JP2006319071A - Method for manufacturing multi-layer circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer circuit board, suppressing the deformation of a conductor pattern and the displacement of mutual positions, also suppressing inter-layer separation in an outer periphery, manufacturing with high yield the multi-layer circuit board by heating the lamination body of resin films including a thermoplastic resin where the conductor pattern is formed, performing bonding by pressurization, segmenting a prescribed area from a bonded body to obtain the multi-layer circuit board. <P>SOLUTION: In the multi-layer circuit board manufacturing method, a space ks for segmenting is arranged in the respective resin films 10a-10f which constitute the lamination body by enclosing the prescribed area. When heating and pressurizing are performed by thermal press boards Pa, Pb, a frame shape pressurizing board 20 to be abutted in the space ks for segmenting is held between the thermal press boards Pa, Pb and the lamination body, and pressed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In the present invention, a plurality of resin films made of a thermoplastic resin having a conductor pattern formed thereon are laminated, and the laminated film is heated and pressed to bond the resin films to each other, and a predetermined region is cut out from the bonded body. The present invention relates to a method for manufacturing a multilayer circuit board.

  As a method for producing a multilayer circuit board, a method of laminating resin films on which conductor patterns are formed and pressurizing them while heating them is known. Thereby, a plurality of resin films can be bonded together to manufacture a multilayer circuit board. Also, a press method for heating and pressurizing a laminate of resin films using a hot press plate, which is used in the method for manufacturing a multilayer circuit board, is disclosed in Japanese Patent Application Laid-Open No. 2003-273511 (Patent Document 1). .

According to the press method disclosed in Patent Document 1, a pressing member (buffer material) having a buffering effect is provided between a laminated body of a resin film on which a hot press plate and a conductor pattern are formed during heating and pressurization. Intervene. Accordingly, it is possible to cancel the thickness distribution of the multilayer body due to the presence of the conductor pattern and apply a uniform pressure to the whole. For this reason, the mutual position shift of the conductor pattern currently formed in each resin film can be suppressed, and a product yield can be raised.
JP 2003-273511 A

  In the production of multilayer circuit boards, in recent years, the thickness distribution of the laminate due to the presence of the conductor pattern tends to increase with the increase in the number of laminated resin films, and the thickness distribution cannot be covered only with the cushioning material. ing. For example, in the case of manufacturing a multilayer circuit board by laminating 25 resin films having conductor patterns formed using 12 μm copper foil, a thickness distribution of 12 × 25 = 300 μm at the maximum at each position of the laminate. Occurs.

  In particular, when the product is small and a predetermined area is cut out from the resin film adhesive to take a large number of multilayer circuit boards, the maximum thickness distribution is generally generated in the cutting space. This is because the conductor pattern is not usually formed in the space for cutting so that the end mill blade used for cutting is difficult to break. Further, the space for cutting is set to a narrow width so as to cut out as many multilayer circuit boards as possible from one adhesive body, and surrounds a predetermined region to be a multilayer circuit board. For this reason, it is difficult for the cushioning material to go around and it is difficult to apply a uniform pressure to the entire laminate. Therefore, in a multilayer circuit board manufactured by cutting out from a multi-layered adhesive body as described above, deformation of the conductor pattern and mutual positional deviation are likely to occur. In addition, since sufficient pressure is not applied around the cutout space, delamination is likely to occur in the cutout space that is the outer peripheral portion of the multilayer circuit board. As a result, in the production of a multi-layer circuit board in which a large number of multi-layers are obtained, the product yield is low.

  Accordingly, the present invention provides a multilayer circuit board manufacturing method in which a laminate of a resin film made of a thermoplastic resin having a conductor pattern formed thereon is bonded by heating and pressing, and a predetermined region is cut out from the adhesive body to form a multilayer circuit board. Thus, it is an object of the present invention to provide a method for manufacturing a multilayer circuit board that is difficult to cause deformation of the conductor pattern and mutual positional deviation, can suppress delamination at the outer peripheral portion, and can be manufactured with a high yield.

  The invention according to claim 1 is a method of laminating a plurality of resin films made of a thermoplastic resin on which a conductor pattern is formed, and pressurizing the laminate of the plurality of resin films while being heated by a hot press plate. A method for manufacturing a multilayer circuit board, in which the resin films are bonded to each other, and a predetermined region is cut out from an adhesive body of the plurality of resin films bonded to each other to form a multilayer circuit board. A space surrounds the predetermined area and is provided in each resin film constituting the laminate, and when the heat press plate is heated and pressed by the hot press plate, the cutout is performed between the hot press plate and the laminate. It presses by interposing the frame-shaped press board which contact | abuts in the space for an object.

  In the manufacturing method described above, generally, a conductor pattern is not formed, and a maximum thickness distribution is generated around a space for cutting. To do. The frame-shaped pressing plate appropriately sets the width of the frame to be equal to or less than the space width for cutting, even for a cutting space set to a thin width in order to cut out as many multilayer circuit boards as possible from one adhesive body. Thus, it can be brought into contact with the space for cutting. By pressing the space for cutting with this frame-shaped pressing plate, it is possible to suppress the flow of the resin plasticized by heat in the predetermined region surrounded by the space for cutting during heating and pressurization. it can. As a result, it is possible to suppress deformation of the conductor pattern in the predetermined region and mutual positional deviation. Therefore, it is possible to cope with the production of a multilayer circuit board on which a finer conductor pattern is formed. Moreover, since sufficient pressure can be applied to the space for cutting, the occurrence of delamination can be suppressed in the space for cutting that is the outer peripheral portion of the multilayer circuit board. As a result, the yield of the product can be increased in the method for manufacturing the multilayer circuit board.

  As described above, the method for manufacturing the multilayer circuit board is such that a laminate of a resin film made of a thermoplastic resin on which a conductor pattern is formed is bonded by heating and pressing, and a predetermined region is cut out from the bonded body. A method of manufacturing a multilayer circuit board as a circuit board, wherein the conductor pattern is hardly deformed or misaligned with each other, can prevent delamination at the outer periphery, and can be manufactured with a high yield. It can be.

  As described in claim 2 or 3, in the method for manufacturing a multilayer circuit board, the conductor pattern is not formed in the space for cutting, or is laminated on the outermost layer on both sides of the laminate. It is preferable not to form the conductor pattern in the space for cutting, except for a single resin film.

  As a result, there is no hard conductor pattern in the cutting space, so even if the end mill blade used for cutting corresponds to the cutting space set to a narrow width, the blade is difficult to break, It is possible to achieve both the reduction of the space and the extension of the end mill blade life.

  According to a fourth aspect of the present invention, in the method for manufacturing the multilayer circuit board, the thickness of the frame-shaped pressing plate is set to a thickness equal to or less than the sum of the conductor pattern thicknesses formed on the plurality of resin films. It is preferable to set.

  The thickness of the frame-shaped pressing plate compensates for the lack of thickness of the space for cutting due to the absence of the conductor pattern, and makes the space for cutting and the thickness distribution around it uniform when heating and pressing. Can do. Further, by setting the thickness of the frame-shaped pressing plate to a thickness equal to or less than the sum of the conductor pattern thicknesses, it is possible to prevent application of excessive pressure to the space for cutting. As a result, the space for cutting and the surrounding area can be pressed with a suitable pressure distribution, the deformation of the conductor pattern and the mutual displacement can be suppressed, and delamination at the outer peripheral portion of the multilayer circuit board can be suppressed. can do.

  As described in claims 5 and 6, in the method for manufacturing a multilayer circuit board, it is preferable that the frame-shaped pressing plate is made of a heat-resistant metal such as stainless steel that has heat resistance against heating and pressing. .

  As described in claim 7, it is preferable to use an end mill for the cutting. Cutting out the multilayer circuit board from the bonded body using an end mill is low in cost and can cope with the space for cutting set to a narrow width.

  In order to press the space for cutting and its periphery uniformly, as described in claim 8, when heating and pressurizing by the hot press plate, a buffering effect is provided between the hot press plate and the frame-like press plate. It is preferable to press with a pressing member having

  In addition, in a multilayer circuit board that requires smoothness of the surface, a smooth surface between the hot press plate and the frame-shaped press plate when heated and pressed by the hot press plate as described in claim 9. It is preferable to press the steel plate with a smooth plate such as a steel plate. In this case, deformation of the frame-shaped pressing plate during heating / pressurization can be suppressed, and the frame-shaped pressing plate can be used repeatedly.

  According to a tenth aspect of the present invention, in the method for manufacturing a multilayer circuit board, the thickness distribution at the time of lamination depending on the presence or absence of a conductor pattern becomes remarkable, the number of laminations of the resin film is 20 or more, It is suitable for manufacturing a multilayer circuit board.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  The method for producing a multilayer circuit board according to the present invention includes laminating a plurality of resin films on which conductor patterns are formed, and bonding the resin films to each other by applying pressure while heating the laminated body. In this manufacturing method, a region is cut out to form a multilayer circuit board.

  FIG. 1 is a schematic perspective view showing six laminated resin films 10a to 10f arranged side by side in the method for manufacturing a multilayer circuit board. In the following description, the lamination of the six resin films 10a to 10f in FIG. 1 will be described as an example. However, the number of laminations of the resin films is not limited to this and may be any plural number of laminations. . In the production of multilayer circuit boards in recent years, the number of laminated resin films tends to increase, and multilayer circuit boards having 20 or more laminated resin films have been produced.

  Each of the six resin films 10a to 10f shown in FIG. 1 is made of a thermoplastic resin film 1 such as a liquid crystal polymer, and conductor patterns 2a and 2b made of copper foil shown by hatching are formed on the thermoplastic resin film 1. Is formed. A reference through hole kh for alignment is formed in the conductor pattern 2b on the outer periphery of the resin films 10a to 10f.

  The laminate of the six resin films 10a to 10f shown in FIG. 1 is heated and pressurized, and the resin films 10a to 10f made of a thermoplastic resin are bonded to each other. Next, nine regions surrounded by dotted lines in the figure are cut out from the adhesive bodies of the resin films 10a to 10f with an end mill or the like to manufacture multilayer circuit boards t1 to t9. For this reason, each resin film 10a-10f which comprises a laminated body surrounds the predetermined area | region used as the multilayer circuit boards t1-t9, and the space ks for cutting out is provided. In each of the resin films 10a to 10f shown in FIG. 1, a region between the predetermined regions surrounded by dotted lines in the drawing, which is the conductor pattern 2b on the outer periphery and the multilayer circuit boards t1 to t9, is a cutting space ks. It corresponds to.

  The cut-out space ks is an empty space where the conductor patterns 2a and 2b provided for cutting out the multilayer circuit boards t1 to t9 are not formed, and has the same position and size over the six resin films 10a to 10f. Set by. The cut-out space ks is set to a narrow width ws so as to cut out as many multilayer circuit boards t1 to t9 as possible from the adhesive body of the resin films 10a to 10f, and surrounds a predetermined area to be the multilayer circuit boards t1 to t9. Yes.

  It is preferable to use an end mill for the cutting, and the cutting of the multilayer circuit boards t1 to t9 from the adhesive body of the resin films 10a to 10f using the end mill is low-cost and the space for cutting set to a narrow width ws. ks can also be handled. In addition, as described above, the conductor patterns 2a and 2b are not formed in the cutout space ks, or cut out except for the two resin films 10a and 10f stacked on the outermost layers on both sides of the laminate. It is preferable not to form the conductor patterns 2a and 2b in the space ks. In this case, since there is no hard conductor pattern 2a, 2b in the cutting space ks, even if the end mill blade used for cutting is thin corresponding to the cutting space ks set to the narrow width ws. The blade is difficult to break, and the reduction of the cutting space ks and the extension of the end mill blade life can be achieved at the same time.

  On the other hand, since the conductor patterns 2a and 2b are not formed in the cutting space ks as described above, the laminate of the resin films 10a to 10f shown in FIG. 1 has the maximum thickness around the cutting space ks. Distribution occurs. The thickness distribution around the cut-out space ks becomes more prominent as the number of laminated resin films increases. For example, in the case of manufacturing a multilayer circuit board by laminating 25 resin films in which conductor patterns 2a and 2b are formed using a 12 μm copper foil, 12 × 25 = 300 μm at the maximum in each position of the laminate. A thickness distribution occurs.

  FIG. 2A is a schematic top view of one resin film 10 representing each of the resin films 10a to 10f in FIG. FIG. 2B is a top view of the frame-shaped pressing plate 20 that contacts the space ks for cutting out the resin film 10 in FIG. Moreover, FIG. 3 is typical sectional drawing which shows the laminated body of resin film 10a-10f at the time of a heating and pressurization, and arrangement | positioning of each pressurization member. In FIG. 1, for the sake of simplicity, all the resin films 10a to 10f are laminated with the surfaces on which the conductor patterns 2a and 2b are formed facing forward, but in the manufacture of an actual multilayer circuit board, As shown in FIG. 3, some resin films 10d to 10f are inverted and laminated. Each of the resin films 10a to 10f is formed with a bottomed hole having the conductor pattern 2a as a bottom, and is filled with a conductive paste 3 serving as a connection conductor.

  As shown in FIG. 3, in the method for manufacturing a multilayer circuit board according to the present invention, when the laminated body of resin films 10a to 10f is heated and pressed by the hot press plates Pa and Pb, the hot press plates Pa and Pb and the resin are used. It is characterized in that it is pressed by interposing a frame-shaped pressing plate 20 in contact with the cutout space ks between the laminates of the films 10a to 10f. The frame-shaped pressing plate 20 is made of a heat-resistant metal such as stainless steel that has heat resistance against heating and pressurization.

  Further, in the arrangement of FIG. 3, adhesion preventing films 40 a and 40 b made of a polyimide film or the like are arranged on both sides of the laminate of the resin films 10 a to 10 f. Further, for example, pressing members 30a and 30b having a cushioning effect formed by molding a fibrous metal such as stainless steel are provided between the hot press plate Pa and the frame-like press plate 20 at the upper side and the hot press plate Pb and the adhesion preventing film at the lower side. 40b. The laminated body of the resin films 10a to 10f can be uniformly pressed as a whole by the pressing members 30a and 30b having a buffering effect, including the frame-shaped pressing plate 20 in contact with the cutting space ks.

  In the press according to the arrangement shown in FIG. 3, generally, the conductor patterns 2a and 2b are not formed, and therefore a frame-shaped pressing plate that abuts in the cutting space ks around the cutting space ks where the maximum thickness distribution occurs. No. 20 is pressed while heating. In order to cut out as many multilayer circuit boards as possible from one adhesive body, the frame-shaped pressing plate 20 is also used for the cutting space ks set to the thin width ws shown in FIG. By appropriately setting the width wo of the frame shown in b) to be equal to or smaller than the space width ws for cutting, the frame can be brought into contact with the space ks for cutting.

  By pressing the space ks for cutting with the frame-shaped pressing plate 20, the flow of the resin 1 plasticized by heat in the predetermined region surrounded by the space ks for cutting is suppressed during heating and pressurization. can do. Thereby, the deformation | transformation of the conductor pattern 2a in a predetermined area | region and mutual position shift can be suppressed. Therefore, it is possible to cope with the production of a multilayer circuit board on which a finer conductor pattern is formed. In addition, since a sufficient pressure can be applied to the cutting space ks, it is possible to suppress the occurrence of delamination in the cutting space ks that is the outer peripheral portion of the multilayer circuit boards t1 to t9. As a result, the yield of the product can be increased in the method for manufacturing the multilayer circuit board.

  The thickness t of the frame-shaped pressing plate 20 shown in FIG. 3 is preferably set to a thickness equal to or less than the sum of the conductor pattern thicknesses formed on the six resin films 10a to 10f.

  The thickness t of the frame-shaped pressing plate 20 compensates for the insufficient thickness of the cutting space ks due to the fact that the conductor patterns 2a and 2b are not formed. The thickness distribution can be made uniform. Further, by setting the thickness t of the frame-shaped pressing plate 20 to a thickness that is equal to or less than the sum of the conductor pattern thicknesses, it is possible to prevent excessive pressure application to the cutting space ks. As a result, the cutting space ks and its surroundings can be pressed with a suitable pressure distribution, deformation of the conductor patterns 2a and 2b and mutual displacement can be suppressed, and at the outer peripheral portion of the multilayer circuit board. Delamination can be suppressed.

  FIG. 4 is a schematic cross-sectional view showing another arrangement of the laminates of the resin films 10a to 10f and the pressure members at the time of heating and pressing.

  In the arrangement of FIG. 3, a press member 30 a having a buffering effect is interposed between the upper hot press plate Pa and the frame-like press plate 20. On the other hand, in the arrangement of FIG. 4, a smooth plate 50 such as a steel plate having a smooth surface is interposed between the upper hot press plate Pa and the frame-shaped press plate 20. The heating press using the arrangement shown in FIG. 4 is suitable for manufacturing a multilayer circuit board that requires surface smoothness. In this case, the deformation of the frame-shaped pressing plate 20 during heating and pressurization can be suppressed, and the frame-shaped pressing plate 20 can be used repeatedly. In addition, in the heat press using the arrangement of FIG. 4, it is possible to suppress the deformation of the conductor patterns 2a and 2b and mutual positional deviation and to suppress delamination at the outer peripheral portion of the multilayer circuit board. Needless to say.

  As described above, in the above-described method for manufacturing a multilayer circuit board, the laminate of the resin film made of the thermoplastic resin 1 on which the conductor patterns 2a and 2b are formed is bonded by heating and pressurizing, and a predetermined amount is applied from the adhesive. A method for manufacturing a multilayer circuit board by cutting out a region to form a multilayer circuit board, in which deformation of the conductor patterns 2a and 2b and mutual positional deviation hardly occur, delamination at the outer peripheral portion can be suppressed, and high yield This is a method for manufacturing a multilayer circuit board that can be manufactured.

In the manufacturing method of the multilayer circuit board of the present invention, it is the typical perspective view showing resin films 10a-10f laminated side by side. FIG. 2A is a schematic top view of a single resin film 10 representing each resin film of FIG. 1. (B) is a top view of the frame-shaped pressing plate 20 which contacts the space ks for cutting out the resin film 10 of (a). It is typical sectional drawing which shows arrangement | positioning of the laminated body of resin film 10a-10f at the time of a heating and pressurization, and each pressurization member. It is typical sectional drawing which shows another arrangement | positioning of the laminated body of resin film 10a-10f at the time of a heating and pressurization, and each pressurization member.

Explanation of symbols

10, 10a to 10f Resin film t1 to t9 Multilayer circuit board ks Space for cutting 1 Thermoplastic resin film 2a, 2b Conductor pattern 3 Conductive paste 20 Frame-shaped press plate Pa, Pb Hot press plate 30a, 30b Press with buffer effect Member 40a, 40b adhesion prevention film 50 smooth plate

Claims (10)

Laminating a plurality of resin films made of thermoplastic resin on which a conductor pattern is formed,
By applying pressure while heating the laminate of the plurality of resin films with a hot press plate, the resin films are bonded to each other,
A method for producing a multilayer circuit board, wherein a predetermined region is cut out from an adhesive body of a plurality of resin films adhered to each other to form a multilayer circuit board,
The cutout space surrounds the predetermined area and is provided in each resin film constituting the laminate,
A multilayer circuit board comprising: a frame-shaped pressing plate that is in contact with the cut-out space between the hot pressing plate and the laminate when being heated and pressed by the hot pressing plate. Manufacturing method.   The method for manufacturing a multilayer circuit board according to claim 1, wherein the conductor pattern is not formed in the space for cutting.   2. The multilayer circuit board according to claim 1, wherein the conductor pattern is not formed in the space for cutting, except for two resin films laminated on outermost layers on both sides of the laminate. Method.   The thickness of the frame-shaped pressing plate is set to a thickness equal to or less than the sum of the thicknesses of the conductor patterns formed on the plurality of resin films, according to any one of claims 1 to 3. The manufacturing method of the multilayer circuit board as described.   The method for manufacturing a multilayer circuit board according to claim 1, wherein the frame-shaped pressing plate is made of a heat-resistant metal.   6. The method for manufacturing a multilayer circuit board according to claim 5, wherein the refractory metal is stainless steel.   The multi-layer circuit board manufacturing method according to claim 1, wherein an end mill is used for the cutting.   8. The press according to claim 1, wherein a press member having a buffering effect is interposed between the hot press plate and the frame-shaped press plate when heating and pressurizing by the hot press plate. 9. A method for producing a multilayer circuit board according to one item.   8. The method according to any one of claims 1 to 7, wherein when the hot press plate is heated and pressed, a smooth plate having a smooth surface is interposed between the hot press plate and the frame-shaped press plate. The manufacturing method of the multilayer circuit board as described in a term.   The method for producing a multilayer circuit board according to claim 1, wherein the number of laminated resin films is 20 or more.

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