JP2002305382A - Printed board and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board and its manufacturing method, capable of simplifying a structure and a manufacturing process, which has sections with different number of layers of conductor pattern. SOLUTION: Conductor pattern films 21 filled with a conductive paste 50 are laminated in a via hole 24 of a thermo-plastic resin film 23 where a conductor pattern 22 is formed, which is collectively heat-pressed through a buffer material 31, to provide a multilayer printed board 10 having sections of different number of layers of a conductor pattern 22. Since the insulating base materials 23 are all formed of the same themo-plastic resin, it is not required to provide a working process for each material of the insulating base material, resulting in no complicate manufacturing process. Thus a manufacturing cost is lowered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board and a method of manufacturing the same, and more particularly, to a printed circuit board having portions having different numbers of conductive pattern layers and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, there is a multi-layer substrate in which the number of layers of a conductor pattern is different depending on the portion according to the required characteristics of each portion in the same substrate. As a typical example, a so-called rigid-flexible substrate is known in which a portion requiring high-density mounting has a multilayer structure such as a five-layer structure, and a portion requiring flexible flexibility has a single-layer structure. Have been. This rigid-flexible board is based on a flexible board using a film of polyimide or the like as an insulating base material, and by bonding a rigid board using an epoxy resin or the like as an insulating base material to both surfaces of a portion requiring a multilayer structure. Is formed.

[0003]

However, in the above-mentioned prior art, the flexible substrate and the rigid substrate are separately formed, or the conductor of the flexible substrate and the conductor of the rigid substrate are electrically connected to each other. It is necessary to adhere to a rigid substrate. Therefore, there is a problem that the structure and manufacturing process of the printed circuit board are complicated.

[0004] The present invention has been made in view of the above points,
It is an object of the present invention to provide a printed circuit board and a method for manufacturing the same, which can simplify the structure and the manufacturing process even if the printed circuit board has portions having different numbers of layers of conductive patterns.

[0005]

According to a first aspect of the present invention, there is provided a printed circuit board according to the first aspect, wherein a plurality of conductor patterns (22) are laminated via an insulating base material (23). Conductor pattern according to area (22)
(23) having a structure in which the number of layers for laminating is different.
In addition, the same thermoplastic resin is used.

According to this, the insulating base material (23) can be made of a thermoplastic resin of the same material. Therefore, it is possible to simplify the structure of the printed circuit board (100). Also, there is no need to bond insulating substrates of different materials when manufacturing the printed circuit board (100). Therefore, the manufacturing process can be simplified.

In the printed circuit board according to the second aspect of the present invention, at least a part of the plurality of conductive patterns (222)
a, 222b) are electrically connected via an interlayer connection material (50) in a hole (224) provided in the insulating base material (223b), and are at least partially electrically connected. Of the plurality of conductor pattern (222a, 222b) layers, at least a part of adjacent two conductor pattern (222a, 222b) layers is formed of a stripe-shaped conductor pattern (222a, 222b), respectively. Conductor patterns (222a, 22a)
2b) are arranged in the direction in which they intersect.

According to this, a hole (224) is formed at an arbitrary intersection of the striped conductor patterns (222a, 222b).
And adjacent conductor patterns (222a, 222b)
Can be connected between layers. Therefore, the steps of forming the stripe-shaped conductor patterns (222a, 222b) can be shared, so that the printed circuit board (200)
Can further simplify the structure and manufacturing process.

In the method of manufacturing a printed circuit board according to the third aspect of the present invention, the insulating base material (23) made of the same thermoplastic resin having a conductive pattern (22) formed on the surface.
Are stacked so that the number of layers of the conductor pattern (22) becomes a desired number for each substrate region.

According to this, when manufacturing a printed circuit board (100) having portions (100a, 100b, 100c) having different numbers of layers of the conductor pattern (22), the insulating base material (2) is formed.
Since 3) is a thermoplastic resin of the same material, there is no need to provide a processing step for each material due to the different material of the insulating base material. Also, there is no need to bond insulating substrates of different materials. Therefore, it is possible to simplify the structure and manufacturing process of the printed circuit board (100). This makes it possible to reduce the manufacturing cost of the printed circuit board (100).

In the method of manufacturing a printed circuit board according to the present invention, the insulating substrate (23) is a resin film (23).
3) A single-sided conductor pattern film (21) having a conductor pattern (22) formed only on one surface is laminated.

According to this, a printed circuit board can be manufactured by laminating single-sided conductor pattern films (21) of the same type. Therefore, the manufacturing process of the printed circuit board can be simplified.

In the method for manufacturing a printed circuit board according to the fifth aspect of the present invention, the single-sided conductor pattern film (321)
a, 321b, 321c, and 321d) correspond to the substrate section (30
(1) a first region (341), which is connected to the periphery of the first region (341),
2) and a second region (342), and in the laminating step, each substrate region (300a, 300b, 300
c) The same number of single-sided conductor pattern films (321a, 3A) as the number of layers of the conductor pattern (22) in the substrate region (300a) in which the number of layers of the conductor pattern (22) is the maximum.
21b, 321c, 321d), and before performing the laminating step, the single-sided conductor pattern films (321a, 32
1b, 321c, 321d) in the first region (341), the portions corresponding to the substrate regions (300b, 300c) in which the desired number of layers of the conductor pattern (22) is smaller than the maximum number are removed and laminated. When the single-sided conductor pattern films (321a, 321b, 321c, 321d) are laminated in the process, each substrate region (300a, 300b, 30)
0c) single-sided conductor pattern film (321a, 321)
b, 321c, 321d) to remove the single-sided conductor pattern film (32) after the substrate (310) is formed.
1a, 321b, 321c, 321d). A discard plate portion removing step of removing the discard plate portion (302) formed by the second region (342).

According to this, each of the substrate regions (300a, 300a) is placed in the second region (342) to be the waste plate portion (302).
b, 300c) and the single-sided conductor pattern films (321a, 321b,
21c, 321d) are laminated, and after the substrate (310) is formed, the discarded plate portion (302) is removed to remove the substrate region (300).
a, 300b, 300c) according to the conductor pattern (2
Printed circuit boards having different numbers of layers in 2) can be manufactured. Therefore, the substrate regions (300a, 300b, 300
c) When manufacturing a printed circuit board (300) having a different number of layers of the conductor pattern (22) for each, the substrate area (300)
a, 300b, 300c), there is no need to laminate the single-sided conductor pattern films. In this way, the manufacturing process of the printed circuit board can be further simplified.

In the method of manufacturing a printed circuit board according to the present invention, the conductive patterns (222a, 222a
Of the layers of b), at least some of the layers of the two adjacent conductor patterns (222a, 222b) are stripe-shaped conductor patterns (222a, 222b), respectively, and the insulating base material (223a, 223b) And stripe-shaped conductor patterns (222a, 222b) are laminated so as to intersect with each other, and have holes (224) filled with interlayer connection materials (50) at desired positions.

According to this, a hole (224) is formed at an arbitrary intersection of the striped conductor patterns (222a, 222b).
And adjacent conductor patterns (222a, 222b)
Can be connected between layers. Therefore, the process of forming the striped conductor patterns (222a, 222b) can be shared, and the manufacturing process can be further simplified. By doing so, it is possible to further reduce the manufacturing cost.

In the method for manufacturing a printed circuit board according to the present invention, after the insulating base material is laminated,
It is characterized in that the insulating substrates (23) are bonded to each other by heating while applying pressure from both sides of the substrate (100).

According to this, the conductor pattern (22) of the printed circuit board (100) has a multilayer portion (100a, 100b).
Bonding of the insulating base materials (23) to each other can be performed collectively. Therefore, it is possible to simplify the manufacturing process and shorten the processing time. By doing so, it is possible to further reduce the manufacturing cost.

In the method of manufacturing a printed circuit board according to the present invention, when the insulating bases (23) are bonded to each other, they are heated while being pressed through the elastic member (31). I have.

According to this, even if there are portions (100a, 100b, 100c) having different substrate thicknesses due to the different number of layers of the conductor pattern (22) of the printed circuit board (100), the insulating base material (23) is not Can be collectively performed. Therefore, the manufacturing process can be further simplified, and the processing time can be further reduced. By doing so, it is possible to further reliably reduce the manufacturing cost.

Note that the reference numerals in parentheses attached to the respective means indicate the correspondence with specific means described in the embodiment described later.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a sectional view showing the steps of manufacturing a printed circuit board according to this embodiment.

In FIG. 1A, reference numeral 21 denotes a conductor pattern 22 formed by etching a conductor foil (copper foil having a thickness of 18 μm in this example) adhered to one surface of a resin film 23 as an insulating base material. It is a single-sided conductor pattern film. In the present embodiment, the resin film 23 has a thickness of 25 to 35% by weight of a polyetheretherketone resin 65 to 35% by weight and a polyetherimide resin 35 to 65% by weight.
A 75 μm resin film is used. In addition, other metal foils such as an aluminum foil can be used as the conductor foil in addition to the copper foil.

As shown in FIG. 1A, the conductor pattern 2
When the formation of the second conductive layer 2 is completed, next, as shown in FIG. 1B, a carbon dioxide laser is irradiated from the resin film 23 side to form a hole having the conductive pattern 22 as a bottom surface, that is, a via hole 24 as a bottomed via hole. Form. The via hole 24 is formed by adjusting the output of the carbon dioxide gas laser, the irradiation time, and the like so that a hole is not formed in the conductor pattern 22.

In forming the via hole 24, an excimer laser or the like can be used in addition to the carbon dioxide gas laser. A method of forming via holes and holes other than laser, such as drilling, is also possible. However, it is preferable to perform drilling with a laser beam because a hole with a fine diameter can be formed and the conductor pattern 22 is hardly damaged.

As shown in FIG. 1B, the via hole 24
When the formation of is completed, next, as shown in FIG.
Conductive paste 5 as an interlayer connection material in via hole 24
Fill with zeros. The conductive paste 50 is obtained by adding a binder resin or an organic solvent to silver alloy metal particles, kneading the mixture, and forming a paste.

The conductive paste 50 is printed and filled into the via holes 24 of the single-sided conductive pattern film 21 by a screen printing machine using a metal mask. In the present embodiment, the via hole 24 is filled with the conductive paste 50 using a screen printing machine. However, other methods using a dispenser or the like are also possible as long as the filling can be reliably performed.

When the filling of the via hole 24 with the conductive paste 50 is completed, as shown in FIG. 1D, a plurality of single-sided conductor pattern films 21 are formed in the substrate region where the layers of the conductor pattern 22 are multilayered. In this example, 2 to 4 sheets are laminated depending on the substrate region. An aluminum plate 25 serving as a heat radiating member is laminated on the rear side (lower side in FIG. 1D) of a portion where a heating element such as a power element is mounted when the substrate is used.

Further, on the upper and lower surfaces of the laminated single-sided conductor pattern film 21 and the aluminum plate 25, a buffer material 31 for pressing the entire surface of the substrate without adhering to the substrate in a heating press step described later is disposed. In this example, a sheet in which a knitted sheet member made of stainless steel fiber and a polyimide film are laminated on the surface of the sheet member in contact with the substrate is used as the cushioning material 31.

The cushioning member 31 is an elastic member in the present embodiment, has heat resistance higher than the heating temperature in a heating press step described later, and does not adhere to the substrate, and does not adhere to the difference between the mold surface of the press die and the substrate shape. Any other material and configuration may be used as long as the material has flexibility that can be deformed to a shape capable of buffering.

After laminating the single-sided conductor pattern film 21, the aluminum plate 25, and the cushioning material 31 as shown in FIG. 1 (d), as shown in FIG. Pressurizing while heating with 32. In this example, heating to a temperature of 200 to 350 ° C.
It was pressurized at a pressure of 〜１０10 MPa.

Thus, the single-sided conductor pattern film 21 and the aluminum plate 25 are bonded to each other. The resin films 23 are heat-sealed and integrated, and the conductive paste 50 in the via hole 24 connects the adjacent conductor patterns 22 between layers, thereby obtaining the printed circuit board 100 having portions with different numbers of layers. Since the resin films 23, which are insulating base materials, are all formed of the same thermoplastic resin, they can be reliably integrated by being softened by heating and pressed.

By the way, as shown in FIG. 1 (f), the printed circuit board 100 obtained according to the present embodiment has a four-layer structure substrate part 100a which requires high-density mounting and a power element mounting according to the substrate area. Heat-dissipating structure board part 100b (two layers of conductor pattern 22) that require heat-dissipating properties, and connection structure board part 100c that requires flexibility to connect them.
(The conductor pattern 22 has one layer).

According to the structure and the manufacturing method described above, the single-sided conductor pattern film 21 in which the resin film 23 as the insulating base material is entirely formed of the same thermoplastic resin is appropriately laminated, and the layer of the conductor pattern 22 is formed depending on the portion. A different number of printed circuit boards 100 can be obtained. Therefore, there is no need to provide a processing step for each material due to the difference in the material of the insulating base material, so that the manufacturing process is not complicated.

The bonding between the resin films 23 in the multilayer portions 100a and 100b of the conductor pattern 22 of the printed circuit board 100, and the resin film 23 and the aluminum plate 2
5 can be collectively performed. Therefore, the manufacturing process can be simplified and the processing time can be reduced. As described above, the manufacturing cost can be reduced.

In this embodiment, each part 100a, 100b, 100c of the printed circuit board 100 is heated and pressed at a time. However, the connection structure substrate part 100c having one conductive pattern 22 is long. In the case where the four-layer structure substrate part 100a and the heat radiation structure substrate part 100b are separated from each other, it is preferable to heat press each of the substrate parts 100a and 100b separately from the viewpoint of the production cost without increasing the size of the production equipment. There is also.

(Second Embodiment) Next, a second embodiment will be described with reference to the drawings.

FIG. 2 is a perspective view showing a schematic configuration of a printed circuit board according to this embodiment. In FIG. 2, illustration of the conductor pattern 22 is omitted.

The printed circuit board 200 shown in FIG. 2 is formed by the same manufacturing method as that of the first embodiment.
The layer structure substrate portion 200b, the layer extending from the lowermost layer constituting the four-layer structure substrate portion 200a, and the three-layer structure substrate portion 200
and b, a two-layer structure substrate portion 200c formed of a layer extending from the lowermost layer. The material of each component is the same as that of the first embodiment.

FIG. 3 shows a single-sided conductive pattern film 221a constituting the lowermost layer of the four-layered substrate portion 200a and a layer extending from this layer, and the lowermost layer of the three-layered substrate portion 200b and a layer extending from this layer. FIG. 7 is a diagram showing a connection relationship with a single-sided conductor pattern film 221b to be formed. Therefore, in FIG. 3, the upper three layers and the three
The upper two layers of the layered substrate portion 200b are not shown.

The conductor pattern 222a of the single-sided conductor pattern film 221a and the single-sided conductor pattern film 221
The conductor pattern 222b of b is formed in a stripe pattern by the same process as the process shown in FIG. 1A in the first embodiment. In addition, the conductor pattern 222 is provided on the resin film 223b as an insulating base material.
a at the position where the conductor pattern 222b is connected to the conductor pattern 222b.
By the same process as the process shown in FIG.
1 are formed in the via hole 224.
By the same process as the process shown in FIG.
0 is filled.

Then, in a step similar to the step shown in FIG. 1D, the insulating base 223a and the insulating base 223b are laminated so that the conductor pattern 222a and the conductor pattern 222b are orthogonal to each other. ), The single-sided conductor pattern films 221a, 221
b is bonded.

Thus, each of the resin films 223a, 223a,
23b are thermally fused and integrated, and the via hole 2
By the conductive paste 50 in 24, the interlayer connection between the adjacent conductor patterns 222a and 222b is performed. A four-layer structure substrate unit 200a not shown in FIG.
The three layers and the two layers of the three-layer structure substrate part 200b are also processed by the same steps as those shown in FIG.
Is obtained. In addition, since the resin films that are the insulating base materials are all formed of the same thermoplastic resin, they can be reliably integrated by being softened by heating and pressed.

According to the above configuration and manufacturing method, the first
The same effect as that of the embodiment can be obtained. In addition, stripe-shaped conductor patterns 222a, 222b
A through-hole 224 is provided at an arbitrary intersection of the conductive pastes 50 filled in the through-holes 224, and interlayer connection between the adjacent conductive patterns 222a and 222b can be performed. Therefore, the process of forming the stripe-shaped conductor pattern can be shared, so that the manufacturing process can be further simplified. Thus, the manufacturing cost can be further reduced.

(Third Embodiment) Next, a third embodiment will be described with reference to the drawings.

The same parts as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

FIG. 4 shows one-sided conductor pattern films 321a, 321b, 321c, 3c constituting a printed circuit board 300 (shown in FIG. 5 (c) described later) in this embodiment.
It is a top view which shows schematic structure of 21d. In FIG. 4, illustration of the conductor pattern 22, the via hole 24, and the like is omitted.

The single-sided conductor pattern film 321a shown in FIG. 4A is formed by the same manufacturing method as the single-sided conductor pattern film 21 of the first embodiment. However, the single-sided conductor pattern film 321a is connected to the first region 341 (a portion surrounded by a dashed line in the drawing) and the periphery of the first region 341 to be the substrate portion 301 constituting the printed circuit board 300, and is printed. Substrate 30
And a second region 342 (a portion outside the one-dot chain line in the figure) that is to be removed at the time of forming the zero.

The single-sided conductor pattern film 321a
Is processed in the same process as the manufacturing process of the single-sided conductive pattern film 21, in the process of forming the conductive pattern 22 similar to that shown in FIG.
2 is a reference mark 32 serving as a processing reference in a subsequent process.
6 (4 in this example) are formed.

In the step of forming a via hole 24 similar to that shown in FIG. 1B, an opening 343a is formed by laser processing (that is, a part of the conductor pattern film is removed). The opening 343a has a smaller number of layers than the four-layer structure board 300a in which the number of conductive pattern layers of the printed circuit board 300 described later is the maximum.
b or a portion corresponding to the single-layer substrate portion 300c. In this embodiment, the opening 343a is formed not only in the first region 341 but also partially so as to extend to the second region 342, as shown in FIG. 4A. I have.

In this embodiment, the opening 343a is formed by
In the via hole forming step, the laser processing is performed. However, after the via hole 24 is formed, or after the conductive paste 50 is filled in the via hole 24, the die cutting may be performed.

Along with the single-sided conductor pattern film 321a shown in FIG. 4 (a), the single-sided conductor pattern films 321b, 321c, 321d shown in FIGS. It is formed similarly to the film 321a. However, the opening 343b of the single-sided conductor pattern film 321b and the opening 343d of the single-sided conductor pattern film 343d are provided at portions corresponding to the single-layered board portion 300c having a smaller number of layers than the four-layered board portion 300a of the printed board 300 described later. Provided.

The openings 343b and 343d are also provided in the opening 34.
Similarly to 3a, not only the first region 341 but also a part thereof is formed to extend to the second region 342.

After the single-sided conductor pattern films 321a, 321b, 321c and 321d are formed as shown in FIG. 4, these single-sided conductor pattern films 321a, 321b, 321c and 321 are formed as shown in FIG.
d is laminated. The relative positions of the single-sided conductor pattern films at the time of lamination are matched by the reference marks 326 shown in FIG.

Although not shown in FIG. 5A, in the present embodiment, the single-sided conductive pattern film 32 is used.
1a, 321b and 321c are single-sided conductor pattern films 32 with the surface on which the conductor pattern 22 is formed facing upward.
1d is laminated with the surface on which the conductor pattern 22 is formed as the lower side.

The laminated single-sided conductor pattern films 321a, 321b, 321c, and 321d are formed as shown in FIG.
By a process similar to the process shown in (e), a vacuum heating press is performed through the cushioning material 31, and the single-sided conductor pattern films 321a, 321b, 321c, and 321d are bonded to each other.

At this time, each single-sided conductor pattern film 3
The resin films 21a, 321b, 321c, and 321d are heat-sealed and integrated, and interlayer connection of adjacent conductor patterns is performed by conductive paste in via holes (not shown). Since the resin films that are the insulating base materials are all formed of the same thermoplastic resin, they can be reliably integrated by being softened by heating and pressed.

In this way, as shown in FIG. 5B, a printed circuit board 310 in which the discard plate 302 is connected around the substrate 301 is obtained. And the printed circuit board 3
10 is obtained, the substrate portion 301 of the printed circuit board 310
(Not shown in FIG. 5B, a position corresponding to the dashed line in FIG. 4) is cut by laser processing or router processing to remove the discard plate portion 302. And the printed circuit board 3 composed of the board part 301
00 is obtained.

Printed circuit board 300 obtained by this example
As shown in FIG. 5C, the four-layer structure substrate part 300a and the three-layer structure substrate part 300b are flexible according to each substrate region in the substrate part 301, and there is flexibility to connect them. 1
And a layer structure substrate section 300c.

The printed circuit boards 310 and 3 shown in FIG.
Also in 00, the illustration of the conductor pattern and the like is omitted.

The material of each component in this embodiment, the processing conditions in the processing step, and the like are the same as those in the first embodiment.

According to the above-described structure and manufacturing method, the single-sided conductor pattern films 321a, 321a, and 321a are all formed of the same thermoplastic resin.
By appropriately laminating 21b, 321c, and 321d, it is possible to obtain a printed circuit board 300 having a different number of conductor pattern layers depending on portions. Accordingly, there is no need to provide a processing step for each material due to a difference in the material of the insulating base material or a processing step for a film having a configuration other than the single-sided conductor pattern film, so that the manufacturing process is not complicated.

Each single-sided conductor pattern film 321
a, 321b, 321c, and 321d can be collectively bonded to each other. Therefore, the manufacturing process can be simplified and the processing time can be reduced.

Further, the four-layer structure substrate portion 30 in which the number of conductor patterns is the maximum number (four in this example) in each substrate region
A printed circuit board having a different number of conductor pattern layers according to the substrate area of the substrate portion by laminating four single-sided conductor pattern films capable of forming a single-layer conductor pattern and bonding the single-sided conductor pattern films to each other and removing the discarded plate portion. Can be obtained. As in the first embodiment, it is not necessary to laminate the single-sided conductor pattern films in each of the regions where the number of layers of the conductor pattern is different, so that the number of steps such as alignment can be reduced, and the manufacturing process can be further simplified. It is.

(Other Embodiments) In each of the above embodiments, a bottomed via hole was formed, and this bottomed via hole was filled with a conductive paste. It may be filled.

In each of the above embodiments, the conductor pattern is formed by etching the copper foil. However, the conductor pattern is formed by printing a conductive paste pattern on an insulating base material. Is also good.
When the conductive paste is formed by pattern printing of the conductive paste, the conductive paste may be simultaneously filled into the via holes.

In each of the above embodiments, the resin film as the insulating base material is 65 to 35% by weight of polyetheretherketone resin and 35 to 35% by weight of polyetherimide resin.
Although a resin film consisting of 65% by weight was used, the film is not limited to this, and a film in which a non-conductive filler is filled in a polyetheretherketone resin and a polyetherimide resin may be used. It may be a resin film. Any thermoplastic resin film that can be bonded by a heat press and has heat resistance required in a subsequent step such as a soldering step can be suitably used.

In each of the above embodiments, the conductive paste 50 containing silver alloy metal particles is used as the interlayer connection material. However, a conductive paste containing other metal particles may be used. Or the like may be used.

In each of the above embodiments, in the hot pressing step, the cushioning material 31 which is a flexible elastic member is used.
Although the pressure is applied while heating via the substrate, the pressure may be applied while heating via a jig or the like adapted to the shape in the thickness direction of the substrate.

In the second embodiment, only the conductor patterns 222a and 222b of the single-sided conductor pattern films 221a and 221b are formed in a stripe shape.
Four-layer substrate part 200a and three-layer substrate part 200b
As shown in FIG. 6A, another single-sided conductive film is also formed by forming a striped conductive pattern 322 on a resin film 323 and laminating the striped conductive patterns so as to intersect. There may be. In addition, as shown in FIG. 6B, a structure in which discontinuous stripe-shaped conductor patterns 322a are formed may be employed. According to these, the formation of the conductor pattern can be further shared, and the manufacturing cost can be further reduced.

Although the stripe-shaped conductor patterns are stacked so as to be orthogonal to each other, any other shape may be used as long as they are stacked so as to intersect.

In the third embodiment, the openings 343a, 343b, and 343d of the single-sided conductor pattern films 321a, 321b, and 321d are formed in the first region 34.
Although it is formed so as to partially extend to the second region 342 as well as in the first region, it may be formed only in the first region. However, in the third embodiment, even when a slight displacement occurs at the time of laminating each single-sided conductor pattern film, the three-layer structure substrate part 300b and the one-layer structure substrate part 30 can be used.
0c can be reliably formed.

In the third embodiment, the second region 342 of each single-sided conductor pattern film to be the discard plate portion 302 is provided on the entire periphery of the first region 341. However, the second region 342 is provided on the entire periphery. It is not necessary. Any structure may be used as long as a single-sided conductor pattern film from which a portion corresponding to a substrate region that does not have the maximum number of layers is appropriately removed can be stably laminated.

In each of the above embodiments, the printed board 100 is a board including one, two, and four layers, and the printed board 200 is a board including two, three, and four layers. Although the printed circuit board 300 is a board including one, three, and four layers, the number of layers is not limited as long as the printed board includes a part having different numbers of conductor patterns. Needless to say.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a schematic manufacturing process of a printed circuit board according to a first embodiment of the present invention.

FIG. 2 is a perspective view illustrating a schematic configuration of a printed circuit board according to a second embodiment of the present invention.

FIG. 3 is a plan view showing a connection relation of main parts according to a second embodiment of the present invention.

FIG. 4 is a plan view illustrating a schematic configuration of a single-sided conductive pattern film constituting a printed circuit board according to a third embodiment of the present invention.

FIG. 5 is a perspective view illustrating a schematic manufacturing process of a printed circuit board according to a third embodiment of the present invention.

FIG. 6 is a plan view showing an example of a conductor pattern according to another embodiment of the present invention.

[Explanation of symbols]

21, 221a, 221b, 321a, 321b, 32
1c, 321d Single-sided conductor pattern film 22, 222a, 222b Conductor pattern 23, 223a, 223b Resin film (insulating base material) 24, 224 Via hole (bottomed via hole, hole) 31 Buffer material (elastic member) 50 Conductive paste (interlayer connection) Materials) 100, 200, 300 Printed circuit board 301 Substrate section 302 Discard plate section 341 First area 342 Second area

Continuing from the front page (72) Inventor Kazuyoshi Nakamura 1-1-1, Showa-cho, Kariya-shi, Aichi Prefecture Inside Denso Co., Ltd. ) Inventor Koji Kondo 1-1-1, Showa-cho, Kariya-shi, Aichi F-term in DENSO Corporation (reference) 5E346 AA60 BB02 BB12 CC08 CC10 CC32 CC34 DD12 FF18 GG15 HH17 HH32

Claims (8)

[Claims] 1. A structure in which a plurality of conductor patterns (22) are laminated via an insulating base material (23), and the number of layers in which the conductor patterns (22) are laminated differs according to a substrate region. A printed circuit board, wherein the same thermoplastic resin is used for the insulating base material (23). 2. An insulating base material (223) between at least some of the layers of the plurality of conductor patterns (222a, 222b).
b) The interlayer connection material (5) in the hole (224) provided in
0), and at least some of the at least some of the plurality of electrically connected conductor pattern (222a, 222b) layers that are electrically connected are connected to at least some of the two adjacent conductor patterns (222a, 222a, 222a, 222b). 222
b) The layers are each formed of a striped conductor pattern (22).
2. The printed circuit board according to claim 1, wherein the printed circuit board is made of 2a, 222 b) and the stripe-shaped conductor patterns (222 a, 222 b) are arranged in a direction crossing each other. 3. An insulating substrate (23) made of the same thermoplastic resin having a conductor pattern (22) formed on its surface, so that the number of layers of the conductor pattern (22) becomes a desired number for each substrate region. A method of manufacturing a printed circuit board, comprising: 4. The single-sided conductor pattern in which the insulating substrate (23) is a resin film (23), and the conductor pattern (22) is formed only on one surface of the resin film (23) in the laminating step. The method according to claim 3, wherein the film (21) is laminated. 5. The single-sided conductor pattern film (321)
a, 321b, 321c, and 321d) correspond to the substrate section (30
(1) a first region (341), which is connected to the periphery of the first region (341),
And 2) a second region (342). In the laminating step, each substrate region (300a, 30
0b, 300c), the same number of the single-sided conductor pattern films (321a, 321b) as the number of layers of the conductor pattern (22) in the substrate region (300a) in which the number of layers of the conductor pattern (22) is the maximum. , 321c, 321
d) and before the laminating step, in the first region (341) of the single-sided conductor pattern film (321a, 321b, 321c, 321d), the number of layers of the conductor pattern (22) A portion corresponding to the substrate region (300b, 300c) in which the desired number is smaller than the maximum number is removed and the single-sided conductor pattern films (321a, 321b, 321c, 321d) are laminated in the laminating step. Substrate area (300a, 300b, 30
0c) of the single-sided conductor pattern film (321a, 3b)
21b, 321c, 321d) to remove the single-sided conductor pattern film so that the number of layers becomes the desired number; and, after forming the substrate (310), the first side of the single-sided conductor pattern film (321a, 321b, 321c, 321d). The method for manufacturing a printed circuit board according to claim 4, further comprising: removing a discarded plate portion (302) formed by the second region (342). 6. The conductor pattern (222a, 222a)
Among the layers of b), at least some of the adjacent layers of the two conductor patterns (222a, 222b) are stripe-shaped conductor patterns (222a, 222b), respectively, and the insulating base materials (223a, 223b). The semiconductor device is characterized in that the stripe-shaped conductor patterns (222a, 222b) are stacked so as to intersect, and have holes (224) filled with an interlayer connection material (50) at desired positions. A method of manufacturing a printed circuit board according to claim 3. 7. After laminating the insulating base material (23),
7. The printed circuit board manufacturing method according to claim 3, wherein the insulating substrates are bonded to each other by applying pressure and heating from both sides of the substrate. Method. 8. The method for manufacturing a printed circuit board according to claim 7, wherein when the insulating substrates are bonded to each other, heating is performed while applying pressure through an elastic member.