JP3838119B2 - Manufacturing method of multilayer printed wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a multilayer printed wiring board, which is performed by laminating a plurality of circuit boards through a prepreg.
[0002]
[Prior art]
For example, the multilayer printed wiring board is manufactured as shown in FIG. That is, a circuit is formed by using a plurality of inner-layer circuit boards 1 having a circuit formed on the surface and stacking a plurality of circuit boards 1 with a prepreg 2 sandwiched between adjacent circuit boards 1 as shown in FIG. A combination 3 composed of the plate 1 and the prepreg 2 is produced, and a metal foil 10 for forming an outer layer circuit is stacked on the outside of the combination 3 via the prepreg 2 as necessary. Then, the plurality of combinations 3 are stacked in multiple stages via the forming plate 4 and placed between the upper and lower heating plates 5 as shown in FIG. A multilayer printed wiring board as shown in FIG. 4 (c) in which a plurality of circuit boards 1 and metal foils 10 are laminated and integrated with an insulating adhesive layer 6 formed by melt-curing the resin 2 can be obtained. It is.
[0003]
In the multilayer printed wiring board manufactured as described above, a plurality of layers of circuits are formed by the plurality of circuit boards 1, and each of these circuits is conductively connected by through holes, via holes, or the like. ing. Therefore, if the circuit boards 1 are displaced from each other during the period from the completion of the heat and pressure molding to the lamination integration after the plurality of circuit boards 1 are stacked through the prepreg 2 to produce the combination 3. Since the circuit position may be shifted and a poor conductive connection may occur, the circuit boards 1 are prevented from being displaced from each other, and the respective circuits are accurately aligned with each other. It is necessary to make it.
[0004]
Therefore, in the combination 3 in which a plurality of circuit boards 1 are stacked via the prepreg 2, as shown in FIG. 5 (a), each of the two opposite sides is locally applied from above and below by the thermocompression bonding head 11. By applying heat and pressure, the resin of the prepreg 2 is locally heat-welded to the circuit board 1, and the circuit boards 1 are coupled to each other via the prepreg 2 by the welding locations. Thus, by connecting each circuit board 1 in the combination 3 via the prepreg 2, the circuit boards 1 are displaced from each other when the combination 3 is stacked in multiple stages and is heated and pressed. It is possible to prevent this from occurring, and it is possible to laminate and integrate by heating and pressing in a state where the circuits of the circuit boards 1 are accurately aligned with each other in the combination 3.
[0005]
Here, FIG. 7 shows the welding location in the conventional combination 3, and when welding at a plurality of locations along the edge on each of two opposite sides of the combination 3 formed in a rectangle, These sides are welded at three locations of equally spaced a1, a2, and a3, and the other side is welded at three locations of equally spaced b1, b2, and b3.
[0006]
[Problems to be solved by the invention]
Then, the combination 3 of the circuit board 1 and the prepreg 2 which are welded and joined at the welding locations as shown in FIG. 7 are stacked in multiple stages via the molding plate 4, and this is combined with the upper and lower heating plates 5 as shown in FIG. In the heat and pressure molding, the two welded points a1, a2, a3 and b1, b2, b3 of each stacked product 3 overlap each other in the vertical direction at the same position in all the combined products 3. become.
[0007]
However, in the combination 3, the welding location is locally heated and pressurized by the thermocompression bonding head 11 from above and below, so that the welding location becomes concave as shown in FIG. (FIG. 5 (b) exaggeratedly shows the concave portion of the welded portion). Therefore, when stacking the combinations 3 in multiple stages, if the welding locations on the two sides of each combination 3 overlap each other in the same position in all combinations 3, the total of the combinations 3 stacked in multiple stages in the vertical direction As for the thickness, the difference between the portion where the welded portions overlap vertically and the other portion becomes large. For this reason, the pressure applied when heating and pressing between the hot plates 5 is non-uniform, the thickness of the multilayer printed wiring board obtained by lamination molding becomes non-uniform, and the laminated product 3 is laminated. There is a problem in that there is a risk of forming defects such as wrinkles occurring in the outer layer metal foil 10.
[0008]
The present invention has been made in view of the above points, and provides a method for manufacturing a multilayer printed wiring board that can form a multi-layer stacked combination with uniform pressure and reduce molding defects. It is for the purpose.
[0009]
[Means for Solving the Problems]
In the method for manufacturing a multilayer printed wiring board according to claim 1 of the present invention, a plurality of circuit boards 1 are overlapped via a prepreg 2, and each side of two opposite sides of the combination 3 of the circuit board 1 and the prepreg 2 is opposed. By locally heating and pressing at a plurality of locations along the edge, the resin of the prepreg 2 is partially welded to the circuit board 1 and the circuit board 1 is coupled via the prepreg 2, and this coupled circuit board A plurality of combinations 3 of the prepreg 2 and the prepreg 2 are stacked in multiple stages through the molding plate 4 and formed by heating and pressing between the hot plates 5 to form a plurality of sheets via the insulating adhesive layer 6 of the prepreg 2. in producing the multilayer printed wiring board was laminated and integrated circuit board 1, of the bonded portion forming a pair in correspondence with each other of the two opposite sides of the combination product, position facing each other at least a pair of bonded portion Shifted in the direction along the edge thermally welded from the combination was 3 to be stacked next to each other vertically, at least one location does not correspond to the vertical offset in the edge direction in the bonded portion of each side of the two sides The combination 3 is stacked in multiple stages so as to be positioned.
[0011]
The invention of claim 2 is that in claim 1 , when the combinations 3 are stacked in multiple stages via the molding plate 4, the adjacent combinations 3 in the vertical direction are stacked in multiple stages in an inverted state. It is characterized by.
[0012]
Further, the invention of claim 3 is the invention according to claim 1 or 2, wherein a plurality of combinations 3 are arranged side by side, and a plurality of combination sets 7 in which the combinations 3 are arranged side by side are arranged in multiple stages via the molding plate 4. At the time of stacking, in the combination set 7 that is stacked next to each other vertically, at least one position among the welding positions of the mutually opposing sides of the horizontally adjacent combination 3 is shifted in the edge direction and does not correspond to the top and bottom Thus, the combination set 7 is stacked in multiple stages.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below.
[0014]
As the circuit board 1 in the present invention, any circuit board used as an inner layer circuit board or the like can be used. That is, a base material such as a glass cloth is impregnated with a thermosetting resin varnish such as an epoxy resin and dried by heating, and a plurality of the prepregs are stacked and a metal foil such as a copper foil is stacked on the outside. A metal foil-clad laminate can be produced by heat-pressing this, and a product produced by forming a circuit by etching the metal foil of the metal foil-clad laminate can be used.
[0015]
Further, as the prepreg 2, any one used for multilayer molding or the like can be used. That is, use what was manufactured by impregnating a base material such as glass cloth with a thermosetting resin varnish such as an epoxy resin, and drying and heating the impregnated thermosetting resin into a semi-cured state. Can do.
[0016]
The plurality of circuit boards 1 are used as the inner layer material, the plurality of circuit boards 1 are overlapped via the prepreg 2, and the two opposite sides of the combination 3 of the circuit board 1 and the prepreg 2 are described above. As shown in FIG. 5A, the resin of the prepreg 2 is locally heat-welded to the circuit board 1 by locally applying heat and pressure from above and below with the thermocompression bonding head 11, and each circuit board 1 through the prepreg 2. The combination 3 which couple | bonded can be obtained.
[0017]
Here, the above-mentioned welding is performed at a plurality of locations along the edge on each of two opposing sides of the combination 3 formed in a rectangle (including a square), as shown in FIG. In the embodiment, of the two sides of the combination 3, one side has a position offset toward one side (the lower side in the figure), and welding locations are set at three locations a1, a2, and a3 that are equally spaced. At the same time, the other one side is set at three positions of b1, b2, and b3 at equal intervals at a position shifted to the other side (upper side in the figure). As described above, in the combination 3 in FIG. 1A, the welding locations a1 and b1, a2 and b2, and a3 and b3, which form a pair corresponding to each other on the two opposing sides, are all from the positions facing each other. It is formed at a position shifted in the direction along the edge.
[0018]
FIG. 1 (b) shows the combination 3 of FIG. 1 (a) turned upside down and inverted. By reversing up and down in this way, there are welded locations at three positions b1, b2, and b3 at equal intervals on one side of the two opposite sides of the combination 3 at a position offset to the upper side of the figure. In addition, on the other side, there are three welding locations a1, a2 and a3 at equal intervals at a position shifted to the lower side of the figure.
[0019]
Then, if necessary, a metal for forming an outer layer circuit is provided on the outside of the combination 3 in which the circuit board 1 and the prepreg 2 are overlapped and locally welded as described above, with the prepreg 2 interposed as shown in FIG. After the foils 10 are stacked, a plurality of the combinations 3 are stacked in multiple stages via the forming plate 4 and are arranged between the upper and lower heating plates 5 as shown in FIG. Thus, a multilayer printed wiring board as shown in FIG. 4C in which a plurality of circuit boards 1 and metal foils 10 are laminated and integrated with an insulating adhesive layer 6 formed by melt-curing the resin of the prepreg 2 is obtained. It is something that can be done.
[0020]
Here, when stacking a plurality of combinations 3 as shown in FIG. 4 (b), the combination 3 in which the positions of the welding locations are set as shown in FIG. Combinations 3 whose arrangement is as shown in FIG. 1B are alternately stacked. When the combination 3 in FIG. 1 (a) and the combination 3 in FIG. 1 (b) are alternately stacked to be stacked in multiple stages as shown in FIG. 1 (c) (FIG. 1 (c) 2 shows only two combinations 3 that are adjacent to each other in the vertical direction), and one of the two sides of the combination 3 that is adjacent in the vertical direction is welded a1 of the upper combination 3 on one side. The welding locations b1, b2, and b3 of a2, a3 and the lower combination 3 are shifted in the direction of the edge of the combination 3, respectively, and the welding locations b1, b2, b3 of the upper combination 3 on the other side. The welded locations a1, a2, and a3 of the lower combination 3 are shifted in the direction of the edge of the combined product 3, and any of the welded locations on each side of the two sides is shifted in the direction of the edge and coincides vertically. It is something that can be avoided.
[0021]
Therefore, when the combination 3 of the circuit board 1 and the prepreg 2 is stacked in multiple stages and heated and pressed as shown in FIG. 4B, all the welding locations on the two sides of each stacked combination 3 are all combined. The thing 3 does not overlap in the vertical direction at the same position. For this reason, when stacking the combination 3 in multiple stages, the total thickness in the vertical direction of the combination 3 stacked in multiple stages does not increase the difference between the portion where the welded portions overlap vertically and the other portions. As a result, it is possible to make the pressure applied in the heat press molding between the heating plates 5 uniform, and the thickness of the multilayer printed wiring board obtained by lamination molding can be reduced. In addition to being uniform, it is possible to prevent the outer metal foil 10 laminated on the combination 3 from being wrinkled and to reduce the occurrence of molding defects.
[0022]
In the embodiment shown in FIG. 2 (a), among the two sides of the combination 3, the welding locations are set at three locations a1, a2 and a3 on one side, and the interval between the welding locations a1 and a2 is widened. In other side, the welding locations are set at three locations b1, b2 and b3, and the interval between the welding locations b2 and b3 is set wide. As described above, in the combination 3 in FIG. 2A, among the welding locations a1 and b1, a2 and b2, and a3 and b3 that form a pair corresponding to each other on two opposite sides, a1 and b1, a3 and b3. Are formed at positions facing each other, but a2 and b2 are formed at positions shifted from the positions facing each other in the direction along the edge.
[0023]
FIG. 2B shows the combination 3 of FIG. 2A turned upside down and inverted. By reversing up and down in this way, among the two sides of the combination 3, there are three locations of b 1, b 2 and b 3 on one side, and the weld locations of b 2 and b 3 are formed with a wide interval. As a result, there are three welding locations a1, a2 and a3 on the other side, and the interval between the welding locations a1 and a2 is wide.
[0024]
Then, when stacking a plurality of combinations 3 as shown in FIG. 4B, the arrangement of the welding locations is the combination 3 of FIG. The combination 3 as shown in FIG. When the combination 3 in FIG. 2 (a) and the combination 3 in FIG. 2 (b) are alternately stacked to be stacked in multiple stages, as shown in FIG. 2 (c) (FIG. 2 (c) 2 shows only two combinations 3 that are adjacent to each other in the vertical direction), and one of the two sides of the combination 3 that is adjacent in the vertical direction is welded a1 of the upper combination 3 on one side. The welding locations b1 and b3 of a3 and the lower combination 3 are aligned vertically, but the welding location a2 of the upper combination 3 and the welding location b2 of the lower combination 3 are shifted in the direction of the edge of the combination 3. On the other side, the welding locations b1 and b3 of the upper combination 3 and the welding locations a1 and a3 of the lower combination 3 are aligned vertically, but the welding location b2 of the upper combination 3 and the lower The welding location a2 of the combination 3 is shifted in the direction of the edge of the combination 3. Cage, bonded portion of each side of the two sides are those respectively can be prevented coincident vertically displaced in the edge direction by one position.
[0025]
Therefore, when the combination 3 of the circuit board 1 and the prepreg 2 is stacked in multiple stages and heated and pressed as shown in FIG. 4 (b), all the welding locations on the two sides of each stacked combination 3 are combined. The thing 3 does not overlap in the vertical direction at the same position. For this reason, when stacking the combination 3 in multiple stages, the total thickness in the vertical direction of the combination 3 stacked in multiple stages does not increase the difference between the portion where the welded portions overlap vertically and the other portions. As a result, it is possible to make the pressure applied in the heat press molding between the heating plates 5 uniform, and the thickness of the multilayer printed wiring board obtained by lamination molding can be reduced. In addition to being uniform, it is possible to prevent the outer metal foil 10 laminated on the combination 3 from being wrinkled and to reduce the occurrence of molding defects.
[0026]
FIG. 3 shows another embodiment of the present invention. In other words, a plurality of combinations 3 of the circuit board 1 and the prepreg 2 as shown in FIGS. 1 and 2 are arranged side by side in a row and used as a set of combination sets 7.
[0027]
Then, as shown in FIG. 6, a metal foil 10 is stacked on the upper and lower sides of the combination set 7 composed of the plurality of combinations 3 via the prepreg 2 as necessary, and this combination set 7 is combined with FIG. In the same manner, the insulating adhesive layer 3 is formed by stacking a plurality of layers through the molding plate 4 and arranging them between the upper and lower heating plates 5 and performing heat and pressure molding to melt and cure the resin of the prepreg 2. 4C in which a plurality of circuit boards 1 and metal foils 10 are laminated and integrated, a plurality of printed circuit boards 1 at each stage between the forming plates 4 can be obtained. Since the combination 3 can be simultaneously molded, the molding can be performed with high productivity.
[0028]
Here, as the combination 3, for example, as shown in FIG. 7 described above, the two opposite sides are welded at a1, a2, a3 and b1, b2, b3 at equal intervals. When a plurality of the combinations 3 are arranged side by side and used as a combination set 7 as shown in FIG. 8, the combination sets 7 are stacked in multiple stages via the forming plate 4 and are combined as shown in FIG. 4 (b). In the heating and pressure forming between the upper and lower heating plates 5, in each of the stacked combination sets 7, the respective combinations 3 corresponding to the upper and lower sides are welded at the same position in all the combined products 3 on the two sides. It will overlap in the vertical direction. Accordingly, as in the case described above, in the combination set 7 stacked in multiple stages, the total thickness in the vertical direction of the combination 3 corresponding to the top and bottom is the difference between the portion where the welded portions overlap vertically and the other portions. , Which may cause molding defects.
[0029]
Therefore, in the embodiment of FIG. 3 (a), when producing the combination set 7 by arranging the three combinations 3 side by side, the leftmost combination 3 is used as one of the two opposite sides. Welding points are provided at three equally spaced a1, a2, and a3 locations, and the other one is provided with welding locations at three locations b1, b2, and b3 and a wide interval between the welding locations of b1, b2 is used. As the center combination 3, the welded portions are provided at three locations c1, c2 and c3 on one side of the two opposing sides, and the interval between the welded locations of c1 and c2 is widened. Three welds are provided at three locations, d1, d2, and d3, and a wide interval between the weld locations of d2 and d3 is used. As a right end combination 3, three locations of e1, e2, and e3 are provided on one side. The spacing of the bonded portion of e2, e3 provided with a bonded portion widely formed, are to use a thing in which a bonded portion into three locations equally spaced f1, f2, f3 in other side. FIG. 3B shows the combination set 7 of FIG. 3A turned upside down and inverted.
[0030]
Then, when stacking a plurality of combination sets 7 as shown in FIG. 4 (b), the arrangement of the welding locations is the combination set 7 of FIG. The combination set 7 as shown in (b) is alternately stacked. When the combination set 7 in FIG. 3 (a) and the combination set 7 in FIG. 3 (b) are alternately stacked and stacked in multiple stages as shown in FIG. c) shows only two combinations set 7 that are adjacent to each other in the upper and lower directions), and one of the two sides of the combination 3 at the left end that overlaps the upper and lower sides is one of the upper combination 3. The weld locations a1, a2, and a3 and the weld locations f1, f2, and f3 of the lower combination 3 are aligned vertically, and on the other side, the weld locations b1, b3 of the upper combination 3 and the lower combination 3 Although the welding locations e1 and e3 coincide vertically, the welding location b2 of the upper combination 3 and the welding location e2 of the lower combination 3 are shifted in the edge direction of the combination 3. Further, among the two sides of the center combination 3 that overlaps vertically, the welding locations c1 and c3 of the upper combination 3 and the welding locations d1 and d3 of the lower combination 3 are vertically aligned on one side. The welding location c2 of the upper combination 3 and the welding location d2 of the lower combination 3 are shifted in the direction of the edge of the combination 3. On the other side, the welding locations d1, d3 of the upper combination 3 and the bottom The welded portions c1 and c3 of the combination 3 are aligned vertically, but the welded portion d2 of the upper combination 3 and the welded portion c2 of the lower combination 3 are shifted in the edge direction of the combination 3. Furthermore, among the two sides of the combination 3 at the right end that overlaps vertically, on one side, the welding locations e1, e3 of the upper combination 3 and the welding locations b1, b3 of the lower combination 3 are aligned vertically, The welding location e2 of the upper combination 3 and the welding location b2 of the lower combination 3 are shifted in the direction of the edge of the combination 3, and the welding locations f1, f2, f3 of the upper combination 3 on the other side. And the welding locations a1, a2, and a3 of the lower combination 3 are aligned vertically.
[0031]
In this way, a plurality of welds are provided on the sides of each combination 3 excluding the outer sides of the combination 3 located at both ends of the combination set 7, that is, on the opposite sides of the side-by-side combination 3. The combination set 7 can be stacked up and down so that at least one of the locations is shifted in the edge direction and does not correspond to up and down. Therefore, when the combination set 7 is stacked in multiple stages and is heat-pressed as shown in FIG. 4B, all the welded portions of the opposite sides of the respective combinations 3 of the stacked combination set 7 are all located. Are not overlapped in the vertical direction at the same position in the combination 3 that overlaps vertically. For this reason, when stacking the combination set 7 in multiple stages, the total thickness in the vertical direction of each combination 3 of the combination set 7 stacked in multiple stages is such that the welded portion overlaps vertically and other parts As a result, it is possible to make the method of applying pressure when heating and pressing between the heating plates 5 uniform, and to obtain a multilayer obtained by lamination molding. It is possible to make the thickness of the printed wiring board uniform and prevent the outer layer metal foil 10 laminated on the combination 3 from being wrinkled and reduce the occurrence of molding defects. .
[0032]
In the embodiment of FIG. 3, all the welded portions are aligned vertically on the outer side of the combined product 3 positioned at both ends of the combined product set 7, but at least one of the welded portions is included. Needless to say, the position may be shifted in the edge direction so as not to correspond to the top and bottom.
[0033]
【The invention's effect】
As described above, in the method for manufacturing a multilayer printed wiring board according to claim 1 of the present invention, a plurality of circuit boards are stacked via a prepreg, and the two opposite sides of the combination of the circuit board and the prepreg are arranged. A combination of the combined circuit board and the prepreg is obtained by locally heating and pressing at a plurality of locations along the edge to partially weld the resin of the prepreg to the circuit board and coupling the circuit board through the prepreg. A multilayer printed wiring board in which a plurality of circuit boards are laminated and integrated through an insulating adhesive layer made of prepreg by stacking a plurality of layers in multiple stages via a molding plate and molding them by heating and pressing between hot plates. In manufacturing, in a combination that is stacked next to each other in the vertical direction, at least one of the welding locations on each side of the two sides is shifted in the edge direction and does not correspond to the vertical direction. In this way, the combinations are stacked in multiple stages, so that all the welded parts on the two sides of each stacked combination do not overlap in the vertical direction at the same position. Thus, it is possible to make uniform the pressure applied during hot press molding, and to reduce the occurrence of molding defects.
[0034]
Also, among the bonded portion forming the combination thereof opposing two sides mutually in pairs by corresponding to the, to perform the heat welding is shifted in a direction along the edge from a position facing each other at least a pair of bonded portion Therefore, when stacking the combination in multiple stages, it becomes easy to shift the welding positions on the two sides of the combination stacked next to each other in the vertical direction so that they do not correspond to the top and bottom. Is.
[0035]
Further, the invention of claim 2 is that in claim 1 , when stacking the combinations in multiple stages via the molding plate, the adjacent combinations in the vertical direction are stacked in multiple stages in a state where the front and back are alternately reversed. It is easy to shift the welding locations on the two sides of the combined product stacked next to each other in the vertical direction so that the positions do not correspond to the vertical direction.
[0036]
In the invention of claim 3 , a plurality of combinations are arranged side by side, and when a plurality of combinations sets in which the combinations are arranged side by side are stacked in multiple stages via a molding plate, they are stacked adjacent to each other vertically. In the combination set, the combination set is stacked in multiple stages so that at least one of the welded portions of each side facing each other in the side-by-side combination is shifted in the edge direction and does not correspond vertically. As a result, it is possible to prevent the welded portions of the opposite sides of the combination in each stacked combination set from overlapping each other at the same position in the vertical direction. The method of applying pressure during pressure forming can be made uniform, and the occurrence of molding defects can be reduced.
[Brief description of the drawings]
1A and 1B show an example of an embodiment of the present invention, in which FIG. 1A is a plan view of a combination, FIG. 1B is a plan view of a state in which the combination is inverted, and FIG. It is a top view which shows the state of the overlap of a combination thing.
FIGS. 2A and 2B show another example of the embodiment of the present invention, where FIG. 2A is a plan view of a combination, FIG. 2B is a plan view of a state in which the combination is inverted, and FIG. It is a top view which shows the state of the overlap of an adjacent combination thing.
FIGS. 3A and 3B show an example of an embodiment of the present invention, in which FIG. 3A is a plan view of a combination set, FIG. 3B is a plan view of a state in which the combination set is inverted, and FIG. It is a top view which shows the state of the overlap of the combination of an adjacent combination set.
FIG. 4 shows an example of a method for manufacturing a multilayer printed wiring board, wherein (a), (b), and (c) are front views, respectively.
FIGS. 5A and 5B are views showing a combination, in which FIG. 5A is a front view of an operation for welding the combination, and FIG. 5B is an enlarged front view showing a state in which a welded portion is recessed.
FIG. 6 is a front view showing a combination set.
FIG. 7 is a plan view showing a conventional combination.
FIG. 8 is a plan view showing a combination set of a conventional example.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 2 Prepreg 3 Combination 4 Molding plate 5 Heating board 6 Insulation adhesive layer 7 Combination set

Claims (3)

A plurality of circuit boards are stacked through a prepreg, and each of the two opposite sides of the combination of the circuit board and the prepreg is locally heated and pressed at a plurality of locations along the edge, whereby the resin of the prepreg is obtained. The circuit board is partially welded to the circuit board and connected to the circuit board through the prepreg. A plurality of combinations of the combined circuit board and prepreg are stacked in multiple stages through the molding plate, and this is heated and pressed between the hot plates. When manufacturing a multilayer printed wiring board in which a plurality of circuit boards are laminated and integrated through an insulating adhesive layer made of prepreg, a pair of welds that form a pair corresponding to the two opposite sides of the combination among locations, thermally welded shifted in the direction along the edge from a position facing each other at least a pair of welding portions, in combination product to be stacked next to each other vertically, So that at least one portion of the bonded portion of each side edge is at a position not corresponding to the vertical offset in the edge direction, a method for manufacturing a multilayer printed circuit board, characterized in that stacking combinations thereof in multiple stages. 2. The multilayer printed wiring board according to claim 1 , wherein when stacking the combinations in multiple stages through the forming plate, the stacks are stacked in multiple stages in a state where the top and bottom adjacent combinations are alternately reversed. Method. When a plurality of combinations are arranged side by side, and a plurality of combination sets in which the combinations are arranged side by side are stacked in multiple stages via a molding plate, they are next to each other in a combination set that is stacked next to each other vertically. The combination set is stacked in multiple stages so that at least one of the welding locations on each side of the combination facing each other is shifted in the edge direction and does not correspond to the top and bottom. Or the manufacturing method of the multilayer printed wiring board of 2 .

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