CN201491375U - Inner-layer reducing-flow structure of circuit board - Google Patents

Inner-layer reducing-flow structure of circuit board Download PDF

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Publication number
CN201491375U
CN201491375U CN2009201933138U CN200920193313U CN201491375U CN 201491375 U CN201491375 U CN 201491375U CN 2009201933138 U CN2009201933138 U CN 2009201933138U CN 200920193313 U CN200920193313 U CN 200920193313U CN 201491375 U CN201491375 U CN 201491375U
Authority
CN
China
Prior art keywords
circuit board
block
flow
layer
internal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009201933138U
Other languages
Chinese (zh)
Inventor
莫介云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GUANG DONG ELLINGTON ELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
GUANG DONG ELLINGTON ELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GUANG DONG ELLINGTON ELECTRONICS TECHNOLOGY Co Ltd filed Critical GUANG DONG ELLINGTON ELECTRONICS TECHNOLOGY Co Ltd
Priority to CN2009201933138U priority Critical patent/CN201491375U/en
Application granted granted Critical
Publication of CN201491375U publication Critical patent/CN201491375U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model discloses an inner-layer reducing-flow structure of a circuit board, comprising a circuit board inner-layer board, and the board edge of the circuit board inner-layer board is provided with a strip-shaped reducing-flow block, and the strip-shaped reducing-flow block is provided with a plurality of fluid channels, and a plurality of block-shaped reducing-flow blocks are formed between the fluid channels. The utility model aims at overcoming shortcomings in prior art, and provides the inner-layer reducing-flow structure of the circuit board which has simple structure and can effectively prevent deformation of the board edge, the inner-layer deviation, layering and explosion plate and other defects.

Description

A kind of circuit board internal layer choked flow structure
[technical field]
The utility model relates to a kind of circuit board internal layer choked flow structure.
[background technology]
Circuit board such as rigid circuit board, flexible PCB are widely used in electronic applications.In the technology that multilayer circuit board is produced, all be to adopt the point-like choker bar to carry out choked flow usually on the edges of boards of inner plating, see Fig. 1.Glue is easy to spill out from the passage between the point-like choker bar in the process of pressing plate.Edges of boards filler deficiency be can cause like this, thereby edges of boards distortion, defectives such as internal layer off normal, layering and plate bursting caused.
[utility model content]
The utility model purpose is to have overcome deficiency of the prior art, provides a kind of simple in structure, can effectively prevent the edges of boards distortion, the block choked flow structure of the circuit board internal layer of defectives such as internal layer off normal, layering and plate bursting.
The utility model is achieved through the following technical solutions:
A kind of circuit board internal layer choked flow structure, comprise the circuit board inner plating, on the edges of boards of described circuit board inner plating, be provided with the strip choker bar, on described strip choker bar, be provided with a plurality of fluid passages, between described fluid passage, form a plurality of block choker bars.
Aforesaid a kind of circuit board internal layer choked flow structure is characterized in that described block choker bar is a parallelogram.
Aforesaid a kind of circuit board internal layer choked flow structure is characterized in that described fluid passage is set in parallel between the block choker bar.
Compared with prior art, the utility model has following advantage:
The utility model is provided with block choker bar on the edges of boards of inner plating, between block choker bar, form the fluid passage that be arranged in parallel, the many problems of gummosis in the pressing plate process have been reduced, both effectively prevented plate bursting because of edges of boards filler deficiency, effectively prevent inner plating edges of boards local deformation again, reduce the internal layer thin plate and carry defectives such as producing off normal, layering in the production process.
[description of drawings]
Fig. 1 is the schematic diagram of existing inner plating;
Fig. 2 is a schematic diagram of the present utility model;
Fig. 3 circuit board edges of boards place generalized section.
[embodiment]
Below in conjunction with accompanying drawing the utility model is elaborated:
A kind of circuit board internal layer choked flow structure shown in Fig. 2 and 3, comprise circuit board inner plating 1, on the edges of boards of described circuit board inner plating 1, be provided with the strip choker bar, on described strip choker bar, be provided with a plurality of fluid passages 3, between described fluid passage 3, form a plurality of block choker bars 2.
Block choker bar 2 described in the utility model is a parallelogram.Described fluid passage 3 is set in parallel between the block choker bar 2.Described fluid passage 3 is parallel with the hypotenuse of block choker bar 2.
On the edges of boards of inner plating 1, be provided with block choker bar 2 in the utility model, between block choker bar 2, form the fluid passage 3 that be arranged in parallel, the many problems of gummosis in the pressing plate process have been reduced, effectively prevent plate bursting because of edges of boards filler deficiency, effectively prevent inner plating 1 edges of boards local deformation, reduce the internal layer thin plate and carry defectives such as producing off normal, layering in the production process.

Claims (3)

1. circuit board internal layer choked flow structure, comprise circuit board inner plating (1), it is characterized in that: on the edges of boards of described circuit board inner plating (1), be provided with the strip choker bar, on described strip choker bar, be provided with a plurality of fluid passages (3), between described fluid passage (3), form a plurality of block choker bars (2).
2. a kind of circuit board internal layer choked flow structure according to claim 1 is characterized in that described block choker bar (2) is a parallelogram.
3. a kind of circuit board internal layer choked flow structure according to claim 1 is characterized in that described fluid passage (3) is set in parallel between the block choker bar (2).
CN2009201933138U 2009-08-19 2009-08-19 Inner-layer reducing-flow structure of circuit board Expired - Lifetime CN201491375U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009201933138U CN201491375U (en) 2009-08-19 2009-08-19 Inner-layer reducing-flow structure of circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009201933138U CN201491375U (en) 2009-08-19 2009-08-19 Inner-layer reducing-flow structure of circuit board

Publications (1)

Publication Number Publication Date
CN201491375U true CN201491375U (en) 2010-05-26

Family

ID=42430237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009201933138U Expired - Lifetime CN201491375U (en) 2009-08-19 2009-08-19 Inner-layer reducing-flow structure of circuit board

Country Status (1)

Country Link
CN (1) CN201491375U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458033A (en) * 2010-10-18 2012-05-16 上海嘉捷通电路科技有限公司 Inner-layer plate side structure of thick-copper printed circuit board
CN105101625A (en) * 2015-09-02 2015-11-25 竞陆电子(昆山)有限公司 Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102458033A (en) * 2010-10-18 2012-05-16 上海嘉捷通电路科技有限公司 Inner-layer plate side structure of thick-copper printed circuit board
CN105101625A (en) * 2015-09-02 2015-11-25 竞陆电子(昆山)有限公司 Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards

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Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CX01 Expiry of patent term

Granted publication date: 20100526

CX01 Expiry of patent term