JP2000013024A - Manufacture of multilayer board and plate for multilayer board manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve formability by providing a thermoplastic resin layer for an inner layer in at least one plate and making the plate provided with metallic plate layers on both outermost layers. SOLUTION: Two thermosetting resin sheets 12 are overlapped on both outer sides of a substrate 11 where a conductor circuit is formed on a surface, and metallic foil 13 is stacked on both outermost layers so as to form a to-be- pressure bonded body 14. The two bodies 14 are sandwiched and overlapped by plates 18 and a stacked body 10 is formed. It is sandwiched by hot plates 19 and they are heated/pressurized. Two multilayer boards are manufactured in one step. The plates 18 are provided with thermoplastic resin layers 184 on the inner layers and with metallic plate layers 182 on both outermost layers so as to integrate them. Thus, formability can be improved since bubbles do not remain in the obtained multilayer boards.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer board used for manufacturing a printed wiring board.

[0002]

2. Description of the Related Art Multilayer boards are used for manufacturing printed wiring boards used for electric and electronic equipment. This multilayer board is, for example, a thermosetting resin sheet called a prepreg impregnated into a base material on the front and back of a substrate having a conductive circuit formed on the surface, and a sheet-like thermosetting resin sheet is stacked thereon. After a release sheet such as a metal foil or a fluororesin film is disposed on the outside and stacked to form a pressed body, the pressed body is sandwiched by a flat plate, further sandwiched by a molding press, and heated and pressed. ing. In addition, in order to improve productivity, a plurality of the above-mentioned compression-bonded members are vertically stacked with a flat plate interposed therebetween, and the stacked ones are sandwiched between forming presses and heated and pressed to form a large number of multilayer plates at once. Is generally performed.

[0003] As another method, there is a method in which a resin film formed by forming a thermosetting resin composition in the form of a sheet in place of a prepreg is used as a thermosetting resin sheet, or one side of a metal foil. By using a metal foil with a resin layer having a thermosetting resin layer formed thereon, by overlapping the thermosetting resin layer directly or via a prepreg with the substrate, the metal foil with the resin layer and the substrate, A method of stacking such that a metal foil is arranged on the outer side thereof to form a body to be pressed, and then similarly heating and pressurizing the plate to manufacture the same is also being studied.

[0004] Since the thickness of the substrate having the conductor circuit formed on the surface is different between the portion having the conductor circuit and the portion not having the conductor circuit, when the substrate is heated and pressed by a molding press,
There is a pressure difference between the part with the conductor circuit and the part without the conductor circuit. For this reason, bubbles may sometimes remain in portions of the obtained multilayer board where there is no conductive circuit on the surface of the substrate where the pressure was relatively low, and there was a problem that moldability was low. For this reason, it has been practiced to improve the formability by simultaneously sandwiching an elastic flat body having elasticity, such as cellulose paper, which is generally referred to as a cushioning material, with a molding press. In the case or when using a prepreg having a large variation in the resin adhesion amount,
There are still cases where bubbles remain, and there is a demand for a production method capable of obtaining a multilayer board having excellent moldability.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has as its object to provide a thermosetting resin sheet containing a thermosetting resin composition; A plurality of press-bonded members each having a substrate on which a conductive circuit is formed, a metal foil or a release sheet, and a metal foil or a release sheet stacked outside such that the metal foil or the release sheet is disposed, are sandwiched between flat plates and stacked. An object of the present invention is to provide a method for producing a multilayer board, which is produced by forming a body and then heating and pressing the laminated body, wherein the method is for producing a multilayer board having excellent moldability.

Further, a metal foil with a resin layer having a thermosetting resin layer formed on one surface of the metal foil and a substrate having a conductive circuit formed on the surface thereof are arranged such that the metal foil is disposed outside the metal foil. This is a method for manufacturing a multilayer board in which a plurality of stacked pressure-bonded objects are sandwiched between flat plates to form a laminate, and then the laminate is heated and pressed to produce a multilayer board having excellent moldability. To provide a method for manufacturing a multilayer board.

It is another object of the present invention to provide a flat plate for manufacturing a multilayer plate which is used for manufacturing a multilayer plate and which can obtain a multilayer plate having excellent formability.

[0008]

According to a first aspect of the present invention, there is provided a method for manufacturing a multilayer board, comprising: a thermosetting resin sheet containing a thermosetting resin composition; a substrate having a conductive circuit formed on a surface; A metal foil or a release sheet is formed by stacking a plurality of press-bonded members so that the metal foil or the release sheet is disposed on at least one of the outer sides thereof, sandwiching the flat plate with each other, and forming a laminate. In the method for producing a multilayer board produced by heating and pressing a laminate, at least one of the flat boards is a flat board having a thermoplastic resin layer in an inner layer and a metal plate layer in both outermost layers. Features.

According to a second aspect of the present invention, there is provided a method for manufacturing a multilayer board according to the first aspect, wherein the thermosetting resin sheet is formed by impregnating a substrate with the thermosetting resin composition. Or a resin film formed by forming a thermosetting resin composition into a sheet shape.

According to a third aspect of the present invention, there is provided a method for manufacturing a multilayer board, comprising: a metal foil provided with a resin layer having a thermosetting resin layer formed on one surface of the metal foil; After a plurality of pressed bodies stacked so that the metal foil is arranged on at least one of the outer sides thereof, a plurality of stacked bodies are sandwiched between flat plates to form a stacked body, and then the multilayer body is manufactured by heating and pressing the stacked body. In the method of manufacturing,
The sheet is a flat plate having a thermoplastic resin layer as an inner layer and a metal plate layer as both outermost layers.

According to a fourth aspect of the present invention, in the method for manufacturing a multilayer board according to any one of the first to third aspects, the thermoplastic resin layer is a layer of a fluororesin. There is a feature.

According to a fifth aspect of the present invention, there is provided a flat plate for manufacturing a multilayer board, wherein the flat plate has a thermoplastic resin layer as an inner layer and a metal plate layer as both outermost layers.

A substrate having a conductive circuit formed on its surface has a different thickness between a portion having a conductive circuit and a portion having no conductive circuit.
When heating and pressing between molding presses, there is a pressure difference between the part with and without the conductor circuit, but according to the present invention, the thermoplastic resin in the thermoplastic resin layer is softened by heating and flows slightly. However, in order to alleviate the pressure difference between the two, it is considered that pressure is likely to be applied even to a portion where the conductor circuit is not provided on the surface of the substrate where the pressure is relatively low, and bubbles are less likely to remain in the obtained multilayer board.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a multilayer board according to the present invention will be described with reference to the drawings. FIG. 1 is a view for explaining an embodiment of the method for manufacturing a multilayer board according to claims 1 and 2 of the present invention, wherein (a) is an exploded front view and (b) is a front view showing a flat plate. is there. FIG. 2 is a front view showing a modified example of a flat plate in one embodiment of the method for manufacturing a multilayer plate according to the present invention, and FIG. 3 is a plan view of the multilayer plate according to claims 1 and 2 of the present invention. It is an exploded front view explaining an important section of another embodiment of a manufacturing method. FIG. 4 is a view for explaining an embodiment of the method for producing a multilayer board according to claim 3 of the present invention.
(A) is an exploded front view, (b) is a front view showing a flat plate. FIG. 5 is an exploded front view illustrating a main part of another embodiment of the method for manufacturing a multilayer board according to claim 3 of the present invention.

[Method of Manufacturing a Multilayer Board According to Claims 1 and 2 of the Present Invention] One embodiment of a method of manufacturing a multilayer board according to claims 1 and 2 of the present invention is shown in FIG. 2), two prepregs each formed by impregnating a base material with a thermosetting resin composition as a thermosetting resin sheet 12 are stacked on both outer sides of a substrate 11 having a conductive circuit formed on the surface thereof. The metal foil 13 is stacked on the outermost layers of the
4 are formed in two sets. Then, the two sets of crimped members 14,
14 are sandwiched between flat plates 18, 18, and 18, and
This is an embodiment in which the laminate 10 is sandwiched between hot plates 19, 19, and then heated and pressed to produce two multilayer plates at a time.

As shown in FIG. 1B, the flat plate 18 (a flat plate for manufacturing a multilayer board according to the fifth aspect of the present invention) has a thermoplastic resin layer 184 as an inner layer and a metal layer as an outermost layer. It is important that the flat plate 18 includes the plate layers 182 and 182 and is integrated. When the thermoplastic resin layer 184 is not provided in the inner layer, bubbles may remain in the obtained multilayer board, which may cause a problem in moldability.
When 82 and 182 are not provided, the surface roughness of the obtained multilayer board may increase.

The thermoplastic resin layer 184 is formed in a layer using a thermoplastic resin. The thermoplastic resin layer 184 is made of a thermoplastic resin, such as a fluororesin such as an ethylene tetrafluoride resin, or a polyphenylene ether resin, which can withstand the temperature during heating. It is formed in a layer using a resin. In the case of a fluororesin layer, since the heat resistance is excellent, the number of times that the flat plate 18 can be repeatedly used is preferably relatively large. When the thermoplastic resin is reinforced with a glass cloth or the like, the number of repetitive use is particularly large, which is preferable.

It is to be noted that, even if a load in which metal plates are stacked on both outer sides of a thermoplastic resin sheet is used instead of the flat plate 18, the effect of improving the moldability is obtained, but the inside of the obtained multilayer plate is still obtained. Bubbles may remain. this is,
In the case of a load, when the thermoplastic resin sheet and the metal plate are stacked, air does not sufficiently escape and air tends to remain between them, so that the portion of the obtained multilayer plate corresponding to the portion where the air remains Alternatively, it is considered that air bubbles remain in the surrounding area.

The metal plate layer 182 is formed in a plate shape using a metal that can withstand the temperature and pressure during heating and pressurizing, and examples thereof include an iron plate and a stainless plate. Note that the surface of the metal plate may be subjected to insulation treatment. The thickness of the thermoplastic resin layer 184 and the metal plate layer 182 may be appropriately adjusted according to the number of the pressure-bonded members 14 to be stacked and the pressure at the time of heating and pressing, but generally, The thickness of the thermoplastic resin layer 184 is 0.2 to 1 mm,
The thickness of 82 is about 0.3 to 1 mm.

The flat plate 18 has a thermoplastic resin layer 184 as an inner layer and metal plate layers 182, 1
2A, and as shown in FIG. 2A, two thermoplastic resin layers 18 with a metal plate layer 182b interposed therebetween.
4a and 184b are provided in the inner layer, and a flat plate 18 having metal plate layers 182 and 182 on both outermost layers, or two thermoplastic resin layers 184a and 184b as shown in FIG. In the inner layer, a metal plate layer 1
A plurality of thermoplastic resin layers 184... May be provided like the flat plate 18 having 82, 182.

Further, at least one of the flat plates 18 constituting the laminate 10 has a thermoplastic resin layer 184 as the inner layer.
When the flat plate 18 having the metal plate layers 182 and 182 as the outermost layers is used, a multilayer plate having excellent moldability can be obtained. However, all the flat plates 18 to be used are provided with the thermoplastic resin layer 184 as the inner layer. And a metal plate layer 1 on both outermost layers.
When the flat plate 18 is provided with 82 and 182, a multilayer plate having particularly excellent moldability is obtained, which is preferable.

The substrate 11 used in the present invention may be a substrate having a conductor circuit formed on at least one surface. Examples thereof include epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, and the like. A thermosetting resin such as a polyphenylene ether resin, a mixture of these thermosetting resins with an inorganic filler, or a sheet of a thermoplastic resin such as polyvinyl chloride or polyethylene is covered with a metal foil on one or both surfaces. A substrate, a substrate of inorganic fibers such as glass, a cloth of organic fibers such as polyester, polyamide, and cotton, and a substrate such as paper are adhered with the above-mentioned thermosetting resin or the above-mentioned thermoplastic resin, and one side or both sides. Conductive circuits are formed by etching metal foil using a plate or the like on which a metal foil is stretched. Perform plating, or the like obtained by forming the conductor circuits and the like. The number of substrates 11 to be stacked in one set of pressure-bonded members 14 is not particularly limited, and may be appropriately adjusted according to the number of conductor layers to be formed.

The thermosetting resin sheet 12 used in the present invention is a sheet containing a thermosetting resin composition, such as a prepreg obtained by impregnating a thermosetting resin composition into a substrate, or a thermosetting resin composition. And a resin film formed by forming the conductive resin composition into a sheet shape, and these may be used in combination. Note that when a prepreg is used, an insulating layer with a uniform thickness can be formed, which is preferable. When a resin film is used, a thin insulating layer can be formed, which is preferable. The number of the thermosetting resin sheets 12 to be used is not particularly limited, and may be appropriately adjusted according to the thickness of the insulating layer to be formed.

The thermosetting resin composition used for the thermosetting resin sheet 12 may be an epoxy resin, a phenol resin, a polyimide resin, an unsaturated polyester resin, or the like, alone, modified, or a mixture. In addition, general thermosetting resin compositions can be used. The thermosetting resin composition contains a thermosetting resin as an essential component, and may contain a curing agent, a curing accelerator, an inorganic filler, and the like for the thermosetting resin as necessary. In addition, when the thermosetting resin composition is an epoxy resin type, a multilayer board having an excellent balance between electrical properties and adhesiveness can be obtained, which is preferable.

The substrate may be made of inorganic fibers such as glass, polyester, polyamide, polyacryl, or the like.
A woven fabric, nonwoven fabric, paper, or the like of organic fibers such as polyimide or natural fibers such as cotton can be used. Note that the use of a glass fiber woven fabric (glass cloth) is preferable because the resulting multilayer board has excellent heat resistance and moisture resistance. The thickness of the base material is generally 0.04 to 0.3 mm.

The method for producing the prepreg by impregnating the base material with the thermosetting resin composition is not particularly limited. For example, a varnish prepared by adjusting the viscosity of the thermosetting resin composition with a solvent may be used. After the material is immersed and impregnated, it is manufactured by heating and drying and semi-curing as necessary, or without using a solvent, by heating and melting the thermosetting resin composition and impregnating the substrate. . The amount of the resin in the prepreg is determined by the weight of the prepreg (the total weight of the thermosetting resin composition and the base material) 1
It is preferably 40 to 70 parts by weight based on 00 parts by weight. When the amount is less than 40 parts by weight, the heat resistance of the obtained multilayer board may decrease, and when it exceeds 70 parts by weight, the thickness of the obtained multilayer board may vary greatly.

As a method for producing a resin film formed by forming a thermosetting resin composition into a sheet, for example, a sheet insoluble in a thermosetting resin composition such as a polyester film or a polyimide film may be used. The thermosetting resin composition is applied to a thickness of 5 to 700 μm, dried if necessary, and then peeled off to produce a sheet, which is generally called a casting method.

The metal foil 13 used in the present invention is not particularly limited as long as it is a metal foil.
A single, alloy, or composite foil of copper, aluminum, brass, nickel, or the like can be used. The thickness of the metal foil 13 is generally 5 to 70 μm. In addition, metal foil 1
Instead of 3, a release sheet such as a fluororesin film may be stacked. In addition, when a release sheet is laminated | stacked, after heating and pressurizing, a release sheet is peeled and a multilayer board is used.

The conditions for heating and pressurizing the laminate 10 may be appropriately adjusted under the conditions under which the thermosetting resin composition in the thermosetting resin sheet 12 is cured, and may be heated and pressurized.
If the pressurizing pressure is too low, bubbles may remain inside the obtained multilayer board, so it is preferable to pressurize under conditions that satisfy the moldability. In addition, heating and pressurization are 300To
It is preferable to perform the treatment in a reduced pressure atmosphere of rr or less, since the amount of bubbles remaining in the obtained multilayer board is particularly reduced. Heat and pressure may be applied between the laminate 10 and the hot plate 19 with a cushion material such as cellulose paper or aramid fiber paper, a heat conduction adjusting material, or the like interposed therebetween, if necessary.

Although the above embodiment has been described with reference to the embodiment in which the laminate 10 is formed by stacking two sets of crimped bodies 14 and 14 with a flat plate 18 interposed therebetween, the number of crimped bodies 14 is particularly limited. There is no limitation, and it may be adjusted appropriately.
When it is about 5, the balance between productivity and moldability is excellent and preferable. The object to be pressed 14 is formed of the thermosetting resin sheet 12.
And the substrate 11 and the metal foil 13 or the release sheet, as long as they are stacked such that the metal foil 13 or the release sheet is disposed on at least one of the outsides thereof.
As shown in FIG. 3, a substrate 1 having a conductor circuit formed on one surface and having a metal foil 13 layer on the entire other surface is provided.
1, a thermosetting resin sheet 12 is laminated on the side of the surface on which the conductive circuit is formed, and a metal foil 13 is formed on the entire surface.
The pressure-bonded member 14 may be formed by stacking the release sheet 15 on the side having the surface having the above layer.

In the above-described embodiment, the object 1
Although the method of forming the laminate 4 and forming the laminate 10 by sandwiching them with the flat plate 18 has been described, the present invention includes another method as long as the shape of the laminate 10 is the same. As another method, for example, in the case of the configuration shown in FIG. 1A, after a metal foil 13 is stacked on a flat plate 18, a required number of thermosetting resin sheets 12 are stacked,
After the thermosetting resin sheet 12 and the metal foil 13 are sequentially stacked to form the pressed body 14, the flat plate 18 is stacked, and then the metal foil 13, the thermosetting resin sheet 12, the substrate 11, the thermosetting resin sheet 12, From the portion corresponding to the metal foil 13 and the lower hot plate 19 to the portion corresponding to the upper hot plate 19,
There is a method of stacking in order.

[Method for Producing Multilayer Board According to Claim 3 of the Present Invention] One embodiment of the method for producing a multilayer board according to claim 3 of the present invention is, as shown in FIG. A metal foil with a resin layer 16 having a thermosetting resin layer 17 formed on one surface of a metal foil 13 on both outer sides of the substrate 11 on which the conductive circuit is formed.
Are stacked so that the thermosetting resin layer 17 is in contact with the substrate 11 so that the metal foil 13 is arranged on both outer sides thereof, and two sets of the pressure-bonded members 14 are formed.
Then, the two sets of crimped bodies 14, 14 are
After the laminated body 10 is formed by being sandwiched between the hot plates 19, 19, the laminated body 10 is sandwiched between the hot plates 19, 19, and then heated.
This is an embodiment in which two multilayer boards are manufactured at a time by applying pressure.

The flat plate 18 (the flat plate for manufacturing a multilayer board according to the fifth aspect of the present invention) is the same as the method for manufacturing a multilayer board according to the first and second aspects of the present invention, as shown in FIG. It is important that the flat plate 18 has a thermoplastic resin layer 184 in the inner layer and metal plate layers 182 and 182 in the outermost layers as shown in FIG. When the inner layer is not provided with the thermoplastic resin layer 184, bubbles may remain in the obtained multilayer board, which may cause a problem in moldability. When the outermost layers do not include the metal plate layers 182, 182, In some cases, the surface roughness of the obtained multilayer plate becomes large.

The material and thickness of the thermoplastic resin layer 184 and the metal plate layer 182 constituting the flat plate 18 and the flat plate 1
The number of sheets using No. 8 is the same as that in the method of manufacturing a multilayer board according to claims 1 and 2 of the present invention.

The metal foil 16 with a resin layer used in the present invention has a thermosetting resin layer 17 on one surface of the metal foil 13.
After applying the same thermosetting resin composition as that used for the thermosetting resin sheet 12 to one surface of the metal foil 13 to a thickness of 5 to 300 μm,
It was manufactured by drying as necessary. The conditions for heating and pressurizing the metal foil 13, the substrate 11, and the laminate 10 to be used include the same conditions as in the method of manufacturing a multilayer board according to claims 1 and 2 of the present invention. .

The object to be pressed 14 may be any one as long as the metal foil 16 with a resin layer and the substrate 11 are stacked so that the metal foil 13 is arranged on at least one of the outsides. As shown in FIG. 5 (a), a conductor circuit is formed on one surface and a metal foil 13 is formed on the entire other surface.
A metal foil 16 with a resin layer is provided on the side of the surface of the substrate 11 having the
May be formed so as to be in contact with the substrate 11, and the thermosetting resin sheet is provided between the metal foil 16 with a resin layer and the substrate 11 as shown in FIG. 12
The body 14 to be crimped may be formed by stacking them.

[0037]

(Example 1) A copper foil (70 μm thick) on the surface of a copper-clad laminate [R1766, manufactured by Matsushita Electric Works, Ltd.] having a thickness of 0.1 mm was used as a substrate having a conductive circuit formed on the surface.
The substrate on which the conductor circuit was formed by etching m) was used. Further, as the prepreg, a prepreg having a thickness of 0.1 mm obtained by impregnating a glass cloth (substrate) with an epoxy resin-based resin composition [R1661G, manufactured by Matsushita Electric Works, Ltd.]
G], and a copper foil [manufactured by Nikko Gould Foil Co., Ltd.] having a thickness of 18 μm was used as the metal foil.

As a flat plate, a flat plate made of stainless steel alone having a thickness of 1 mm (hereinafter referred to as a flat plate A), a 0.3 mm-thick fluororesin layer as an inner layer, and a 0.5 mm-thick A flat plate having a stainless steel plate layer and having an integrated three-layer structure (hereinafter, referred to as a flat plate B) was used.
In addition, the flat plate B was manufactured by sandwiching a fluororesin film between stainless steel plates, and then molding and integrating them.

One prepreg is laminated on both outer sides of the substrate on which the conductor circuit is formed on the surface, and 10 sets of crimped bodies formed by laminating copper foil on both outermost layers are sandwiched between flat plates. To form a laminate. In addition, by using the flat plate A and the flat plate B alternately, six flat plates A and five flat plates B were used as the whole laminate.

Next, the laminate was sandwiched between hot plates,
It was heated and pressed at 0 ° C. and a pressure of 3.0 MPa for 90 minutes to obtain a multilayer board. In addition, between the laminated body and the hot plate, five sheets of kraft paper [manufactured by Tomagawa Seisakusho Co., Ltd.] of 190 g / sq.

Example 2 Instead of the flat plate B, an inner layer was provided with a fluorine resin layer reinforced with a glass cloth having a thickness of 0.3 mm, and both outermost layers were provided with a stainless steel plate layer having a thickness of 0.5 mm. A multilayer board was obtained in the same manner as in Example 1, except that an integrated three-layer flat plate was used. This flat plate was manufactured by sandwiching a sheet of glass cloth impregnated with a fluororesin between stainless steel plates, and then molding and integrating the sheet.

(Example 3) A copper foil with a resin layer having a 0.1 mm thick epoxy resin-based resin layer formed on one side of a copper foil was formed on both outer sides of a substrate having a conductor circuit formed on the surface. The same as in Example 1, except that the pressure-bonded members formed by stacking the resin layers so that the copper foils are arranged on both outer sides thereof by stacking the resin layers in contact with the substrate were stacked to form a stacked body. To obtain a multilayer board.

(Comparative Example 1) Instead of the flat plate B, an inner layer was provided with a layer of an epoxy resin-based thermosetting resin reinforced with a glass cloth having a thickness of 0.3 mm, and both outermost layers were formed of stainless steel having a thickness of 0.5 mm. A multilayer board was obtained in the same manner as in Example 1 except that a flat plate having a plate layer and having an integrated three-layer structure was used. The flat plate was manufactured by sandwiching three prepregs between stainless steel plates, and then molding and integrating the prepregs.

Comparative Example 2 A multilayer board was obtained in the same manner as in Example 1 except that the flat plate A was used instead of the flat plate B (that is, all the flat plates A were used).

Comparative Example 3 A multilayer board was obtained in the same manner as in Example 3 except that the flat plate A was used instead of the flat plate B.

(Evaluation / Results) The moldability of the multilayer boards obtained in each of the examples and comparative examples was evaluated. The method is to remove the outermost copper foil of the multilayer board by etching and then visually inspect the copper foil.
By observing 0 sheets, the number of multilayer boards having bubbles remaining therein was determined. As a result, as shown in Table 1, it was confirmed that the number of bubbles remaining in each example was smaller in each example than in each comparative example, and that the moldability was excellent.

[0047]

[Table 1]

[0048]

According to the present invention, at least one of the flat plates has a thermoplastic resin layer as an inner layer and a metal plate layer as both outermost layers. Since it is a flat plate provided, it is possible to obtain a multilayer plate having excellent moldability.

The flat plate for producing a multilayer board according to the fifth aspect of the present invention is a flat plate having a thermoplastic resin layer in the inner layer and a metal plate layer in both outermost layers. It is possible to obtain a multilayer board having excellent properties.

[Brief description of the drawings]

FIG. 1 is a view for explaining an embodiment of a method for manufacturing a multilayer board according to claims 1 and 2 of the present invention, wherein (a) is an exploded front view and (b) is a front view showing a flat plate. It is.

FIG. 2 is a front view showing a modified example of a flat plate in one embodiment of the method for manufacturing a multilayer plate according to the present invention.

FIG. 3 is an exploded front view illustrating a main part of another embodiment of the method for producing a multilayer board according to claims 1 and 2 of the present invention.

FIG. 4 is a view for explaining an embodiment of the method for manufacturing a multilayer board according to claim 3 of the present invention, wherein (a) is an exploded front view,
(B) is a front view showing a flat plate.

FIG. 5 shows a method for producing a multilayer board according to claim 3 of the present invention.
It is an exploded front view explaining an important section of other embodiments.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Laminated body 11 Substrate 12 Thermosetting resin sheet 13 Metal foil 14 Compression-bonded body 15 Release sheet 16 Metal foil with resin layer 17 Thermosetting resin layer 18 Flat plate 182 Metal plate layer 184 Thermoplastic resin layer 19 Hot plate

Claims (5)

[Claims] 1. A thermosetting resin sheet containing a thermosetting resin composition, a substrate having a conductive circuit formed on a surface thereof, a metal foil or a release sheet, and a metal foil or a release sheet on at least one of the outer sides thereof. In a method of manufacturing a multilayer board in which a plurality of press-bonded members stacked so that a release sheet is arranged, a plurality of stacked members are sandwiched between flat plates to form a stacked body, and the stacked body is heated and pressed to manufacture, At least one of them is a flat plate having a thermoplastic resin layer as an inner layer and a metal plate layer as both outermost layers. 2. The thermosetting resin sheet is a prepreg formed by impregnating a base material with a thermosetting resin composition or a resin film formed by forming a thermosetting resin composition into a sheet. The method for producing a multilayer board according to claim 1, wherein: 3. A press-bonded body in which a metal foil with a resin layer having a thermosetting resin layer formed on one surface of a metal foil and a substrate are stacked so that the metal foil is disposed on at least one of the outsides. After sandwiching a plurality of sheets to form a laminate,
In the method for manufacturing a multilayer board produced by heating and pressing the laminate, at least one of the flat boards is a flat board having a thermoplastic resin layer in an inner layer and a metal plate layer in both outermost layers. A method for producing a multilayer board, characterized by the following. 4. The method for producing a multilayer board according to claim 1, wherein the thermoplastic resin layer is a layer of a fluorine-based resin. 5. An inner layer comprising a thermoplastic resin layer,
A flat plate for manufacturing a multilayer board, comprising a metal plate layer on both outermost layers.