JP3275782B2 - Manufacturing method of laminated board - Google Patents

Manufacturing method of laminated board

Info

Publication number
JP3275782B2
JP3275782B2 JP16754897A JP16754897A JP3275782B2 JP 3275782 B2 JP3275782 B2 JP 3275782B2 JP 16754897 A JP16754897 A JP 16754897A JP 16754897 A JP16754897 A JP 16754897A JP 3275782 B2 JP3275782 B2 JP 3275782B2
Authority
JP
Japan
Prior art keywords
conductive sheet
laminate
insulating plate
elastic body
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16754897A
Other languages
Japanese (ja)
Other versions
JPH1110790A (en
Inventor
勉 一木
裕信 森
伸也 荒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP16754897A priority Critical patent/JP3275782B2/en
Publication of JPH1110790A publication Critical patent/JPH1110790A/en
Application granted granted Critical
Publication of JP3275782B2 publication Critical patent/JP3275782B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電気・電子機器等
に使用される積層板の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board used for electric / electronic equipment and the like.

【0002】[0002]

【従来の技術】従来より、プリント配線板の製造に用い
られる、表面に導電体の層を有する積層板は、例えばガ
ラスクロス等の基材にエポキシ樹脂等の熱硬化性樹脂を
含浸した後、乾燥して半硬化させて製造したプリプレグ
を所要枚数と、必要に応じて導体回路を形成した内層板
を重ねて被圧着体を形成し、その両外側に導電シートを
配して積層した後、この積層物を金属製等の平板に挟ん
で積層体を形成し、更にこの積層体を成形プレスの加圧
板に挟んで、加熱・加圧することにより、被圧着体及び
導電シートを接着して製造されている。
2. Description of the Related Art Conventionally, a laminated board having a conductor layer on its surface, which is used for manufacturing a printed wiring board, is prepared by impregnating a base material such as a glass cloth with a thermosetting resin such as an epoxy resin. The required number of prepregs manufactured by drying and semi-curing, and an inner layer plate on which a conductor circuit is formed as necessary, are laminated to form a body to be crimped, and a conductive sheet is arranged on both outer sides and laminated. The laminate is sandwiched between flat plates made of metal or the like to form a laminate, and the laminate is sandwiched between pressurizing plates of a molding press, and heated and pressed to bond the object to be compressed and the conductive sheet to produce the laminate. Have been.

【0003】また、生産性の向上のために、複数の積層
物を、間に平板を介在させて重ね、その重ねた積層体を
成形プレスの加圧板の間に挟んで加熱・加圧することに
より、一度に多数の積層板を得る方法も用いられてい
る。
In order to improve productivity, a plurality of laminates are stacked with a flat plate interposed therebetween, and the stacked products are heated and pressed by being sandwiched between pressing plates of a forming press. A method of obtaining a large number of laminates at one time is also used.

【0004】これらの加熱・加圧する方法としては、積
層体を加熱した加圧板の間に挟んで加圧板からの伝熱に
より加熱しながら加圧する方法や、特表平8−5062
89号に記載されたような、積層体を加圧板の間に挟ん
だ状態で導電シートに給電して、抵抗加熱により加熱し
ながら加圧する方法が行われている。なお、抵抗加熱
は、電気抵抗を有する導電体に電流を流し、ジュール効
果で発生する熱により加熱する方法である。
[0004] As a method of heating and pressurizing, a method in which a laminate is sandwiched between heated pressurizing plates and pressurized while heating by heat transfer from the pressurizing plate, or Japanese Patent Application Laid-Open No. Hei 8-5062.
No. 89, a method of supplying power to a conductive sheet in a state where a laminate is sandwiched between pressure plates, and performing pressure while heating by resistance heating. Note that resistance heating is a method in which a current is applied to a conductor having electric resistance and heating is performed using heat generated by the Joule effect.

【0005】この抵抗加熱により加熱しながら加圧する
方法としては、図3に示すような、プリプレグ31等を
所要枚数重ねて形成した被圧着体32と、平板35の、
それぞれの一端面部で導電シート33を折り曲げること
により、間に平板35を挟んで隣り合う被圧着体32,
32間で導電シート33が連続化するように、被圧着体
32、平板35及び導電シート33を重ねて積層体36
を形成した後、その積層体36を成形プレスの加圧板3
9,39の間に挟んで加圧した状態で、導電シート33
に給電することにより、各被圧着体32,32を抵抗加
熱によって加熱する方法が行われている。
As a method of applying pressure while heating by resistance heating, as shown in FIG. 3, a pressure-bonded body 32 formed by laminating a required number of prepregs 31 and the like,
By bending the conductive sheet 33 at each one end surface, the pressure-bonded members 32 adjacent to each other with the flat plate 35 interposed therebetween,
The crimped body 32, the flat plate 35, and the conductive sheet 33 are stacked so that the conductive sheet 33 is continuous between the
Is formed, and the laminated body 36 is pressed into a pressing plate 3 of a forming press.
In a state where the conductive sheet 33 is pressed between the conductive sheets 33 and 39,
In this method, each of the pressure-bonded members 32 is heated by resistance heating.

【0006】この方法の場合、導電シート33は、間に
平板35を挟んで隣り合う被圧着体32,32間で連続
化するように配置されており、導電シート33の両端部
に給電すると、電流が流れた部分の導電シート33全体
が発熱し、複数の被圧着体32,32全てがほぼ同じよ
うに発熱するようになっている。そのため、この抵抗加
熱により加熱する方法は、上記加圧板39からの伝熱に
より加熱する方法と比較して加熱時間が短く済み、生産
性が高いという特徴があり増加しつつある。なお、上記
被圧着体32,32間に配置される平板35は、導電性
を有していると、平板35内に電流が流れてしまい、導
電シート33には均一に電流が流れなくなって、均一に
抵抗発熱し難くなり、その部分の被圧着体32は加熱不
足となって、得られる積層板の特性が低くなるため、絶
縁性を有する平板35が用いられている。
In this method, the conductive sheet 33 is disposed so as to be continuous between the pressure-bonded members 32 adjacent to each other with the flat plate 35 interposed therebetween, and when power is supplied to both ends of the conductive sheet 33, The entirety of the conductive sheet 33 where the current has flowed generates heat, and the plurality of pressure-bonded bodies 32, 32 all generate heat in substantially the same manner. Therefore, the method of heating by resistance heating has a feature that the heating time is shorter and the productivity is higher than that of the method of heating by heat transfer from the pressure plate 39, and is increasing. If the flat plate 35 disposed between the pressed bodies 32, 32 has conductivity, current flows in the flat plate 35, and current does not flow uniformly in the conductive sheet 33. Uniform resistance heat generation is difficult, and the pressure-bonded body 32 in that portion is insufficiently heated, and the characteristics of the obtained laminated board are deteriorated. Therefore, a flat plate 35 having an insulating property is used.

【0007】なお、上記プリプレグ31は、熱硬化性樹
脂を基材に含浸して半硬化させたものであるため、この
樹脂は加熱するといったん粘度が低下して樹脂が流れ、
更に加熱すると硬化して樹脂が流れなくなる挙動を示
す。そのため、プリプレグ31の取り扱いにおいては半
硬化しているため扱いやすく、また、加熱加圧して成形
する途中である程度流動性を有するため、多少の樹脂量
のばらつきがあっても樹脂が流れてほぼ均一の厚みの積
層板が得られるという特徴があり汎用されている。しか
し、樹脂は一般に粘度が高いため、基材の内部まで十分
に樹脂が含浸されにくく、得られるプリプレグ31の内
部には、気泡が残留している場合が一般的である。その
ため加熱して樹脂が溶融したときに、圧力をかけること
により樹脂を流動させて、気泡を抜く方法で一般に積層
板は製造されている。
Since the prepreg 31 is obtained by impregnating a thermosetting resin into a base material and semi-curing the resin, the viscosity of the resin decreases as soon as it is heated, and the resin flows.
When heated further, the resin hardens and the resin stops flowing. Therefore, the prepreg 31 is semi-cured and easy to handle, and has a certain degree of fluidity during molding by heating and pressing, so that even if there is a slight variation in the amount of resin, the resin flows and is almost uniform. It is widely used because it has the characteristic that a laminated plate having a thickness of 3 mm can be obtained. However, since the resin generally has a high viscosity, it is difficult to sufficiently impregnate the resin into the inside of the base material, and bubbles are generally left inside the obtained prepreg 31. Therefore, when the resin is heated and melted, pressure is applied to cause the resin to flow to remove air bubbles, and thus a laminate is generally manufactured.

【0008】しかし、加圧板39,39の間に挟む被圧
着体32の数が多いと、得られる積層板中に気泡が残留
しやすく、成形性が低いという問題があった。そのた
め、積層体36と加圧板39の間に、一般にクッション
材と呼ばれる、セルロースペーパー等の弾性を有するシ
ート状の弾性体38を挟んで成形性を向上させることが
検討されている。
However, when the number of the pressure-bonded members 32 sandwiched between the pressing plates 39, 39 is large, there is a problem that air bubbles are likely to remain in the obtained laminated plate and the moldability is low. Therefore, it has been studied to improve the formability by interposing a sheet-like elastic body 38 having elasticity, such as cellulose paper, generally called a cushion material, between the laminate 36 and the pressing plate 39.

【0009】しかし、樹脂付着量のばらつきが大きいプ
リプレグ31を用いた場合や、加圧板39,39の間に
挟む被圧着体32の数が特に多い場合等には、積層体3
6と加圧板39の間に挟む弾性体38の量を増加させて
も、得られる積層板中に気泡が残留する場合があるとい
う問題があった。そのため、樹脂付着量のばらつきが大
きいプリプレグ31を用いた場合等であっても、成形性
が優れた積層板が得られる積層板の製造方法が望まれて
いる。
However, when the prepreg 31 having a large variation in the amount of adhered resin is used, or when the number of the pressure-bonded members 32 sandwiched between the pressing plates 39, 39 is particularly large, etc.
Even when the amount of the elastic body 38 sandwiched between the pressure plate 6 and the pressing plate 39 is increased, there is a problem that air bubbles may remain in the obtained laminated plate. Therefore, there is a demand for a method of manufacturing a laminate that can provide a laminate having excellent moldability, even when a prepreg 31 having a large variation in the amount of adhered resin is used.

【0010】[0010]

【発明が解決しようとする課題】本発明は、上記問題点
を改善するために成されたもので、その目的とするとこ
ろは、熱硬化性樹脂を基材に含浸したプリプレグを有す
る被圧着体と、絶縁板の、それぞれの一端面部で導電シ
ートを折り曲げることにより、間に絶縁板を挟んで隣り
合う被圧着体間で導電シートが連続化するように、被圧
着体、絶縁板及び導電シートを重ねて積層体を形成した
後、上記導電シートに給電し、抵抗加熱により積層体を
加熱すると共に、加圧して製造する積層板の製造方法で
あって、成形性が優れた積層板が得られる積層板の製造
方法を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a press-bonded object having a prepreg in which a thermosetting resin is impregnated in a base material. And an insulating plate, by bending the conductive sheet at one end surface of each, so that the conductive sheet is continuous between the objects to be pressed and adjacent to each other with the insulating plate interposed therebetween, so that the object to be pressed, the insulating plate, and the conductive sheet Are laminated, a power is supplied to the conductive sheet, the laminate is heated by resistance heating, and the laminate is manufactured by pressurizing the laminate. To provide a method for manufacturing a laminated board.

【0011】[0011]

【課題を解決するための手段】本発明の請求項1に係る
積層板の製造方法は、熱硬化性樹脂を基材に含浸したプ
リプレグを有する被圧着体と、絶縁板の、それぞれの一
端面部で導電シートを折り曲げることにより、間に絶縁
板を挟んで隣り合う被圧着体間で導電シートが連続化す
るように、被圧着体、絶縁板及び導電シートを重ねて積
層体を形成した後、上記導電シートに給電し、抵抗加熱
により積層体を加熱すると共に、加圧して製造する積層
板の製造方法において、被圧着体、絶縁板及び導電シー
トを重ねて積層体を形成する方法が、絶縁板と導電シー
トの間に、弾性を有する弾性体を挟みながら、被圧着
体、絶縁板及び導電シートを重ねて積層体を形成する方
法であり、さらに、絶縁板と導電シートの間に、弾性体
を挟んで重ねる方法が、導電シートの一方の面に弾性体
を離脱可能に接着した後、その接着した弾性体が絶縁板
に接する側になるように、絶縁板と、弾性体を接着した
導電シートとを重ねる方法であることを特徴とする。
According to a first aspect of the present invention, there is provided a method for manufacturing a laminated board, comprising: a pressure-bonded body having a prepreg in which a thermosetting resin is impregnated in a base material; By bending the conductive sheet at, so that the conductive sheet is continuous between the body to be pressed and adjacent to each other with an insulating plate in between, after forming a laminate by stacking the body to be pressed, the insulating plate and the conductive sheet, Power is supplied to the conductive sheet, the laminate is heated by resistance heating, and the laminate is manufactured by pressurization. between the plate and the conductive sheet, while sandwiching the elastic member having elasticity, the pressure-bonded body, a method of forming a laminate superimposed insulating plate and the conductive sheet, further, between the insulating plate and a conductive sheet, elastic How to stack your body After the elastic body is detachably adhered to one surface of the conductive sheet, the insulating plate and the conductive sheet to which the elastic body is adhered are overlapped so that the adhered elastic body comes into contact with the insulating plate. There is a feature.

【0012】[0012]

【0013】本発明の請求項2に係る積層板の製造方法
は、請求項1又は請求項2記載の積層板の製造方法にお
いて、弾性体が、セルロースシート、アラミド繊維シー
ト、ゴムシート及びこれらの複合体から選ばれた少なく
とも1種であることを特徴とする。
According to a second aspect of the present invention, there is provided a method for manufacturing a laminated board according to the first or second aspect, wherein the elastic body comprises a cellulose sheet, an aramid fiber sheet, a rubber sheet, It is characterized in that it is at least one selected from composites.

【0014】従来の、弾性体を積層体と成形プレスの加
圧板との間に挟む方法の場合、中央部分に配置する被圧
着体には弾性体の弾性が伝わり難くなっており、中央部
分に配置する被圧着体はプリプレグの樹脂量のばらつき
等が残った状態で硬化してしまうため、樹脂量の少ない
部分に気泡が残留すると考えられる。しかし、本発明に
よると、絶縁板と導電シートの間に弾性体を挟むため、
中央部分に配置する被圧着体にプリプレグの樹脂量のば
らつき等があった場合であっても、そのばらつきを絶縁
板と導電シートの間に挟んだ弾性体が吸収して均一に圧
力がかかるようになり、得られる積層板の内部に気泡が
残留し難くなると考えられる。
In the conventional method in which the elastic body is sandwiched between the laminate and the pressing plate of the forming press, the elasticity of the elastic body is hardly transmitted to the crimped body disposed at the center, and Since the body to be pressed is hardened in a state where the variation in the resin amount of the prepreg remains, it is considered that bubbles remain in the portion where the resin amount is small. However, according to the present invention, since the elastic body is sandwiched between the insulating plate and the conductive sheet,
Even if there is a variation in the amount of resin of the prepreg in the object to be pressed placed in the center part, the elastic body interposed between the insulating plate and the conductive sheet absorbs the variation and uniformly applies pressure. It is considered that air bubbles hardly remain inside the obtained laminate.

【0015】[0015]

【発明の実施の形態】本発明に係る積層板の製造方法の
実施の形態を、図面に基づいて説明する。図1は本発明
に係る積層板の製造方法に関連する参考方法を説明する
であり、図2は本発明に係る積層板の製造方法の、
実施の形態を説明する図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the method for manufacturing a laminated board according to the present invention will be described with reference to the drawings. FIG. 1 illustrates a reference method relating to a method for manufacturing a laminate according to the present invention.
FIG . 2 is a diagram showing one example of a method for manufacturing a laminate according to the present invention.
It is a figure explaining an embodiment .

【0016】本発明に係る積層板の製造方法の一実施の
形態は、図1に示す参考方法と同様に、熱硬化性樹脂を
基材に含浸したプリプレグ1を有する被圧着体2と、絶
縁板5の、それぞれの一端面部で導電シート3を折り曲
げることにより、間に絶縁板5を挟んで隣り合う被圧着
体2,2間で導電シート3が連続化するように、被圧着
体2、絶縁板5及び導電シート3を重ねて積層体6を形
成する。次いで、その積層体6を成形プレスの加圧板
9,9の間に挟んで加圧した状態で、導電シート3に給
電することにより、抵抗加熱によって積層体6を加熱す
ると共に、加圧して積層板を製造する。
One embodiment of the method for manufacturing a laminated board according to the present invention comprises , similarly to the reference method shown in FIG. 1, a pressure-bonded body 2 having a prepreg 1 in which a thermosetting resin is impregnated in a base material, By bending the conductive sheet 3 at each end surface of the plate 5, the crimped bodies 2, 2 are connected so that the conductive sheet 3 is continuous between the crimped bodies 2, 2 adjacent to each other with the insulating plate 5 interposed therebetween. The laminate 6 is formed by stacking the insulating plate 5 and the conductive sheet 3. Then, the laminate 6 is sandwiched between the pressurizing plates 9 of the forming press and pressurized, and power is supplied to the conductive sheet 3 to heat the laminate 6 by resistance heating and pressurize the laminate. Manufacture boards.

【0017】なお、絶縁板5と導電シート3の間に、弾
性を有する弾性体8を挟みながら、被圧着体2、絶縁板
5及び導電シート3を重ねることが重要である。弾性体
8を挟まない場合は、得られる積層板中に気泡が残留し
て成形性に問題が発生する場合がある。
It is important that the pressure-bonded member 2, the insulating plate 5 and the conductive sheet 3 are stacked while the elastic body 8 having elasticity is sandwiched between the insulating plate 5 and the conductive sheet 3. If the elastic body 8 is not sandwiched, bubbles may remain in the obtained laminated plate, which may cause a problem in moldability.

【0018】なお同様の弾性体8を、積層体6と加圧板
9の間に挟んだ(又は挟む量を増加した)場合にも、成
形性を改良する効果はあるが、絶縁板5と導電シート3
の間に挟む場合と比較して効果が小さく、依然として得
られる積層板の内部に気泡が残留する場合がある。
When the same elastic body 8 is sandwiched between the laminate 6 and the pressing plate 9 (or the amount of sandwiching is increased), there is an effect of improving the formability, but the insulating plate 5 and the conductive plate are electrically conductive. Sheet 3
The effect is small as compared with the case where it is sandwiched between the laminated sheets, and air bubbles may still remain inside the obtained laminate.

【0019】絶縁板5と導電シート3の間に挟む弾性体
8は、弾性を有し、加熱加圧時の温度及び圧力に耐える
ものをシート状に形成したものであり、例えばクラフト
紙、リンター紙等のセルロースシートや、アラミド繊維
シートや、ポリエステル繊維シート等の、多数の繊維を
間に空隙を設けて結合してシート状に形成したものや、
フッ素ゴム、ブタジエンスチレンゴム等の弾性を有する
化合物をシート状に形成したものや、これらの複合体が
挙げられる。なお、セルロースシート、アラミド繊維シ
ート、ゴムシート及びこれらの複合体から選ばれた少な
くとも1種であると、特に弾性が高いため、得られる積
層板の内部に特に気泡が残留し難くなり好ましい。
The elastic body 8 sandwiched between the insulating plate 5 and the conductive sheet 3 is formed of a sheet having elasticity and withstanding the temperature and pressure at the time of heating and pressurizing. Cellulose sheets such as paper, aramid fiber sheets, and polyester fiber sheets, etc., are formed in a sheet shape by bonding a large number of fibers with a gap therebetween,
Examples thereof include those in which a compound having elasticity such as fluororubber and butadiene styrene rubber is formed in a sheet shape, and a composite thereof. It is preferable that at least one selected from the group consisting of a cellulose sheet, an aramid fiber sheet, a rubber sheet, and a composite thereof is particularly high in elasticity, so that air bubbles hardly remain inside the obtained laminate.

【0020】なお、弾性体8を挟む位置は、全ての絶縁
板5と導電シート3の間に挟むことに限定するものでは
なく、用いるプリプレグ1の樹脂付着量のばらつきや、
加圧板9,9の間に挟む被圧着体2の数量等に応じて、
適宜調整すればよい。
The position at which the elastic body 8 is sandwiched is not limited to being sandwiched between all the insulating plates 5 and the conductive sheet 3.
According to the quantity of the pressure-bonded body 2 sandwiched between the pressing plates 9, 9,
It may be adjusted appropriately.

【0021】また、導電シート3と弾性体8は直接、接
するようにする
The conductive sheet 3 and the elastic body 8 are in direct contact with each other .

【0022】本発明の被圧着体2は、熱硬化性樹脂を基
材に含浸したプリプレグ1を、その表面及び/又は内部
に有するものであり、プリプレグ1を所要枚数と、必要
に応じて導体回路を形成した基板を重ねたものである。
The object to be pressed 2 of the present invention has a prepreg 1 in which a thermosetting resin is impregnated in a base material on its surface and / or inside. This is a stack of substrates on which circuits are formed.

【0023】本発明に用いられる基材としては、ガラス
等の無機質繊維やポリエステル、ポリアミド、ポリアク
リル、ポリイミド等の有機質繊維や、木綿等の天然繊維
の織布、不織布、紙等を用いることができる。なお、ガ
ラス繊維製の織布(ガラスクロス)を用いると、得られ
る積層板の耐熱性、耐湿性が優れ、かつ、本発明の効果
が得られやすく好ましい。なお、基材の厚みとしては
0.04〜0.3mmのものが一般的に使用される。
As the base material used in the present invention, woven fabric, nonwoven fabric, paper and the like of inorganic fibers such as glass, organic fibers such as polyester, polyamide, polyacryl and polyimide, and natural fibers such as cotton can be used. it can. It is preferable to use a woven fabric (glass cloth) made of glass fiber because the obtained laminate has excellent heat resistance and moisture resistance, and the effect of the present invention can be easily obtained. The thickness of the base material is generally 0.04 to 0.3 mm.

【0024】また、本発明に用いられる熱硬化性樹脂と
しては、エポキシ樹脂系、フェノール樹脂系、ポリイミ
ド樹脂系、不飽和ポリエステル樹脂系、ポリフェニレン
エーテル樹脂系等の単独、変性物、混合物のように、熱
硬化性樹脂全般を用いることができる。
The thermosetting resin used in the present invention may be an epoxy resin, a phenol resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene ether resin, or the like, alone, modified or mixed. In addition, general thermosetting resins can be used.

【0025】この熱硬化性樹脂中には、熱硬化性樹脂を
必須として含有し、必要に応じてその熱硬化性樹脂の硬
化剤、硬化促進剤及び無機充填材等を含有することがで
きる。なおエポキシ樹脂等のように自己硬化性の低い熱
硬化性樹脂は、その樹脂を硬化するための硬化剤等も含
有することが必要である。
The thermosetting resin essentially contains a thermosetting resin, and may contain a curing agent, a curing accelerator, an inorganic filler and the like for the thermosetting resin as required. Note that a thermosetting resin having a low self-curing property, such as an epoxy resin, must also contain a curing agent for curing the resin.

【0026】熱硬化性樹脂を基材に含浸してプリプレグ
1を製造する方法としては特に限定するものではなく、
例えば、上記熱硬化性樹脂を溶剤で粘度調整したワニス
に、上記基材を浸漬して含浸した後、加熱乾燥すること
により半硬化して製造したり、室温で固体状の熱硬化性
樹脂を、加熱溶融させて粘度を低下させた状態で、基材
に含浸した後、冷却することにより固化して製造する。
The method for producing the prepreg 1 by impregnating the base material with the thermosetting resin is not particularly limited.
For example, after the thermosetting resin is varnished with a solvent, the viscosity of which is adjusted with a solvent, the base material is immersed and impregnated, and then heat-dried to produce a semi-cured product or a solid thermosetting resin at room temperature. After being impregnated into a substrate in a state where the viscosity is reduced by heating and melting, the mixture is cooled and solidified to produce a product.

【0027】なお、プリプレグ1中の樹脂量は、プリプ
レグ1の重量(熱硬化性樹脂及び基材の合計重量)10
0重量部に対し、40〜70重量部であると好ましい。
40重量部未満の場合は、得られる積層板の耐熱性が低
下する場合があり、70重量部を超える場合は、得られ
る積層板の板厚のばらつきが大きくなる場合がある。
The amount of the resin in the prepreg 1 is 10% by weight of the prepreg 1 (total weight of the thermosetting resin and the base material).
The amount is preferably 40 to 70 parts by weight with respect to 0 parts by weight.
If the amount is less than 40 parts by weight, the heat resistance of the obtained laminate may decrease, and if it exceeds 70 parts by weight, the thickness of the obtained laminate may vary greatly.

【0028】また、本発明に用いる導電シート3として
は、銅、アルミニウム、真鍮、ニッケル等の単独、合
金、複合の金属箔を用いることができ、この金属箔の厚
みとしては、0.012〜0.070mmのものが一般
的に使用される。なお、この導電シート3がプリプレグ
1と直接接触した部分は、加熱・加圧することによって
接着し、この導電シート3が積層板の表面の導電層とな
る。
As the conductive sheet 3 used in the present invention, a single, alloy, or composite metal foil of copper, aluminum, brass, nickel, or the like can be used. Those having a thickness of 0.070 mm are generally used. The portion where the conductive sheet 3 is in direct contact with the prepreg 1 is bonded by heating and pressing, and the conductive sheet 3 becomes a conductive layer on the surface of the laminate.

【0029】また、本発明に用いる絶縁板15として
は、加熱加圧時の温度及び圧力に耐える絶縁物であれば
特に限定するものではなく、例えば、金属板の表面全体
に、酸化金属やフッ素樹脂等の絶縁層を形成したものが
挙げられる。なお、絶縁板15の両側に電気絶縁性の弾
性体8が接して配設される場合には、絶縁板15の代わ
りに、一般に絶縁板15と比較して加圧強度が強い金属
板を用いることも可能である。
The insulating plate 15 used in the present invention is not particularly limited as long as it is an insulating material capable of withstanding the temperature and pressure during heating and pressurizing. For example, metal oxide or fluorine One in which an insulating layer such as a resin is formed can be given. When the electrically insulating elastic body 8 is disposed in contact with both sides of the insulating plate 15, a metal plate having generally higher pressure strength than the insulating plate 15 is used instead of the insulating plate 15. It is also possible.

【0030】積層体6を加熱・加圧する条件としては、
プリプレグ1中の熱硬化性樹脂が硬化する条件で適宜調
整して加熱・加圧すればよいが、加圧の圧力があまり低
いと得られる積層板の内部に気泡が残留する場合がある
ため、成形性を満足する条件で加圧することが好まし
い。
Conditions for heating and pressurizing the laminated body 6 include:
Heating and pressurizing may be performed by appropriately adjusting the conditions under which the thermosetting resin in the prepreg 1 is cured. However, if the pressurizing pressure is too low, bubbles may remain inside the obtained laminate, It is preferable to apply pressure under conditions that satisfy moldability.

【0031】なお、図1に示す参考方法では、絶縁板5
及び導電シート3の間ごとに、絶縁板5とほぼ同じ大き
さの弾性体8を、それぞれ挟んで重ねるようにしている
が、絶縁板5と導電シート3の間に、弾性体8を挟んで
重ねる方法は、本発明においては、例えば図2に示すよ
うに、導電シート3の一方の面に弾性体8を離脱可能に
接着した後、その接着した弾性体8が絶縁板5に接する
側になるように、絶縁板5と、弾性体8を接着した導電
シート3とを重ねるものである。なお、弾性体8を接着
した導電シート3を用いる方法では、あらかじめ導電シ
ート3の一方の面に弾性体8を離脱可能に接着したシー
トを準備しておくと、被圧着体2、絶縁板5及び導電シ
ート3を重ねて積層体6を形成するときの生産性が優れ
好ましい
In the reference method shown in FIG.
And between every conductive sheet 3, the elastic body 8 of approximately the same size as the insulation plate 5, <br/> that so as to overlap each other across each, between the insulating plate 5 and the conductive sheet 3, the elastic member In the present invention, for example, as shown in FIG. 2, after the elastic body 8 is detachably adhered to one surface of the conductive sheet 3, the adhered elastic body 8 is attached to the insulating plate 5. so that the side in contact with, the insulating plate 5, a shall overlap the conductive sheet 3 adhered to the elastic body 8. In the method of using the conductive sheet 3 to which the elastic body 8 is bonded, if a sheet to which the elastic body 8 is detachably bonded to one surface of the conductive sheet 3 is prepared in advance, the object to be pressed 2 and the insulating plate 5 In addition, the productivity when the laminate 6 is formed by stacking the conductive sheets 3 is excellent and is preferable .

【0032】[0032]

【実施例】(参考例1) 熱硬化性樹脂として、下記のエポキシ樹脂、硬化剤及び
硬化促進剤よりなる熱硬化性樹脂を使用した。 ・エポキシ樹脂:エポキシ当量が500であるテトラブ
ロモビスフェノールA型エポキシ樹脂[東都化成株式会
社製、商品名YDB−500]を固形分として80重量
部と、 ・硬化剤:ジシアンジアミド[日本カーバイド株式会社
製]を3重量部と、 ・硬化促進剤:2−エチル−4−メチルイミダゾール
[四国化成株式会社製]を0.2重量部。
EXAMPLES ( Reference Example 1 ) As the thermosetting resin, a thermosetting resin comprising the following epoxy resin, curing agent and curing accelerator was used. -Epoxy resin: 80 parts by weight as a solid content of a tetrabromobisphenol A type epoxy resin having an epoxy equivalent of 500 [trade name: YDB-500, manufactured by Toto Kasei Co., Ltd.]-Curing agent: dicyandiamide [manufactured by Nippon Carbide Co., Ltd.] ] And 0.2 parts by weight of a curing accelerator: 2-ethyl-4-methylimidazole [manufactured by Shikoku Chemicals Co., Ltd.].

【0033】上記熱硬化性樹脂にN,N−ジメチルホル
ムアミド[三菱瓦斯化学株式会社製]を溶剤として加え
て粘度調整したワニスに、厚さ0.19mmのガラスク
ロス[旭シュエーベル株式会社製、商品名7628]を
基材として用いて、浸漬して含浸し、次いで、最高温度
180℃で加熱乾燥して、樹脂量が40重量%、170
℃のゲルタイムが150秒のプリプレグを作製した。得
られたプリプレグの樹脂量の面内ばらつきをニューウエ
ーブゲージ[横河電機株式会社製]を用いて測定速度1
m/分、測定スパン10mm/回の条件で測定したとこ
ろ、最大と最小の差が10.7g/平方mであった。
A varnish prepared by adding N, N-dimethylformamide (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a solvent to the above thermosetting resin and adjusting the viscosity thereof is coated with a 0.19 mm-thick glass cloth [manufactured by Asahi Schwebel Co., Ltd. Name 7628] as a base material, and immersion by impregnation, followed by drying by heating at a maximum temperature of 180 ° C.
A prepreg having a gel time at 150 ° C. of 150 seconds was produced. The in-plane variation of the resin amount of the obtained prepreg was measured at a measuring speed of 1 using a new wave gauge [manufactured by Yokogawa Electric Corporation].
When measured under conditions of m / min and a measurement span of 10 mm / time, the difference between the maximum and minimum was 10.7 g / m 2.

【0034】そしてこのプリプレグを2枚重ねて被圧着
体を形成した後、この被圧着体と、アルミニウム板の表
面全体に酸化アルミニウムの層を形成した絶縁板の、そ
れぞれの一端面部で導電シートを折り曲げることによ
り、間に絶縁板を挟んで隣り合う被圧着体間で導電シー
トが連続化するように、10組の被圧着体と、11枚の
絶縁板と導電シート(銅箔、厚み18μm)を重ねて積
層体を形成した。なおこのとき、絶縁板と導電シートの
間ごとに、弾性を有する弾性体を挟んで重ねて積層体を
形成した。なお、弾性体としては、190g/平方mの
クラフト紙[株式会社巴川製作所製]を、絶縁板と導電
シートの間ごとに各1枚用いた。
After the two prepregs are stacked to form a pressure-bonded body, a conductive sheet is formed on each end face of the pressure-bonded body and an insulating plate having an aluminum oxide layer formed on the entire surface of an aluminum plate. By folding, 10 sets of crimped bodies, 11 insulating plates and a conductive sheet (copper foil, thickness 18 μm) so that the conductive sheet is continuous between adjacent crimped bodies with an insulating plate interposed therebetween. Were laminated to form a laminate. At this time, a laminated body was formed by interposing an elastic body having elasticity between the insulating plate and the conductive sheet. As the elastic body, kraft paper of 190 g / m 2 [manufactured by Tomagawa Seisakusho Co., Ltd.] was used for each one between the insulating plate and the conductive sheet.

【0035】次いで、この積層体の両側に、上記と同様
のクラフト紙を各5枚配した後、成形プレスの加圧板に
挟んだ。なお、加圧板間に挟んだクラフト紙の枚数は、
全体で30枚となる。
Next, five kraft papers similar to the above were arranged on both sides of the laminate, and were sandwiched between pressure plates of a forming press. The number of kraft paper sandwiched between the pressure plates is
The total is 30 sheets.

【0036】そして、導電シートに給電し、抵抗加熱に
より積層体を170℃で80分加熱すると共に、加圧し
て、厚み0.4mmの両面銅張り積層板を10枚得た。
Then, power was supplied to the conductive sheet, and the laminate was heated at 170 ° C. for 80 minutes by resistance heating and pressed to obtain 10 double-sided copper-clad laminates having a thickness of 0.4 mm.

【0037】なお、弾性体として用いたクラフト紙[株
式会社巴川製作所製]の弾性の大きさ(加圧時の圧縮
量)を、オートグラフ[島津製作所株式会社製]を用い
て試験片の大きさ50×50mm、荷重30kg/平方
cm、ヘッドスピード50mm/分の条件で測定したと
ころ、1枚当たり40μmであり、弾性を有することが
確認された。
The magnitude of the elasticity (compression amount during pressurization) of the kraft paper (manufactured by Tomagawa Seisakusho) used as the elastic body was measured by using an autograph (manufactured by Shimadzu Seisakusho) to measure the size of the test piece. When measured under the conditions of a size of 50 × 50 mm, a load of 30 kg / square cm, and a head speed of 50 mm / min, it was 40 μm per sheet, and it was confirmed that the sheet had elasticity.

【0038】(実施例2) 絶縁板と導電シートの間ごとに、弾性を有する弾性体を
各1枚挟んで重ねて積層体を形成する代わりに、導電シ
ートの一方の面に、参考例1と同様の弾性体を接着した
後、その接着した弾性体が絶縁板に接する側になるよう
に、絶縁板と、弾性体を接着した導電シートとを重ねて
積層体を形成したこと、及び、加熱・加圧した後、積層
板表面の導電シートから弾性体を引き剥がしたこと以外
参考例1と同様にして両面銅張り積層板を得た。
Example 2 Instead of forming a laminated body by sandwiching one elastic body having elasticity between the insulating plate and the conductive sheet to form a laminated body, reference example 1 is applied to one surface of the conductive sheet. After bonding the same elastic body as described above, an insulating plate and a conductive sheet to which the elastic body is bonded are laminated to form a laminate so that the bonded elastic body is on the side in contact with the insulating plate, and After heating and pressing, a double-sided copper-clad laminate was obtained in the same manner as in Reference Example 1 , except that the elastic body was peeled off from the conductive sheet on the laminate surface.

【0039】(参考例3) クラフト紙の代わりに、厚み3mmのフッ素ゴム製クッ
ション材[ヤマウチ株式会社製、商品名FF20M]を
1枚用いたこと以外は参考例1と同様にして両面銅張り
積層板を得た。なおこのクッション材の弾性の大きさ
を、参考例1と同様にして測定したところ、150μm
であり、弾性を有することが確認された。
Reference Example 3 Double-sided copper-clad in the same manner as in Reference Example 1 except that one sheet of a 3 mm-thick fluororubber cushion material [trade name: FF20M, manufactured by Yamauchi Co., Ltd.] was used instead of kraft paper. A laminate was obtained. When the magnitude of elasticity of this cushion material was measured in the same manner as in Reference Example 1 , it was 150 μm.
And it was confirmed to have elasticity.

【0040】(比較例1) 絶縁板と導電シートの間に弾性体を挟まずに、直接接す
るように重ねたこと以外は参考例1と同様にして両面銅
張り積層板を得た。
(Comparative Example 1) A double-sided copper-clad laminate was obtained in the same manner as in Reference Example 1 except that the elastic body was stacked so as to be in direct contact with the insulating plate and the conductive sheet without sandwiching them.

【0041】(比較例2) 絶縁板と導電シートの間に弾性体を挟まずに、直接接す
るように重ねたこと、及び、積層体の両側に、上記と同
様のクラフト紙を各15枚配したこと以外は参考例1
同様にして両面銅張り積層板を得た。なお、この場合
も、加圧板間に挟んだクラフト紙の枚数は、参考例1
同様に、全体で30枚となる。
(Comparative Example 2) An elastic body was stacked so as to be in direct contact with an insulating plate and a conductive sheet without being sandwiched between the insulating plate and the conductive sheet, and fifteen kraft papers similar to the above were disposed on both sides of the laminate. A double-sided copper-clad laminate was obtained in the same manner as in Reference Example 1 except for the above. In this case as well, the number of kraft papers sandwiched between the pressure plates is 30 in total, as in Reference Example 1 .

【0042】(評価、結果)各参考例、実施例2 及び各比較例で得られた両面銅張り
積層板について、成形性を評価した。その方法は、上側
から5組目と6組目の被圧着体から得られた両面銅張り
積層板の銅箔を全面エッチングした後、積層板中の気泡
の有無を目視で観察し、気泡の残留数を数えた。
(Evaluation and Results) The moldability of the double-sided copper-clad laminates obtained in each of the Reference Examples, Example 2, and Comparative Examples was evaluated. The method is such that after the copper foil of the double-sided copper-clad laminate obtained from the fifth and sixth sets of pressed bodies from the upper side is entirely etched, the presence or absence of bubbles in the laminate is visually observed, The number of residues was counted.

【0043】その結果は、各参考例及び実施例2が共に
0個と0個、比較例1が8個と10個、比較例2が2個
と3個であり、実施例2は各比較例と比べて、積層板中
の気泡の数が少なく、成形性が優れていることが確認さ
れた。
The results are as follows: 0 and 0 in each of Reference Examples and Example 2, 8 and 10 in Comparative Example 1, 2 and 3 in Comparative Example 2, and Example 2 Compared with the example, the number of bubbles in the laminated plate was small, and it was confirmed that the moldability was excellent.

【0044】[0044]

【発明の効果】本発明に係る積層板の製造方法は、絶縁
板と導電シートの間に、弾性を有する弾性体を挟みなが
ら、被圧着体、絶縁板及び導電シートを重ねて積層体を
形成するため、樹脂付着量のばらつきが大きいプリプレ
グを用いた場合等であっても、成形性が優れた積層板が
得られる。
According to the method of manufacturing a laminate according to the present invention, a laminate is formed by stacking an object to be pressed, an insulating plate and a conductive sheet while sandwiching an elastic body having elasticity between the insulating plate and the conductive sheet. Therefore, even when a prepreg having a large variation in the amount of adhered resin is used, a laminate having excellent moldability can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る積層板の製造方法に関連する参考
方法を説明する図である。
FIG. 1 is a reference relating to a method for manufacturing a laminate according to the present invention.
It is a figure explaining a method .

【図2】本発明に係る積層板の製造方法の、一実施の形
を説明する図である。
FIG. 2 shows one embodiment of a method for manufacturing a laminated board according to the present invention.
It is a figure explaining a state .

【図3】従来の積層板の製造方法を説明する図である。FIG. 3 is a diagram illustrating a conventional method for manufacturing a laminated board.

【符号の説明】[Explanation of symbols]

1,31 プリプレグ 2,32 被圧着体 3,33 導電シート 5 絶縁板 6,36 積層体 8,38 弾性体 9,39 加圧板 35 平板 Reference Signs List 1,31 Prepreg 2,32 Crimping object 3,33 Conductive sheet 5 Insulating plate 6,36 Laminated body 8,38 Elastic body 9,39 Pressing plate 35 Flat plate

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−233213(JP,A) 特開 昭61−255849(JP,A) 特表 平8−506289(JP,A) 特表 平7−508940(JP,A) 特表 平8−501991(JP,A) (58)調査した分野(Int.Cl.7,DB名) B32B 15/08 B29C 43/00 - 43/34 B32B 31/20 ──────────────────────────────────────────────────の Continuation of the front page (56) References JP-A-62-233213 (JP, A) JP-A-61-255849 (JP, A) JP-T 8-506289 (JP, A) JP-T 7- 508940 (JP, A) Table 8-8-501991 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B32B 15/08 B29C 43/00-43/34 B32B 31/20

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 熱硬化性樹脂を基材に含浸したプリプレ
グ(1)を有する被圧着体(2)と、絶縁板(5)の、
それぞれの一端面部で導電シート(3)を折り曲げるこ
とにより、間に絶縁板(5)を挟んで隣り合う被圧着体
(2)間で導電シート(3)が連続化するように、被圧
着体(2)、絶縁板(5)及び導電シート(3)を重ね
て積層体(6)を形成した後、上記導電シート(3)に
給電し、抵抗加熱により積層体(6)を加熱すると共
に、加圧して製造する積層板の製造方法において、 被圧着体(2)、絶縁板(5)及び導電シート(3)を
重ねて積層体(6)を形成する方法が、絶縁板(5)と
導電シート(3)の間に、弾性を有する弾性体(8)を
挟みながら、被圧着体(2)、絶縁板(5)及び導電シ
ート(3)を重ねて積層体(6)を形成する方法で
り、さらに、絶縁板(5)と導電シート(3)の間に、
弾性体(8)を挟んで重ねる方法が、導電シート(3)
の一方の面に弾性体(8)を離脱可能に接着した後、そ
の接着した弾性体(8)が絶縁板(5)に接する側にな
るように、絶縁板(5)と、弾性体(8)を接着した導
電シート(3)とを重ねる方法であることを特徴とす
積層板の製造方法。
1. A pressure-bonded body (2) having a prepreg (1) in which a thermosetting resin is impregnated in a substrate, and an insulating plate (5).
By bending the conductive sheet (3) at each end surface, the conductive sheet (3) becomes continuous between the pressure-receiving bodies (2) adjacent to each other with the insulating plate (5) interposed therebetween. (2) After stacking the insulating plate (5) and the conductive sheet (3) to form a laminate (6), power is supplied to the conductive sheet (3), and the laminate (6) is heated by resistance heating. In a method of manufacturing a laminate by pressurizing, the method of forming a laminate (6) by laminating the pressure-bonded body (2), the insulating plate (5), and the conductive sheet (3) is as follows. The body to be pressed (2), the insulating plate (5), and the conductive sheet (3) are stacked while sandwiching the elastic body (8) having elasticity between the conductive sheet (3) and the conductive sheet (3) to form a laminate (6). Oh in a way that
And between the insulating plate (5) and the conductive sheet (3).
The method of superposing the elastic body (8) on the conductive sheet (3)
After the elastic body (8) is removably adhered to one surface of the insulating plate (5), the insulating plate (5) and the elastic body (5) are arranged such that the adhered elastic body (8) is in contact with the insulating plate (5). method of manufacturing that <br/> laminate to features a method to overlay the adherent conductive sheet (3) and 8).
【請求項2】 弾性体(8)が、セルロースシート、ア
ラミド繊維シート、ゴムシート及びこれらの複合体から
選ばれた少なくとも1種であることを特徴とする請求項
記載の積層板の製造方法。
Wherein the elastic body (8) is, claims, characterized in that the cellulose sheet, aramid fiber sheet, is at least one selected from the rubber sheet and these complexes
A method for producing a laminate according to claim 1 .
JP16754897A 1997-06-24 1997-06-24 Manufacturing method of laminated board Expired - Fee Related JP3275782B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16754897A JP3275782B2 (en) 1997-06-24 1997-06-24 Manufacturing method of laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16754897A JP3275782B2 (en) 1997-06-24 1997-06-24 Manufacturing method of laminated board

Publications (2)

Publication Number Publication Date
JPH1110790A JPH1110790A (en) 1999-01-19
JP3275782B2 true JP3275782B2 (en) 2002-04-22

Family

ID=15851765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16754897A Expired - Fee Related JP3275782B2 (en) 1997-06-24 1997-06-24 Manufacturing method of laminated board

Country Status (1)

Country Link
JP (1) JP3275782B2 (en)

Also Published As

Publication number Publication date
JPH1110790A (en) 1999-01-19

Similar Documents

Publication Publication Date Title
JP3514667B2 (en) Heat fusible insulating sheet
JP3514656B2 (en) Surface smooth wiring board and its manufacturing method
JP3275782B2 (en) Manufacturing method of laminated board
JPH1154922A (en) Manufacturing inner layer circuit-contg. laminate board
JP5098572B2 (en) Metal foil-clad laminate and multilayer printed wiring board
JP2985642B2 (en) Manufacturing method of metal-clad laminate
JP2000013024A (en) Manufacture of multilayer board and plate for multilayer board manufacture
JP4214573B2 (en) Laminate production method
JP2000212532A (en) Adhesive composition for metal foil and adhesive-applied metal foil using the same, metal-clad laminate
JP4802541B2 (en) Method for producing metal foil-clad laminate and multilayer printed wiring board
JP3915260B2 (en) Multilayer board manufacturing method
JP2000210962A (en) Manufacture of laminate
JPH1191035A (en) Manufacture of laminate board
JPH10235796A (en) Production of laminate
JP3277893B2 (en) Manufacturing method of laminated board
JPH05138807A (en) Manufacture of copper clad laminated sheet
JP3954831B2 (en) Method for producing heat-resistant flexible laminate
JP3343722B2 (en) Method for producing composite prepreg and laminate
JP3605917B2 (en) Manufacturing method of laminated board with inner layer circuit
JP4207282B2 (en) Manufacturing method of multilayer printed wiring board
JPH1142736A (en) Manufacture of metal foil-clad laminate
JP3329218B2 (en) Thermal barrier for laminate molding
JP2006307067A (en) Composite, prepreg, metal-clad laminated board, printed-wiring board and its manufacturing method
JPH11214842A (en) Manufacture of multilayer board
JPH1016100A (en) Preparation of laminated sheet

Legal Events

Date Code Title Description
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20020108

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080208

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090208

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090208

Year of fee payment: 7

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090208

Year of fee payment: 7

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100208

Year of fee payment: 8

LAPS Cancellation because of no payment of annual fees