JPH071828B2 - Method for manufacturing multilayer printed wiring board - Google Patents

Description

Detailed Description of the Invention [Industrial applications]

The present invention relates to a method for manufacturing a multilayer printed wiring board used in electric equipment and electronic equipment.

[Prior art]

The multilayer printed wiring board is an inner layer circuit board in which a circuit pattern-formed inner layer circuit board and an outer layer circuit board similarly formed with a circuit pattern are superposed via an adhesive sheet made of prepreg, and heat-pressed to form an inner layer circuit board. It is manufactured by laminating and integrating a board and an outer layer circuit board. When carrying out the lamination molding in this way, it is necessary to laminate the inner layer circuit board and the outer layer circuit board with the circuit pattern of the inner layer circuit board and the circuit pattern of the outer layer circuit board aligned with each other. For this reason, conventionally, the inner layer circuit board and the outer layer circuit board are aligned as shown in FIG. That is,
Guide holes 6a and 6b are provided in the inner layer circuit board 1 and the outer layer circuit board 2, respectively.
Guide holes 11 are also provided in the adhesive sheet 3, and these are stacked vertically, set on the alignment plate 5 provided with the guide pins 4, and the guide pins 4 are inserted into the guide holes 6a, 6b and 11. . By thus inserting the guide pins 4 into the respective guide holes 6a, 6b of the inner layer circuit board 1 and the outer layer circuit board 2, the inner layer circuit board 1 and the outer layer circuit board 2 are positioned with reference to the guide holes 6a, 6b. Will be done. Then, the pressing plate 13 provided with the guide hole 12 is overlaid and the upper end of the guide pin 4 is inserted into the guide hole 12, thereby sandwiching the inner layer circuit board 1 and the outer layer circuit board 2 between the upper and lower plates 5 and 13. In this state, it is set in the lamination molding apparatus and heated and pressed by a hot press machine for a predetermined time.

[Problems to be Solved by the Invention]

However, in this method, since it is necessary to hold the inner layer circuit board 1 and the outer layer circuit board 2 by sandwiching them between the upper and lower plates 5 and 13, they are bulky and heavy, which hinders storage and transportation. In addition, the number of stages to be set in the laminating molding apparatus is reduced, which causes a problem in productivity. Furthermore, the resin of the adhesive sheet adheres to the periphery of the guide pin 4 during the heat and pressure molding, and after molding. The problem is that it becomes difficult to remove it. The present invention has been made in view of the above points, and an object of the present invention is to provide a method for manufacturing a multilayer printed wiring board that does not require forming a laminate while being integrated with an alignment plate. Is.

[Means for Solving the Problems]

The method for manufacturing a multilayer printed wiring board according to the present invention comprises stacking an inner layer circuit board 1 and an outer layer circuit board 2 with an adhesive sheet 3 interposed therebetween, and setting them on an alignment plate 5 having a guide pin 4 protruding therefrom. The inner layer circuit board 1 and the outer layer circuit board 2 are aligned with each other by inserting the guide pins 4 into the guide holes 6a and 6b provided in the board 1 and the outer layer circuit board 2, respectively, and then the alignment plate 5 is vertically aligned only. The inner layer circuit board 1 and the outer layer circuit board 2 are passed through the through holes 7 formed so as to open.
And are joined together by crimping or the like, after which they are taken out from the alignment plate 5 and heat-pressed.

[Action]

In the present invention, the inner layer circuit board 1 and the outer layer circuit board 2 are aligned with each other by inserting the guide pins 4 into the guide holes 6a and 6b provided in the inner layer circuit board 1 and the outer layer circuit board 2, respectively, and then Since the inner-layer circuit board 1 and the outer-layer circuit board 2 are joined by caulking or the like, the inner-layer circuit board 1 and the outer-layer circuit board 2 are joined in a state of being aligned with each other, and their positions are displaced from each other. Therefore, it can be subjected to heating and pressurizing while being taken out from the alignment plate 5. Further, since the inner layer circuit board 1 and the outer layer circuit board 2 are joined by caulking or the like through the through hole 7 formed in the alignment plate 5 so as to be opened only in the vertical direction, the position through the through hole 7 is used. The work of connecting the inner layer circuit board 1 and the outer layer circuit board 2 can be easily performed without the mating plate 5 interfering.

【Example】

Hereinafter, the present invention will be described in detail with reference to examples. The inner layer circuit board 1 and the outer layer circuit board 2 are formed, for example, by stacking a plurality of prepregs prepared by impregnating and drying a thermosetting resin varnish such as an epoxy resin on a base material such as glass cloth, and forming a copper foil on one or both sides of the prepreg. It is possible to manufacture by forming a metal foil-clad laminate by laminating metal foils and heat-pressing the metal foils, and by etching the metal foils of the metal foil-clad laminate to form a circuit. Then, guide holes 6a and 6b, which have a predetermined positional relationship with the circuit pattern formed respectively, are drilled at least at two positions at the end of each inner layer circuit board 1 and outer layer circuit board 2. is there. When the inner layer circuit board 1 and the outer layer circuit board 2 are overlapped with each other by aligning the guide holes 6a and 6b, the guides are arranged so that the circuit patterns formed on the respective circuit boards 1 and 2 are aligned in an accurate positional relationship with each other. The positions of the holes 6a and 6b are set, and the inner diameter thereof is set to be substantially equal to the outer diameter of the guide pin 4 described later. Further, a prepreg is used as the adhesive sheet 3, and guide holes 11 are also formed at the ends of the adhesive sheet 3 at positions corresponding to the guide holes 6a and 6b. The guide hole 11 does not need to be provided at a particularly accurate position and may be a so-called stupid hole. On the other hand, the alignment plate 5 is formed of a metal flat plate or the like, and the guide pins 4 are provided on the upper surface of the end of the alignment plate 5 at positions accurately corresponding to the guide holes 6a and 6b. is there. In addition, a through hole 7 that opens vertically is formed at the end of the alignment plate 5. The through hole 7 is formed as a hole that opens only in the upper and lower sides, and is provided on both sides of the guide pin 4. First
In the illustrated embodiment, the through hole 7 is formed as a round hole, but the shape of the hole is not limited and may be a triangular hole or a square hole. Then, as shown in FIG. 1, the inner layer circuit board 1 and the outer layer circuit board 2 are overlapped with each other with the adhesive sheet 3 interposed therebetween, and the guide holes 6a, 6b, 11 are inserted into the guide pins 4 and the alignment plate 5 is inserted. Set on the upper surface of. By stacking the inner layer circuit board 1 and the outer layer circuit board 2 with the guide holes 6a, 6b inserted in the guide pins 4 in this manner, the respective circuit patterns of the inner layer circuit board 1 and the outer layer circuit board 2 are automatically generated. Will be aligned with. Next, the inner layer circuit board 1 and the outer layer circuit board 2 are aligned and aligned in this way, and then the inner layer circuit board 1 and the outer layer circuit board 2 are joined by caulking or the like. The work such as crimping can be performed through the through hole 7. For example, as shown in FIG.
Hollow rivets such as brass on outer layer circuit board 2 and adhesive sheet 3
It can be done by crimping through 14. All of the drilling work before inserting the rivet 14, the inserting work of the rivet 14 and the crimping of the rivet 14 can be carried out through the through hole 7 without the positioning plate 5 interfering. Here, the through hole 7 is the first
As shown by the imaginary line in the figure, it is also possible to form a notch that also opens on the end surface of the alignment plate 5, but if such a notch is formed, the strength of the notch end edge portion (indicated by an arrow) is increased. There is a problem that it becomes weak and deformation is likely to occur in this portion, the durability life of the alignment plate 5 is shortened, and that there is a possibility that it may be caught in the notched edge and interfere with work. . Therefore, in the present invention, the through hole 7 is not formed as such a notch, but is formed so as to open only in the vertical direction of the alignment plate 5. The inner layer circuit board 1 and the outer layer circuit board 2 are caulked as described above.
Since there is no possibility that the inner layer circuit board 1 and the outer layer circuit board 2 will be misaligned when they are combined with each other, they can be taken out from the alignment plate 5 and stored or transported.
When carrying out the lamination molding, as shown in FIG. 3, the combined product of the inner layer circuit board 1 and the outer layer circuit board 2 taken out from the alignment plate 5 is used as the end plate 15 and the cushion plate 16.
It can be carried out by setting it between the hot press boards 17 of the laminating and molding apparatus through the heat-pressing molding and heat-pressing, and the inner-layer circuit board 1 and the outer-layer circuit board 2 through the adhesive sheet 3.
It is possible to manufacture a multilayer printed wiring board in which and are laminated and integrated. In this molding, since the inner layer circuit board 1 and the outer layer circuit board 2 are joined by caulking or the like, the adhesive sheet 3
Inner layer circuit board 1 and outer layer circuit board 2 as the resin flows
The inner layer circuit board 1 and the outer layer circuit board 2 can be laminated and integrated in a state in which the mutual circuit patterns are accurately aligned with each other without any positional deviation.

【The invention's effect】

As described above, in the present invention, the inner layer circuit board and the outer layer circuit board are mutually aligned by passing the guide pins through the guide holes respectively provided in the inner layer circuit board and the outer layer circuit board,
Next, since the inner layer circuit board and the outer layer circuit board are joined by caulking or the like, the inner layer circuit board and the outer layer circuit board are joined in a state of being aligned with each other so that they are not displaced from each other. It is possible to store and transport the product in a state where it is taken out from the alignment plate, and further to be subjected to heat and pressure molding. Further, since the inner layer circuit board and the outer layer circuit board are connected by caulking or the like through the through hole formed in the alignment plate, the inner layer circuit board and the outer layer circuit board can be connected through the through hole without disturbing the alignment plate. It is easy to work with the plate, and the through hole is formed in the alignment plate so that it opens only in the vertical direction. The strength of the alignment plate becomes weaker at the edge portion, so that the deformation of this portion does not occur and the work is not hindered by being caught by the edge portion of the cutout edge.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment of the present invention, FIG. 2 is a sectional view of the same, FIG. 3 is an exploded front view of the same, and FIG. 4 is an exploded perspective view of a conventional example. 1 is an inner layer circuit board, 2 is an outer layer circuit board, 3 is an adhesive sheet, 4
Is a guide pin, 5 is an alignment plate, 6a and 6b are guide holes, and 7 is a through hole.

Claims (1)

[Claims] 1. An inner layer circuit board and an outer layer circuit board are stacked via an adhesive sheet, and these are set on a positioning plate having a guide pin projecting, and are guided in guide holes respectively provided in the inner layer circuit board and the outer layer circuit board. The inner layer circuit board and the outer layer circuit board are aligned with each other by inserting the pins, and then the inner layer circuit board and the outer layer circuit board are caulked or the like through the through holes formed in the alignment plate so as to open only in the vertical direction. A method for manufacturing a multi-layer printed wiring board, which comprises bonding, and then taking this out from an alignment plate and subjecting it to heat and pressure molding.