KR200240976Y1 - A fixture and laminating device of multi-layer PCB - Google Patents

Abstract

The present invention is a printed circuit board that is combined with a high multiple layer in a printed circuit board that is stacked and bonded in a high multiple layer having at least 10 layers or a stack thickness of 4 mm or more, the upper layer printed circuit board group and the lower layer printed circuit. The rivet holes are formed by dividing into a plurality of substrate groups and forming a plurality of images in a circuit pattern. The main rivet holes in the upper and lower printed circuit board groups are formed in line with each other in the same position line, and the upper and lower layers are printed. Upper and lower layers in advance when laminated and bonded by interposing epoxy riveted hot melt adhesive sheets between high multilayer printed circuit boards required by separately forming primary rivet holes that are displaced from each other around the main rivet hole of the circuit board. Of each printed circuit board by stacking and combining the printed circuit board groups separately through the respective primary rivet holes. Securely fix and bond the inherent epoxy insulation hot melt adhesive sheet and printed circuit board, and then stack and fix the first and second riveted printed circuit board groups through the main rivet hole. As a conventional method, a high-layer printed circuit board generated by removing an unstable interlayer flow factor of an insulated hot melt adhesive sheet interposed between printed circuit boards of a high multilayer in a hot press operation for laminating and combining the same by hot pressing. It completely prevents the phenomenon of printed circuit pattern and pinhole misalignment of the circuit printed on the printed circuit board of each layer due to the mismatch between layers. Improves production and processing cost by eliminating defective rate of printed circuit boards The present invention relates to a laminated fixed structure of a high multilayer printed circuit board, which can reduce the size of the printed circuit board and improve the product reliability of the printed circuit board of the high performance multilayer by equalizing interlayer fluidity.

Description

A fixture and laminating device of multi-layer PCB

The present invention is a printed circuit board that is laminated and bonded to at least 10 layers or a multi-layered layer having a stacking thickness of 4 mm or more, the upper printed circuit board group and the lower layer printed on the printed circuit board combined in a high multiple layer The rivet holes are divided into a plurality of circuit board groups to form a plurality of images at the time of forming the circuit pattern. The upper and lower printed circuit board groups are formed by matching the main rivet holes on the same position line with each other, and forming the upper and lower parts. The primary rivet holes of the printed circuit board are displaced from each other in different positions, so that the primary rivet holes are separately formed, and an epoxy-based insulating hot melt adhesive sheet is interposed between the high multilayer printed circuit boards required to be stacked and bonded in advance. The first printed circuit board group in the lower layer is laminated and combined separately through the respective primary rivet holes, and between each printed circuit board Epoxy-insulated hot melt adhesive sheet and printed circuit board inherently fixed to each other are firmly fixed and bonded.Then, the first and second riveted printed circuit board groups of the upper and lower layers are integrally riveted through the main rivet hole to be laminated and fixed. In the hot press operation of heating, pressing, stacking, and joining them in a conventional manner, the unstable interlayer flow factor of the insulating hot melt adhesive sheet interposed between the printed circuit boards of the high multilayer layer is removed, thereby resulting in the high multilayer printed circuit. Completely and easily carry out the manufacturing process of high-layered printed circuit boards by completely preventing occurrence of printed circuit patterns and pinhole displacement of printed circuits on printed circuit boards of each layer due to mismatch of boards. Improves production and processing cost by eliminating defect rate of high multilayer printed circuit boards It can be reduced, and also relates to a securing structure for lamination Gouda-layer printed circuit board capable of providing a high quality of Gouda-layer printed circuit board to equalize the inter-layer fluid to improve the product reliability of the multilayer printed circuit board in the high-function.

In general, printed circuit boards with complex circuit configurations are required due to the appearance of various electronic devices and various high-functional electronic devices that are microcomputerized, and according to this trend, various complex circuit patterns on one side or both sides of the polymer insulating sheet are required. There is a demand for a multilayer printed circuit board in which a printed circuit board on a sheet printed and printed with a circuit pattern in this manner is laminated and bonded in multiple layers.

Even in the multilayer printed circuit board, according to the demand of the high performance of the electronic device, not a low printed circuit board of 1 or 2 layers, but more than 10 layers or a thickness of 4 mm or more, so-called high multiple layers Since a precision printed circuit board is also required, in laminating and bonding such a multilayered printed circuit board, as shown in FIG. 7, the printed circuit pattern 100 is formed on each sheet printed on one side or both sides. The printed circuit pattern 100 and the necessary rivet hole 102 are formed in the printed circuit board 101, and the positions of the rivet holes 102 of the printed circuit board 101 of each layer are made to coincide with each other. The rivet holes 102 are collectively processed through each of the layers between the multiple printed circuit boards 101 stacked through the insulating hot melt adhesive sheets 103 and 104, and then through the rivet holes 102. Bulk riveting with copper rivet (105) Insulating hot melt adhesive sheets 103 and 104 interposed between the respective printed circuit boards 101 by a press operation for laminating and bonding the multilayer printed circuit boards 101 and then heating and pressing them. Method of melt bonding and bonding

However, in the conventional high multilayer printed circuit board 101, since only the rivet holes 102 are formed so as to coincide with each other in position, the rivet holes are fixed in a single turn in a batch, and thus the stacking state is unstable. In the case of the printed circuit board 101, the overall thickness becomes considerable, and in this case, the binding state between the printed circuit board 101 located on the top layer and the printed circuit board 101 located on the bottom layer becomes unstable, which causes Insulation hot melt adhesive sheet which is melted in the process of bonding the hot melt adhesive sheets 103, 104 interposed between each of the multiple printed circuit boards 101, 104, which are interlayered by hot-pressing, while being melted in a gelled state ( 103) and 104, the fluidity is generated by itself, and as the press pressure goes to the lower layer portion, a considerable stress is generated in the lower layer portion, whereby the insulating hot melt adhesive sheet ( When the melt of 103, 104 is melted, the fluidity is greatly generated, so that the position of the printed circuit boards 101 stacked in a high multiple layer is located in the lower layer, so that the fluid flows finely. The position of the printed circuit pattern 100 of the printed circuit is deformed to cause a mismatch between the positions of the printed circuit pattern 100 and the pinholes between the interlayer printed circuit boards 101, which causes expensive multi-layer printed circuits. The lamination of the substrate 101 and the operation burdens and risks that easily cause defects in the bonded state are followed, and the lamination and fixing of the multi-layer printed circuit board 101 is difficult and difficult, requiring careful attention. There are not only uneconomical factors that cause problems in the operation, which lowers the productivity and significantly increases the production and processing costs. Due to the unstable state of lamination and fixing of multilayer printed circuit boards, various defects and work defects have been shown, such as requiring a lot of labor and technology to obtain high quality multilayer printed circuit boards.

Therefore, the final work process using the multilayered high-layered circuit board due to the occurrence of significant difficulties in stacking circuits of the primary high-layered layer as described above and the failure of lamination bonding, that is, the work of setting parts or elements or completing the substrate There is also a problem that causes a serious problem in subsequent process operations, such as a risk that the operation is badly performed and a risk of fatal damage to the product's operation characteristics or reliability occurs. There are many problems such as the inability to carry out the subsequent product completion process, resulting in limitations in the stacking and thickness of the multi-layers, thereby meeting the demanding reality of higher-layer circuit boards with higher and more complex patterns. A lot of troubles that can't be done Various problems, such as manufacturing process cost and product production cost, also increased.

Therefore, the present invention is applied to a relatively high multilayer printed circuit board having at least 10 layers or stack thicknesses of at least 4 mm in order to solve the above-mentioned defects. It eliminates the defect rate of the printed circuit board of high multilayer by completely preventing the position of the printed circuit pattern of the multilayer printed circuit board which is laminated by excluding the fluidity of the insulating hot melt adhesive sheet interposed between the melted and hot melt adhesive sheets. The purpose of this is to stack high quality multilayer printed circuit boards by stacking and joining the stacking state of a relatively thick and complex high multilayer printed circuit board of 10 layers or more and 4 mm or more in a perfect and stable state. .

In addition, the present invention divides a printed circuit board that is laminated in advance in the case of stacking a high multilayer printed circuit board into upper and lower layers, and interposes an epoxy-based insulating hot melt adhesive sheet between the divided upper and lower printed circuit board layers. The first and second rivets are laminated and fixed separately to form upper and lower circuit layers. Then, the upper and lower layer circuit layers are overlaid and collectively riveted together to integrally laminate and bond the printed circuit board layers of the upper and lower layers. After individual lamination to combine, re-lamination method is adopted to make stacking state of high multilayer printed circuit board stable and perfect. Laminates relatively thick and high multilayer printed circuit boards perfectly with easy work process without fear of lamination failure. By enabling the molding, it can reduce the manufacturing cost of high multilayer printed circuit board and improve its productivity and processability As it can be able to have another purpose.

In addition, the present invention adopts a method of arbitrarily dividing a high multilayer printed circuit board into upper and lower layers, and then repeatedly riveting the first individual rivet and then collectively ripping them to overlap and fix the high multilayer printed circuit board. It is another object to provide a high quality high multilayer printed circuit board by removing the product defect rate and improving productivity by performing relatively easy and robust, and also the present invention is to secure the laminated bonding state of the high multilayer printed circuit board By stacking and joining in the exact position joining state without any defects, it is possible to improve the productivity by completely and efficiently performing the part or device setting process or the final product manufacturing work without any phenomenon or concern of defects, It improves the reliability of the product by improving the operation characteristics of the final precision product using the manufacturing process as well. By giving it with yet another object of Gouda-layer printed circuit board which can greatly reduce the production cost to provide.

In order to achieve this purpose, the present invention divides the upper and lower printed circuit board layers into arbitrary numbers according to the number of stacked layers, and matches the main rivet holes on the upper and lower printed circuit board layers on the upper and lower printed circuit boards. The first and second rivet holes are formed separately around the main rivet holes of the upper and lower layer printed circuit boards, and are separately stacked through the respective primary rivet holes of the upper and lower layer printed circuit boards. It is possible to fix and stack the printed circuit boards of the upper and lower layers of the upper and lower layers, respectively, and stack them through the main rivet hole, thereby stacking and stacking the printed circuit boards of the upper and lower layers. By heating and applying the printed circuit board of the upper and lower layers and the fixing state of epoxy-based insulating hot melt adhesive sheet interposed therebetween stably and firmly, It removes the fluidity of the insulating hot melt adhesive sheet that melts during press processing, etc., and completely prevents the flow or positional deformation of the printed circuit pattern printed on the multi-layer printed circuit board. An embodiment is described as follows.

Figure 1 (a), (b) is a rivet hole of each printed circuit board of the upper and lower layers of the present invention

As an embodiment showing the configuration state,

(A) is a plan view showing an example of the rivet hole configuration of the upper-layer printed circuit board

(B) is a plan view showing an example of the rivet hole configuration of the lower printed circuit board

2 is an exploded perspective view of the upper and lower printed circuit boards of the present invention before lamination

3 and 4 illustrate a stacking state of the upper and lower printed circuit board layers of the present invention.

As a perspective view,

3 is a perspective view of an individual primary rivet state of the upper and lower printed circuit board layers;

4 is a perspective view of a batch riveting state of the upper and lower printed circuit board layers

Figure 5 is a cross-sectional view of the bonding state of the upper printed circuit board layer in the present invention

Figure 6 is a cross-sectional view of the coupling state of the upper, lower printed circuit board of the present invention

7 is an exemplary view showing a bonding state of a conventional high multilayer printed circuit board.

* Explanation of symbols for the main parts of the drawings

1, 3: printed circuit pattern

2: upper printed circuit board layer 2-₁, 2-₂..2-n: printed circuit board

4: lower printed circuit board 4-₁, 4-₂..4-n: printed circuit board

5a, 5b: upper insulation hot melt adhesive sheet

6a, 6b: Lower Insulation Hot Melt Adhesive Sheet

7a, 7b, 7c, 7d; Main rivet hole on the upper printed circuit board

8a, 8b, 8c, 8d: main rivet hole on lower printed circuit board

9a, 9b, 9c, 9d: primary rivet holes in upper printed circuit board

10a, 10b, 10c, 10d; Primary rivet hole in lower printed circuit board

Figure 1 (a) is a plan view showing an example of the rivet hole configuration of the upper printed circuit board, (b) is a plan view showing an example of the rivet hole configuration of the lower printed circuit board, Figure 2 is an exploded perspective view before the lamination of the present invention FIG. 3 is a perspective view of individual primary rivet states of upper and lower printed circuit board layers, FIG. 4 is a perspective view of collective rivet states of upper and lower printed circuit board layers, and FIG. 5 is an upper printed circuit layer of the present invention. 6 is a cross-sectional view of the bonded state of the substrate, and FIG. 6 is a cross-sectional view of the bonded state of the upper and lower printed circuit boards of the present invention.

As shown in (a) to (b) to FIG. 6 of the accompanying drawings, the present invention is a sheet-shaped printed circuit board on which at least one side or both sides of a printed circuit pattern 1 is formed by printing a desired circuit. A printed circuit board 4 having a printed circuit board layer 2 formed thereon of (2-₁), (2-₂) .. (2-n) and a printed circuit pattern 3 formed in the same manner as above. (I) divided into a printed circuit board layer (4) of the lower layer, which is (4-₂) .. (4-n), and a printed circuit board layer (2) of the upper layer and a printed circuit board layer of the lower layer ( Epoxy series between printed circuit boards (2-₁), (2-₂) .. (2-n) and (4-₁), (4-₂) .. (4-n) between each layer of 4) A printed circuit board of the upper and lower insulating hot melt adhesive sheets 5a, 5b, and 6a and 6b, which is formed between the upper and lower insulating hot melt adhesive sheets, and the printed circuit board layer 2 of the upper layer and the printed circuit board layer 4 of the lower layer. (2-₁), (2-₂) .. (2-n) and (4-₁), (4-₂) .. (4-n) and each one inserted between them Main rivet holes (7a), (7b), (7c), (7d) and (8a) located on the centerline of each side of the soft hot melt adhesive sheets (5a) (5b) and (6a) (6b). And (8b), (8c), and (8d) to penetrate the printed circuit board (2-₁), (2-₂) of the upper printed circuit board layer (2) and (2-n) and Primary rivet holes 7a, 7b, 7c, 7d on one side of the upper and lower insulating hot melt adhesive sheets 5a, 5b interposed therebetween, for example, primary rivet holes 9a on the opposite side. ), (9b), (9c) and (9d), and the printed circuit board (4-₁), (4-₂) .. (4-n) of the lower printed circuit board layer 4 One side of the main rivet holes 8a, 8b, 8c, and 8d positioned on the center line of the upper and lower insulating hot melt adhesive sheets 6a and 6b interposed between each layer therebetween. Primary rivet holes (9a), (9b), (9c) formed in the printed circuit boards (2-₁), (2-₂) .. (2-n) of the printed circuit board layer (2) of one upper layer. Primary rivet hole 10a on the right side of main rivet hole 8a, 8b, 8c, 8d , (10b), (10c), and (10d) are formed.

The printed circuit boards (2-₁), (2-₂). (2-n) and (4-₁) of the upper and lower printed circuit board layers (2) and (4) of the high multilayer thus formed are ( 4-₂) .. (4-n) and primary rivet holes (9a) and (9b) drilled in the upper and lower insulating hot melts (5a) (5b) and (6a) (6b) interposed therebetween, respectively. (9c), (9d) and (10a), (10b), (10c) and (10d) through the riveting copper rivets (11), (12) through the upper and lower printed circuit board layer (2), (4) is first divided into the primary and laminated bonding, and the first and lower printed circuit board layers (2) and (4), which are individually divided and laminated in this manner, are combined again to form a main rivet hole which is previously formed to match each other ( 7a), (7b), (7c), (7d) and (8a), (8b), (8c), and (8d) are all riveted together with copper rivets 13 at the top and bottom of the printed circuit board layer (2). ) And (4) are laminated and bonded to each other, followed by heating and pressing to form a sheet-like polymer compound of upper and lower printed circuit board layers (2) and (4) (2-₁), (2-₂) Phase between .2- (2-n) and (4-₁), (4-₂) .. (4-n), Insulated hot melt adhesive sheets 5a, 5b, and 6a and 6b are melted and gelled, and printed circuit boards (2-₁) and (2-₂) of upper and lower printed circuit board layers 2 and 4 .. (2-n) and (4-₁), (4-₂) .. (4-n) are firmly bonded to each other to be integrally overlapped. At this time, at least 10 layers or 40 cm thick in the present invention. In the case of the upper and lower printed circuit board layers (2) and (4), which are abnormal multi-layers, the primary rivet holes (9a), (9b), (9c), (9d), and (10a), (10b) In the process of bonding while heating and pressurizing while maintaining the state of having solid binding force by individually riveting through (10c) and (10d), the stress according to melting temperature deviation or pressure, i.e., increases toward the lower end The change or deviation of interlaminar fluidity of the insulating hot melt adhesive sheets 5a, 5b, and 6a and 6b is caused by stress, which causes the high and high layers of the upper and lower printed circuit boards 2, (4) or between them The insulated hot melt adhesive sheets 5a, 5b, and 6a and 6b are melted and flowed so that the mutual position is not deformed, so that the printed circuit boards of each of the printed circuit board layers 2 and 4 do not appear. Position of the printed circuit patterns (1) and (3) of (2-₁), (2-₂) .. (2-n) and (4-₁), (4-₂) .. (4-n) It is possible to obtain a printed board laminated with a high quality and high quality multilayer by being firmly bonded together in a state where deformation does not occur. As described above, a printed circuit board of a high multilayer laminated and bonded by the present invention has a top and bottom printed circuits. Printed circuit board (2-₁), (2-₂) .. (2-n) and (4-₁), (4-₂) .. (4-n) between substrate layers (2) and (4) It is possible to stack the printed circuit patterns (1) and (3) formed on the circuit board) and pinholes formed on them in the same state, so that the post-processing of the multilayered printed circuit board and the setting of components or elements can be performed. Easy and simple to perform, adhesive In the final product completion process such as cutting and removing of rivet parts, there is no possibility of high quality printed circuit boards peeling off each other and there is no possibility of bad cases. It is possible to completely prevent cases of defects due to poor operation or failure of the printed circuit board, as well as the inability to set components or elements.

In the above description, the method of dividing the upper and lower printed circuit board layers (2) and (4) into two layers of at least 10 layers and 4 mm or more in thickness is described above. Depending on the thickness of the circuit board and the number of layers, the board is divided into at least two layers and laminated. The main rivet holes are formed in the same position where all of the divided layers coincide, and the positions are different from each other around the main rivet hole or any other position. After forming the primary rivet hole, the printed circuit boards of each layer divided by each may be riveted and combined, and then they may be collectively riveted through the main rivet hole to be laminated and combined.

The present invention is divided into a high-layer printed circuit board is divided into an upper printed circuit board group and a lower printed circuit board group formed by forming a plurality of rivet holes in any number of circuit patterns, the upper layer and the lower layer printing The main rivet hole is formed in the circuit board group by matching the same position line with each other, and the primary rivet hole is formed separately from the main rivet hole of the upper and lower layer printed circuit boards. The multilayer printed circuit board is divided into 1st individual, laminated, combined, and then riveted together to securely fix and bond each printed circuit board and the epoxy-based insulating hot melt adhesive sheet and the printed circuit board interposed therebetween. Multi-layer printed circuit boards for hot press operation by stacking and fixing The unstable interlayer flow factor of the insulating hot melt adhesive sheet interposed therebetween is removed, and the printed circuit pattern of the printed circuit board of each layer due to the interlayer mismatch of the high multilayer printed circuit board and the misalignment of the pinhole, etc. It completely prevents the phenomena and completely and easily performs the manufacturing work of the high multi-layer printed circuit board, thereby eliminating the defect occurrence rate of the expensive multi-layer printed circuit board, thereby improving the production and processability, thereby greatly reducing the production and processing costs. In addition, after the individual lamination, by adopting the re-lamination method, the lamination and bonding state of the high multilayer printed circuit board is stabilized and perfected, so that the relatively thick and high multilayer printed circuit board can be perfectly stacked with a simple work process without fear of lamination failure. It can be molded to provide a variety of complex It can reduce the manufacturing cost of middle-layer printed circuit board, improve its productivity and processability, and can mass-produce. It can provide high-quality high-layer printed circuit board by improving product reliability of high-functional multilayer printed circuit board by equalizing interlayer fluidity. By stacking the bonded state of the multi-layered printed circuit board in a solid and accurate position-bonded state without any defects, the process of setting up parts or devices or manufacturing the final product is completed perfectly and efficiently without the occurrence or concern of defects. It is possible to improve productivity by improving performance, manufacturing and processing of multi-layer printed circuit boards, as well as improving the operation characteristics of final precision products using the same, which can improve product reliability and greatly reduce production costs. It is a useful design with.

Claims (2)

The printed circuit board (2-₁) of the upper and lower printed circuit board layers (2) and (4) is divided into upper and lower printed circuit board layers (2) and (4) at an arbitrary number according to the number of first stacked layers. Main rivet holes (7a), (7b), (7c), (7d in (2-₂) .. (2-n) and (4-₁), (4-₂) .. (4-n) ) And (8a), (8b), (8c), and (8d) are formed so as to coincide with each other, and the upper and lower printed circuit boards (2-₁) and (2-₂) .. (2-n ) And (4-₁), (4-₂) .. (4-n) main rivet holes (7a), (7b), (7c), (7d) and (8a), (8b), (8c) The primary rivet holes 9a, 9b, 9c, 9d, and 10a, 10b, 10c, and 10d, respectively, whose positions are shifted from each other around Forming and stacking each of the upper and lower printed circuit boards individually through the primary rivet holes, and stacking and stacking the stacked upper and lower printed circuit board layers of the upper and lower layers respectively through the main rivet holes. Laminated fixed structure of a high multilayer printed circuit board, characterized in that. The method of claim 1, High multilayer printed circuit board is a laminated fixed structure of a high multilayer printed circuit board, characterized in that composed of the upper and lower printed circuit board layers (2), (4) coupled to each other by riveting.