CN106686913A

CN106686913A - Adhesive filling and laminating method for inner layer copper-less regions of PCB multilayered board

Info

Publication number: CN106686913A
Application number: CN201611241599.3A
Authority: CN
Inventors: 张雷; 姜广彪; 赵小龙; 张琳; 赵乾龙; 张岐; 赵守波; 展春雷; 胡洪波; 赵守江; 张玲
Original assignee: Anhui Deep Marsh Electronic Science And Technology Co Ltd
Current assignee: Anhui Deep Marsh Electronic Science And Technology Co Ltd
Priority date: 2016-12-29
Filing date: 2016-12-29
Publication date: 2017-05-17

Abstract

The invention discloses an adhesive filling and laminating method for inner layer copper-less regions of a PCB multilayered board. In CAM design, copper PAD flow-choking blocks are arranged in adhesive flowing openings of the copper-less regions of the PCB board; by virtue of the copper PAD flow-choking blocks, the adhesive flowing openings are designed in a staggered arrangements manner; then corresponding PPs are cut, and the cut PPs are pasted on PPs on the sub outer layer of the copper-less regions of the PCB board by an adhesive sealing machine; and finally, laminating is performed. After lamination, insufficient adhesive filling is avoided through complete detection; bubble forming and laying after a thermal stress experiment are prevented; and the board is thick and the thickness of the board is within designed specification.

Description

PCB multilayer board internal layer is without copper region filler compression method

Technical field

The present invention relates to PCB plate production method field, specifically a kind of PCB multilayer board internal layer is without copper region filler pressing side Method.

Background technology

Pcb board pressing filler deficiency happens occasionally in pressure programming, and with the fast development of modern electronic product, part is more Laminate product design is more special, internal layer different levels the same area without copper design, this bring to pcb board factory pressure programming and Big difficult, there is filler deficiency in the product after pressing, and section after Thermal Stress Experiment finds to be layered because filling out not enough generation plate bursting, leads Cause product cannot shipment.

The content of the invention it is an object of the invention to provide a kind of PCB multilayer board internal layer is without copper region filler compression method, to solve Easily occurs filler not enough problem when certainly prior art pcb board is pressed.

In order to achieve the above object, the technical solution adopted in the present invention is：

PCB multilayer board internal layer is without copper region filler compression method, it is characterised in that：When CAM is designed, for multiple structure and have Pcb board of the same position without copper region, without copper PAD choker bars are arranged at the gummosis mouth of copper region on pcb board, is hindered using copper PAD Gummosis mouth is designed as Heterogeneous Permutation by stream block；Then corresponding PP is cut manually according to the outer layer PP thickness specifications for being pressed, and At the secondary outer layer PP that the PP molding machines for cutting are bonded on pcb board at without copper region；Finally pressed.

Described PCB multilayer board internal layer is without copper region filler compression method, it is characterised in that：The PP areas that cut with without copper Region area size is matched.

Described PCB multilayer board internal layer is without copper region filler compression method, it is characterised in that：Enter to pressing formula during pressing Row adjustment, pressing pressure is adjusted to increases by 20% pressure on the basis of with money material and identical folded structure.

Compared with the prior art, beneficial effects of the present invention are embodied in：

1. full inspection is not enough without filler after pressing.

2. without foaming layering after Thermal Stress Experiment.

3. thickness of slab, is situated between thick in design specification.

Description of the drawings

Fig. 1 is provided with pcb board schematic diagram of the large area without copper region for different levels same position.

Fig. 2 is that Fig. 1 arranges pcb board schematic diagram after choker bar.

Fig. 3 is to cut the pcb board schematic diagram after PP.

Specific embodiment

, without copper region filler compression method, the structure of PCB multilayer board 1 for being pressed is as shown in figure 1, more for PCB multilayer board internal layer Laminate same position has without copper region 2.

As shown in Fig. 2 when CAM is designed, for multiple structure and with pcb board 1 of the same position without copper region, in PCB Without copper PAD choker bars 3 are arranged at the gummosis mouth of copper region 2 on plate 1, gummosis mouth is designed as into dislocation row using copper PAD choker bars 3 Row.

As shown in figure 3, and then corresponding PP4 cut manually according to the outer layer PP thickness specifications for being pressed, and will cut PP4 molding machines are bonded on pcb board 1 without at the secondary outer layer PP at copper region；Finally pressed.

The PP4 areas for cutting with match without copper region area size.

It is adjusted to pressing formula during pressing, pressing pressure is adjusted to and is increased on the basis of with money material and identical folded structure Plus 20% pressure.

Claims

1.PCB multilamellars inner cord is without copper region filler compression method, it is characterised in that：When CAM is designed, for multiple structure and tool There is pcb board of the same position without copper region, without copper PAD choker bars are arranged at the gummosis mouth of copper region on pcb board, using copper PAD Gummosis mouth is designed as Heterogeneous Permutation by choker bar；Then corresponding PP is cut manually according to the outer layer PP thickness specifications for being pressed, And at the secondary outer layer PP that the PP molding machines for cutting are bonded on pcb board at without copper region；Finally pressed.

2. PCB multilayer board internal layer according to claim 1 is without copper region filler compression method, it is characterised in that：Cut PP areas with match without copper region area size.

3. PCB multilayer board internal layer according to claim 1 is without copper region filler compression method, it is characterised in that：During pressing It is adjusted to pressing formula, pressing pressure is adjusted to increases by 20% pressure on the basis of with money material and identical folded structure.