JP6366562B2 - Manufacturing method of multilayer wiring board - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer wiring board in which an electronic component such as a semiconductor element is mounted and a plurality of resin insulating layers are mounted on an upper surface of a ceramic substrate.

For example, a laminate is formed by laminating a plurality of resin films made of a thermoplastic resin having a conductor pattern formed on one side, and the laminate is heated and pressed between a pair of hot press plates. While the glass fiber nonwoven fabric is interposed between the laminated body and the resin sheet is interposed between the glass fiber nonwoven fabric and the laminated body, the glass fiber in the glass fiber nonwoven fabric is pulverized, and the laminated body. A method of manufacturing a multilayer circuit board that heats and presses is proposed (see, for example, Patent Document 1).
Furthermore, when a plurality of resin films having a conductor pattern formed on one side are laminated with positioning pins passing through them to form a laminate, the laminate is heated and pressed between a pair of hot press plates. A cushioning material is interposed between the heat press plate and one of the heat press plates, and a smooth plate having a positioning hole through which the positioning pin passes is interposed between the laminate and the other heat press plate. However, a method of manufacturing a multilayer circuit board that pressurizes while pressing has also been proposed (see, for example, Patent Document 2).

  However, in the method of manufacturing a multilayer circuit board described in Patent Document 1, the glass fiber nonwoven fabric interposed between the laminate and the hot press plate is not directly above the conductor pattern and the conductor pattern. Since the density of the glass fibers differs depending on the position, the pressure tends to vary on the entire surface of each resin film forming the laminate. As a result, the conductor pattern and via conductor for each resin film cause a positional shift along the direction orthogonal to the pressure accompanying the pressurization, thereby causing an inadvertent short circuit between the conductor patterns and the conductor pattern and the via conductor. In some cases, such as short circuit due to inadvertent contact with the device, or open failure due to separation. Such a problem has not been sufficiently solved even in the method of manufacturing a multilayer circuit board described in Patent Document 2.

JP 2010-147419 A (pages 1 to 12, FIGS. 1 to 5) JP 2007-20371 A (pages 1 to 14 and FIGS. 1 to 7)

  The present invention solves the problems described in the background art and reliably suppresses or reduces misalignment when a plurality of unit resin insulating layers having wiring layers on one side are stacked and placed on a ceramic substrate. Thus, it is an object of the present invention to provide a method for manufacturing a multilayer wiring board in which an inadvertent short circuit and an open defect are hardly generated as much as possible.

Means for Solving the Problems and Effects of the Invention

In order to solve the above problems, the present invention provides a thermosetting resin layer and a metal foil between the upper pressure bonding jig and the uppermost unit resin insulating layer adjacent to the upper one among the plurality of unit resin insulating layers. It was conceived that a cushion material composed of a plurality of unit resin buffer layers and a thermoplastic resin layer sandwiched between them is interposed.
That is, the method for manufacturing a multilayer wiring board according to the present invention (Claim 1) has a thermosetting resin layer between the wiring layer and the heat-sealing layer, and is along the thickness direction of the thermosetting resin layer. A method of manufacturing a multilayer wiring board in which a plurality of unit resin insulation layers including via conductors are placed on a ceramic substrate, wherein the plurality of units are formed on the upper surface of the ceramic substrate constrained on a lower crimping jig. A cushioning material comprising a resin insulating layer, a plurality of unit resin buffer layers made of the same thermosetting resin layer and metal foil as described above, and a thermoplastic resin layer sandwiched between them, and an upper crimping jig A step of forming a composite laminate by sequentially laminating it so as to be movable only in the direction, sandwiching the composite laminate between a lower heating jig and an upper heating jig, and heating the upper heating jig to the lower side Including vacuum thermocompression bonding while pressing to the jig side. To.

According to this, the following effects (1) to (3) can be achieved.
(1) Since the thickness of the cushion material is uniform, uniform pressure can be applied in the whole thickness direction of the plurality of unit resin insulation layers, so that the component force (sliding force) along the direction orthogonal to the thickness direction Can be suppressed.
(2) Due to the effect (1), it is possible to reduce the positional deviation of the wiring layers and via conductors in the plurality of unit resin insulation layers as much as possible.
(3) The above effect (2) can reduce the inadvertent short circuit between the wiring layers in the plurality of unit resin insulation layers, the inadvertent short circuit between the wiring layer and the via conductor, and the open defect. A high multilayer wiring board can be provided.

The thermosetting resin layer constituting the unit resin insulating layer is made of polyimide.
The heat sealing layer formed on the unit resin insulating layer is made of thermoplastic polyimide. In addition, this heat-fusion layer may be previously coated on both surfaces of the thermosetting resin layer, and the wiring layer may be formed on one surface thereof.
Further, the wiring layer is formed by patterning a copper foil, for example.
In the unit resin insulating layer, one end of the via conductor and the wiring layer are connected.
Furthermore, the thermoplastic resin layer constituting the cushion material is also made of thermoplastic polyimide.
Moreover, the said metal foil which comprises the said cushion material is a copper foil, for example.
Further, a plurality of guides erected from the upper surface of the lower pressure bonding jig on the periphery of the plurality of unit resin insulation layers, the periphery of the cushion material, and the periphery of the upper pressure bonding jig (lid plate). A through-hole for positioning at the time of stacking through which the pins individually penetrate is formed.

The ceramic substrate includes at least one ceramic layer, a plurality of pads or a plurality of connection terminals individually formed on both surfaces thereof, and a via conductor that conducts between them.
Furthermore, the ceramic substrate includes a ceramic substrate body in which a plurality of ceramic layers are laminated, a wiring layer disposed between the ceramic layers, pads or connection terminals individually formed on both surfaces of the ceramic substrate body, and the pads or connection. It may have a form having via conductors connecting between the terminals and the wiring layers and between the wiring layers. The ceramic layer is made of alumina, for example, and the wiring layer, pads, connection terminals, and via conductors are made of W or Mo, for example.
In addition, the vacuum thermocompression bonding step is performed by heating to a temperature range (about 300 to 380 ° C.) equal to or higher than the glass transition temperature (glass transition point) of the thermoplastic resin layer constituting the cushion material, and 0.095 MPa or less. The vacuum is maintained for about 0.5 to 1 hour.

Further, in the present invention, a recess is formed on the upper surface of the lower crimping jig to accommodate most of the ceramic substrate except for the vicinity of the upper surface of the ceramic substrate, and the ceramic substrate is placed in the recess along the horizontal direction. A method for manufacturing a multilayer wiring board that is housed while being restrained (claim 2) is also included.
According to this, the effects (1) and (2) can be achieved more reliably.
In order to constrain and store the ceramic substrate in the recess in the horizontal direction, for example, a plurality of slide pins that advance and retract into the recess from the side walls of the four sides of the recess having a rectangular shape in plan view are provided with a ball screw. A structure that can be moved with is mentioned.

Furthermore, the present invention includes a method for manufacturing a multilayer wiring board (Claim 3) in which the heating surface of the upper heating jig used in the vacuum thermocompression bonding step can be inclined.
According to this, even if the composite laminate is slightly inclined, a uniform pressure can always be applied, and slipping in a direction perpendicular to the direction of the pressure can be further suppressed, so the effects (1) to (3) Can be achieved more remarkably.
In addition, the mechanism that can tilt the heating surface of the upper heating jig includes, for example, a concave curved surface that is recessed along the pressing direction on the opposite side of the heating surface of the upper heating jig, and a point on the concave curved surface. The combination with the press axis | shaft which has a hemispherical convex curved surface which contacts is illustrated.

In addition, the present invention includes the lower heating jig and the lower pressure bonding jig, the lower pressure bonding jig and the ceramic substrate, and the upper heating jig and the upper pressure bonding jig. In addition, a method for manufacturing a multilayer wiring board in which a heat-resistant buffer plate is interposed is also included.
According to this, even if heat accompanying heat is transmitted together with pressure from the upper heating jig and the lower heating jig, it is possible to suppress a situation where the heat is excessively transferred to the plurality of unit resin insulating layers. Therefore, the effects (1) to (3) can be more reliably achieved.
Examples of the heat-resistant buffer plate include a heat-resistant board made of wholly aromatic polyamide.

(A) is sectional drawing of the copper foil tension resin sheet for forming a unit resin insulation layer, (B), (C) is sectional drawing which shows the process of forming a unit resin insulation layer, (D) is a composite laminated body The vertical sectional view showing the process of forming. (A), (B) is the vertical cross section which shows the process of forming the composite laminated body following FIG.1 (D). The vertical sectional view showing the state just before the vacuum pressure bonding process. The vertical cross section which shows the state immediately after performing a vacuum press-bonding process. The vertical cross section which shows the composite laminated body obtained by vacuum-compression bonding. 1 is a vertical sectional view showing a multilayer wiring board obtained by the present invention. The vertical sectional view which shows the manufacturing method of a comparative example. The vertical sectional view which shows the manufacturing method of a different comparative example.

Hereinafter, modes for carrying out the present invention will be described.
A plurality of copper foil-clad resin sheets J0 shown in FIG. As shown in the drawing, the copper foil-clad resin sheet J0 includes a thermosetting resin layer 1 made of polyimide (hereinafter referred to as PI), and a heat-sealing layer 2 made of thermoplastic PI formed on both surfaces thereof. And a copper foil (metal foil) 3 adhered to the heat-sealing layer 2, and a composite laminate having a total thickness of about 30 μm. Three such copper foil-clad resin sheets J0 were prepared.
First, as shown in FIG. 1B, a plurality of via holes 5a are formed in the center side of the copper foil-clad resin sheet J0, and a plurality of (for example, four) through holes 6 are formed in the periphery of the resin sheet J0. Set up. Each via hole 5a was filled with a conductive paste containing copper powder to form a via conductor 5 having one end (upper end) passing through the copper foil 3.
Next, a patterning technique such as photolithography was applied to the copper foil 3 to form a wiring layer 4 having a required pattern as shown in FIG. As a result, a plurality of unit resin insulating layers Jn (for example, n = 1 to 3) were obtained.

Next, as shown in FIG. 1D, most of the ceramic substrate 12 except for the vicinity of the upper surface is accommodated in the recess 8 opened on the upper surface of the lower crimping jig 7 via the heat-resistant buffer plate 11. did. For the buffer plate 11, for example, a heat resistant board made of wholly aromatic polyamide is used.
Further, a plurality of slide pins 9 that advance and retreat in the horizontal direction from the inner wall surface of the recess 8 along the horizontal direction and toward the center side of the recess 8 are individually applied to each side surface of the ceramic substrate 12. By contacting, the ceramic substrate 12 was restrained in a state of being positioned in the horizontal direction.

  As shown in FIG. 1D, the ceramic substrate 12 is formed on, for example, ceramic layers c1 to c3 mainly composed of alumina, a plurality of pads 13 formed on the upper surface (front surface), and the bottom surface (rear surface). The plurality of connection terminals 14, the wiring layer 15 having a required pattern formed between the ceramic layers c1 to c3, and the pad 13, the wiring layer 15, and the connection terminals 14 are individually conducted and the ceramic layer c1. To via conductors 16 penetrating through c3 individually. The pad 13, the connection terminal 14, the wiring layer 15, and the via conductor 16 are made of, for example, W or Mo.

  As shown in FIG. 1D, a plurality of (for example, four) positioning guide pins 10 are vertically erected in advance on the upper surface surrounding the opening of the recess 8 in the lower crimping jig 7. ing. As shown in the figure, the plurality of guide pins 10 are individually inserted into the plurality of through holes 6 so that the plurality (three layers) of the unit resin insulation layers J1 to J3 are sequentially disposed above the ceramic substrate 12. When laminated. At this time, the pad 13 on the ceramic substrate 12 side and the via conductor 5 exposed on the bottom surface of the lowermost unit resin insulating layer J1 were electrically connected. In addition, the said lower side crimping jig 7, the slide pin 9, and the guide pin 10 consist of metals, such as steel and cast iron, for example.

Next, as shown in FIG. 2A, the upper and lower unit resin buffer layers J0 made of the copper foil-clad resin sheet J0 with the copper foil 3 exposed to the outside, and the heat sandwiched between them. The cushion material Cn composed of the plastic resin layer 18 was placed through the guide pins 10 through the through holes 6 and 17 formed in the same manner as described above. The thermoplastic resin layer 18 is made of a thermoplastic PI film having a thickness of about 25 μm.
As a result, a composite laminate HS composed of the ceramic substrate 12, the unit resin insulation layers J1 to J3, and the cushion material Cn was obtained.
Next, as shown in FIG. 2 (B), an upper pressure bonding having a plurality of through-holes 19 into which the upper end side of the guide pin 10 enters on the peripheral side on the copper foil 3 of the unit resin buffer layer J0 on the upper layer side. By placing the jig 20, the composite laminate HS was sandwiched between the upper crimping jig 20 and the lower crimping jig 7. The upper crimping jig 20 is also made of the same metal as described above.

  Further, as shown in FIG. 3, the composite laminate is interposed between the lower heating jig 22 and the upper heating jig 23 constituting the thermocompression press through buffer plates 21 each made of the same heat-resistant board. The body HS and the lower crimping jig 7 and the upper crimping jig 20 sandwiching the body HS were disposed. The lower heating jig 22 is a base board made of the same metal having a flat upper surface. On the other hand, the upper heating jig 23 has a convex portion 25 having an upward concave concave curved surface 24 at the center of the upper surface, and the concave curved surface 24 has a downward convex convex curved surface 26 at the lower end. The press shaft 27 is in contact by point contact. The concave curved surface 24 and the convex curved surface 26 constitute a mechanism (tilting mechanism) that can tilt the heating surface (bottom surface) of the upper heating jig 23.

In the state shown in FIG. 3, the lower heating jig 22, the lower pressure bonding jig 7 including a plurality of guide pins 10, the buffer plate 11, the composite laminate HS (ceramic substrate 12, unit resin insulating layers J1 to J3, The upper heating jig 23 including the cushion material Cn), the upper crimping jig 20, the buffer plate 21, and the press shaft 27 was inserted into a vacuum chamber (not shown), and the degree of vacuum was 0.095 MPa or less.
In the vacuum state, a heater (not shown) embedded in the lower heating jig 7 and the upper heating jig 23 is energized, and the temperature is equal to or higher than the glass transition temperature (glass transition point) of the thermoplastic resin layer 18 constituting the cushion material Cn. And a pressure P is applied to the upper heating jig 23 via the tilt mechanisms 24 and 26 as shown by the white arrows in FIG. A vacuum thermocompression bonding step was performed in which the tool 23 was pushed down to the lower heating jig 7 side and held for about 0.5 to 1 hour.
The pressure P varies depending on the size of the ceramic substrate 12. The pressure P is set so that a pressure of about 10 to 80 kgf / cm ² (about 0.98 to 7.84 MPa) is applied to the ceramic substrate 12 (for example, the size of the ceramic substrate 12 is 4 cm square and 50 kgf / cm ² ). When a pressure of cm ² is applied, the set value of the device is 4 cm × 4 cm × 50 kgf / cm ² = 800 kgf / cm ² ).

As a result, as shown in FIG. 4, the unit resin insulation layers J1 to J3 are bonded by the adjacent heat fusion layers 2 and the bottom side heat fusion layer 2 in the lowermost unit resin insulation layer J1. The upper surface of the ceramic substrate 12 adjacent to the upper surface of the ceramic substrate 12 was adhered, and the pad 13 on the upper surface was bitten. At the same time, the cushion material Cn and the upper crimping jig 20 were lowered to the uppermost unit resin insulating layer J3 side.
In the vacuum thermocompression bonding step, as indicated by the white arrow in FIG. 4, the pressure P applied to the press shaft 27 is applied to the entire surface of the cushion resin Cn in the unit resin buffer layer J0 on the upper layer side in a plan view. Evenly dispersed, the adjacent thermoplastic resin layer 18 becomes a relatively large component force (sliding force) along the horizontal direction toward the outer peripheral side. However, since the copper foil 3 of the lower unit resin buffer layer J0 and the wiring layer 4 of the uppermost unit resin buffer layer J3 are in close contact with each other and no sliding occurs in the horizontal direction, the lower unit resin buffer layer In J0 and the unit resin insulating layers J1 to J3, a relatively small and uniform component force (sliding force) along the horizontal direction toward the outer peripheral side was suppressed. At this time, the lowermost (first layer) unit resin insulating layer J1 receives only a sliding force generated by itself, and therefore, there was relatively little positional displacement. However, the middle (second layer) unit resin insulating layer As the result of including the influence of the sliding force on the lower layer side as J2 and further on the upper layer side of the unit resin insulating layer J3 of the uppermost layer (third layer), the positional deviation tended to increase gradually.

Moreover, even if the cushion material Cn is inclined by the wiring layer 4 of the uppermost unit resin insulating layer J3, the heating surface (bottom surface) of the upper heating jig 23 is provided by the inclination mechanism formed by the concave curved surface 24 and the convex curved surface 26. Can follow the above inclination. Therefore, in the same manner as described above, the lower unit resin buffer layer J0 and the unit resin insulating layers J1 to J3 are suppressed to a relatively small and uniform component force along the horizontal direction toward the outer peripheral side.
As a result, since the thermosetting resin 1 of the unit resin insulating layers J1 to J3 is extremely prevented from extending along the horizontal direction, an inadvertent short circuit between the wiring layers 4 or the wiring layer 4 and the via conductor 5 Inadvertent short-circuits and open defects were eliminated.

FIG. 5 is a vertical view showing the composite wiring board HP after the upper heating jig 23 including the press shaft 27 and the cushion material Cn are removed and extracted from the plurality of guide pins 10 after the vacuum thermocompression bonding step. It is sectional drawing.
By inserting a cutting cutter rotating at a high speed (not shown) along the planned cutting surface 29 indicated by a broken line in FIG. 5 and moving it along the horizontal direction, the outer ear portion including the through-hole 6 ( (Discarding allowance) 28 was excised.
Further, electrolytic plating such as nickel or gold is applied to the surface of the uppermost wiring layer (pad) 4 exposed to the outside on the composite wiring board HP and the surface of the plurality of connection terminals 14 located on the bottom surface of the ceramic substrate 12. Or electroless plating was performed.

As a result, as shown in FIG. 6, on the upper side of the ceramic substrate 12, unit resin insulating layers J1 to J3 having the same size as or similar to the size of the ceramic substrate 12 in plan view are integrally bonded. The wiring board 30 could be obtained.
According to the manufacturing method of the multilayer wiring board 30 as described above, the effects (1) to (3) can be reliably achieved.
In the vacuum thermocompression bonding step, the tilt mechanism by the concave curved surface 24 and the convex curved surface 26 is omitted, and the upper heating jig 23 is directly connected to the center portion of the upper surface of the press shaft 27. However, it is possible to obtain the same operation and effect as described above.

Hereinafter, specific examples of the production method of the present invention will be described together with comparative examples.
A total of 40 ceramic substrates 12 (80 mm square in length and width) having the same shape and structure and five unit resin insulating layers J1 to J5 having the same shape and structure in advance, each consisting of 4 groups and 10 groups each. Prepared.
The unit resin insulation layers J1 to J5 have a thickness of 30 μm and a size of 160 mm in length and breadth, and are formed of a heat seal layer 2 on both sides of the thermosetting resin layer 1 and one heat seal layer 2. Using the copper foil-clad resin sheet (trade name: Ubicell N manufactured by Ube Industries, Ltd.) J0 with the copper foil 3 attached to the entire surface, the wiring layer 4 and the via conductor 5 were formed by the above-described steps. Is.

As shown in FIG. 3, the first set includes the buffer plate 11 by inserting the unit resin insulating layers J1 to J5 through the through-holes 6 into the guide pins 10 of the lower crimping jig 7. Laminated above the ceramic substrate 12 fixed above, and further, a pair of unit resin buffer layers J0 above the uppermost unit resin insulation layer J, and a thermoplastic resin having a thickness of 25 μm between them and a length and width of 100 mm each. A cushion material Cn sandwiching a layer (Kurabo Co., Ltd., trade name: midfil) 18 was placed in the same manner as described above. Then, after placing the upper crimping jig 20 and the heat-resistant buffer plate 21 in the same manner as described above above the cushion material Cn, the upper heating jig 23 not having the tilt mechanism (24, 26) is arranged. The vacuum thermocompression bonding process described above was performed. Ten multilayer wiring boards 30 obtained by this method were taken as Example 1.
The conditions of the vacuum thermocompression bonding step are: a degree of vacuum of 0.090 MPa, a heating temperature of 350 ° C., a pressure applied to the ceramic substrate 12 of 6.86 MPa per 1 cm ² (70 kgf / cm ² ), and a holding time of 60 minutes. Met.

The second set includes the same ceramic substrate 12, the same unit resin insulating layers J1 to J5 as described above, the cushion material Cn, the lower crimping jig 7 and the upper crimping jig 20, and the buffer plate. 11 and 21, and the whole was sandwiched between the lower heating plate 22 and the upper heating plate 23 having the tilting mechanisms 24 and 26, and then a vacuum thermocompression bonding process under the same conditions as described above was performed. Ten multilayer wiring boards 30 obtained by such a method were taken as Example 2.
Further, as shown in FIG. 7, the third set is made of PI on both surfaces of the same ceramic substrate 12, the same unit resin insulating layers J1 to J5 as those described above, and the glass fiber plate 33 having a thickness of 2 mm. The resin film 34 having a thickness of 25 μm is attached between the lower and upper crimping tools 7 and 20 via the buffer plate 11, and the whole is interposed between a pair of upper and lower buffer plates 21. A vacuum thermocompression bonding process under the same conditions as described above was performed by sandwiching between the lower heating jig 22 and the upper heating jig 23 without the tilt mechanisms 24 and 26. Ten multilayer wiring boards 30 obtained by this method were used as Comparative Example 1.

  In addition, as shown in FIG. 8, the fourth group includes the same ceramic substrate 12, the same unit resin insulating layers J1 to J5 as those described above, and the upper and lower unit resin buffer layers J0. The lower and upper crimping tools 7 and 20 are sandwiched via the buffer plate 11, and the whole is not provided with the lower heating jig 22 and the tilting mechanisms 24 and 26 through the pair of upper and lower buffer plates 21. A vacuum thermocompression bonding process was performed under the same conditions as described above by being sandwiched between the upper heating jig 23. Ten multilayer wiring boards 30 obtained by this method were used as Comparative Example 2. That is, in Comparative Example 2, the thermoplastic resin layer 18 is removed from the cushion material Cn. In FIG. 8, the unit resin insulation layers J4 and J5 are omitted for convenience of drawing.

In each of the above examples, the upper surfaces of the lowermost (first layer) unit resin insulating layer J1 with the smallest positional deviation and the uppermost layer (fifth layer) unit resin insulating layer J5 with the largest positional deviation are In addition, a copper pattern for confirming misalignment is provided in advance in each square corner portion centered on the center of the upper surface and having a side of 50 mm in a plan view, and before and after the vacuum thermocompression bonding step, The position coordinates were measured individually.
3, 7, and 8, the length of one side along the horizontal direction (X direction) on the upper surface of the unit resin insulating layer J <b> 5 of the uppermost layer (fifth layer) and the depth direction ( The elongation amount of the length of one side along (Y direction) was measured, and the average value of each example was calculated. It should be noted that the larger extension amount was adopted for a pair of sides along the same X direction and Y direction. The result of the average value of the elongation is shown on the left side in Table 1.
Further, for the unit resin insulation layer J1 of the lowermost layer (first layer) in each example, the amount of elongation of one side along the X and Y directions was measured and the average value was calculated for each. In each of the above examples, the difference in elongation between the lowermost (first) unit resin insulation layer J1 and the uppermost (fifth) unit resin insulation layer J5 in the X and Y directions, that is, the amount of deviation. Were calculated individually, and the average value of each example was calculated. The results are shown on the right side of Table 1.

According to Table 1, in the multilayer wiring board 30 of Example 1 using the upper heating jig 23 that does not have the tilt mechanism (24, 26), the fifth unit resin insulation layer J5 has X and Y directions. The amount of elongation along each side along the lines was relatively small at 16 μm and 21 μm, and the amount of deviation between the first and fifth unit resin insulation layers J1 and J5 was also relatively small at 14 μm and 17 μm. As a result, in Example 1, the elongation amount was small in all of the first to fifth unit resin insulation layers J1 to J5, and the elongation amount was gradually increased toward the unit resin insulation layers J1 to J5. It is estimated that
Furthermore, in the multilayer wiring board 30 of the second embodiment using the upper heating jig 23 having the tilt mechanism (24, 26), each side along the X and Y directions in the fifth unit resin insulating layer J5. The amount of elongation was the smallest at 9 μm, and the amount of deviation between the first and fifth unit resin insulating layers J1 and J5 was the smallest at 8 μm and 10 μm. As a result, in Example 2, the elongation amounts of all the unit resin insulation layers J1 to J5 of the first layer to the fifth layer are small, and the elongation amounts slightly from the unit resin insulation layers J1 to J5. This is presumably due to the increase.

On the other hand, in the multilayer wiring board 30 of Comparative Example 1, the extension amount of each side along the X and Y directions in the fifth unit resin insulating layer J5 is relatively large as 39 μm and 43 μm, and the first layer and the fifth layer The amount of misalignment between the unit resin insulation layers J1 and J5 of the eyes was also relatively large at 28 μm and 34 m. As a result, in Comparative Example 1, all the unit resin insulation layers J1 to J5 from the first layer to the fifth layer have a large elongation amount, and the elongation amounts increase sequentially even in the unit resin insulation layers J1 to J5. It is estimated that
Further, in the multilayer wiring board 30 of Comparative Example 2, the extension amount of each side along the X and Y directions in the fifth unit resin insulating layer J5 is the largest, 53 μm and 59 μm, and the first and fifth layers The amount of deviation between the eye unit resin insulation layers J1 and J5 was relatively small, 9 μm and 14 m. Such a result is presumed that in Comparative Example 2, the elongation amount was the largest in all of the first to fifth unit resin insulating layers J1 to J5.
According to the above results, it was confirmed that the method for manufacturing a multilayer wiring board according to the present invention exemplified in Examples 1 and 2 can achieve the effects (1) to (3). .

The present invention is not limited to the embodiments and examples described above.
For example, the ceramic substrate 12 may be formed of a ceramic layer made of a high-temperature fired ceramic such as mullite or aluminum nitride, or a low-temperature fired ceramic such as glass-ceramic, and the number of ceramic layers is also arbitrary. In the case of the ceramic layer of the low-temperature fired ceramic, Cu or Ag is applied to the pad 13, connection terminal 14, wiring layer 15, and via conductor 16.
The unit resin insulation layer Jn and the other marking resin buffer layer J0 may have any thickness and may have a rectangular shape in plan view.
Furthermore, the thickness of the thermoplastic resin layer 18 used for the cushion material Cn is arbitrary, and may be a rectangular shape in plan view.

Further, six, eight, or ten or more guide pins 10 may be provided vertically on the peripheral side of the upper surface of the lower crimping jig 7.
Further, the plurality of guide pins 10 can be moved up and down and rotated by individually screwing male threads engraved below them into a plurality of female screw holes formed in the lower crimping jig 7. You may stand upright.
Further, the upper crimping jig 20 can be moved up and down while individually screwing male screws engraved on the upper side of each guide pin 10 for each of a plurality of female screw holes provided on the peripheral side thereof. It is also good.
In addition, the multilayer wiring board obtained by the present invention includes a wiring board for an electronic component inspection apparatus for simultaneously inspecting a plurality of electronic components.

  According to the present invention, when a plurality of resin insulation layers having a wiring layer are stacked and placed on a ceramic substrate, misalignment is reliably suppressed or reduced, and inadvertent short circuits and open defects are possible. It is possible to provide a method for manufacturing a multilayer wiring board that is less likely to occur.

1 …………… Thermosetting resin layer, 2 …………… Thermal fusion layer,
3 ……… Metal foil (copper foil) 4 …………… Wiring layer,
5 ......... Via conductor, 7 ......... Lower crimping jig,
8 ......... concave, 10 ......... guide pin,
11, 21 ... buffer plate, 12 ... ceramic substrate,
18 ………… Thermoplastic resin layer, 20 ………… Upper crimping jig,
22 ………… Lower heating jig 23 ………… Upper heating jig
30 ………… Multilayer wiring board J0 ………… Unit resin buffer layer,
J1 to J5: Unit resin insulation layer, Cn ......... Cushion material,
HS ………… Composite laminate

Claims (4)

A plurality of unit resin insulation layers having a thermosetting resin layer between the wiring layer and the heat sealing layer and having via conductors along the thickness direction of the thermosetting resin layer are placed on the ceramic substrate. A method for manufacturing a multilayer wiring board, comprising:
A plurality of unit resin insulation layers, a plurality of unit thermosetting resin layers, and a plurality of unit resin buffer layers made of metal foil are sandwiched between the ceramic substrate constrained on the lower crimping jig. A step of forming a composite laminate by sequentially laminating a cushion material composed of a thermoplastic resin layer and an upper crimping jig so as to be movable only in the vertical direction;
Sandwiching the composite laminate between a lower heating jig and an upper heating jig, and vacuum thermocompression bonding while pressing the upper heating jig toward the lower heating jig,
A method for manufacturing a multilayer wiring board. A recess is formed on the upper surface of the lower crimping jig to store most of the ceramic substrate except for the vicinity of the upper surface thereof, and the ceramic substrate is stored in the recess while being restrained in the horizontal direction. ,
The method for producing a multilayer wiring board according to claim 1. The upper heating jig used in the vacuum thermocompression bonding step has an inclined heating surface.
The method for producing a multilayer wiring board according to claim 1, wherein Between the lower heating jig and the lower crimping jig, between the lower crimping jig and the ceramic substrate, and between the upper heating jig and the upper crimping jig, heat resistance Of the buffer plate,
The method for manufacturing a multilayer wiring board according to any one of claims 1 to 3, wherein:

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