulding.
The object of the invention can be realized through following technical scheme:
A kind of thick copper printed circuit board internal layer edges of boards structure; Said thick copper printed circuit board edges of boards structure includes a plurality of square choked flow copper billets, and said square choked flow copper billet all becomes unified angle with edges of boards, be best with the miter angle; Between each square choked flow copper billet the space is arranged all; Copper billet forms many parallel guiding gutters with the spacing of copper billet, and the width of guiding gutter is with doing suitable adjustment according to different copper is thick, as enlarging or dwindling; The glue of interlayer will flow out from guiding gutter under lamination production process HTHP; Because guiding gutter width design is suitable, and parallel staggered, thereby avoided hickie, the thickness of slab of the moving too fast generation of solation of interlayer inhomogeneous, quality defects such as plate bursting, slide plate.
Compared with prior art, the present invention has reduced the gummosis passage through unified square choked flow copper billet is set, and has avoided the too much problem of gummosis in the pressing plate process, and has avoided the generation of phenomenons such as internal layer hickie, thickness of slab inequality, layering, plate bursting, slide plate.
Description of drawings
Fig. 1 is the thick copper printed circuit board of a present invention internal layer edges of boards structural representation,
Wherein: 1-square choked flow copper billet, 2-guiding gutter, the thick copper printed circuit board of 3-.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated.
As shown in the figure; A kind of thick copper printed circuit board internal layer edges of boards structure, thick copper printed circuit board 3 edges of boards structures include a plurality of square choked flow copper billets 1, and square choked flow copper billet 1 all becomes unified miter angle with edges of boards; Between each square choked flow copper billet 1 space is arranged all; Copper billet forms many parallel guiding gutters 2 with the spacing of copper billet, and the width of guiding gutter 2 is with doing suitable adjustment according to different copper is thick, as enlarging or dwindling; The glue of interlayer will flow out from guiding gutter 2 under lamination production process HTHP; Because guiding gutter 2 width designs is suitable, and parallel staggered, thereby avoided hickie, the thickness of slab of the moving too fast generation of solation of interlayer inhomogeneous, quality defects such as plate bursting, slide plate.
Claims (2)
1. thick copper printed circuit board internal layer edges of boards structure; It is characterized in that; Said thick copper printed circuit board edges of boards structure includes a plurality of square choked flow copper billets, and said square choked flow copper billet all becomes unified angle with edges of boards, between each square choked flow copper billet the space is arranged all.
2. a thick copper printed circuit board internal layer edges of boards structure is characterized in that, said square choked flow copper billet becomes unified angle with edges of boards be 45 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010510494XA CN102458033A (en) | 2010-10-18 | 2010-10-18 | Inner-layer plate side structure of thick-copper printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010510494XA CN102458033A (en) | 2010-10-18 | 2010-10-18 | Inner-layer plate side structure of thick-copper printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102458033A true CN102458033A (en) | 2012-05-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010510494XA Pending CN102458033A (en) | 2010-10-18 | 2010-10-18 | Inner-layer plate side structure of thick-copper printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN102458033A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596361A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Flow choking strip for printed circuit board |
| CN105101625A (en) * | 2015-09-02 | 2015-11-25 | 竞陆电子(昆山)有限公司 | Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards |
| CN106163096A (en) * | 2016-08-26 | 2016-11-23 | 奥士康精密电路（惠州）有限公司 | The impedance plate of a kind of high evenness and production method thereof |
| CN106255326A (en) * | 2016-08-26 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip |
| CN106255327A (en) * | 2016-08-26 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of impedance plate thickness of dielectric layers control method |
| CN107529294A (en) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN109640547A (en) * | 2018-12-01 | 2019-04-16 | 广东骏亚电子科技股份有限公司 | A method of improving multilayer circuit board interlayer alignment precision |
| CN112291950A (en) * | 2020-10-20 | 2021-01-29 | 江西强达电路科技有限公司 | Multilayer board prevent flowing and glue shift structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
| CN201378896Y (en) * | 2009-02-27 | 2010-01-06 | 深圳市博敏兴电子有限公司 | Inner plate edge structure for producing printed circuit boards |
| CN201491375U (en) * | 2009-08-19 | 2010-05-26 | 广东依顿电子科技股份有限公司 | Inner-layer reducing-flow structure of circuit board |
| CN101772263A (en) * | 2009-12-31 | 2010-07-07 | 广州杰赛科技股份有限公司 | Embedded capacitance printed circuit board and production method thereof |
| CN101778543A (en) * | 2010-02-04 | 2010-07-14 | 深南电路有限公司 | Multi-layer printed circuit board machining process |
-
2010
- 2010-10-18 CN CN201010510494XA patent/CN102458033A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
| CN201378896Y (en) * | 2009-02-27 | 2010-01-06 | 深圳市博敏兴电子有限公司 | Inner plate edge structure for producing printed circuit boards |
| CN201491375U (en) * | 2009-08-19 | 2010-05-26 | 广东依顿电子科技股份有限公司 | Inner-layer reducing-flow structure of circuit board |
| CN101772263A (en) * | 2009-12-31 | 2010-07-07 | 广州杰赛科技股份有限公司 | Embedded capacitance printed circuit board and production method thereof |
| CN101778543A (en) * | 2010-02-04 | 2010-07-14 | 深南电路有限公司 | Multi-layer printed circuit board machining process |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596361A (en) * | 2013-10-11 | 2014-02-19 | 大连太平洋电子有限公司 | Flow choking strip for printed circuit board |
| CN105101625A (en) * | 2015-09-02 | 2015-11-25 | 竞陆电子(昆山)有限公司 | Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards |
| CN106163096A (en) * | 2016-08-26 | 2016-11-23 | 奥士康精密电路（惠州）有限公司 | The impedance plate of a kind of high evenness and production method thereof |
| CN106255326A (en) * | 2016-08-26 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip |
| CN106255327A (en) * | 2016-08-26 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | A kind of impedance plate thickness of dielectric layers control method |
| CN106255327B (en) * | 2016-08-26 | 2019-12-03 | 奥士康精密电路（惠州）有限公司 | A kind of impedance plate thickness of dielectric layers control method |
| CN106163096B (en) * | 2016-08-26 | 2019-12-03 | 奥士康精密电路（惠州）有限公司 | A kind of impedance plate and its production method of high evenness |
| CN106255326B (en) * | 2016-08-26 | 2019-12-03 | 奥士康精密电路（惠州）有限公司 | A kind of multilayer impedance circuit board producing method improving edges of boards impedance strip |
| CN107529294A (en) * | 2017-09-27 | 2017-12-29 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN109640547A (en) * | 2018-12-01 | 2019-04-16 | 广东骏亚电子科技股份有限公司 | A method of improving multilayer circuit board interlayer alignment precision |
| CN112291950A (en) * | 2020-10-20 | 2021-01-29 | 江西强达电路科技有限公司 | Multilayer board prevent flowing and glue shift structure |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120516 |