JP2002309200A - Adhesive film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive film which can introduce simply an insulating layer of high dielectric capacity onto a multilayer printed circuit board by a vacuum laminator and be plated onto the insulating layer of high dielectric capacity. SOLUTION: This adhesive film comprises being layered with an epoxy resin composition containing components (A)-(D): (A) an aromatic epoxy resin being liquid at an ordinary temperature having two or more epoxy groups in a molecule; (B) an epoxy curing agent; (C) a phenoxy resin having weight- average molecular weight of 5,000 to 100,000; and (D) an inorganic filler of a high dielectric constant, on a supporting base film, wherein a specific dielectric constant after heat-curing of the epoxy resin composition is 10 or more.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive film for introducing a high dielectric capacity insulating layer in a multilayer printed wiring board, and further relates to a multilayer printed wiring board provided with a high dielectric insulating layer by the adhesive film. The present invention relates to a method for manufacturing the multilayer printed wiring board.

[0002]

2. Description of the Related Art In recent years, there has been a growing demand for a printed wiring board used for electronic equipment, communication equipment and the like to have a higher arithmetic processing speed and a higher wiring density. Digital I mounted
A large number of capacitors are formed on a wiring board in order to cope with malfunctions of C and the like and noise prevention. However, with the high-density mounting, capacitors have been improved to be smaller. On the other hand, Japanese Unexamined Patent Publication No.
A printed wiring board in which a high dielectric capacitance insulating layer is provided between a power supply layer and an installation layer as described in 1-340636 has been proposed.

Conventionally, as a high dielectric capacity insulating layer provided on such a printed wiring board, a prepreg in which epoxy resin is mixed with a high dielectric inorganic filler and impregnated into a glass cloth, or a high dielectric polymer and a high dielectric inorganic material are mixed. It is introduced by a composition or the like in which a filler is combined. However, these materials are not always satisfactory in industrial production, for example, the resin flow is poor and high temperature and high pressure pressing conditions are required for bonding.

On the other hand, as an adhesive film for a multilayer printed wiring board, an insulating layer can be introduced into the multilayer printed wiring board by a vacuum laminator without requiring a high-temperature and high-pressure press, and plating is further performed on the insulating layer. An adhesive film which makes it possible to do this is known (JP-A-11-8792).
7). However, an adhesive film having such a function and capable of introducing a high dielectric capacitance insulating layer has not been known.

[0005]

SUMMARY OF THE INVENTION According to the present invention, a high dielectric capacity insulating layer can be easily introduced into a multilayer printed wiring board by a vacuum laminator, and plating can be performed on the high dielectric capacity insulating layer. An object of the present invention is to provide an adhesive film. It is still another object of the present invention to provide a multilayer printed wiring board into which a high dielectric capacity insulating layer manufactured by the adhesive film is introduced, and a method for manufacturing the multilayer printed wiring board.

[0006]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that a specific resin composition containing a high dielectric constant inorganic filler is formed on a supporting base film as a layer. The inventors have found that the above-mentioned problems can be solved by a film, and have completed the present invention. That is, the present invention includes the following contents.

(1) The following components (A) to (D): (A) Aromatic epoxy resin having two or more epoxy groups in one molecule and being liquid at room temperature (B) Epoxy curing agent (C) Weight average An adhesive film in which an epoxy resin composition containing a phenoxy resin having a molecular weight of 5,000 to 100,000 (D) a high dielectric constant inorganic filler is formed on a support base film, and the epoxy resin composition after heat curing. Wherein the relative dielectric constant of the adhesive film is 10 or more.

(2) A multilayer printed wiring board wherein a high dielectric capacitance insulating layer is introduced using the above-mentioned adhesive film.

(3) The adhesive film was laminated on a circuit board under pressure and heating conditions, the support base film was peeled off if necessary, and the epoxy resin composition formed on the support base film was cured by heating. After that, if a supporting base film is present, it is peeled off if necessary, the surface of the epoxy resin composition layer cured by an oxidizing agent is roughened if necessary, and a conductive layer is formed by plating, thereby forming a multilayer printed wiring. Plate manufacturing method.

(4) A multilayer printed wiring board obtained according to the above manufacturing method.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.

As the aromatic epoxy resin which is liquid at room temperature and has two or more epoxy groups in one molecule of the component (A), bisphenol A epoxy resin and bisphenol F epoxy resin are preferable. And epoxy resins which are liquid at normal temperature (23 ° C.) such as naphthalene type epoxy resin and phenol novolak type epoxy resin. As these resins, those having a viscosity of usually 5 to 200 poise at 25 ° C. can be used. However, from the viewpoint of highly filling the high dielectric constant inorganic filler (D), an adhesive film suitable for vacuum lamination From the viewpoint of achieving the thermal fluidity of the above, it is preferable to use one having a lower viscosity, that is, one having a viscosity of 5 to 100 poise at 25 ° C.

The epoxy curing agent which is the component (B) in the present invention includes an amine curing agent, a guanidine curing agent, an imidazole curing agent, a phenol curing agent, an acid anhydride curing agent, or an epoxy adduct thereof. Is mentioned. Preferably, these curing agents are microencapsulated and have a long pot life at room temperature or lower.

If a phenolic curing agent containing a nitrogen atom is used among the epoxy curing agents, the heat resistance and flame retardancy required for the insulating layer of the epoxy resin composition of the present invention can be obtained.
The adhesion is improved. Examples of the phenolic curing agent having a nitrogen atom include novolak resins containing a triazine structure (for example, phenolite 7050 series: manufactured by Dainippon Ink and Chemicals, Inc.) and melamine-modified phenol novolak resins (for example, Japan Epoxy Resin Co., Ltd.) Made:
YLH828). These epoxy curing agents may be used alone or in combination of two or more.

[0015] The compounding amount of these epoxy curing agents is 2 to 2 parts with respect to the epoxy resin except for the phenolic curing agent.
Preferably it is in the range of 12% by weight. On the other hand, as for the blending amount of the phenolic curing agent, it is desirable to blend a phenolic curing agent corresponding to 0.5 to 1.3 phenolic hydroxyl group equivalents with respect to 1 epoxy equivalent in the epoxy resin composition. Outside of these ranges, the epoxy resin composition obtained after curing may not have sufficient performance in terms of heat resistance and mechanical strength.

Next, the phenoxy resin having a weight average molecular weight of 5,000 to 100,000, which is the component (C) in the present invention, will be described.

The weight average molecular weight is 5,000 to 10,000
Examples of the phenoxy resin which is 0 include phenothoto YP50 (manufactured by Toto Kasei Co., Ltd.) and E-1256 (manufactured by Japan Epoxy Resin Co., Ltd.).

As the component (C), particularly, a bisphenol S skeleton having a weight average molecular weight of 5,000 to 1,000
Phenoxy resins that are 00 are preferred. Specific examples of such a phenoxy resin include YL6746H30 (manufactured by Japan Epoxy Resins Co., Ltd.) [cyclohexanone varnish of a phenoxy resin composed of a bixinol type epoxy resin (Epicoat YX4000) and bisphenol S:
YL6747H30 (manufactured by Japan Epoxy Resin Co., Ltd.) [cyclohexanone varnish of a phenoxy resin composed of bisphenol A type epoxy resin (Epicoat 828) and bisphenol S: 30% by weight of nonvolatile content, 30% by weight of nonvolatile content, Weight average molecular weight of about 47000].

Since the phenoxy resin has a sulfone group, the compatibility with the epoxy resin is deteriorated. Therefore, the phenoxy resin is compatible in a resin varnish obtained by dissolving the epoxy resin composition in a solvent. Phase separates to form a sea-island structure. Therefore, a good roughened surface can be easily obtained without adding a roughening component such as a rubber component. In addition, since the phenoxy resin itself has a high glass transition point and excellent flame retardancy, there is also an advantage that the epoxy resin composition of the present invention can have better heat resistance and flame retardancy performance. .

When the weight average molecular weight of the phenoxy resin is less than 5,000, the epoxy resin composition of the present invention has insufficient roughening performance, and when it exceeds 100,000, the solubility in an organic solvent is significantly reduced. , Making practical use difficult.

The amount of the phenoxy resin of component (C) varies depending on the type of phenoxy resin, but the total amount of the epoxy resin of component (A) and the phenolic curing agent of component (B) is different. It is preferably in the range of 5 to 100 parts by weight based on 100 parts by weight. If the amount is less than 5% by weight, the flexibility is insufficient from the viewpoint of the handleability of the adhesive film, and sufficient roughening property in forming the conductor layer may not be obtained. On the other hand, when the content exceeds 100% by weight, problems such as phase separation of the resin varnish itself and inversion of the sea-island structure of the cured product may occur.

As the high dielectric constant inorganic filler of the component (D) in the present invention, barium titanate, strontium titanate, calcium titanate, magnesium titanate,
It is selected from lead titanate, bismuth titanate, titanium oxide, barium zirconate, and calcium zirconate. Particularly, barium titanate is preferable. These inorganic fillers have a relative dielectric constant of 100 or more, and each may be used alone,
Two or more kinds may be used in combination. The shape may be spherical, plate-like, or whisker (fiber) -like.

By adding a high dielectric constant inorganic filler, the epoxy resin composition can have a high dielectric constant,
The function as a capacitor can be provided.

The amount of the inorganic filler varies depending on the relative dielectric constant desired after heat curing, and is 70 to 900 parts by weight based on 100 parts by weight of the total of the epoxy resin (A) and the epoxy curing agent (B). A range of parts by weight is preferred. If the amount is too small, the effect of increasing the dielectric constant is not sufficient, and if the amount is too large, handling as an adhesive film becomes difficult.

Further, in addition to the above-mentioned essential components, other thermosetting resins and additives can be used in the epoxy resin composition of the present invention, as long as the effects of the present invention are not impaired. Examples of the thermosetting resin include a polyfunctional epoxy resin other than (A), a monofunctional epoxy resin as a diluent, a blocked isocyanate resin, a xylene resin, a radical generator and a polymerizable resin. Examples of the additives include silica, alumina, and the like as inorganic fillers other than (D).
Examples include barium sulfate, talc, clay, mica powder, aluminum hydroxide, and magnesium hydroxide. In addition, organic fillers such as silicon powder, nylon powder, and fluorine powder, thickeners such as asbestos, orben, and bentone, silicone-based, fluorine-based, polymer-based antifoaming agents or leveling agents, imidazole-based, thiazole-based, Adhesion imparting agents such as triazoles and silane coupling agents, and coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, disazo yellow, and carbon black can be used.

Next, the adhesive film of the present invention will be described.

After dissolving the epoxy resin composition of the present invention in an organic solvent to form a resin varnish, the resin varnish is applied on a base film (support base film) as a support,
The solvent can be dried by blowing hot air or the like to produce an adhesive film. Preferably 10 to 200 μm
The thickness of the epoxy resin composition layer is formed on the thick supporting base film in a thickness not less than the conductor thickness of the circuit board to be laminated, preferably in the range of 10 to 100 μm. Particularly, in order to improve the electric capacity, it is preferable to form the resin layer thin. The amount of residual solvent in the resin layer after drying is 5
% By weight or less is preferred. If the amount of the residual solvent is too large, voids may be generated in the resin when the resin is cured by heating with a supporting base film. The surface of the epoxy resin composition layer on which the supporting base film is not in close contact is 1 to 40.
A protective film conforming to a μm-thick support film may be further laminated, wound up in a roll shape, and stored.

Examples of the support base film include polyolefins such as polyethylene and polyvinyl chloride; polyesters such as polyethylene terephthalate and polyethylene naphthalate; polycarbonates and polyimides; and release papers and metal foils such as copper foil and aluminum foil. Can be.

The supporting base film may be subjected to a mold release treatment in addition to a mud treatment and a corona treatment.
Examples of the organic solvent include ketones such as acetone, methyl ethyl ketone and cyclohexanone, ethyl acetate, butyl acetate, cellosolve acetate, acetic acid esters such as propylene glycol monomethyl ether acetate and carbitol acetate, cellosolves such as cellosolve and butyl cellosolve, and carbitol. And carbitols such as butyl carbitol, aromatic hydrocarbons such as toluene and xylene, dimethylformamide, dimethylacetamide and the like. These organic solvents may be used alone or in combination of two or more.

Next, a method for producing the multilayer printed wiring board of the present invention using the adhesive film of the present invention will be described.

The adhesive film of the present invention is laminated on a patterned circuit board. In the lamination, when the adhesive film has a protective film, after removing the protective film, the adhesive film is pressure-bonded to the circuit board while applying pressure and heat.

The laminating conditions are as follows: the adhesive film and the circuit board are preheated as necessary, and the pressing temperature is preferably 70 to 130 ° C., and the pressing pressure is preferably 1 to 11 kgf /
cm ^2, and preferably laminated under reduced pressure. The lamination method may be a batch method or a continuous method using a roll. After lamination, the support base film is peeled off after cooling to around room temperature, and the epoxy resin composition of the present invention is cured by heating on a circuit board.

When a support film subjected to a release treatment is used, the support film may be peeled off after being cured by heating. On the other hand, when a metal foil is used, the supporting film can be used as it is as the conductor layer, and thus does not necessarily need to be peeled off.

Next, a method for manufacturing a multilayer printed wiring board according to the present invention will be described. Note that as a substrate used for the circuit substrate, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, or the like can be used.

In the present invention, the circuit board refers to a board on which a patterned conductor layer (circuit) is formed on one or both sides of the board. The present invention also relates to a multilayer printed wiring board in which conductor layers and insulating layers are alternately formed, wherein one or both outermost layers of the multilayer printed wiring board are patterned conductor layers (circuits). Included in the circuit board. The surface of the conductive circuit layer may be previously subjected to a roughening treatment such as a blackening treatment.

After the epoxy resin composition is cured by heating, a via hole is formed by drilling, if necessary, laser or plasma to form a via hole, and then a conductor layer is formed by dry plating or wet plating. Known methods such as vapor deposition, sputtering, and ion plating can be used as the dry plating.

In the case of the wet method, first, the surface of the epoxy resin composition layer (insulating layer) cured with an oxidizing agent such as permanganate, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid or the like is roughened. Processing to form a rough anchor. Next, a conductor layer is formed by a method combining electroless plating and electrolytic plating. Alternatively, a plating resist having a pattern opposite to that of the conductor layer may be formed, and the conductor layer may be formed only by electroless plating. As a method for forming a pattern thereafter, for example, a subtractive method, a semi-additive method, or the like known to those skilled in the art can be used.

The epoxy resin composition of the present invention becomes a high-capacity insulating layer having a relative dielectric constant of 10 or more after heat curing.
By manufacturing a multilayer printed wiring board using an adhesive film in which the epoxy resin composition is formed on a supporting base film, a capacitor can be freely incorporated in the multilayer printed wiring board. This eliminates the need to secure a capacitor mounting area, and not only enables high mounting density, but also shortens the path for connecting electronic components and reduces the speed compared to the conventional case where power is supplied via chip capacitors. The radiation noise can be suppressed even in the signal circuit board. In addition, a high-temperature, high-pressure press is not required, and a high-capacity insulating layer can be introduced into a multilayer printed wiring board by a vacuum laminator, and furthermore, plating can be performed on the insulating layer. A multilayer printed wiring board having a high electric capacity insulating layer can be manufactured by a simple method.

[0039]

EXAMPLES The present invention will be described below in more detail with reference to examples, but the present invention is not limited to these examples.

Example 1 A liquid bisphenol A type epoxy resin (epoxy equivalent: 176, Epicoat 825 manufactured by Japan Epoxy Resin Co., Ltd.) 30 as the component (A) 30
Parts by weight, 2 parts of dicyandiamide (DICY7 manufactured by Japan Epoxy Resin Co., Ltd.) as 2, (B), 2,4-diamino-6- (2-methyl-1-imidazolylethyl)-
1 part of 1,3,5-triazine / isocyanuric acid adduct (2MA-OK-PW manufactured by Shikoku Chemicals Co., Ltd.), phenoxy resin varnish as component (C) (YP5 manufactured by Toto Kasei Co., Ltd.)
0-EK35), 100 parts by weight of titanic oxide (KR-380 manufactured by Titanium Industry Co., Ltd.) as component (D), 30 parts of methyl ethyl ketone, and 5 parts of dimethylformamide were added and kneaded with a spike mill to obtain epoxy. A resin composition was prepared. The varnish-like epoxy resin composition was applied to a copper foil having a thickness of 18 µm by a die coater so that the thickness after drying became 50 µm, and dried at 80 to 120 ° C for 10 minutes to obtain an adhesive film.

Example 2 A liquid bisphenol F type epoxy resin (epoxy equivalent 166, Epicoat 806 manufactured by Japan Epoxy Resin Co., Ltd.) 30 as the component (A) 30
Parts by weight, MEK varnish of phenol novolak resin containing triazine structure as component (B) (Phenolite LA-7052, manufactured by Dainippon Ink and Chemicals, Ltd., nonvolatile content 6)
0%, nonvolatile phenolic hydroxyl equivalent weight 120) 20
Part by weight, cyclohexanone varnish of phenoxy resin comprising Epicoat 828 and bisphenol S as component (C) (YL6747 manufactured by Japan Epoxy Resin Co., Ltd.)
H30, non-volatile content 30% by weight, weight average molecular weight 4700
0) 30 parts by weight, 80 parts by weight of barium titanate (BT-100P manufactured by Fuji Titanium Industry Co., Ltd.) as the component (D), 25 parts of methyl ethyl ketone, and 5 parts of dimethylformamide were added and kneaded with a spike mill to obtain an epoxy resin. A composition was made. The varnish-like epoxy resin composition was treated with a 38 μm-thick polyethylene terephthalate (PE).
T) The composition was applied on a film by a die coater so that the thickness after drying was 30 μm, and dried at 80 to 120 ° C. for 8 minutes to obtain an adhesive film.

<Comparative Example 1> Liquid bisphenol A type epoxy resin (epoxy equivalent 176, Epicoat 825 manufactured by Japan Epoxy Resin Co., Ltd.) 30 as component (A) 30
Parts by weight, 2 parts of dicyandiamide (DICY7 manufactured by Japan Epoxy Resin Co., Ltd.) as 2, (B), 2,4-diamino-6- (2-methyl-1-imidazolylethyl)-
1 part of 1,3,5-triazine isocyanuric acid adduct (2MA-OK-PW manufactured by Shikoku Chemicals Co., Ltd.), phenoxy resin varnish as component (C) (YP50 manufactured by Toto Kasei Co., Ltd.)
30 parts by weight of EK35) and 20 parts by weight of titanium oxide (KR-380 manufactured by Titanium Industry Co., Ltd.) (61% by weight of the total amount of (A) and (B)) as component (D), and 10 parts of methyl ethyl ketone; 5 parts of dimethylformamide was added and kneaded with a spike mill to prepare an epoxy resin composition. The varnish-like epoxy resin composition has a thickness of 18 μm.
On a copper foil, applied with a die coater so that the thickness after drying is 50 μm, and dried at 80 to 120 ° C. for 10 minutes,
An adhesive film was obtained.

<Comparative Example 2> Liquid bisphenol F type epoxy resin (epoxy equivalent 166, Epicoat 806 manufactured by Japan Epoxy Resin Co., Ltd.) 30 as component (A) 30
Parts by weight, MEK varnish of phenol novolak resin containing triazine structure as component (B) (Phenolite LA-7052, manufactured by Dainippon Ink and Chemicals, Ltd., nonvolatile content 6)
0%, nonvolatile phenolic hydroxyl equivalent weight 120) 20
80 parts by weight of barium titanate (BT-100P manufactured by Fuji Titanium Industry Co., Ltd.), 20 parts of methyl ethyl ketone and 5 parts of dimethylformamide were added as a component (D), and the mixture was kneaded with a spike mill to obtain an epoxy resin composition. Produced. The varnish-like epoxy resin composition was applied to a thickness of 38.
It was applied to a μm polyethylene terephthalate (PET) film by a die coater so that the thickness after drying became 30 μm, and dried at 80 to 120 ° C. for 8 minutes to obtain an adhesive film.

Example 3 A six-layer circuit board having an outer conductor thickness of 18 μm and a thickness of 0.8 mm was prepared, and the adhesive film obtained in Example 1 was heated at a temperature of 110 ° C. using a vacuum laminator.
After laminating on both sides under the conditions of a temperature of 8 ° C., a pressure of 8 kgf / cm ² , and a pressure of 5 mmHg or less, the laminate was heated at 120 ° C. for 30 minutes and further at 170 ° C. for 3 minutes.
It was cured by heating for 0 minutes. After that, a via hole is formed by drilling with a laser, and then electroless and electrolytic plating is performed to form a pattern according to a subtractive method,
A multilayer printed wiring board having a built-in capacitor at a predetermined position was obtained. The printed wiring board obtained was soldered at 260 ° C. for 60 seconds and the heat resistance was observed. No abnormality was found.

Example 4 After laminating in the same manner as in Example 3 using the adhesive film obtained in Example 2,
The PET film was peeled off and cured by heating at 170 ° C. for 30 minutes. Thereafter, a via hole was formed by drilling with a laser, the surface was roughened with an alkaline oxidizing agent of permanganate, and a conductor layer was formed on the entire surface by electroless plating and electrolytic plating. The plating peel strength after aging at 150 ° C. for 30 minutes was 0.8 kgf / cm. Next, a pattern was formed according to the subtractive method to obtain a multilayer printed wiring board having a capacitor built in a predetermined position. The printed wiring board obtained was soldered at 260 ° C. for 60 seconds and the heat resistance was observed. No abnormality was found.

<Comparative Example 3> The adhesive film obtained in Comparative Example 2 was laminated in the same manner as in Example 3. This adhesive film had poor stiffness and inferior handleability as compared with Examples 1 and 2. Next, a conductor layer was formed on the entire surface of the epoxy resin composition layer by electroless and electrolytic plating in the same manner as in Example 4. However, the adhesion of the plating was weak and blisters were generated during aging after plating. Occurred.

<Measurement of relative permittivity of epoxy resin composition> In the case of Example 1, the resin surfaces of the adhesive film are laminated together. In the case of Example 2 and Comparative Example 1, the PET film was peeled off after laminating the adhesive film on the copper plate, and the adhesive film was laminated two more times on the resin, and finally, an 18 μm thick copper foil was laminated. 100 μm sandwiched in the conductor layer thus obtained
m thickness of the epoxy resin composition at 120 ° C. for 30 minutes,
The sample was thermoset at 170 ° C. for 30 minutes to prepare a sample. room temperature,
The results at a measurement frequency of 1 MHz are shown in Table 1 below.

[0048]

[Table 1]

Table 1 shows that the epoxy resin composition of the present invention has a high dielectric constant and becomes a high electric capacity insulating layer. Further, a multilayer printed wiring board having a built-in capacitor can be easily manufactured using the adhesive film of the present invention.
(Examples 3 and 4) Further, it can be seen that copper plating having excellent adhesion was formed even by roughening (Example 4). On the other hand, the resin composition of Comparative Example 1 had a low relative dielectric constant and did not become a high-capacity insulating layer, and the adhesive film of Comparative Example 2 was inferior in handleability. Further, in the multilayer printed wiring board manufactured according to Comparative Example 3, since the insulating layer did not have a roughening property, the peel strength of copper plating was low and the copper plating was not usable.

[0050]

According to the adhesive film of the present invention, an insulating layer can be easily formed by a vacuum laminator in the production of a multilayer printed wiring board and the like, and a conductive layer can be formed on the insulating layer by plating. Further, the insulating layer introduced by the adhesive film of the present invention becomes a high-capacitance insulating layer having a relative dielectric constant of 10 or more, and a capacitor can be freely incorporated in the multilayer printed wiring board. Can be mounted at a high density.

Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat II (Reference) H05K 3/46 H05K 3/46 ETF term (Reference) 4J004 AA02 AA11 AA13 AA18 FA05 4J040 EC051 EC061 EC071 EC171 EE062 HA116 HB36 HC25 KA16 KA42 LA01 LA09 MB03 NA20 5E343 AA07 AA15 AA16 AA17 AA18 BB24 BB67 CC03 CC07 CC48 DD32 DD33 DD43 EE37 EE38 GG01 GG11 5E346 AA16 CC04 CC08 CC09 CC10 CC12 CC32 CC43 DD12 DD22 DD25 EE06 EE19 FF15 H15

Claims (9)

[Claims] 1. The following components (A) to (D): (A) an aromatic epoxy resin which has two or more epoxy groups in one molecule and is liquid at room temperature, (B) an epoxy curing agent, and (C) a weight average molecular weight. Is an adhesive film in which an epoxy resin composition containing a phenoxy resin (D) a high dielectric constant inorganic filler is 5000 to 100000 is formed on a supporting base film, and the epoxy resin composition after heat curing An adhesive film having a relative dielectric constant of 10 or more. 2. The adhesive film according to claim 1, wherein the viscosity at 25 ° C. of the (A) aromatic epoxy resin which is liquid at room temperature and has two or more epoxy groups in one molecule is 5 to 100 poise. 3. The adhesive film according to claim 1, wherein the epoxy curing agent (B) is a triazine-modified phenolic curing agent. (C) a weight average molecular weight of 5000 to 1
2. The adhesive film according to claim 1, wherein the phenoxy resin of 00000 has a bisphenol S skeleton. 5. The high dielectric constant inorganic filler (D) is barium titanate, strontium titanate, calcium titanate, magnesium titanate, lead titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate. The adhesive film according to claim 1, wherein the adhesive film is at least one member selected from the group consisting of: 6. A weight average molecular weight of (C) based on 100 parts by weight of a total amount of (A) an aromatic epoxy resin having two or more epoxy groups in one molecule and liquid at room temperature and (B) an epoxy curing agent. 2. The adhesive film according to claim 1, comprising 5 to 100 parts by weight of a phenoxy resin having a molecular weight of 5,000 to 100,000 and 70 to 900 parts by weight of (D) a high dielectric constant inorganic filler. 7. A multilayer printed wiring board wherein a high dielectric capacity insulating layer is introduced using the adhesive film according to claim 1. 8. An epoxy resin composition formed on a supporting base film by laminating the adhesive film according to claim 1 on a circuit board under pressure and heating conditions, and peeling off the supporting base film if necessary. After the heat curing, the support base film is peeled off if necessary, if necessary, the surface of the epoxy resin composition layer cured by the oxidizing agent is roughened if necessary, and the conductor layer is formed by plating. Of manufacturing a multilayer printed wiring board. 9. A multilayer printed wiring board obtained according to the method of claim 8.