CN110678013A - Processing method of embedded copper block printed board and printed board - Google Patents
Processing method of embedded copper block printed board and printed board Download PDFInfo
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- CN110678013A CN110678013A CN201910740081.1A CN201910740081A CN110678013A CN 110678013 A CN110678013 A CN 110678013A CN 201910740081 A CN201910740081 A CN 201910740081A CN 110678013 A CN110678013 A CN 110678013A
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- printed board
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- copper block
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- auxiliary material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing an embedded copper block printed board, which mainly comprises the following steps: s1, slotting the copper block embedding area on the core plate; s2, grooving a copper block embedding area on the inner core PP; s3, slotting the copper block embedding area on the auxiliary material; s4, riveting the core plate and the inner core PP on the top bottom layer; s5, embedding the copper block into the groove on the printed board, placing the auxiliary material and the flowing prepreg on the top and bottom layers of the printed board, and pressing; s6, grinding the printed board to form a processing and manufacturing method suitable for the double-layer or multi-layer printed board. The core plate layer is arranged in the middle of the printed board, and the printed board is of a symmetrical structure from the middle to two sides, so that the double-layer or multi-layer printed board with the inner layer embedded with the copper block and adopting the non-flowing PP is formed.
Description
Technical Field
The invention relates to the technical field of printed boards, in particular to a processing method of an embedded copper block printed board and the printed board.
Background
When a single-double-sided or multi-sided printed board appears in the design of the printed board, and the inner layer of the printed board adopts non-flowing PP, the printed board cannot be manufactured according to the traditional design and processing method when a copper block needs to be embedded.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the processing method of the embedded copper block printed board and the printed board are provided, so that the problem that a single-double-sided printed board and a multi-sided printed board are embedded into a copper block is solved.
The technical scheme provided by the invention for solving the technical problem on one hand is as follows: the manufacturing method of the embedded copper block printed board mainly comprises the following steps of slotting a copper block embedding area on a core board; slotting a copper block embedding area on the inner core PP; slotting a copper block embedding area on the auxiliary material; the core plate and the inner core PP are riveted on the opposite top bottom layer; embedding a copper block into a groove on a printed board, and placing auxiliary materials and a fluid prepreg on the top and bottom layers of the printed board for pressing; finally, the printed board is ground.
As an improvement of the scheme, after the auxiliary materials and the flowing prepreg are placed on the top layer and the bottom layer of the printed board, the prepreg is melted and flows at high temperature and high pressure to fill glue in a bonding area of the copper block and the printed board.
On one hand, the invention has the beneficial technical effects that: the processing and manufacturing method is suitable for the double-layer or multi-layer printed board and comprises the steps of arranging grooves on a core board, an inner core PP and auxiliary materials, riveting the core board and the inner core PP on a top layer and a bottom layer, placing the auxiliary materials and a mobile prepreg on the bottom layer of the printed board, carrying out pressing, and finally grinding the printed board.
The invention also provides a printed board for solving the technical problem, which can be manufactured by the manufacturing method of the copper block printed board and comprises a Opera, an auxiliary material layer, a top layer, a bottom layer and a copper block, wherein the core layer is positioned in the middle of the printed board, and the printed board has a symmetrical structure from the middle to two sides.
As an improvement of the scheme, the upper part of the Core layer is a Core4350B layer, the upper part of the Core4350B layer is an auxiliary material layer, the upper part of the auxiliary material layer is a flowing PP layer, and the upper part of the flowing PP layer is a top bottom layer.
As an improvement of the scheme, the core plate layer comprises a core plate and an inner core PP, and the inner core PP is non-flowing PP.
As a further improvement of the scheme, the core plate, the inner core PP, the auxiliary materials and the top bottom layer are all provided with grooves.
As a further improvement of the scheme, the size of the slot on the core plate is 4mil larger than that of the copper block on one side.
As a further improvement of the scheme, the size of the groove in the inner core PP is 6mil larger than that of the copper block to a single side.
As a further improvement of the scheme, the size of the groove in the auxiliary material is 6mil larger than that of the single side of the copper block.
As a further improvement of the scheme, the auxiliary material is copper foil.
The beneficial technical effects of the invention are as follows: through setting up core plate layer, assistance material layer, top bottom layer to and the copper billet, the core layer is located the middle part of printing the board, and the printing board is the symmetrical formula structure from the middle to both sides, forms one kind and inlays the inlayer that has the copper billet and adopts the double-deck or multilayer printing board of stagnant PP.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below.
Fig. 1 is a flowchart of a method for manufacturing an embedded copper block printed board according to the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the printed board of the present invention.
Fig. 3 is a schematic structural view of a second embodiment of the printed board of the present invention.
Detailed Description
The conception, the specific structure and the technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the schemes and the effects of the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. Furthermore, the descriptions of the upper, lower, left, right, etc. used in the present invention are only relative to the positional relationship of the components of the present invention with respect to each other in the drawings.
Fig. 1 is a flowchart of a method for manufacturing an embedded copper block printed board of the present invention, and referring to fig. 1, when a single-sided, double-sided, and multi-sided printed board using non-flowing PP (polypropylene) facing an inner layer of the printed board needs to embed a copper block, the method includes the following steps: s1, slotting the copper block embedding area on the core plate to facilitate the copper block to pass through; s2, slotting the copper block embedded area on the inner core PP, and milling holes by a machine tool; s3, slotting the copper block embedding area on the auxiliary material; s4 the core board and the inner core PP are riveted on the top layer and the bottom layer, then board stacking is carried out, the copper block is embedded into the position where the auxiliary material copper foil and the flowing prepreg need to be placed on the top layer and the bottom layer in the printed board, pressing is carried out, the core board, the inner core PP, the auxiliary material, the top layer and the bottom layer are connected into an integrated structure, finally, the printed board is ground, redundant parts on the surface of the printed board are removed, the copper foil and the flowing PP on the top layer and the bottom layer of the printed board are ground flat by grinding the printed board, the printed board is parallel and level to the upper bottom surface and the lower bottom surface of. After the auxiliary material and the flowing prepreg are placed on the top layer and the bottom layer of the printed board, the prepreg is melted and flows through high temperature and high pressure to fill glue in a copper block and printed board combination area, so that the copper block and the printed board are bonded into an integral structure. Because the grooves are formed in the core plate, the non-flowing PP and the auxiliary materials in advance, the prepreg under the action of high temperature and high pressure is melted and then fully flows into the joint of the copper block and the printed board, and the reliability of connection of the copper block and the printed board is guaranteed.
It should be noted that the top and bottom layers in the technical solution of the present invention refer to: and printing the integral structure from the top layer to the bottom layer of the board.
According to the manufacturing method of the embedded copper block printed board, the copper block is subjected to flowing and melting at high temperature and high pressure, and the position of the copper block corresponding to the auxiliary material copper foil is arranged for window opening in advance; the copper foil and the flowing prepreg are placed during laminating of the top layer and the bottom layer of the printed board, so that the prepreg is melted and flows under the action of high temperature and high pressure to fill glue in a copper block and printed board combination area, the manufacture of the copper block embedded printed circuit board is completed, and the problems that the traditional printed board cannot solve the problem that the middle part is non-flowing PP, and the operation of embedding the copper block cannot be completed by a single-layer, double-layer and multi-layer printed board are solved.
Fig. 2 is a schematic diagram of an embodiment of the printed board of the present invention, referring to fig. 2, the printed board includes a Core board layer 10, an auxiliary material layer 20, a top bottom layer, and a copper block 40, the Core board layer 10 is located in the middle of the printed board, the printed board has a symmetrical structure from the middle to both sides, the Core4350B layer 50 is located on the upper portion of the Core board layer 10, the auxiliary material layer 20 is located on the upper portion of the Core4350B layer 50, the upper portion of the auxiliary material layer 20 is a flowing PP layer 60, and the upper portion of the flowing PP layer 60 is a carbon steel and stainless steel outer layer. The core layer 10 includes a core sheet 11, an inner core PP12, the inner core PP12 being a no-flow PP. The core plate 11, the inner core PP12, the auxiliary material layer 20 and the top bottom layer are all provided with grooves 70 for penetrating through the copper block 40, the copper block 40 is arranged in the middle of the printed board, and then the movable PP layer 60 is melted at high temperature and high pressure and enters the joint of the copper block 40 and the printed board to reliably bond the copper block 40 and the printed board into an integrated structure.
The preferable size of the slot on the core plate 11 is 4minl larger than the single side of the size of the copper block 40, the size of the slot on the inner core PP is 6mil larger than the single side of the size of the copper block 40, and the size of the slot on the auxiliary material layer 20 is 6mil larger than the single side of the size of the copper block 40. Due to the arrangement of the grooves, when the printed board is produced and manufactured, the flowing PP can be melted in a high-temperature and high-pressure environment and flows into the joint of the copper block 40 and the printed board, and the reliability of connection of the copper block 40 and each layer structure on the printed board is guaranteed.
Fig. 3 is a schematic structural diagram of a second embodiment of the printed board, and referring to fig. 3, a copper block 40 is arranged in the middle of the printed board, and the copper block 40 is bonded with the core plate 11, the inner core PP12 and the auxiliary material layer 20 through a flowing PP layer 60 to form an integrated structure. The whole printed board is of a symmetrical structure, the non-flowing PP layer, the auxiliary material layer 20, the Core4305B layer and the auxiliary material layer 20 are sequentially arranged from the middle to two sides, the height of the end part of the copper block 40 is consistent with the thickness of the printed board, and then the printed board is processed and manufactured by adopting a conventional process.
According to the technical scheme, at least one technical scheme has the following beneficial effects that the auxiliary materials of the copper foil and the mobile prepreg are placed on the top layer and the bottom layer in the printed circuit board, the mobile prepreg is melted and uniformly flows into the joint between the copper block and the printed circuit board for glue filling at high temperature and high pressure, the reliability of the connection between the copper block and the printed circuit board is guaranteed, the connection reliability of the heat dissipation copper block of the high-frequency and microwave printed circuit board is improved, and the problem that the copper block is embedded in the double-sided printed circuit board and the multilayer printed circuit board is solved.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The manufacturing method of the embedded copper block printed board mainly comprises the following steps:
s1, slotting the copper block embedding area on the core plate;
s2, grooving a copper block embedding area on the inner core PP;
s3, slotting the copper block embedding area on the auxiliary material;
s4, riveting the core plate and the inner core PP on the top bottom layer;
s5, embedding the copper block into the groove on the printed board, placing the auxiliary material and the flowing prepreg on the top and bottom layers of the printed board, and pressing;
s6 finally, the printed board is ground.
2. The method for manufacturing the embedded copper block printed board according to claim 1, wherein the method comprises the following steps: after the auxiliary materials and the flowing prepreg are placed on the top layer and the bottom layer of the printed board, the prepreg is melted and flows at high temperature and high pressure to fill glue in a copper block and printed board combination area.
3. Printed board, its characterized in that: the manufacturing method of the embedded copper block printed board comprises a core board layer, an auxiliary material layer, a top layer, a bottom layer and a copper block, wherein the core board layer is located in the middle of the printed board, and the printed board is of a symmetrical structure from the middle to two sides.
4. The method for manufacturing the embedded copper block printed board according to claim 3, wherein the method comprises the following steps: the upper portion of Core layer is Core4350B layer, Core4350B layer upper portion is the auxiliary material layer, the upper portion of auxiliary material layer is the mobile PP layer, the upper portion on mobile PP layer is the top bottom.
5. The printed board of claim 3, wherein: the core layer comprises a core plate and an inner core PP, and the inner core PP is non-flowing PP.
6. The printed board of claim 5, wherein: the core plate, the inner core PP, the auxiliary material layer and the top bottom layer are all provided with grooves.
7. The printed board of claim 6, wherein: the size of the slot on the core plate is 4mil larger than that of the single side of the copper block.
8. The printed board of claim 5, wherein: the size of the groove in the inner core PP is 6mil larger than the size of the single side of the copper block.
9. The printed board of claim 5, wherein: and the size of the groove on the auxiliary material layer is 6mil larger than the size of the single side of the copper block.
10. The printed board of claim 5, wherein: the auxiliary material is copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910740081.1A CN110678013A (en) | 2019-08-12 | 2019-08-12 | Processing method of embedded copper block printed board and printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910740081.1A CN110678013A (en) | 2019-08-12 | 2019-08-12 | Processing method of embedded copper block printed board and printed board |
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| CN110678013A true CN110678013A (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910740081.1A Pending CN110678013A (en) | 2019-08-12 | 2019-08-12 | Processing method of embedded copper block printed board and printed board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111785507A (en) * | 2020-08-03 | 2020-10-16 | 湖南维胜科技电路板有限公司 | Planar transformer coil plate and manufacturing method thereof |
| CN112888182A (en) * | 2020-02-04 | 2021-06-01 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
| CN117042305A (en) * | 2023-10-09 | 2023-11-10 | 四川英创力电子科技股份有限公司 | Manufacturing method for improving flatness of copper-clad laminate |
| CN112888182B (en) * | 2020-02-04 | 2024-05-31 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
-
2019
- 2019-08-12 CN CN201910740081.1A patent/CN110678013A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888182A (en) * | 2020-02-04 | 2021-06-01 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
| CN112888182B (en) * | 2020-02-04 | 2024-05-31 | 苏州金像电子有限公司 | Method for manufacturing multilayer printed circuit board |
| CN111785507A (en) * | 2020-08-03 | 2020-10-16 | 湖南维胜科技电路板有限公司 | Planar transformer coil plate and manufacturing method thereof |
| CN111785507B (en) * | 2020-08-03 | 2024-05-10 | 湖南维胜科技电路板有限公司 | Planar transformer coil plate and manufacturing method thereof |
| CN117042305A (en) * | 2023-10-09 | 2023-11-10 | 四川英创力电子科技股份有限公司 | Manufacturing method for improving flatness of copper-clad laminate |
| CN117042305B (en) * | 2023-10-09 | 2024-01-23 | 四川英创力电子科技股份有限公司 | Manufacturing method for improving flatness of copper-clad laminate |
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