CN107529294A - A kind of PCB preparation method and PCB - Google Patents
A kind of PCB preparation method and PCB Download PDFInfo
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- CN107529294A CN107529294A CN201710978940.1A CN201710978940A CN107529294A CN 107529294 A CN107529294 A CN 107529294A CN 201710978940 A CN201710978940 A CN 201710978940A CN 107529294 A CN107529294 A CN 107529294A
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- choked flow
- flow module
- module unit
- dried flower
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of PCB preparation method, it is related to PCB processing technique fields, comprises the following steps：Identify dried flower risk zones；Choker bar group is set in dried flower risk zones.The resin in prepreg between bonding processes middle level enters can be sufficient filling with no copper region without the guide functions behind copper region due to choker bar group, improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part can be also sufficient filling with by resin.And then realize and occur the defects of dried flower, yields when lifting PCB makes in effectively prevention PCB manufacturing process.The invention also discloses a kind of PCB, including line pattern region and dried flower risk zones, choker bar group is provided with dried flower risk zones, choker bar group is made up of some choked flow module units, gap is provided between adjacent choked flow module unit, the material of choked flow module unit is copper, and the gross area of choked flow module unit is more than 20 the percent of the area of choker bar group.
Description
Technical field
The present invention relates to the preparation method and PCB of PCB processing technique fields, more particularly to a kind of PCB.
Background technology
The making of multi-layer PCB is that resin melting solidification is bonded together in bonding processes by interlaminar bonding piece.PCB is pressed
The dried flower (hickie) occurred afterwards is that PCB is manufactured the defects of middle a kind of common, and taking the form of for dried flower goes out in dried flower region
Existing hickie, essential reason is that the resin glue in bonding sheet can not be filled up completely with PCB inter-pattern spaces.The reason for causing the phenomenon has very
It is more, such as press equipment exception, pressing programming is unreasonable, and bonding sheet fluidity is low, and inner figure designs unreasonable, internal layer
Copper thickness thicker (>=1oz, 1oz are defined as the copper layer thickness of one square chi of area one side covering copper foil weight 1oz (28.35g)), milk
Core intersection (Butter coat thickness) deficiency etc..Major consequences caused by the defect have：Dried flower area inner layer goes out
Easily layering etc. after internal layer circuit connection short circuit, thermal stress after existing cavity, via hole metal.
For drawbacks described above, current way is：Before PCB pressings, padded coaming (aluminium flake or ox-hide are provided to it
Paper), make PCB uniform forces in bonding processes.Current way can prevent the high resin production of mobility to a certain extent
Raw dried flower problem, but the resin low to mobility, present practice still can not effectively prevent.Simultaneously current this method is also deposited
Deficiency be：, it is necessary to add padded coaming in the case of there is no specific aim Define defects, and cause unnecessary supplies wave
Take, it is impossible at utmost scrapped caused by reduction pressing dried flower.
The content of the invention
It is an object of the present invention to provide a kind of PCB preparation method, can effectively prevent to occur in PCB manufacturing process
The defects of dried flower, the PCB yields of making are high.
It is another object of the present invention to provide a kind of PCB, the trunciflory inside PCB is less, and PCB quality is high.
To use following technical scheme up to this purpose, the present invention：
On the one hand, there is provided a kind of PCB preparation method, comprise the following steps：
Identify dried flower risk zones；
Choker bar group is set in dried flower risk zones；
Pressing and following process program.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
CAM (computer Aided Manufacturing, the area of computer aided used during according to PCB design and production
Manufacture) data identifies easily occur the region of dried flower in bonding processes, as dried flower risk zones；Or by production process
The region for dried flower occur in the useless plate of output is counted, the standard of further Statistical error dried flower risk zones.
According to the dried flower risk zones identified, choker bar group is set in dried flower risk zones, in bonding processes middle level
Between prepreg in resin enter and without the guide functions behind copper region due to choker bar group can be sufficient filling with no copper region,
Improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part can also be set
Fat is sufficient filling with.And then realize and occur the defects of dried flower, yields when lifting PCB makes in effectively prevention PCB manufacturing process.
Ensure certain gap be present between the border of choker bar group and the border in line pattern region simultaneously, as circuit
The safe distance of the shielding of signal.
Preferably, step：Identify that dried flower risk zones are specifically：
Filter out area more than or equal to 900 square millimeters without copper region as dried flower risk zones.
Further, according to CAM Data selections go out area more than or equal to 900 square millimeters without copper region as dried flower
Risk zones.Because the physical property between the PCB of the different numbers of plies has corresponding difference, therefore can be selected according to specifically situation
Select suitable dried flower risk zones.
Preferably, be 800 square millimeters by area, 810 square millimeters, 820 square millimeters, 830 square millimeters, it is 840 flat
980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters conducts of square millimeter ...
Dried flower risk zones.
Meanwhile in order to further improve the yields that PCB is manufactured, ensure that preparation method is applicable the PCB of the different numbers of plies,
Dried flower defect area is counted in PCB production processes, the standard of further Statistical error dried flower risk zones.
Preferably, step：Identify that dried flower risk zones are specifically：
If being more than six layers with the continuous number of plies without copper region, and there is intersection without copper region on adjacent layer,
Then using every layer without copper region as dried flower risk zones.
For multi-layer PCB, if continuous multilayer all has without copper region, while meet that there is weight without copper region on adjacent layer
Part is closed, can not ensure that resin sufficiently flows in pressing, resin can not be filled up completely with no copper region and line pattern is reached the standard grade
Gap between road, then using on above-mentioned pantostrat without copper region as dried flower risk zones.
Without copper region there is intersection to refer on above-mentioned adjacent layer：When PCB is kept flat, adjacent layer Shang Wutong areas
There is intersection between the projection of domain in the horizontal plane.
Preferably, if it is four layers, five layers, six layers, seven layers, eight layers, nine layers ... 18 to have without the continuous number of plies in copper region
Layer, 19 layers or 20 layers, and there is intersection without copper region on adjacent layer, then using every layer without copper region as doing
Flower risk zones.
Preferably, choker bar group is made up of some choked flow module units, gap, choked flow are provided between adjacent choked flow module unit
The material of module unit is copper, and the gross area of choked flow module unit is more than 20 the percent of the area of choker bar group.
Further, the choked flow module unit on adjacent layer is laid with same position or staggeredly laid, namely on adjacent layer
The projection in the horizontal plane of choked flow module unit be completely superposed or without any intersection region.
Preferably, the choked flow module unit on adjacent layer can also be set in a manner of partly overlapping, namely on adjacent layer
The projection section of choked flow module unit in the horizontal plane overlaps.
Several choked flow module units form choker bar group with suitable arrangement mode, during pressing resin choked flow module unit it
Between gap flowing, form guiding gutter because the gap between choked flow module unit is similar to, therefore improve the mobility of resin
And directionality when enriching resin flowing, ensure that resin can be sufficient filling with no copper region, while in circuit visuals
Trace clearance can be also sufficient filling with by resin.Further enhance the uniformity and popularity of resin distribution in bonding processes.
Preferably, choked flow module unit is circle, the radius of choked flow module unit is less than or equal to 1.27 millimeters.
Choked flow module unit for circle, it is preferred that the radius of choked flow module unit be 0.90 millimeter, 0.91 millimeter, 0.92 millimeter,
0.93 millimeter, 0.94 millimeter, 0.95 millimeter ... 1.75 millimeters, 1.76 millimeters, 1.77 millimeters, 1.78 millimeters, 1.79 millimeters or
1.80 millimeter.
Preferably, choked flow module unit is hexagon, the center of choked flow module unit to any limit of choked flow module unit away from
From less than or equal to 1.27 millimeters.
Further, choked flow module unit is alternatively other figures in addition to circular and hexagon.
Preferably, the centre distance between adjacent choked flow module unit is equal, and the center between adjacent choked flow module unit
Distance is less than or equal to M, M=(2*D+2) millimeter；
Wherein, D be choked flow module unit center to edge vertical range.
Specifically, when choked flow module unit is circular, D is the radius of choked flow module unit；When choked flow module unit is hexagon
When, D is the length of the vertical line between the center and sideline of choked flow module unit.
On the other hand, there is provided a kind of PCB, including line pattern region and dried flower risk zones, set in dried flower risk zones
There is choker bar group, choker bar group is made up of some choked flow module units, and gap is provided between adjacent choked flow module unit.
Line pattern region is specially：Region with configuration, circuit layout wiring is carried out according to designing early stage
Region, there is also certain gap between each circuit.
Dried flower risk zones are specially：Area is more than or equal to 900 square millimeters without copper region；
Or for multi-layer PCB, if continuous multilayer all has without copper region, while meet on adjacent layer without copper region
Then on above-mentioned pantostrat it is dried flower risk zones without copper region with intersection.
Preferably, be 800 square millimeters by area, 810 square millimeters, 820 square millimeters, 830 square millimeters, it is 840 flat
980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters conducts of square millimeter ...
Dried flower risk zones.
Further, if it is four layers, five layers, six layers, seven layers, eight layers, nine layers ... ten to have without the continuous number of plies in copper region
Eight layers, 19 layers or 20 layers, and there is intersection without copper region on adjacent layer, then using every layer without copper region as
Dried flower risk zones.
The resin in prepreg between bonding processes middle level enter without behind copper region due to the choked flow in choker bar group
The guide functions of module unit can be sufficient filling with no copper region, improve the flowing of resin indirectly further as guide functions
Property so that the trace clearance in line pattern part can be also sufficient filling with by resin.And then realize effectively prevention PCB manufacturing process
In there is the defects of dried flower, improve PCB quality.
Ensure certain gap be present between the border of choker bar group and the border in line pattern region simultaneously, as circuit
The safe distance of the shielding of signal.
Preferably, the material of choked flow module unit is copper, the gross area of choked flow module unit is the hundred of the area of choker bar group
/ bis- more than ten, choked flow module unit is circle, and the radius of choked flow module unit is less than or equal to 1.27 millimeters；
Or choked flow module unit is hexagon, the distance of center to any limit of choked flow module unit of choked flow module unit is small
In or equal to 1.27 millimeters.
When choked flow module unit is circle, it is preferred that the radius of choked flow module unit is 0.90 millimeter, 0.91 millimeter, 0.92 milli
Rice, 0.93 millimeter, 0.94 millimeter, 0.95 millimeter ... 1.75 millimeters, 1.76 millimeters, 1.77 millimeters, 1.78 millimeters, 1.79 milli
Rice or 1.80 millimeters.
Further, choked flow module unit is alternatively other figures in addition to circular and hexagon.
Preferably, the centre distance between adjacent choked flow module unit is equal, and the center between adjacent choked flow module unit
Distance is less than or equal to M, M=(2*D+2) millimeter；
Wherein, D be choked flow module unit center to edge vertical range.
Specifically, when choked flow module unit is circular, D is the radius of choked flow module unit；When choked flow module unit is hexagon
When, D is the length of the vertical line between the center and sideline of choked flow module unit.
Beneficial effects of the present invention：The resin in prepreg between bonding processes middle level enter without behind copper region due to
The guide functions of choker bar group can be sufficient filling with no copper region, improve the flowing of resin indirectly further as guide functions
Property so that the trace clearance in line pattern part can be also sufficient filling with by resin.And then realize effectively prevention PCB manufacturing process
In there is the defects of dried flower, yields when lifting PCB makes.
Due to the effect of choker bar group, resin can be sufficient filling between the circuit in no copper region and line pattern part
Gap, improve the quality of PCB product.
Brief description of the drawings
Fig. 1 is the FB(flow block) of PCB preparation methods；
Fig. 2 is PCB exploded view (when choked flow module unit is circular)；
Fig. 3 is the structural representation of choker bar group (when choked flow module unit is circular)；
Fig. 4 is circuit graphics field and the structural representation of dried flower risk zones on core plate；
Fig. 5 is PCB exploded view (when choked flow module unit is hexagon)；
Fig. 6 is the structural representation of choker bar group (when choked flow module unit is hexagon)；
In figure：
1st, line pattern region；
2nd, dried flower risk zones；
3rd, choker bar group；301st, choked flow module unit.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one
As Figure 1-4, a kind of PCB preparation method, comprises the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
CAM (computer Aided Manufacturing, the area of computer aided used during according to PCB design and production
Manufacture) data identifies easily occur the region of dried flower in bonding processes, as dried flower risk zones 2；Or by production process
The region for dried flower occur in the useless plate of middle output is counted, the standard of further Statistical error dried flower risk zones 2.
According to the dried flower risk zones 2 identified, choker bar group 3 is set in dried flower risk zones 2, in bonding processes
Resin in the prepreg of interlayer enters can be sufficient filling with Wu Tongqu without the guide functions behind copper region due to choker bar group 3
Domain, improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part also can
It is sufficient filling with by resin.And then realize occur the defects of dried flower in effectively prevention PCB manufacturing process, it is good when lifting PCB makes
Product rate.
Ensure certain gap be present between the border of choker bar group 3 and the border in line pattern region 1 simultaneously, as line
The safe distance of the shielding of road signal.
Identify that dried flower risk zones 2 are specifically：
According to CAM Data selections go out area more than or equal to 900 square millimeters without copper region as dried flower risk zones
2。
Preferably, be 800 square millimeters by area, 810 square millimeters, 820 square millimeters, 830 square millimeters, it is 840 flat
980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters conducts of square millimeter ...
Dried flower risk zones 2.
Meanwhile in order to further improve the yields that PCB is manufactured, ensure that preparation method is applicable the PCB of the different numbers of plies,
Dried flower defect area is counted in PCB production processes, the standard of further Statistical error dried flower risk zones 2.
Choker bar group 3 is made up of some choked flow module units 301, and gap, choker bar are provided between adjacent choked flow module unit 301
The material of unit 301 is copper, and the gross area of choked flow module unit 301 is more than 20 the percent of the area of choker bar group 3.
Several choked flow module units 301 form choker bar group 3 with suitable arrangement mode, and resin is in choker bar list during pressing
Gap flowing between member 301, guiding gutter is formed because the gap between choked flow module unit 301 is similar to, therefore improve tree
The mobility of fat and enrich resin flowing when directionality, ensure resin can be sufficient filling with no copper region, while line map
Trace clearance in shape part can be also sufficient filling with by resin.Further enhance in bonding processes the uniformity of resin distribution with
Popularity.
Choked flow module unit 301 is circle, and the radius of choked flow module unit 301 is less than or equal to 1.27 millimeters.
Choked flow module unit 301 for circle, it is preferred that the radius of choked flow module unit 301 be 0.90 millimeter, 0.91 millimeter,
0.92 millimeter, 0.93 millimeter, 0.94 millimeter, 0.95 millimeter ... 1.75 millimeters, 1.76 millimeters, 1.77 millimeters, 1.78 millimeters,
1.79 millimeters or 1.80 millimeters.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Further, choked flow module unit 301 is alternatively other figures than circular.
Embodiment two
As shown in Fig. 1 and Fig. 4-6, a kind of PCB preparation method, comprise the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
CAM (computer Aided Manufacturing, the area of computer aided used during according to PCB design and production
Manufacture) data identifies easily occur the region of dried flower in bonding processes, as dried flower risk zones 2；Or by production process
The region for dried flower occur in the useless plate of middle output is counted, the standard of further Statistical error dried flower risk zones 2.
According to the dried flower risk zones 2 identified, choker bar group 3 is set in dried flower risk zones 2, in bonding processes
Resin in the prepreg of interlayer enters can be sufficient filling with Wu Tongqu without the guide functions behind copper region due to choker bar group 3
Domain, improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part also can
It is sufficient filling with by resin.And then realize occur the defects of dried flower in effectively prevention PCB manufacturing process, it is good when lifting PCB makes
Product rate.
Ensure certain gap be present between the border of choker bar group 3 and the border in line pattern region 1 simultaneously, as line
The safe distance of the shielding of road signal.
Identify that dried flower risk zones 2 are specifically：
If being more than six layers with the continuous number of plies without copper region, and there is intersection without copper region on adjacent layer,
Then using every layer without copper region as dried flower risk zones 2.
For multi-layer PCB, if continuous multilayer all has without copper region, while meet that there is weight without copper region on adjacent layer
Part is closed, can not ensure that resin sufficiently flows in pressing, resin can not be filled up completely with no copper region and line pattern is reached the standard grade
Gap between road, then using on above-mentioned pantostrat without copper region as dried flower risk zones 2.
Without copper region there is intersection to refer on above-mentioned adjacent layer：When PCB is kept flat, adjacent layer Shang Wutong areas
There is intersection between the projection of domain in the horizontal plane.
Preferably, if it is four layers, five layers, six layers, seven layers, eight layers, nine layers ... 18 to have without the continuous number of plies in copper region
Layer, 19 layers or 20 layers, and there is intersection without copper region on adjacent layer, then using every layer without copper region as doing
Flower risk zones 2.
Choker bar group 3 is made up of some choked flow module units 301, and gap, choker bar are provided between adjacent choked flow module unit 301
The material of unit 301 is copper, and the gross area of choked flow module unit 301 is more than 20 the percent of the area of choker bar group 3.
Further, the choked flow module unit 301 on adjacent layer is laid with same position or staggeredly laid, namely adjacent layer
On the projection in the horizontal plane of choked flow module unit 301 be completely superposed or without any intersection region.
Several choked flow module units 301 form choker bar group 3 with suitable arrangement mode, and resin is in choker bar list during pressing
Gap flowing between member 301, guiding gutter is formed because the gap between choked flow module unit 301 is similar to, therefore improve tree
The mobility of fat and enrich resin flowing when directionality, ensure resin can be sufficient filling with no copper region, while line map
Trace clearance in shape part can be also sufficient filling with by resin.Further enhance in bonding processes the uniformity of resin distribution with
Popularity.
Choked flow module unit 301 is hexagon, the center of choked flow module unit 301 to any limit of choked flow module unit 301 away from
From less than or equal to 1.27 millimeters.
Further, choked flow module unit 301 or other figures in addition to hexagon.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Embodiment three
As shown in Fig. 1 and Fig. 4-6, a kind of PCB preparation method, comprise the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
CAM (computer Aided Manufacturing, the area of computer aided used during according to PCB design and production
Manufacture) data identifies easily occur the region of dried flower in bonding processes, as dried flower risk zones 2；Or by production process
The region for dried flower occur in the useless plate of middle output is counted, the standard of further Statistical error dried flower risk zones 2.
According to the dried flower risk zones 2 identified, choker bar group 3 is set in dried flower risk zones 2, in bonding processes
Resin in the prepreg of interlayer enters can be sufficient filling with Wu Tongqu without the guide functions behind copper region due to choker bar group 3
Domain, improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part also can
It is sufficient filling with by resin.And then realize occur the defects of dried flower in effectively prevention PCB manufacturing process, it is good when lifting PCB makes
Product rate.
Ensure certain gap be present between the border of choker bar group 3 and the border in line pattern region 1 simultaneously, as line
The safe distance of the shielding of road signal.
Identify that dried flower risk zones 2 are specifically：
According to CAM Data selections go out area more than or equal to 900 square millimeters without copper region as dried flower risk zones
2。
Preferably, be 800 square millimeters by area, 810 square millimeters, 820 square millimeters, 830 square millimeters, it is 840 flat
980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters conducts of square millimeter ...
Dried flower risk zones 2.
Meanwhile in order to further improve the yields that PCB is manufactured, ensure that preparation method is applicable the PCB of the different numbers of plies,
Dried flower defect area is counted in PCB production processes, the standard of further Statistical error dried flower risk zones 2.
Choker bar group 3 is made up of some choked flow module units 301, and gap, choker bar are provided between adjacent choked flow module unit 301
The material of unit 301 is copper, and the gross area of choked flow module unit 301 is more than 20 the percent of the area of choker bar group 3.
Several choked flow module units 301 form choker bar group 3 with suitable arrangement mode, and resin is in choker bar list during pressing
Gap flowing between member 301, guiding gutter is formed because the gap between choked flow module unit 301 is similar to, therefore improve tree
The mobility of fat and enrich resin flowing when directionality, ensure resin can be sufficient filling with no copper region, while line map
Trace clearance in shape part can be also sufficient filling with by resin.Further enhance in bonding processes the uniformity of resin distribution with
Popularity.
Choked flow module unit 301 is hexagon, the center of choked flow module unit 301 to any limit of choked flow module unit 301 away from
From less than or equal to 1.27 millimeters.
Further, choked flow module unit 301 or other figures in addition to hexagon.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Example IV
As Figure 1-4, a kind of PCB preparation method, comprises the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
CAM (computer Aided Manufacturing, the area of computer aided used during according to PCB design and production
Manufacture) data identifies easily occur the region of dried flower in bonding processes, as dried flower risk zones 2；Or by production process
The region for dried flower occur in the useless plate of middle output is counted, the standard of further Statistical error dried flower risk zones 2.
According to the dried flower risk zones 2 identified, choker bar group 3 is set in dried flower risk zones 2, in bonding processes
Resin in the prepreg of interlayer enters can be sufficient filling with Wu Tongqu without the guide functions behind copper region due to choker bar group 3
Domain, improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part also can
It is sufficient filling with by resin.And then realize occur the defects of dried flower in effectively prevention PCB manufacturing process, it is good when lifting PCB makes
Product rate.
Ensure certain gap be present between the border of choker bar group 3 and the border in line pattern region 1 simultaneously, as line
The safe distance of the shielding of road signal.
Identify that dried flower risk zones 2 are specifically：
If being more than six layers with the continuous number of plies without copper region, and there is intersection without copper region on adjacent layer,
Then using every layer without copper region as dried flower risk zones 2.
For multi-layer PCB, if continuous multilayer all has without copper region, while meet that there is weight without copper region on adjacent layer
Part is closed, can not ensure that resin sufficiently flows in pressing, resin can not be filled up completely with no copper region and line pattern is reached the standard grade
Gap between road, then using on above-mentioned pantostrat without copper region as dried flower risk zones 2.
Without copper region there is intersection to refer on above-mentioned adjacent layer：When PCB is kept flat, adjacent layer Shang Wutong areas
There is intersection between the projection of domain in the horizontal plane.
Preferably, if it is four layers, five layers, six layers, seven layers, eight layers, nine layers ... 18 to have without the continuous number of plies in copper region
Layer, 19 layers or 20 layers, and there is intersection without copper region on adjacent layer, then using every layer without copper region as doing
Flower risk zones 2.
Choker bar group 3 is made up of some choked flow module units 301, and gap, choker bar are provided between adjacent choked flow module unit 301
The material of unit 301 is copper, and the gross area of choked flow module unit 301 is more than 20 the percent of the area of choker bar group 3.
Further, the choked flow module unit 301 on adjacent layer is laid with same position or staggeredly laid, namely adjacent layer
On the projection in the horizontal plane of choked flow module unit 301 be completely superposed or without any intersection region.
Several choked flow module units 301 form choker bar group 3 with suitable arrangement mode, and resin is in choker bar list during pressing
Gap flowing between member 301, guiding gutter is formed because the gap between choked flow module unit 301 is similar to, therefore improve tree
The mobility of fat and enrich resin flowing when directionality, ensure resin can be sufficient filling with no copper region, while line map
Trace clearance in shape part can be also sufficient filling with by resin.Further enhance in bonding processes the uniformity of resin distribution with
Popularity.
Choked flow module unit 301 is circle, and the radius of choked flow module unit 301 is less than or equal to 1.27 millimeters.
Choked flow module unit 301 for circle, it is preferred that the radius of choked flow module unit 301 be 0.90 millimeter, 0.91 millimeter,
0.92 millimeter, 0.93 millimeter, 0.94 millimeter, 0.95 millimeter ... 1.75 millimeters, 1.76 millimeters, 1.77 millimeters, 1.78 millimeters,
1.79 millimeters or 1.80 millimeters.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Further, choked flow module unit 301 is alternatively other figures than circular.
Embodiment five
As shown in figures 1 to 6, a kind of PCB preparation method, comprises the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
According to the dried flower risk zones 2 identified, choker bar group 3 is set in dried flower risk zones 2, in bonding processes
Resin in the prepreg of interlayer enters can be sufficient filling with Wu Tongqu without the guide functions behind copper region due to choker bar group 3
Domain, improve the mobility of resin indirectly further as guide functions so that the trace clearance in line pattern part also can
It is sufficient filling with by resin.And then realize occur the defects of dried flower in effectively prevention PCB manufacturing process, it is good when lifting PCB makes
Product rate.
Above-mentioned choker bar group 3 is made up of some choked flow module units 301, and gap is provided between adjacent choked flow module unit 301, resistance
The material of stream module unit 301 is copper, and the gross area of choked flow module unit 301 is more than 20 the percent of the area of choker bar group 3.
Further, the choked flow module unit 301 on adjacent layer is laid with same position or staggeredly laid, namely the choked flow on adjacent layer
The projection of module unit 301 in the horizontal plane is completely superposed or without any intersection region.
Embodiment six
As Figure 1-4, a kind of PCB preparation method, comprises the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Above-mentioned choker bar group 3 is made up of some circular choked flow module units 301, between being provided between adjacent choked flow module unit 301
Gap, the material of choked flow module unit 301 is copper, and the gross area of choked flow module unit 301 is 20 the percent of the area of choker bar group 3
More than, the radius of choked flow module unit 301 is less than or equal to 1.27 millimeters.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Embodiment seven
As shown in Fig. 1 and Fig. 4-6, a kind of PCB preparation method, comprise the following steps：
Identify dried flower risk zones 2；
Choker bar group 3 is set in dried flower risk zones 2；
Pressing and following process program.
Above-mentioned choker bar group 3 is made up of some regular hexagon choked flow module units 301, is set between adjacent choked flow module unit 301
There is gap, the material of choked flow module unit 301 is copper, and the gross area of choked flow module unit 301 is the percent of the area of choker bar group 3
More than 20, the center of choked flow module unit 301 is less than or equal to 1.27 millimeters to the distance of any limit of choked flow module unit 301.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Embodiment eight
As in Figure 2-4, a kind of PCB, including line pattern region 1 and dried flower risk zones 2, in dried flower risk zones 2
Provided with choker bar group 3, choker bar group 3 is made up of some choked flow module units 301, and gap is provided between adjacent choked flow module unit 301,
The material of choked flow module unit 301 is copper, the gross area of choked flow module unit 301 for the area of choker bar group 3 20 percent with
On.
Line pattern region 1 is specially：Region with configuration, circuit layout wiring is carried out according to designing early stage
Region, there is also certain gap between each circuit.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
Dried flower risk zones 2 are specially：Area is more than or equal to 900 square millimeters without copper region.
Preferably, be 800 square millimeters by area, 810 square millimeters, 820 square millimeters, 830 square millimeters, it is 840 flat
980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters conducts of square millimeter ...
Dried flower risk zones 2.
Choked flow module unit 301 is circle, and the radius of choked flow module unit 301 is less than or equal to 1.27 millimeters.
Preferably, the radius of choked flow module unit 301 be 0.90 millimeter, 0.91 millimeter, 0.92 millimeter, 0.93 millimeter, 0.94
Millimeter, 0.95 millimeter ... 1.75 millimeters, 1.76 millimeters, 1.77 millimeters, 1.78 millimeters, 1.79 millimeters or 1.80 millimeters.
Centre distance between adjacent choked flow module unit 301 is equal, and the centre distance between adjacent choked flow module unit 301
Less than or equal to M, M=(2*D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Further, choked flow module unit 301 is alternatively other figures than circular.
Embodiment nine
As in Figure 2-4, a kind of PCB, including line pattern region 1 and dried flower risk zones 2, in dried flower risk zones 2
Provided with choker bar group 3, choker bar group 3 is made up of some choked flow module units 301, and gap is provided between adjacent choked flow module unit 301,
The material of choked flow module unit 301 is copper, the gross area of choked flow module unit 301 for the area of choker bar group 3 20 percent with
On.
Line pattern region 1 is specially：Region with configuration, circuit layout wiring is carried out according to designing early stage
Region, there is also certain gap between each circuit.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
For multi-layer PCB, if continuous multilayer all has without copper region, while meet that there is weight without copper region on adjacent layer
Part is closed, then on above-mentioned pantostrat is dried flower risk zones 2 without copper region.
Further, if it is four layers, five layers, six layers, seven layers, eight layers, nine layers ... ten to have without the continuous number of plies in copper region
Eight layers, 19 layers or 20 layers, and there is intersection without copper region on adjacent layer, then using every layer without copper region as
Dried flower risk zones 2.
Choked flow module unit 301 is circle, and the radius of choked flow module unit 301 is less than or equal to 1.27 millimeters.Adjacent choker bar
Centre distance between unit 301 is equal, and the centre distance between adjacent choked flow module unit 301 is less than or equal to M, M=(2*
D+2) millimeter；Wherein, D be choked flow module unit 301 center to edge vertical range.
Preferably, the radius of choked flow module unit 301 be 0.90 millimeter, 0.91 millimeter, 0.92 millimeter, 0.93 millimeter, 0.94
Millimeter, 0.95 millimeter ... 1.75 millimeters, 1.76 millimeters, 1.77 millimeters, 1.78 millimeters, 1.79 millimeters or 1.80 millimeters.
Further, choked flow module unit 301 is alternatively other figures than circular.
Embodiment ten
As Figure 4-Figure 6, as in Figure 2-4, a kind of PCB, including line pattern region 1 and dried flower risk zones 2, dried flower
Choker bar group 3 is provided with risk zones 2, choker bar group 3 is made up of some choked flow module units 301, adjacent choked flow module unit 301 it
Between be provided with gap, the material of choked flow module unit 301 is copper, and the gross area of choked flow module unit 301 is the hundred of the area of choker bar group 3
/ bis- more than ten.
Line pattern region 1 is specially：Region with configuration, circuit layout wiring is carried out according to designing early stage
Region, there is also certain gap between each circuit.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
Dried flower risk zones 2 are specially：Area is more than or equal to 900 square millimeters without copper region.
Preferably, be 800 square millimeters by area, 810 square millimeters, 820 square millimeters, 830 square millimeters, it is 840 flat
980 square millimeters, 990 square millimeters, 1000 square millimeters, 1010 square millimeters or 1020 square millimeters conducts of square millimeter ...
Dried flower risk zones 2.
Choked flow module unit 301 is hexagon, the center of choked flow module unit 301 to any limit of choked flow module unit 301 away from
From less than or equal to 1.27 millimeters.Centre distance between adjacent choked flow module unit 301 is equal, and adjacent choked flow module unit 301
Between centre distance be less than or equal to M, M=(2*D+2) millimeter；Wherein, D is the center to edge of choked flow module unit 301
Vertical range.
Further, choked flow module unit 301 or other figures in addition to hexagon.
Embodiment 11
As Figure 4-Figure 6, as Figure 4-Figure 6, as in Figure 2-4, a kind of PCB, including line pattern region 1 and dried flower wind
Danger zone domain 2, dried flower risk zones 2 are interior to be provided with choker bar group 3, and choker bar group 3 is made up of some choked flow module units 301, adjacent resistance
Gap is provided between stream module unit 301, the material of choked flow module unit 301 is copper, and the gross area of choked flow module unit 301 is choker bar
More than 20 the percent of the area of group 3.
Line pattern region 1 is specially：Region with configuration, circuit layout wiring is carried out according to designing early stage
Region, there is also certain gap between each circuit.
Specifically, multi-layer PCB is made up of some core plates and the prepreg for solidifying the adjacent core plate of bonding, core plate
It is made up of prepreg and the copper foil located at prepreg both sides.
For multi-layer PCB, if continuous multilayer all has without copper region, while meet that there is weight without copper region on adjacent layer
Part is closed, then on above-mentioned pantostrat is dried flower risk zones 2 without copper region.
Further, if it is four layers, five layers, six layers, seven layers, eight layers, nine layers ... ten to have without the continuous number of plies in copper region
Eight layers, 19 layers or 20 layers, and there is intersection without copper region on adjacent layer, then using every layer without copper region as
Dried flower risk zones 2.
Choked flow module unit 301 is hexagon, the center of choked flow module unit 301 to any limit of choked flow module unit 301 away from
From less than or equal to 1.27 millimeters.Centre distance between adjacent choked flow module unit 301 is equal, and adjacent choked flow module unit 301
Between centre distance be less than or equal to M, M=(2*D+2) millimeter；Wherein, D is the center to edge of choked flow module unit 301
Vertical range.
Further, choked flow module unit 301 or other figures in addition to hexagon.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating example of the present invention, and it is pair to be not
The restriction of embodiments of the present invention.For those of ordinary skill in the field, may be used also on the basis of the above description
To make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (10)
1. a kind of PCB preparation method, it is characterised in that comprise the following steps：
Identify dried flower risk zones (2)；
Choker bar group (3) is set in the dried flower risk zones (2).
2. PCB according to claim 1 preparation method, it is characterised in that the step：Identify dried flower risk zones
(2) it is specifically：
Filter out area more than or equal to 900 square millimeters without copper region as the dried flower risk zones (2).
3. PCB according to claim 1 preparation method, it is characterised in that the step：Identify dried flower risk zones
(2) it is specifically：
If being more than six layers with the continuous number of plies without copper region, and there is intersection without copper region on adjacent layer, then will
Every layer without copper region as the dried flower risk zones (2).
4. PCB according to claim 1 preparation method, it is characterised in that the choker bar group (3) is by some choker bars
Unit (301) forms, and is provided with gap between the adjacent choked flow module unit (301), the material of the choked flow module unit (301) is
Copper, the gross area of the choked flow module unit (301) is more than 20 the percent of the area of the choker bar group (3).
5. PCB according to claim 4 preparation method, it is characterised in that the choked flow module unit (301) is circle,
The radius of the choked flow module unit (301) is less than or equal to 1.27 millimeters.
6. PCB according to claim 4 preparation method, it is characterised in that the choked flow module unit (301) is six sides
Shape, the center of the choked flow module unit (301) are less than or equal to 1.27 to the distance of any limit of the choked flow module unit (301)
Millimeter.
7. the preparation method of the PCB according to claim 5 or 6, it is characterised in that the adjacent choked flow module unit (301)
Between centre distance it is equal, and the centre distance between the adjacent choked flow module unit (301) is less than or equal to M, M=(2*D
+ 2) millimeter；
Wherein, D be the choked flow module unit (301) center to edge vertical range.
A kind of 8. PCB, it is characterised in that including line pattern region (1) and dried flower risk zones (2), the dried flower risk area
Choker bar group (3) is provided with domain (2), the choker bar group (3) is made up of some choked flow module units (301), the adjacent choked flow
Gap is provided between module unit (301).
9. PCB according to claim 8, it is characterised in that the material of the choked flow module unit (301) is copper, the resistance
The gross area for flowing module unit (301) is more than 20 the percent of the area of the choker bar group (3), the choked flow module unit
(301) it is circle, the radius of the choked flow module unit (301) is less than or equal to 1.27 millimeters；
Or the choked flow module unit (301) is hexagon, the center of the choked flow module unit (301) to the choker bar list
The distance of any limit of first (301) is less than or equal to 1.27 millimeters.
10. PCB according to claim 9, it is characterised in that the centre-to-centre spacing between the adjacent choked flow module unit (301)
From equal, and the centre distance between the adjacent choked flow module unit (301) is less than or equal to M, M=(2*D+2) millimeter；
Wherein, D be the choked flow module unit (301) center to edge vertical range.
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| CN201710891118 | 2017-09-27 | ||
| CN2017108911181 | 2017-09-27 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348612A (en) * | 2018-09-30 | 2019-02-15 | 深圳市景旺电子股份有限公司 | The production method and multi-layer PCB board of multi-layer PCB board |
| CN109451679A (en) * | 2018-11-22 | 2019-03-08 | 奥士康科技股份有限公司 | A kind of multi-layer PCB board stacks method |
| CN110708889A (en) * | 2019-09-20 | 2020-01-17 | 大连崇达电子有限公司 | Method for improving press-fit cavity of printed circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA990413A (en) * | 1972-07-17 | 1976-06-01 | E. Curtis Johnson | Low modulus film as a barrier to prevent flow of adhesive into recessed areas in flexible circuits |
| CN102458033A (en) * | 2010-10-18 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Inner-layer plate side structure of thick-copper printed circuit board |
| CN205946335U (en) * | 2016-08-17 | 2017-02-08 | 东莞市五株电子科技有限公司 | PCB board of high reliability |
| CN106686913A (en) * | 2016-12-29 | 2017-05-17 | 安徽深泽电子科技有限公司 | Adhesive filling and laminating method for inner layer copper-less regions of PCB multilayered board |
| CN206332913U (en) * | 2016-12-30 | 2017-07-14 | 上海嘉捷通信息科技有限公司 | A kind of printed circuit board internal layer edge structure |
-
2017
- 2017-10-19 CN CN201710978940.1A patent/CN107529294A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA990413A (en) * | 1972-07-17 | 1976-06-01 | E. Curtis Johnson | Low modulus film as a barrier to prevent flow of adhesive into recessed areas in flexible circuits |
| CN102458033A (en) * | 2010-10-18 | 2012-05-16 | 上海嘉捷通电路科技有限公司 | Inner-layer plate side structure of thick-copper printed circuit board |
| CN205946335U (en) * | 2016-08-17 | 2017-02-08 | 东莞市五株电子科技有限公司 | PCB board of high reliability |
| CN106686913A (en) * | 2016-12-29 | 2017-05-17 | 安徽深泽电子科技有限公司 | Adhesive filling and laminating method for inner layer copper-less regions of PCB multilayered board |
| CN206332913U (en) * | 2016-12-30 | 2017-07-14 | 上海嘉捷通信息科技有限公司 | A kind of printed circuit board internal layer edge structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109348612A (en) * | 2018-09-30 | 2019-02-15 | 深圳市景旺电子股份有限公司 | The production method and multi-layer PCB board of multi-layer PCB board |
| CN109348612B (en) * | 2018-09-30 | 2020-02-21 | 深圳市景旺电子股份有限公司 | Manufacturing method of multilayer PCB and multilayer PCB |
| CN109451679A (en) * | 2018-11-22 | 2019-03-08 | 奥士康科技股份有限公司 | A kind of multi-layer PCB board stacks method |
| CN109451679B (en) * | 2018-11-22 | 2021-03-05 | 奥士康科技股份有限公司 | Method for stacking multilayer PCB (printed circuit board) |
| CN110708889A (en) * | 2019-09-20 | 2020-01-17 | 大连崇达电子有限公司 | Method for improving press-fit cavity of printed circuit board |
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