JP2985642B2 - Manufacturing method of metal-clad laminate - Google Patents
Manufacturing method of metal-clad laminateInfo
- Publication number
- JP2985642B2 JP2985642B2 JP6025648A JP2564894A JP2985642B2 JP 2985642 B2 JP2985642 B2 JP 2985642B2 JP 6025648 A JP6025648 A JP 6025648A JP 2564894 A JP2564894 A JP 2564894A JP 2985642 B2 JP2985642 B2 JP 2985642B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- metal
- dielectric constant
- clad laminate
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、通信機器用の
プリント配線板に用いられる金属張り積層板の製造方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a metal-clad laminate used for a printed wiring board for communication equipment, for example.
【０００２】[0002]
【従来の技術】樹脂ワニスをガラス基材に含浸したプリ
プレグを複数枚重ね、この表面に金属箔を配設した被圧
体を、加熱加圧して金属張り積層板が得られる。また、
内層用配線板にプリプレグを重ね、この表面に金属箔を
配設した被圧体を、加熱加圧して、多層の金属張り積層
板が得られる。これら金属張り積層板にエッチング等を
施し回路を形成したプリント配線板は、種々の電気機器
に搭載して用いられる。なかでも、携帯電話等の通信機
器用のプリント配線板に用いられる金属張り積層板は、
設計される回路の面積により、細分化した所定の範囲の
誘電率を有する材料が要求されている。金属張り積層板
の誘電率を所定の範囲で得るために、用いるプリプレグ
の樹脂量を調製する方法があるが、プリプレグの樹脂量
では、樹脂量が少なすぎると接着力が低下するので、プ
リプレグの樹脂量の範囲だけでは限界がある。また、異
なる樹脂ワニスによって複数種のプリプレグを作製し、
これを組み合わせて、細分化した誘電率を得る方法もあ
るが、樹脂ワニスの種類が異なるとプリプレグが硬化し
た絶縁層間の密着性が弱く、金属張り積層板に層間剥離
が起きやすい。2. Description of the Related Art A plurality of prepregs in which a glass substrate is impregnated with a resin varnish are laminated, and a pressure-bearing body having a metal foil disposed on the surface thereof is heated and pressed to obtain a metal-clad laminate. Also,
A prepreg is placed on the inner layer wiring board, and a pressure-bearing body having a metal foil disposed on the surface thereof is heated and pressed to obtain a multilayer metal-clad laminate. Printed wiring boards in which circuits are formed by subjecting these metal-clad laminates to etching or the like are used mounted on various electric devices. Above all, metal-clad laminates used for printed wiring boards for communication devices such as mobile phones,
Depending on the area of the circuit to be designed, there is a demand for a subdivided material having a dielectric constant in a predetermined range. In order to obtain the dielectric constant of the metal-clad laminate within a predetermined range, there is a method of adjusting the amount of resin of the prepreg to be used.However, with the amount of resin of the prepreg, if the amount of resin is too small, the adhesive strength is reduced. There is a limit only in the range of the resin amount. In addition, multiple types of prepregs are made with different resin varnishes,
There is also a method of obtaining a finely divided dielectric constant by combining these, but if the type of the resin varnish is different, the adhesion between the cured insulating layers of the prepreg is weak, and delamination tends to occur in the metal-clad laminate.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記の事実
に鑑みてなされたもので、その目的とするところは、設
計される回路に応じた誘電率を有し、且つ、層間剥離の
生じない金属張り積層板の製造方法を提供することにあ
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and has as its object to have a dielectric constant corresponding to a circuit to be designed and to cause delamination. To provide a method for manufacturing a metal-clad laminate.
【０００４】[0004]
【課題を解決するための手段】本発明の請求項１に係る
金属張り積層板の製造方法は、樹脂ワニスをガラス基材
に含浸したプリプレグＡと、このプリプレグＡと同一樹
脂ワニスを、上記ガラス基材と異なる誘電率を有するガ
ラス基材に含浸したプリプレグＡと異なる誘電率を有す
るプリプレグＢとを積み重ね積層体とし、この積層体の
表面に金属箔を配設した被圧体を、加熱加圧することを
特徴とする。According to a first aspect of the present invention, there is provided a method of manufacturing a metal-clad laminate, comprising: a prepreg A in which a glass substrate is impregnated with a resin varnish; and a resin identical to the prepreg A. A varnish is formed by laminating a prepreg A and a prepreg B having a different dielectric constant by impregnating a glass base having a different dielectric constant from the above glass base into a laminated body, and disposing a metal foil on the surface of the laminated body. It is characterized in that the body is heated and pressurized.
【０００５】 本発明の請求項２に係る金属張り積層板
の製造方法は、樹脂ワニスをガラス基材に含浸したプリ
プレグＡと、このプリプレグＡと同一樹脂ワニスに酸化
チタンを添加した酸化チタン含有の樹脂ワニスを、ガラ
ス基材に含浸したプリプレグＡと異なる誘電率を有する
プリプレグＢとを積み重ね積層体とし、この積層体の表
面に金属箔を配設した被圧体を、加熱加圧することを特
徴とする。[0005] The method for producing a metal-clad laminate according to claim 2 of the present invention comprises a prepreg A in which a glass substrate is impregnated with a resin varnish, and a titanium oxide-containing resin varnish containing the same prepreg A and titanium oxide added thereto. A resin varnish, a prepreg A impregnated in a glass base material and a prepreg B having a different dielectric constant are stacked to form a laminate, and a pressure-receiving body having a metal foil disposed on the surface of the laminate is heated and pressed. And
【０００６】本発明の請求項３に係る金属張り積層板の
製造方法は、請求項１又は請求項２記載のプリプレグＡ
と、プリプレグＡと異なる誘電率を有するプリプレグＢ
を積み重ねた積層体を、回路を形成した内層用配線板の
回路上に積み重ね、この外面に金属箔を配設した後に、
加熱加圧することを特徴とする。According to a third aspect of the present invention, there is provided a method of manufacturing a metal-clad laminate according to the first or second aspect.
And prepreg B having a different dielectric constant from prepreg A
The stacked body is stacked on the circuit of the inner layer wiring board on which the circuit is formed, and after disposing the metal foil on the outer surface,
It is characterized by heating and pressing.
【０００７】以下、本発明を詳細に説明する。本発明の
請求項１に係る金属張り積層板の製造方法について説明
する。Hereinafter, the present invention will be described in detail. A method for manufacturing a metal-clad laminate according to claim 1 of the present invention will be described.
【０００８】本発明においては、プリプレグＡと、この
プリプレグＡと異なる誘電率を有するプリプレグＢを積
み重ね積層体とする。上記プリプレグＡとプリプレグＢ
は同一の樹脂ワニスを用いる。上記樹脂ワニスに用いら
れる樹脂は、例えば、エポキシ樹脂、フッソ樹脂、ポリ
フェニレンオキサイド、ＰＰＯ樹脂、ポリイミド樹脂等
の単独、変成物、混合物等が挙げられる。これらの樹脂
に、この樹脂に応じた硬化剤、反応開始剤等を加え樹脂
ワニスとする。同一の樹脂ワニスとは、同一の硬化剤、
反応開始剤を用い、この硬化剤、及び反応開始剤と反応
硬化する同一の樹脂を用いた樹脂ワニスである。In the present invention, a prepreg A and a prepreg B having a dielectric constant different from that of the prepreg A are stacked to form a laminate. Prepreg A and Prepreg B above
Use the same resin varnish. Examples of the resin used for the resin varnish include an epoxy resin, a fluorine resin, a polyphenylene oxide, a PPO resin, a polyimide resin, and the like, a modified product, a mixture, and the like. To these resins, a curing agent, a reaction initiator and the like corresponding to the resins are added to form a resin varnish. The same resin varnish is the same curing agent,
A resin varnish using the same curing agent and the same resin that reacts and cures with the reaction initiator.
【０００９】上記プリプレグＡとプリプレグＢは、異な
る誘電率を有するガラス基材を用いる。上記ガラス基材
としては、例えば、誘電率７．３程度を有するＥガラ
ス、誘電率４．７程度を有するＤガラス、誘電率６．３
程度を有するＳガラス、誘電率１０程度を有する高誘電
率ガラス等が挙げられる。なお、本発明において示され
る誘電率の値は周波数１ＭＨｚで測定した値である。The prepreg A and the prepreg B use glass substrates having different dielectric constants. Examples of the glass substrate include E glass having a dielectric constant of about 7.3, D glass having a dielectric constant of about 4.7, and a dielectric constant of 6.3.
For example, S glass having a degree of high dielectric constant and high dielectric constant glass having a dielectric constant of about 10 may be used. The value of the dielectric constant shown in the present invention is a value measured at a frequency of 1 MHz.
【００１０】上記プリプレグＡとプリプレグＢは、上記
樹脂ワニスを異なる誘電率を有するガラス基材に含浸
し、樹脂を半硬化して得られる。上記プリプレグＡとプ
リプレグＢを積み重ね積層体とし、さらに、表面に金属
箔を配設して被圧体が得られる。上記金属箔は、例え
ば、銅、アルミニウム、ニッケル等の単独、合金、複合
箔が挙げられ、通常銅箔が汎用される。上記被圧体は加
熱加圧され、金属張り積層板を得ることができる。[0010] The prepreg A and the prepreg B are obtained by impregnating the resin varnish with glass substrates having different dielectric constants and semi-curing the resin. The prepreg A and the prepreg B are stacked to form a laminate, and a metal foil is disposed on the surface to obtain a pressurized body. Examples of the metal foil include single, alloy, and composite foils of copper, aluminum, nickel, and the like. Copper foil is generally used. The pressure-receiving body is heated and pressurized to obtain a metal-clad laminate.
【００１１】本発明で得られる金属張り積層板は異なる
誘電率を有するプリプレグＡとプリプレグＢを用いてい
るが、同一の樹脂ワニスを用いているので、樹脂が硬化
した絶縁層間の密着がよく、層間剥離が生じない。さら
に、異なる誘電率を有するプリプレグＡとプリプレグＢ
を用いることにより、金属張り積層板の誘電率を、この
プリプレグＡとプリプレグＢの間の所望の値にすること
ができる。金属張り積層板の誘電率は、積層体を構成す
るプリプレグＡとプリプレグＢの比率により所望の誘電
率が得られる。Although the prepreg A and the prepreg B having different dielectric constants are used for the metal-clad laminate obtained in the present invention, the same resin varnish is used, so that the adhesion between the cured insulating layers of the resin is good, No delamination occurs. Further, prepreg A and prepreg B having different dielectric constants
Is used, the dielectric constant of the metal-clad laminate can be set to a desired value between the prepreg A and the prepreg B. As for the dielectric constant of the metal-clad laminate, a desired dielectric constant can be obtained by the ratio of prepreg A and prepreg B constituting the laminate.
【００１２】本発明で得られる金属張り積層板は、金属
箔にエッチング等を施して回路が形成され、通信機器用
等のプリント配線板として用いられる。[0012] The metal-clad laminate obtained by the present invention has a circuit formed by etching a metal foil or the like, and is used as a printed wiring board for communication equipment and the like.
【００１３】本発明の請求項２に係る金属張り積層板の
製造方法について、主に上記請求項１の製造方法との差
異をを説明する。The method of manufacturing a metal-clad laminate according to a second aspect of the present invention will be described mainly with respect to differences from the method of the first aspect.
【００１４】本発明においては、プリプレグＡと異なる
誘電率を有するプリプレグＢは、プリプレグＡに用いた
樹脂ワニスと同一の樹脂ワニスに酸化チタンを添加した
酸化チタン含有の樹脂ワニスをガラス基材に含浸して得
られる。プリプレグＢの作製に用いる上記ガラス基材
は、プリプレグＡの作製に用いたガラス基材と同種でも
異種でもどちらでもよい。上記樹脂ワニスに添加する酸
化チタンの量を調製することにより、プリプレグＡと異
なった所望の誘電率を有するプリプレグＢが得られる。In the present invention, prepreg B having a different dielectric constant from prepreg A is obtained by impregnating a glass substrate with a resin varnish containing titanium oxide obtained by adding titanium oxide to the same resin varnish used for prepreg A. Is obtained. The glass substrate used for producing prepreg B may be the same or different from the glass substrate used for producing prepreg A. By adjusting the amount of titanium oxide to be added to the resin varnish, prepreg B having a desired dielectric constant different from prepreg A can be obtained.
【００１５】本発明は上記プリプレグＡとプリプレグＢ
を積み重ね積層体とし、さらに、表面に金属箔を配設し
た被圧体を、加熱加圧する。The present invention relates to the prepreg A and the prepreg B.
Are stacked, and a pressure-receiving body having a metal foil disposed on the surface thereof is heated and pressed.
【００１６】本発明で得られる金属張り積層板は異なる
誘電率を有するプリプレグＡとプリプレグＢを用いてい
るが、プリプレグＢは酸化チタン含有の樹脂ワニスを用
いており、酸化チタンは樹脂の硬化に直接寄与しないの
で、プリプレグＡとプリプレグＢの樹脂が硬化する際、
樹脂間のなじみがよくなり、絶縁層の密着が良くなる。
従って、金属張り積層板は層間剥離が起こらない。さら
に、上述と同様に、金属張り積層板の誘電率は、積層体
を構成するプリプレグＡとプリプレグＢの比率により所
望の誘電率が得られる。The metal-clad laminate obtained in the present invention uses prepreg A and prepreg B having different dielectric constants. Prepreg B uses a resin varnish containing titanium oxide, and titanium oxide is used to cure the resin. As it does not directly contribute, when the resin of prepreg A and prepreg B cures,
The compatibility between the resins is improved, and the adhesion of the insulating layer is improved.
Therefore, delamination does not occur in the metal-clad laminate. Further, as described above, the desired dielectric constant of the metal-clad laminate can be obtained by the ratio of prepreg A and prepreg B constituting the laminate.
【００１７】本発明の請求項３に係る金属張り積層板の
製造方法について説明する。上述の金属張り積層板は単
層の金属張り積層板に限定されず、多層の金属張り積層
板にも用いられる。回路が形成された内層用配線板の回
路上に、請求項１又は請求項２記載のプリプレグＡとプ
リプレグＡと異なる誘電率を有するプリプレグＢとを積
み重ねた積層体を配設する。さらに、この外側に金属箔
を配設し、加熱加圧すると、多層の金属張り積層板が得
られる。本発明は内層用配線板の上に異なる誘電率を有
する複数種のプリプレグを用いているが、同一の樹脂ワ
ニスであるから、樹脂が硬化した絶縁層間の密着が良
く、層間剥離を生じない。さらに、上記内層用配線板の
上に形成される絶縁層の誘電率は、積層体を構成するプ
リプレグＡとプリプレグＢの比率により所望の誘電率を
有する絶縁層が形成されるので、所望の誘電率を有する
絶縁層を備えた金属張り積層板が得られる。A method for manufacturing a metal-clad laminate according to claim 3 of the present invention will be described. The above-mentioned metal-clad laminate is not limited to a single-layer metal-clad laminate, but may also be used for a multilayer metal-clad laminate. A prepreg A according to claim 1 or 2 and a prepreg B having a different dielectric constant from the prepreg A are stacked on the circuit of the inner layer wiring board on which the circuit is formed. Further, when a metal foil is provided on the outside and heated and pressed, a multilayer metal-clad laminate is obtained. In the present invention, a plurality of types of prepregs having different dielectric constants are used on the wiring board for the inner layer. However, since the same resin varnish is used, adhesion between the cured insulating layers of the resin is good and delamination does not occur. Furthermore, the dielectric constant of the insulating layer formed on the inner layer wiring board is determined by the ratio of the prepreg A and the prepreg B constituting the laminated body. A metal-clad laminate provided with an insulating layer having a high modulus is obtained.
【００１８】[0018]
【作用】本発明の請求項１に係る金属張り積層板の製造
方法によると、異なる誘電率を有するプリプレグＡとプ
リプレグＢを用いているが、同一の樹脂ワニスを用いて
いるので、樹脂が硬化した絶縁層間の密着がよく、層間
剥離が生じない。さらに、異なる誘電率を有するプリプ
レグＡとプリプレグＢを用いることにより、金属張り積
層板の誘電率を、積層体を構成するプリプレグＡとプリ
プレグＢの比率により所望の値にすることができる。According to the method for manufacturing a metal-clad laminate according to claim 1 of the present invention, prepregs A and B having different dielectric constants are used, but since the same resin varnish is used, the resin hardens. Good adhesion between the insulating layers, and no delamination occurs. Further, by using the prepregs A and B having different dielectric constants, the dielectric constant of the metal-clad laminate can be set to a desired value by the ratio of the prepregs A and B constituting the laminate.
【００１９】本発明の請求項２に係る金属張り積層板の
製造方法によると、異なる誘電率を有するプリプレグＡ
とプリプレグＢを用いているが、プリプレグＢは酸化チ
タン含有の樹脂ワニスを用いており、酸化チタンは樹脂
の硬化に直接寄与しないので、プリプレグＡとプリプレ
グＢの樹脂が硬化する際、樹脂間のなじみが良くなり、
絶縁層の密着はよい。従って、金属張り積層板は層間剥
離が起こらない。さらに、上述と同様に、金属張り積層
板の誘電率は、積層体を構成するプリプレグＡとプリプ
レグＢの比率により所望の誘電率が得られる。According to the method for manufacturing a metal-clad laminate according to claim 2 of the present invention, the prepreg A having a different dielectric constant is used.
And prepreg B are used, but prepreg B uses a resin varnish containing titanium oxide, and titanium oxide does not directly contribute to curing of the resin. Therefore, when the resins of prepreg A and prepreg B are cured, Familiarity is improved,
The adhesion of the insulating layer is good. Therefore, delamination does not occur in the metal-clad laminate. Further, as described above, the desired dielectric constant of the metal-clad laminate can be obtained by the ratio of prepreg A and prepreg B constituting the laminate.
【００２０】本発明の請求項３に係る金属張り積層板の
製造方法によると、内層用配線板に、請求項１又は請求
項２記載の積層体を積み重ね、外面に金属箔を配設し、
加熱加圧するので、多層の金属張り積層板が得られる。
上記金属張り積層板は内層用配線板の上の積層体に異な
る誘電率を有するプリプレグを用いているが、樹脂ワニ
スが同一又は酸化チタン含有の樹脂ワニスなので、樹脂
が硬化した絶縁層間の密着が良く、層間剥離を生じな
い。さらに、上記内層用配線板の上に形成される絶縁層
の誘電率は、積層体を構成するプリプレグＡとプリプレ
グＢの比率により所望の誘電率を有する絶縁層が形成さ
れるので、所望の誘電率を有する絶縁層を備えた金属張
り積層板が得られる。According to the method of manufacturing a metal-clad laminate according to claim 3 of the present invention, the laminate according to claim 1 or 2 is stacked on the inner layer wiring board, and the metal foil is disposed on the outer surface.
Since the heating and pressurizing are performed, a multilayer metal-clad laminate is obtained.
The above-mentioned metal-clad laminate uses prepregs having different dielectric constants for the laminate on the inner layer wiring board, but since the resin varnish is the same or a titanium oxide-containing resin varnish, adhesion between the insulating layers where the resin is cured is low. Good, no delamination. Furthermore, the dielectric constant of the insulating layer formed on the inner layer wiring board is determined by the ratio of the prepreg A and the prepreg B constituting the laminated body. A metal-clad laminate provided with an insulating layer having a high modulus is obtained.
【００２１】[0021]
実施例１ プリプレグａを次の条件で作製した。樹脂ワニスとし
て、樹脂にポリフェニレンオキサイド（日本ＧＥ株式会
社製、ノリルＰＸ９７０１）３０重量部（以下部と記
す）、スチレン・ブタジエン・ブロックコポリマー（旭
化成工業株式会社製、ソルプレンＴ４０６）５部、架橋
性モノマー（日本化成株式会社製、ＴＡＩＣ）３５部、
反応開始剤（日本油脂株式会社製、ＰＨ２５Ｂ）１部を
配合したものを用いた。ガラス基材として、厚さ０．１
ｍｍのＥガラス（旭シュエーベル株式会社製、誘電率
７．２）を用いた。上記樹脂ワニスを上記ガラス基材に
含浸しプリプレグａを得た。プリプレグａの樹脂量は５
５重量％であった。このプリプレグａの誘電率は３．５
であった。Example 1 A prepreg a was produced under the following conditions. As a resin varnish, 30 parts by weight of polyphenylene oxide (Noryl PX9701 manufactured by GE Japan Co., Ltd.), 5 parts of styrene-butadiene block copolymer (Solprene T406 manufactured by Asahi Kasei Kogyo Co., Ltd.), a crosslinkable monomer (TAIC manufactured by Nippon Kasei Co., Ltd.) 35 parts,
A mixture containing 1 part of a reaction initiator (manufactured by NOF CORPORATION, PH25B) was used. As glass substrate, thickness 0.1
mm E glass (manufactured by Asahi Schwebel Co., Ltd., dielectric constant 7.2) was used. The glass varnish was impregnated with the resin varnish to obtain a prepreg a. The resin amount of prepreg a is 5
It was 5% by weight. The dielectric constant of this prepreg a is 3.5
Met.
【００２２】プリプレグｂを次の条件で作製した。樹脂
ワニスは、プリプレグａと同一の樹脂ワニスを用いた。
ガラス基材は、厚さ０．１ｍｍの高誘電率ガラス（旭シ
ュエーベル株式会社製、誘電率１１．５）を用いた。上
記樹脂ワニスを上記ガラス基材に含浸しプリプレグｂを
得た。プリプレグｂの樹脂量は５５重量％であった。こ
のプリプレグｂの誘電率は８．０であった。A prepreg b was prepared under the following conditions. The same resin varnish as prepreg a was used as the resin varnish.
As the glass substrate, a high dielectric constant glass having a thickness of 0.1 mm (a dielectric constant of 11.5, manufactured by Asahi Schwebel Co., Ltd.) was used. The glass varnish was impregnated with the resin varnish to obtain a prepreg b. The resin amount of the prepreg b was 55% by weight. The dielectric constant of this prepreg b was 8.0.
【００２３】上記プリプレグａ４枚とプリプレグｂ４枚
を交互に重ね積層体とした。この積層体の両表面に金属
箔として銅箔を重ね被圧体とした。この被圧体を、温度
２００℃、圧力３０ｋｇ／ｃｍ2 で６０分加熱加圧して
金属張り積層板を得た。The four prepregs a and four prepregs b were alternately stacked to form a laminate. A copper foil was laminated as a metal foil on both surfaces of the laminate to form a pressure-receiving body. The pressed body was heated and pressed at a temperature of 200 ° C. and a pressure of 30 kg / cm 2 for 60 minutes to obtain a metal-clad laminate.
【００２４】得られた金属張り積層板の層間剥離試験と
誘電率を測定した。層間剥離試験は表面の銅箔を全面エ
ッチングした５０×５０ｍｍの試料片５枚を、１３０
℃、２時間ＰＣＴ処理した後に、２８８℃の半田に５分
間浸漬した。外観を目視で観察し絶縁層間の剥離の有無
を調べた。剥離が発生していないものは合格、剥離が１
枚でも発生しているものはものは不合格とした。誘電率
は、ＪＩＳ−Ｃ６４８１に基づいて、周波数１ＭＨｚを
用い比誘電率を測定した。The resulting metal-clad laminate was subjected to a delamination test and the dielectric constant was measured. In the delamination test, five 50 × 50 mm sample pieces obtained by etching the entire surface of the copper foil were subjected to 130
After the PCT treatment at 2 ° C. for 2 hours, it was immersed in the solder at 288 ° C. for 5 minutes. The appearance was visually observed to determine whether or not the insulating layers were separated. If no peeling occurred, pass, 1 peeling
Those that occurred even on sheets were rejected. The dielectric constant was measured based on JIS-C6481 using a frequency of 1 MHz.
【００２５】結果は表１に示すとおり、層間剥離は発生
せず合格であり、誘電率は５．３のものが得られた。As shown in Table 1, the result was acceptable without delamination, and a dielectric constant of 5.3 was obtained.
【００２６】実施例２ 実施例１で得られたプリプレグｂを６枚、この両側にプ
リプレグａを各々１枚づつ合計８枚のプリプレグを配設
し積層体とした。この積層体の両表面に銅箔を重ねて被
圧体とした。以下実施例１と同様にして金属張り積層板
を得た。Example 2 Six prepregs b obtained in Example 1 and a total of eight prepregs, one prepreg a on each side, were provided on both sides to form a laminate. Copper foil was superimposed on both surfaces of the laminate to form a pressure-receiving body. Thereafter, a metal-clad laminate was obtained in the same manner as in Example 1.
【００２７】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離は発生せず合格であり、誘電率は
６．５のものが得られた。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As shown in Table 1, the results were acceptable without delamination, and a dielectric constant of 6.5 was obtained.
【００２８】実施例３ プリプレグｃを次の条件で作製した。酸化チタン含有の
樹脂ワニスとして、ポリフェニレンオキサイド（日本Ｇ
Ｅ株式会社製、ノリルＰＸ９７０１）３０部、スチレン
・ブタジエン・ブロックコポリマー（旭化成工業株式会
社製、ソルプレンＴ４０６）５部、架橋性モノマー（日
本化成株式会社製、ＴＡＩＣ）３５部、反応開始剤（日
本油脂株式会社製、ＰＨ２５Ｂ）１部、酸化チタン１５
０部を配合したものを用いた。ガラス基材として、厚さ
０．１ｍｍのＥガラス（旭シュエーベル株式会社製、誘
電率７．２）を用いた。上記酸化チタン含有の樹脂ワニ
スを上記ガラス基材に含浸しプリプレグｃを得た。プリ
プレグｃの樹脂量は８０重量％であった。このプリプレ
グｃの誘電率は１０．５であった。Example 3 A prepreg c was prepared under the following conditions. As a resin varnish containing titanium oxide, polyphenylene oxide (Japan G)
E Co., Ltd., 30 parts of Noril PX9701, 5 parts of styrene-butadiene block copolymer (Solprene T406, manufactured by Asahi Kasei Kogyo Co., Ltd.), 35 parts of a crosslinkable monomer (TAIC, manufactured by Nippon Kasei Co., Ltd.), a reaction initiator (Japan Yushi Co., Ltd., PH25B) 1 part, titanium oxide 15
What mixed 0 part was used. As a glass substrate, E glass having a thickness of 0.1 mm (dielectric constant 7.2, manufactured by Asahi Schwebel Co., Ltd.) was used. The above glass substrate was impregnated with the above-mentioned resin varnish containing titanium oxide to obtain prepreg c. The resin amount of the prepreg c was 80% by weight. The dielectric constant of this prepreg c was 10.5.
【００２９】上記プリプレグｃ４枚と実施例１に用いた
プリプレグａ４枚を交互に重ね積層体とした。この積層
体の両表面に銅箔を重ねて被圧体とした。以下実施例１
と同様にして金属張り積層板を得た。The four prepregs c and the four prepregs a used in Example 1 were alternately stacked to form a laminate. Copper foil was superimposed on both surfaces of the laminate to form a pressure-receiving body. Example 1 below
A metal-clad laminate was obtained in the same manner as described above.
【００３０】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離は発生せず合格であり、誘電率は
６．０のものが得られた。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As shown in Table 1, the results were acceptable without delamination, and a dielectric constant of 6.0 was obtained.
【００３１】実施例４ 実施例１で得られたプリプレグａを６枚、この両側に実
施例３で得られたプリプレグｃを各々１枚づつ，計８枚
のプリプレグを配設し積層体とした。この積層体の両表
面に銅箔を重ねて被圧体とした。以下実施例１と同様に
して金属張り積層板を得た。Example 4 Six prepregs a obtained in Example 1 and prepregs c obtained in Example 3 on each side of the prepreg a were provided with a total of eight prepregs to form a laminate. . Copper foil was superimposed on both surfaces of the laminate to form a pressure-receiving body. Thereafter, a metal-clad laminate was obtained in the same manner as in Example 1.
【００３２】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離は発生せず合格であり、誘電率は
４．５のものが得られた。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As shown in Table 1, the results were acceptable without delamination, and a dielectric constant of 4.5 was obtained.
【００３３】実施例５ 実施例１で得られた金属張り積層板の両表面に銅回路を
形成して内層用配線板とした。実施例１で得られたプリ
プレグｂを１枚とプリプレグａを２枚重ねた積層体を上
記内層用配線板の両面に各々配設し、その両外面に銅箔
を重ねてた。その後実施例１と同条件で加熱加圧し、多
層の金属張り積層板を得た。Example 5 Copper circuits were formed on both surfaces of the metal-clad laminate obtained in Example 1 to obtain an internal wiring board. Laminates of one prepreg b and two prepregs a obtained in Example 1 were disposed on both surfaces of the inner layer wiring board, and copper foil was laminated on both outer surfaces thereof. Thereafter, heat and pressure were applied under the same conditions as in Example 1 to obtain a multilayer metal-clad laminate.
【００３４】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離は発生せず合格であり、内層用配
線板上に形成した絶縁層の誘電率は５．３であった。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As shown in Table 1, the results were acceptable without delamination, and the dielectric constant of the insulating layer formed on the inner layer wiring board was 5.3.
【００３５】実施例６ プリプレグｄを次の条件で作製した。樹脂ワニスとし
て、樹脂にエポキシ樹脂（東都化成株式会社製、ＹＤＢ
−５００）１６０部、エポキシ樹脂（東都化成株式会社
製、ＹＤＣＮ−２２０）３０部、硬化剤にジシアンジア
ミド（日本カーバイト株式会社製）３部、硬化促進剤に
２エチル４メチルイミダゾール（２Ｅ４ＭＺ：四国化成
株式会社製）０．１部を配合したものを用いた。ガラス
基材として、厚さ０．１ｍｍのＥガラス（旭シュエーベ
ル株式会社製、誘電率７．２）を用いた。上記樹脂ワニ
スを上記ガラス基材に含浸しプリプレグｄを得た。プリ
プレグｄの樹脂量は５０重量％であった。このプリプレ
グｄの誘電率は４．８であった。Example 6 A prepreg d was prepared under the following conditions. As resin varnish, epoxy resin (Toto Kasei Co., Ltd., YDB
-500), 160 parts of an epoxy resin (YDCN-220, manufactured by Toto Kasei Co., Ltd.), 3 parts of dicyandiamide (manufactured by Nippon Carbide Co., Ltd.) as a curing agent, and 2ethyl 4-methylimidazole (2E4MZ: Shikoku) as a curing accelerator. A compound obtained by mixing 0.1 part (manufactured by Kasei Corporation) was used. As a glass substrate, E glass having a thickness of 0.1 mm (dielectric constant 7.2, manufactured by Asahi Schwebel Co., Ltd.) was used. The glass varnish was impregnated with the resin varnish to obtain a prepreg d. The resin amount of prepreg d was 50% by weight. The dielectric constant of this prepreg d was 4.8.
【００３６】プリプレグｅを次の条件で作製した。樹脂
ワニスは、プリプレグｄと同一の樹脂ワニスを用いた。
ガラス基材は、厚さ０．１ｍｍの高誘電率ガラス（旭シ
ュエーベル株式会社製、誘電率１１．５）を用いた。上
記樹脂ワニスを上記ガラス基材に含浸しプリプレグｅを
得た。プリプレグｅの樹脂量は４０重量％であった。こ
のプリプレグｅの誘電率は１０．０であった。A prepreg e was prepared under the following conditions. As the resin varnish, the same resin varnish as prepreg d was used.
As the glass substrate, a high dielectric constant glass having a thickness of 0.1 mm (a dielectric constant of 11.5, manufactured by Asahi Schwebel Co., Ltd.) was used. The glass varnish was impregnated with the resin varnish to obtain a prepreg e. The resin amount of prepreg e was 40% by weight. The dielectric constant of this prepreg e was 10.0.
【００３７】上記プリプレグｄ４枚とプリプレグｅ４枚
を交互に重ね積層体とした。この積層体の両表面に銅箔
を重ねて被圧体とした。この被圧体を、温度１７０℃、
圧力３０ｋｇ／ｃｍ2 で６０分加熱加圧して金属張り積
層板を得た。The four prepregs d and four prepregs e were alternately stacked to form a laminate. Copper foil was superimposed on both surfaces of the laminate to form a pressure-receiving body. This pressed body is heated at a temperature of 170 ° C.
The metal-clad laminate was obtained by heating and pressing at a pressure of 30 kg / cm 2 for 60 minutes.
【００３８】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離は発生せず合格であり、誘電率は
８．３のものが得られた。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As shown in Table 1, the results were acceptable without delamination, and a dielectric constant of 8.3 was obtained.
【００３９】実施例７ プリプレグｆを次の条件で作製した。酸化チタン含有の
樹脂ワニスとして、樹脂にエポキシ樹脂（東都化成株式
会社製、ＹＤＢ−５００）１６０部、エポキシ樹脂（東
都化成株式会社製、ＹＤＣＮ−２２０）３０部、硬化剤
にジシアンジアミド（日本カーバイト株式会社製）３
部、硬化促進剤に２エチル４メチルイミダゾール（２Ｅ
４ＭＺ：四国化成株式会社製）０．１部，酸化チタンを
２００部を配合したものを用いた。ガラス基材として、
厚さ０．１ｍｍのＥガラス（旭シュエーベル株式会社
製、誘電率７．２）を用いた。上記酸化チタン含有の樹
脂ワニスを上記ガラス基材に含浸しプリプレグｆを得
た。プリプレグｆの樹脂量は５０重量％であった。この
プリプレグｆの誘電率は７．０であった。Example 7 A prepreg f was produced under the following conditions. As a resin varnish containing titanium oxide, 160 parts of an epoxy resin (YDB-500, manufactured by Toto Kasei Co., Ltd.), 30 parts of epoxy resin (YDCN-220, manufactured by Toto Kasei Co., Ltd.), and dicyandiamide (Nippon Carbide) as a curing agent 3)
Part, 2ethyl 4-methylimidazole (2E
4MZ: 0.1 part of Shikoku Chemicals Co., Ltd.) and 200 parts of titanium oxide were used. As a glass substrate,
E glass with a thickness of 0.1 mm (dielectric constant 7.2, manufactured by Asahi Schwebel Co., Ltd.) was used. The glass substrate was impregnated with the above-mentioned resin varnish containing titanium oxide to obtain a prepreg f. The resin amount of the prepreg f was 50% by weight. The dielectric constant of this prepreg f was 7.0.
【００４０】上記プリプレグｆを６枚、この両側に実施
例６で得られたプリプレグｄを各々１枚、計８枚のプリ
プレグを配設して積層体を得た。この積層体の両表面に
銅箔を重ねて被圧体とした。以下実施例６と同様にして
金属張り積層板を得た。A total of eight prepregs were placed on each of the six prepregs f and one prepreg d obtained in Example 6 on both sides of the prepregs to obtain a laminate. Copper foil was superimposed on both surfaces of the laminate to form a pressure-receiving body. Thereafter, a metal-clad laminate was obtained in the same manner as in Example 6.
【００４１】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離は発生せず合格であり、誘電率は
６．８のものが得られた。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As shown in Table 1, the results were acceptable without delamination, and a dielectric constant of 6.8 was obtained.
【００４２】比較例１ 厚さ０．８ｍｍ、誘電率４．２のポリイミド樹脂銅張り
積層板の表面に銅回路を形成し内層用配線板とした。こ
の内層用配線板に実施例６で作製したプリプレグｄを両
側に４枚づつ配し、この両表面に銅箔を重ね、以下実施
例６と同様にして多層の金属張り積層板を得た。COMPARATIVE EXAMPLE 1 A copper circuit was formed on the surface of a polyimide resin copper-clad laminate having a thickness of 0.8 mm and a dielectric constant of 4.2 to obtain an internal wiring board. Four prepregs d prepared in Example 6 were arranged on both sides of the wiring board for the inner layer, and copper foil was laminated on both surfaces of the prepregs d. In the same manner as in Example 6, a multilayer metal-clad laminate was obtained.
【００４３】得られた金属張り積層板の層間剥離試験と
誘電率を実施例１と同様にして測定した。結果は表１に
示すとおり、層間剥離が発生し、不合格であった。The delamination test and the dielectric constant of the obtained metal-clad laminate were measured in the same manner as in Example 1. As a result, as shown in Table 1, delamination occurred and it was rejected.
【００４４】[0044]
【表１】 [Table 1]
【００４５】[0045]
【発明の効果】本発明の請求項１に係る金属張り積層板
の製造方法を用いると、被圧体を構成する樹脂ワニスが
同一なので、樹脂が硬化した絶縁層の密着が良く、層間
剥離を生じない。さらに、異なる誘電率を有するプリプ
レグを用いて積層体とするので、積層体を構成するプリ
プレグＡとプリプレグＢの比率を調製することにより所
望の誘電率を有する金属張り積層板が得られる。According to the method for manufacturing a metal-clad laminate according to the first aspect of the present invention, since the resin varnish constituting the pressure-receiving body is the same, the adhesion of the cured insulating layer of the resin is good, and delamination is prevented. Does not occur. Furthermore, since a laminate is formed using prepregs having different dielectric constants, a metal-clad laminate having a desired dielectric constant can be obtained by adjusting the ratio of prepreg A and prepreg B constituting the laminate.
【００４６】本発明の請求項２に係る金属張り積層板の
製造方法を用いると、積層体を構成するプリプレグＢは
酸化チタン含有の樹脂ワニスを用いており、酸化チタン
は樹脂の硬化に直接寄与しないので、プリプレグＡとプ
リプレグＢの樹脂が硬化する際、同一樹脂なので樹脂間
のなじみがよくなり、絶縁層の密着はよい。従って、金
属張り積層板は層間剥離が起こらない。さらに、異なる
誘電率を有するプリプレグを用いて積層体とするので積
層体を構成するプリプレグＡとプリプレグＢの比率を調
整することにより所望の誘電率を有する金属張り積層板
が得られる。According to the method for manufacturing a metal-clad laminate according to the second aspect of the present invention, the prepreg B constituting the laminate uses a resin varnish containing titanium oxide, and the titanium oxide directly contributes to the curing of the resin. When the prepreg A and the prepreg B are hardened, the prepreg A and the prepreg B are hardened with each other because the same resin is used. Therefore, delamination does not occur in the metal-clad laminate. Further, since a laminate is formed using prepregs having different dielectric constants, a metal-clad laminate having a desired dielectric constant can be obtained by adjusting the ratio of prepreg A and prepreg B constituting the laminate.
【００４７】本発明の請求項３に係る金属張り積層板の
製造方法を用いると、特に、内層用配線板に、プリプレ
グＡと、プリプレグＡと誘電率が異なるプリプレグＢを
積み重ねると多層の金属張り積層板が得られる。内層用
配線板の上のプリプレグは樹脂ワニスが同一樹脂ワニス
なので樹脂が硬化した絶縁層の密着がよく、層間剥離を
生じない。さらに、積層体を構成するプリプレグＡとプ
リプレグＢの比率により所望の誘電率を有する絶縁層が
形成されるので、所望の誘電率を有する絶縁層を備えた
金属張り積層板が得られる。According to the method for manufacturing a metal-clad laminate according to claim 3 of the present invention, when a prepreg A and a prepreg B having a dielectric constant different from that of the prepreg A are stacked on the inner-layer wiring board, a multilayer metal-clad laminate is obtained. A laminate is obtained. Since the resin varnish of the prepreg on the inner layer wiring board is the same resin varnish, the insulating layer in which the resin is cured has good adhesion and does not cause delamination. Further, an insulating layer having a desired dielectric constant is formed by the ratio of prepreg A and prepreg B constituting the laminate, and a metal-clad laminate provided with an insulating layer having a desired dielectric constant is obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０５Ｋ 1/03 ６３０ Ｈ０５Ｋ 1/03 ６３０Ｆ (56)参考文献 特開 平３−190729（ＪＰ，Ａ) 特開 平４−24985（ＪＰ，Ａ) 特開 平４−24986（ＪＰ，Ａ) 特開 平２−219642（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) B32B 7/02 - 35/00 C08J 5/24 H05K 1/03 ────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 identification code FI H05K 1/03 630 H05K 1/03 630F (56) References JP-A-3-190729 (JP, A) JP-A-4-24985 (JP, A) JP-A-4-24986 (JP, A) JP-A-2-219642 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) B32B 7/02-35 / 00 C08J 5/24 H05K 1/03
Claims (3)
プレグＡと、このプリプレグＡと同一樹脂ワニスを、上
記ガラス基材と異なる誘電率を有するガラス基材に含浸
したプリプレグＡと異なる誘電率を有するプリプレグＢ
とを積み重ね積層体とし、この積層体の表面に金属箔を
配設した被圧体を、加熱加圧することを特徴とする金属
張り積層板の製造方法。1. A prepreg A in which a resin varnish is impregnated in a glass base material, and a dielectric constant different from that of the prepreg A in which the same resin varnish as the prepreg A is impregnated in a glass base material having a different dielectric constant from the glass base material Prepreg B having
And a pressure-applied body having a metal foil disposed on the surface of the laminated body and heating and pressing the laminated body.
プレグＡと、このプリプレグＡと同一樹脂ワニスに酸化
チタンを添加した酸化チタン含有の樹脂ワニスを、ガラ
ス基材に含浸したプリプレグＡと異なる誘電率を有する
プリプレグＢとを積み重ね積層体とし、この積層体の表
面に金属箔を配設した被圧体を、加熱加圧することを特
徴とする金属張り積層板の製造方法。2. A prepreg A obtained by impregnating a glass substrate with a resin varnish, and a dielectric material different from the prepreg A obtained by impregnating a glass substrate with a resin varnish containing titanium oxide added to the same resin varnish as the prepreg A. A method for producing a metal-clad laminate, comprising: laminating a prepreg B having a specific modulus to form a laminate, and heating and pressing a pressure-receiving body having a metal foil disposed on the surface of the laminate.
Ａと、プリプレグＡと異なる誘電率を有するプリプレグ
Ｂを積み重ね積層体を、回路を形成した内層用配線板の
回路上に積み重ね、この外側に金属箔を配設した後に、
加熱加圧することを特徴とする金属張り積層板の製造方
法。3. The prepreg A according to claim 1 or 2, and a prepreg B having a dielectric constant different from that of the prepreg A are stacked and laminated on a circuit of an inner layer wiring board on which a circuit is formed. After arranging metal foil on
A method for producing a metal-clad laminate, comprising heating and pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6025648A JP2985642B2 (en) | 1994-02-23 | 1994-02-23 | Manufacturing method of metal-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6025648A JP2985642B2 (en) | 1994-02-23 | 1994-02-23 | Manufacturing method of metal-clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07232403A JPH07232403A (en) | 1995-09-05 |
| JP2985642B2 true JP2985642B2 (en) | 1999-12-06 |
Family
ID=12171653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6025648A Expired - Fee Related JP2985642B2 (en) | 1994-02-23 | 1994-02-23 | Manufacturing method of metal-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2985642B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4747608B2 (en) * | 2005-02-23 | 2011-08-17 | パナソニック電工株式会社 | Prepreg and laminate containing polyphenylene resin composition |
| JP2008201124A (en) * | 2007-01-24 | 2008-09-04 | Hitachi Chem Co Ltd | Laminated material for electric insulation, and printed wiring board using laminated material |
| JP2013000995A (en) * | 2011-06-17 | 2013-01-07 | Panasonic Corp | Metal-clad laminated plate and printed wiring board |
| JP6057330B2 (en) * | 2013-01-17 | 2017-01-11 | 日本発條株式会社 | COMPOSITE MATERIAL AND METHOD FOR PRODUCING COMPOSITE MATERIAL |
| JP6844066B2 (en) * | 2018-04-17 | 2021-03-17 | 積水化学工業株式会社 | Insulation sheets, laminates, and substrates |
| WO2022059166A1 (en) * | 2020-09-18 | 2022-03-24 | 昭和電工マテリアルズ株式会社 | Organic core material and manufacturing method therefor |
-
1994
- 1994-02-23 JP JP6025648A patent/JP2985642B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07232403A (en) | 1995-09-05 |
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