JP2609298B2 - Manufacturing method of multilayer laminate - Google Patents

Description

Description: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for producing a high-quality multilayer laminate with little misalignment.

(Prior art)

With the recent demand for higher performance of electronic devices, the use of multilayer boards having one or more layers of conductive metal foil inside as wiring boards for mounting electronic components has increased.

For example, a six-layer plate of this multilayer plate is configured as shown in FIG.

That is, two inner layer plates 3 each having a metal conductor circuit 2 formed on both surfaces of the insulating layer 1 are prepared, and the two plates are overlapped with a prepreg 4a interposed therebetween, and a prepreg 4b and a metal conductor foil 5 are further provided on both surfaces thereof. The structure is such that they are overlapped in order. These are all integrally formed by hot pressing.

However, at this time, it is necessary to align the positions of the metal conductor circuits 2 of the two inner layers 3, 3, and various methods have conventionally been employed. For example, there is (a) a pin lamination method, which comprises two copper foils 5, as shown in FIG.
5; three prepregs 4, 4, 4; holes for positioning are made in all of the two inner layers 3, 3, which are sandwiched between stainless steel plates 6, 6 and the mold surfaces of exclusive molds 7, 7 Dowel pin 8
After all of the holes are fitted to each other to perform positioning, they are formed by hot pressing.

Also, after the inner plate and the prepreg laminate are mechanically fixed with rivets or eyelets, they are integrally molded by hot pressing (b), or the inner plates are connected via a prepreg using an instant adhesive such as cyanoacrylate. There is also a method (c) of integrally molding by hot pressing after bonding and fixing to each other.

[Problems of the prior art]

However, in the pin lamination method, the stainless steel plate must be polished after hot press molding in order to remove the pin and remove the resin adhered around the pin, which significantly impairs productivity.

In addition, it is necessary to increase the thickness of the mold to absorb the thickness difference before and after molding, and to set up the guide pins, which has the disadvantage of reduced workability and the inability to mold large size products.
There is also a disadvantage that a hole must be formed in the mold.

In addition, (b) mechanical caulking method may cause rivets and eyelets to damage the stainless steel plate.
Had a big problem.

(C) The method using an instant adhesive such as cyanoacrylate does not have the problems of the methods (a) and (b) described above, but it is difficult to adjust the timing of the alignment work and the adhesive curing time, resulting in misalignment. Often occurred.

The method of the present invention has been made in order to solve these problems, a multilayer laminated board using at least two inner layers that need to be positioned between the inner layers, without impairing the productivity, An object of the present invention is to provide a method for manufacturing without variation in quality.

[Means for solving the problem]

The method for producing a multilayer laminate of the present invention is characterized in that, in producing a multilayer laminate using at least two inner layers, at least the two inner layers are aligned with a prepreg therebetween, laminated, and then cured by ultraviolet curing. A method for manufacturing a multilayer laminate, characterized by fixing and bonding with a resin and then molding by hot pressing.

 Hereinafter, the present invention will be described with reference to the drawings.

In the method of the present invention, for example, as shown in FIG.
First, at least two predetermined numbers of inner layer boards a having a predetermined circuit pattern formed on a copper foil surface of a copper-clad laminate such as a glass epoxy resin, and a prepreg b1 of the same material as the copper-clad laminate preferably interposed therebetween. At this time, an ultraviolet curable resin c is applied to an appropriate portion of the inner layer plate and / or the prepreg, preferably to the periphery, that is, to the end. The form of the end to which the resin is applied is shown in, for example, FIG. 7 ((a), (b), (c)) (the hatched portion in the figure indicates the resin applied portion), but is not particularly limited thereto. Not something.

Next, ultraviolet rays are applied to the aligned (positioned) laminated inner layer plate and prepreg from the side, and the ultraviolet curable resin is cured and fixedly adhered.

Next, the same prepregs b2, b2; copper foils d, d are superposed on the outside of the adhesively fixed inner layer plate to obtain a laminate e.
Then, as shown in FIG. 4, a plurality of sets of the laminates e are inserted between hot plates g of a hot press with stainless steel plates f, f, f... Interposed therebetween, and heated and pressed under predetermined conditions. Mold and integrate.

In addition, epoxy acrylate-based, urethane acrylate-based, polyester acrylate-based resins, and the like are typical examples of the UV-curable resin. As for the prepreg b interposed in the inner layer plate a, as shown in FIG. 5-a, a method of notching a portion where the ultraviolet curing resin c is applied to the inner layer plate and directly joining the inner layer plates together may be used. Absent.

Further, as shown in FIG.
Is applied to both sides of the space block h which can be deformed by press pressure and inserted between the inner layer boards a, or the interior board a
A method in which a resin is applied only to the side and a space block h to which no resin is applied is inserted, or a method in which the resin is applied to both the inner layer plate a and the space block h may be used.

In addition, the timing of irradiating the ultraviolet ray for curing the ultraviolet curable resin is not always performed immediately after positioning and laminating the inner layer plate with the prepreg interposed, and may be performed after the outermost layer prepreg or copper foil is overlaid. It is needless to say that a plurality of such laminates may be stacked and stacked via a stainless steel plate.

〔Example〕

Hereinafter, examples of the present invention and comparative examples will be described, and embodiments of the present invention will be described in more detail.

Example 1 A UV-curable resin MT-AU-2004 was applied to the ends of two inner layers obtained by forming a predetermined inner layer circuit pattern on the copper foil surface of a glass epoxy resin double-sided copper-clad laminate having a size of 500 mm × 500 mm. −
2 (manufactured by Mitsui Toatsu Chemicals Co., Ltd.), a prepreg having the same size as the inner layer plate and notched inner layer plate interposed between the two inner layer plates, aligned and laminated using the reference hole, and then The resin was irradiated with ultraviolet rays to solidify and fix and adhere. Next, on both sides thereof, a prepreg and copper foil of the same size as the inner layer plate are laminated, and this is made into one laminate, and a stainless plate is interposed between various layers by the method shown in FIG. Insert between hot plates, heat press molding by hot press,
A multilayer laminate was manufactured.

Example 2 Two inner layers obtained by forming a predetermined inner layer circuit pattern on the copper foil surface of a glass-epoxy double-sided copper-clad laminate having a size of 500 mm × 500 mm were exposed on both ends shown in FIG. While laying a space block coated with a curable resin MT-AU-2004-2 (manufactured by Mitsui Toatsu Chemicals), a prepreg of the same size as the inner plate and a cut-out portion of the inner plate joint is cut between the two inner plates. After positioning and stacking using the reference holes with intervening, ultraviolet rays were irradiated from the side to solidify and fix and adhere the resin. Next, a prepreg and a copper foil of the same size as the inner layer plate are superimposed on the side surface, and this is made into one laminate, and a stainless plate is interposed between the respective layers by the method shown in FIG. It was inserted between the plates and molded under heat and pressure by a hot press to produce a multilayer laminate.

Comparative Example The same inner layer plate, prepreg, and prepreg as used in Examples 1 and 2.
Positioning and lamination were performed using a copper foil by a pin lamination method as shown in FIG. 2, inserted between hot plates, and hot-pressed by hot pressing. Table 1 shows the results of measuring the positional accuracy between the inner layer plates for Examples 1 and 2 and Comparative Example.

(Note that measurement points A, B, C, D and E correspond to the positions as shown in FIG. 6.) As is clear from Table 1, there is no difference in the positional accuracy between the embodiment of the present invention and the comparative example showing the conventional method. According to the present invention, the conventional method is much easier than the conventional method. It can be seen that a product of the same accuracy as that obtained by the cumbersome method can be obtained.

〔The invention's effect〕

As described above, according to the present invention, the alignment (positioning) laminated in advance is fixed with the ultraviolet curing resin.
The positioning accuracy is good, the time required for fixing is short, and the mold and pin at the time of hot pressing are not required, so that workability and productivity can be significantly improved while maintaining high quality. Therefore, its industrial applicability has to be extremely large.

Although the description and the embodiments of the present invention with reference to the drawings refer to a six-layer plate, it goes without saying that the same effect can be obtained with eight or more layers.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating the configuration of a six-layer plate, and FIG.
Sectional drawing explaining the manufacturing method of the conventional multilayer laminated board, 3rd
FIG. 4, FIG. 4, FIG. 5-a, and FIG. 5-b are cross-sectional views for explaining the method of the present invention, and FIG. 6 is an explanatory view showing measurement points of positional accuracy. FIGS. 7 (a), 7 (b) and 7 (c) are plan views showing positions where the ultraviolet effect type resin is applied.

Claims (1)

(57) [Claims] In producing a multilayer laminate using at least two inner layers, at least the two inner layers are aligned and laminated with a prepreg interposed therebetween, and then fixed and adhered with an ultraviolet curable resin. And then molding by hot pressing.