JP2003110203A - Wiring board for multiple pattern and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board for multiple pattern and a method of manufacturing the same by which wiring conductors and piercing conductors can be reliably bonded when a plurality of insulating sheets each having a wiring conductor deposited thereon are stacked and subjected to hot pressing to manufacturing a wiring board for multiple pattern, and electrical inspection can be precisely performed without causing bending. SOLUTION: In this multiple wiring board, a multiplicity of wiring board regions 5, in which a wiring conductor 2 is formed on the insulating layer 1 surface, and a piercing conductor 3 for electrically connecting the vertically positioned wiring conductors 2 is formed inside the insulating layer 1, are disposed in the central portion of a parent board 6 obtained by stacking a plurality of the insulating layers 1. A wiring conductor 2 is formed in the wiring board region 5 on the insulating layer 1 surface, and a piercing conductor is formed in the insulating layer 1 between the vertically positioned wiring conductors 2. A metallic frame 4 is disposed between and in the outer periphery of the wiring board regions 5 on the insulating layer 1 surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-cavity structure in which a large number of wiring board regions, which are wiring boards for mounting electronic components such as semiconductor elements and resistors, are arranged in a mother board having a large area. The present invention relates to a wiring board and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, as a wiring board used for mounting electronic components such as semiconductor elements and resistors, an insulating layer made of a glass base material and a thermosetting resin and a wiring conductor made of a copper foil are alternately arranged. There is known a printed circuit board formed by stacking a plurality of layers. Such a printed circuit board is formed by etching a copper foil adhered to the surface of an insulating layer to form a wiring conductor, and a plurality of insulating layers having the wiring conductor are sandwiched by an adhesive material made of a thermosetting resin. It is manufactured by laminating and press-bonding to form a multilayer. However, this printed circuit board has an uneven surface due to the step between the part where the wiring conductor is formed on the surface of the insulating layer and the other part. Therefore, an insulating sheet with a little plasticity is used for the insulating layer. When the sheets are laminated, the portion of the insulating sheet that comes into contact with the wiring conductor is plastically deformed in accordance with the thickness of the wiring conductor to embed the wiring conductor in the insulating sheet, and to stack and cure it No unevenness is formed (see Japanese Patent Laid-Open No. 10-27959).

The printed circuit board described in Japanese Unexamined Patent Publication No. 10-27959 has a through hole formed by a laser in a wiring board region of an insulating sheet in which a heat-resistant fiber is impregnated with a thermosetting resin precursor. A metal paste consisting of a metal powder and a thermosetting resin precursor is embedded in the holes by screen printing (press-fitting) to form a through conductor, while a copper foil is adhered to the surface of a transfer sheet made of a heat-resistant resin to form a predetermined conductor. To form a wiring conductor at a position corresponding to each wiring board region of the insulating sheet, and then press-contact the transfer sheet having the wiring conductor formed on the insulating sheet having the penetrating conductor formed thereon. Is transferred to the insulating sheet and connected to the through conductor, and after the transfer sheet is peeled from the insulating sheet, a plurality of insulating sheets in which the wiring conductors are embedded are stacked and heat press is used. The thermosetting resin precursor is cured and integrated to obtain a multi-piece wiring board, and finally, the wiring board is divided by a cutting machine such as a router.

[0004]

However, in the recent trend of making electronic parts lighter, thinner, shorter, and smaller, the thickness of wiring boards has become as thin as about 200 to 500 μm, whereas multi-cavity wiring boards are available. If the thickness of the board becomes thin, the rigidity will decrease and the center part will bend due to its own weight, so when you place the wiring board horizontally and apply the electric test probe from above and below, you will have many electric test probes. There is a problem in that a portion of the surface of the wiring board that does not come into contact with the wiring conductor is generated, and an accurate electrical inspection result cannot be obtained. Further, when the area of the multi-cavity wiring board is widened, the flexure due to its own weight becomes large, and conversely, when the area is narrowed, the number of wiring boards taken up is reduced and the production efficiency is lowered. Further, if a reinforcing plate is used to improve the rigidity of the multi-cavity wiring board, there is a problem in that an extra step of mounting the reinforcing board is required.

Further, since the above printed circuit board is manufactured by using a hot press by laminating a plurality of insulating sheets,
When laminated and hot pressed, the viscosity of the thermosetting resin precursor decreases and the thermosetting resin precursor flows, and the wiring conductor on the surface of the insulating layer deforms, and the through conductor and the wiring connected to it There has been a problem that the position of the conductor is displaced and a short circuit or disconnection occurs.

The present invention has been completed in view of the above problems of the prior art, and an object thereof is to manufacture a multi-cavity wiring board by laminating a plurality of insulating sheets coated with wiring conductors and by hot pressing. Provided are a multi-cavity wiring board and a method for manufacturing the wiring board, in which the wiring conductor and the penetrating conductor can be surely joined to each other and the electrical inspection can be accurately performed without any bending.

[0007]

A multi-cavity wiring board according to the present invention comprises: a mother board formed by laminating a plurality of insulating layers;
A wiring conductor is formed on the surface of the insulating layer, and a large number of wiring board regions are formed inside the insulating layer, and through conductors for electrically connecting the wiring conductors located above and below are formed. The metal frame is arranged between the wiring board regions and in the outer peripheral portion.

Further, the multi-cavity wiring board of the present invention is characterized in that, in the above construction, the metal frame has a thickness of 5 to 50 μm and the width of the metal frame between the wiring board regions is 0.5 to 2.0 mm. It is what

Further, the multi-cavity wiring board of the present invention is
In the above configuration, the metal frame is made of the same metal as the wiring conductor.

Further, the method for manufacturing a multi-cavity wiring board of the present invention comprises an insulating sheet comprising a thermosetting resin precursor and heat resistant fibers, and a large number of wiring board regions arranged in the central portion, and a heat resistant sheet. A step of preparing a transfer sheet in which a wiring conductor having a predetermined pattern is formed in a portion corresponding to a wiring board region of a transfer sheet base material made of a resin, and a metal frame is formed in a portion corresponding to an outer peripheral portion between the wiring board regions; A step of forming a through hole in the wiring board region of the insulating sheet and forming a through conductor in the through hole; and a transfer sheet being pressed against the insulating sheet to transfer and embed the wiring conductor and the metal frame in the insulating sheet. At the same time, a step of electrically connecting the through conductor and the wiring conductor, a step of peeling the transfer sheet base material from the insulating sheet in which the wiring conductor and the metal frame are transfer-embedded, Fine metal frame is characterized in that sequentially perform a step of integrating by curing the thermosetting resin precursor with stacking a plurality implantation has been insulated sheet transfer.

According to the multi-cavity wiring board of the present invention, the metal frames are arranged between the large number of wiring board regions arranged in the central portion of the mother board formed by laminating a plurality of insulating layers and in the outer peripheral portion. Therefore, even when the thickness of the multi-cavity wiring board is reduced to about 200 to 500 μm, the metal frame maintains the rigidity of the multi-cavity wiring board and the multi-cavity wiring board does not bend. When electrically inspecting the individual wiring board,
The electrical inspection probe can be reliably brought into contact with the wiring conductor on the surface of the multi-cavity wiring board, and a multi-cavity wiring board can be obtained in which an accurate electrical inspection result can be obtained.

Further, according to the multi-cavity wiring board of the present invention, in the above structure, the thickness of the metal frame is set to 5 to 50 μm, and the width of the metal frame between the wiring board regions is 0.5.
Since the width is up to 2.0 mm, the rigidity does not deteriorate even if the wiring board has a large area, and as a result, the number of wiring boards can be increased, and high-efficiency multi-processing is possible. It can be a wiring board.

Further, according to the multi-cavity wiring board of the present invention, in the above structure, since the metal frame is made of the same metal as the wiring conductor in the wiring board region, the metal frame and the wiring conductor can be simultaneously formed. In addition, it is possible to obtain a multi-cavity wiring board with high production efficiency without adding extra steps such as attaching a reinforcing plate.

Further, according to the method for manufacturing a wiring board of the present invention, since the above steps are sequentially performed, even if the viscosity of the thermosetting resin precursor is lowered when a plurality of insulating sheets are laminated and hot pressed. The metal frame prevents the flow of the thermosetting resin precursor to prevent the wiring conductor in the wiring board region from being deformed, and as a result, the positions of the through conductor and the wiring conductor connected to it are displaced, resulting in short circuit or disconnection. It is possible to provide a multi-cavity wiring board with excellent connection reliability that does not occur.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a multi-cavity wiring board of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1A is a plan view of a multi-cavity wiring board of the present invention, and FIG. 1B is a sectional view. In these figures, 1 is an insulating layer, 2 is a wiring conductor, 3 is a through conductor, 4
Is a metal frame, 5 is a wiring board region, and 6 is a mother board. These mainly constitute the multi-cavity wiring board of the present invention.

The multi-cavity wiring board of the present invention comprises an insulating layer 1.
Formed by arranging a large number of wiring board regions 5 in the central portion of a mother substrate 6 formed by stacking a plurality of layers and arranging a metal frame 4 between the wiring board regions 5 on the surface of the insulating layer 1 and in the outer peripheral portion. Has been done. Note that FIG. 1 shows an example in which three insulating layers 1 are laminated.

The insulating layer 1 has a thickness of 50 to 150 μm and has a function of supporting the wiring conductors 2 and maintaining insulation between the wiring conductors 2 positioned above and below, and is made of epoxy resin or bismaleimide triazine resin. It is made of a resin such as a modified polyphenylene ether resin and an insulating filler or fiber. If the thickness of the insulating layer 1 is less than 50 μm, the rigidity of the multi-cavity wiring board tends to decrease, and the wiring board tends to bend, while if it exceeds 150 μm, it tends to be difficult to reduce the weight of the wiring board. is there.

The wiring board areas 5 formed in the center of the mother board 6 are areas which serve as small wiring boards for mounting electronic components (not shown) such as semiconductor elements, and are provided at the boundaries thereof. Along with this, the mother board 6 is cut by a cutting machine such as a router to be divided into individual wiring boards.

A wiring conductor 2 is embedded in the surface of each insulating layer 1 in each wiring board region 5. The wiring conductor 2 has a function as a part of a conductive path that electrically connects each electrode of an electronic component such as a semiconductor element mounted in the wiring board region 5 to an external electric circuit board (not shown), 20-200μ width
m, the thickness is 5 to 50 μm, and is made of a metal foil such as copper, aluminum, nickel, silver, or gold, and particularly preferably a copper foil from the viewpoint of workability and low cost. If the width of the wiring conductor 2 is less than 20 μm, the wiring conductor 2 tends to be deformed or broken, and if it exceeds 200 μm, high density wiring cannot be formed. Further, if the thickness of the wiring conductor 2 is less than 5 μm, the strength of the wiring conductor 2 tends to decrease and deformation or disconnection tends to occur, and if it exceeds 50 μm, embedding in the insulating layer 1 tends to become difficult. . Therefore, the wiring conductor 2 preferably has a width of 20 to 200 μm and a thickness of 5 to 50 μm.

In each wiring board region 5 of each insulating layer 1, a plurality of penetrating conductors 3 are arranged from the upper surface to the lower surface. These penetrating conductors 3 have a function of electrically connecting the wiring conductors 2 located above and below the insulating layer 1,
It has a diameter of 30 to 200 μm and is formed by embedding a paste made of a metal powder such as copper or silver alloy and a triazine-based thermosetting resin in the through hole provided in the insulating layer 1. If the diameter of the through conductor 3 is less than 30 μm, its processing tends to be difficult, and if it exceeds 200 μm, high-density wiring cannot be formed. Therefore, the through conductor 3 preferably has a diameter of 30 to 200 μm.

Further, in the multi-cavity wiring board of the present invention, metal frames 4 are arranged between the wiring board regions 5 on the surface of each insulating layer 1 and in the outer peripheral portion. This is important in the multi-cavity wiring board of the present invention.

The metal frame 4 is made of a metal foil having a thickness of 5 to 50 μm, and a plurality of insulating layers 1 on which the wiring conductors 2 and the penetrating conductors 3 are formed are laminated and hot pressed to produce a multi-cavity wiring board. At this time, it has a function of maintaining the rigidity of the multi-cavity wiring board and preventing the multi-cavity wiring board from bending. If the thickness of the metal frame 4 is less than 5 μm, the rigidity of the multi-cavity wiring board decreases, and the central portion bends due to its own weight.
When an electrical inspection is performed by applying the electrical inspection probe from above and below, a portion where the electrical inspection probe does not come into contact with the wiring conductor 2 on the surface of the multi-cavity wiring board is liable to occur, and an accurate electrical inspection result may not be obtained. If it exceeds 50 μm, it is difficult to reduce the weight of the multi-cavity wiring board. Therefore, the metal frame 4 preferably has a thickness of 5 to 50 μm.

Further, the metal frame 4 has a width of 0.5 to 2.0 mm at a portion arranged between the wiring board regions 5,
It is preferable that the width of the portion disposed on the outer peripheral portion of the is 10 to 30 mm. The width of the metal frame 4 between the wiring board regions 5 is 0.5 m
If it is less than m, the rigidity of the multi-cavity wiring board is reduced, the center portion is bent by its own weight, and when conducting an electrical inspection by applying an electrical inspection probe from above and below, the electrical inspection is performed on the wiring conductor 2 on the surface of the multi-cavity wiring board. The area where the probe does not come into contact tends to make it impossible to obtain accurate electrical inspection results.
If it exceeds m, the space between the wiring board regions 5 becomes large and the number of wiring board regions 5 taken tends to decrease. Furthermore, when the width of the metal frame 4 on the outer peripheral portion is less than 10 mm, the rigidity of the multi-cavity wiring board decreases on the outer periphery of the multi-cavity wiring board, the center portion bends due to its own weight, and the electrical inspection probe is applied from above and below. When conducting an electrical inspection, there is a tendency that a portion where the electrical inspection probe does not come into contact with the wiring conductor 2 on the surface of the multi-cavity wiring substrate will not be able to obtain an accurate electrical inspection result. There is a tendency that the number of harvested animals cannot be increased sufficiently. Therefore, in the metal frame 4, the width of the portion disposed between the wiring board regions 5 may be 0.5 to 2.0 mm, and the width of the portion disposed on the outer peripheral portion of the wiring substrate region 5 may be 10 to 30 mm. preferable.

Incidentally, such a metal frame 4 is used for the wiring conductor 2
Similarly, it is made of a metal foil of copper, aluminum, nickel, silver, gold or the like, and is preferably made of a copper foil particularly from the viewpoints of workability and low cost. Further, the metal frame 4 is provided in the wiring conductor 2 of the wiring board region 5. By using the same metal, the metal frame 4 and the wiring conductor 2 can be formed at the same time, and an extra step such as attaching a reinforcing plate does not increase, and a multi-cavity wiring board with high production efficiency can be obtained. Can be Therefore, it is preferable that the metal frame 4 is made of the same metal as the wiring conductor 2 in the wiring board region.

Such a multi-cavity wiring board is manufactured by the method described below. First, a heat-resistant fiber such as glass cloth or aramid fiber is impregnated with a thermosetting resin precursor such as an epoxy resin or a modified polyphenylene resin to semi-cure the insulating sheet, and then the wiring of the insulating sheet is manufactured. A through hole having a diameter of 30 to 200 μm is bored at a predetermined position which becomes the substrate region 5 by using a conventionally known method such as a carbon dioxide gas laser or a YAG laser. And
A well-known screen printing method is used for the through holes, and a paste containing a thermosetting resin precursor such as copper or silver alloy powder and a triazine resin is screen printed (press-fitting).
The through conductor 3 is formed by embedding in. After that, a separately prepared wiring conductor 2 made of a metal foil such as copper or nickel is formed on a surface of the insulating sheet in a predetermined pattern at a portion corresponding to each wiring board region 5, and copper or nickel or the like is also formed. Polyethylene terephthalate (PET) in which a metal frame body 4 made of a metal foil is adhered and formed between the wiring board regions 5 of the insulating sheet and at a portion corresponding to the outer peripheral portion.
A transfer sheet made of a heat-resistant resin such as a resin is aligned and superposed on an insulating sheet so that the predetermined through conductors 3 and wiring conductors 2 are connected, and these are laminated at 100 to 150 ° C. using a heat press machine. The transfer sheet is pressed against the insulating sheet by pressing for a few minutes, and the wiring conductor 2 and the metal frame 4 are transferred and embedded in the insulating sheet 7. After that, the transfer sheet is peeled off from the insulating sheet, and the insulating sheets from which the transfer sheet is peeled off are stacked on top of each other and heat-pressed at a temperature of 150 to 240 ° C for several hours using a heat press machine to obtain multiple pieces. A wiring board is obtained. Then, this multi-cavity wiring board is divided into a large number of wiring board areas 5 by cutting between each wiring board area 5 and the metal frame 4 with a cutting machine such as a router.

Thus, according to the multi-cavity wiring board of the present invention, the metal frame 4 is provided between and in the outer peripheral portions of the plurality of wiring board regions 5 arranged in the central portion of the mother board formed by laminating a plurality of insulating layers 1. Since it is arranged, the thickness of the multi-cavity wiring board can be reduced.
Metal frame 4 even when thinned to around 200-500 μm
Keeps the rigidity of the multi-cavity wiring board, and the multi-cavity wiring board does not bend, and as a result, when electrically inspecting the multi-cavity wiring board, the electrical inspection probe is used for wiring conductors on the surface of the multi-cavity wiring board. It is possible to make a multi-cavity wiring board that can be surely brought into contact with the substrate 2 and can obtain accurate electrical inspection results.

The thickness of the metal frame 4 is 5 to 50 μm, and the width of the metal frame 4 between the wiring board regions 5 is 0.5 to 2.0 m.
Since m is set, the rigidity does not decrease even if the multi-piece wiring board has a large area, and as a result, the number of wiring boards to be taken can be increased and the production efficiency of the multi-piece wiring board is high. Can be

Furthermore, since the metal frame 4 is made of the same metal as the wiring conductor 2 in the wiring board region 5, the metal frame 4 and the wiring conductor 2 can be formed at the same time, and an extra step such as attaching a reinforcing plate is performed. It is possible to obtain a multi-cavity wiring board with high production efficiency without increasing the number of wiring boards.

The present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the gist of the present invention. For example, in the above-mentioned embodiments, three insulating layers are used. Although the case where the insulating layers are laminated is illustrated, the insulating layer may be two layers or four or more layers.

Next, the method for manufacturing a multi-cavity wiring board of the present invention will be described in detail by taking the case of manufacturing the above-mentioned multi-cavity wiring board as an example. 2 (a) to 2 (d) are process drawings for each process for explaining the method for manufacturing a multi-cavity wiring board of the present invention. In these drawings, 7 is an insulating sheet and 8 is a transfer sheet. Is. The same members as those in FIG. 1 are designated by the same reference numerals as those in FIG.

First, the insulating sheet 7 and the transfer sheet 8 are prepared. The insulating sheet 7 serves as the insulating layer 1 in the multi-cavity wiring board shown in FIG.
It is about 150 μm and is made by impregnating heat-resistant fiber such as glass cloth or aramid fiber with a thermosetting resin precursor such as epoxy resin or modified polyphenylene resin and semi-curing the surface of the wiring conductor 2 or The plasticity is such that the metal frame 4 can be embedded. A plurality of wiring board regions 5 are arranged in the central portion of the insulating sheet 7, as will be described later.

On the other hand, the transfer sheet 8 is made of a heat resistant resin such as polyethylene terephthalate (PET) resin, and the wiring conductor 2 made of a metal foil such as copper or nickel is provided on the surface of each of the wiring boards of the insulating sheet 7. In addition to being formed in a predetermined pattern on the region corresponding to the region 5,
Similarly, a metal frame body 4 made of a metal foil such as copper or nickel is adhered and formed between the wiring board regions 5 of the insulating sheet 7 and at a portion corresponding to the outer peripheral portion. The wiring conductor 2 and the metal frame body 4 are made of copper or nickel having a thickness of about 18 μm on the entire one main surface of the transfer sheet 8 base material made of a heat-resistant resin such as polyethylene terephthalate having a thickness of about 18 μm. After peelingly adhering the resulting metal foil via an adhesive such as acrylic resin, apply a liquid or film-like photosensitive resist on the metal foil and expose it.
After developing to form an etching mask having a pattern corresponding to the pattern of the wiring conductor 2 and the metal frame 4, the non-patterned portion of the metal foil is removed by etching by immersion in a ferric chloride solution, and then a photosensitive resist is applied. It is formed by peeling and removing.

Next, as shown in the process diagram of FIG.
Through holes are formed in the wiring board region 5 of the insulating sheet 7, and the through conductors 3 are formed by embedding a conductive paste in the through holes. Such a through conductor 3 is formed by forming a through hole in the insulating sheet 7 using a carbon dioxide gas laser, a YAG laser or the like, and then, for example, copper or silver alloy powder and a thermosetting resin such as a triazine resin in the through hole. Screen printing method (press-fitting) of metal paste containing precursor
It is formed by embedding in. The through conductor 3
Has a diameter of 30 to 200 μm, and if the diameter of the through conductor 3 is less than 30 μm, its processing tends to be difficult, and if it exceeds 200 μm, it tends to be difficult to form high-density wiring. Therefore, the through conductor 3 preferably has a diameter of 30 to 200 μm.

Next, as shown in the process diagram of FIG.
The transfer sheet 8 and the insulating sheet 7 are aligned so that the penetrating conductor 3 and the wiring conductor 4 are electrically connected, and then these are pressed for several minutes at 100 to 150 ° C. using a heat press machine. Thus, the transfer sheet 8 is pressed against the insulating sheet 7, and the wiring conductor 2 and the metal frame 4 are transferred and embedded in the insulating sheet 7. At this time, since the metal frame 4 is embedded between the wiring board regions 5 of the insulating sheet 7 and in the outer peripheral portion, it is thermosetting when a plurality of insulating sheets 7 described later are laminated and hot pressed. Even if the viscosity of the resin precursor is reduced, the metal frame 4 prevents the thermosetting resin precursor from flowing and the wiring conductor 2 is not deformed. As a result, the through conductor 3
It is possible to manufacture a multi-cavity wiring board which is excellent in connection reliability and does not cause a short circuit or a disconnection due to the position of the wiring conductor 2 connected thereto being displaced. If the thickness of the wiring conductor 2 and the metal frame 4 is less than 5 μm, the rigidity of the metal frame 4 is low, so that the flow of the thermosetting resin precursor cannot be sufficiently prevented and the wiring conductor 2 is likely to be deformed. , On the other hand, 50μ
When it exceeds m, it becomes difficult to satisfactorily embed the wiring conductor 2 and the metal frame 4 in the insulating sheet 7, and large irregularities are formed on the surface of the obtained multi-cavity wiring board, and this wiring board has electronic components. There is a tendency that components cannot be mounted well. Therefore, the thickness of the wiring conductor 2 and the metal frame 4 is preferably in the range of 5 to 50 μm. Further, the width of the metal frame 4 between the wiring board regions 5 is 0.
When the thickness is less than 5 mm, it is difficult to prevent the flow of the thermosetting resin precursor because the rigidity of the metal frame 4 is low, and the flow of the thermosetting resin precursor cannot be sufficiently prevented, and the wiring conductor 2
Deformation tends to occur on the other hand, if it exceeds 2 mm,
Since the metal frame 4 having such a width is provided between the wiring board areas 5, the size of the multi-piece wiring board becomes unnecessarily large, or the number of wiring board areas 5 taken becomes small. Therefore, the width of the metal frame 4 between the wiring board regions 5 is preferably in the range of 0.5 to 2 mm. further,
When the width of the metal frame 4 on the outer peripheral portion of the insulating sheet 7 is less than 10 mm, the rigidity of the metal frame 4 is low, so that the flow of the thermosetting resin precursor cannot be sufficiently prevented, and the wiring conductor 2 and the metal frame 4 are prevented from flowing. When transferring to the insulating sheet 7, the wiring conductor 2 and the metal frame 4
Is likely to be deformed, while if it exceeds 30 mm,
Since the metal frame 4 having such a width is provided on the outer peripheral portion of the insulating sheet 7, the size of the multi-piece wiring board becomes unnecessarily large, or the number of wiring board regions 5 is small. Therefore, the width of the metal frame 4 on the outer peripheral portion of the insulating sheet 7 is preferably in the range of 10 to 30 mm.

Next, as shown in the sectional view of FIG.
The base material of the transfer sheet 8 is peeled off from the insulating sheet 7 in which the wiring conductor 2 and the metal frame 4 have been transferred and embedded.

Finally, as shown in the sectional view of FIG. 2 (d), a plurality of insulating sheets 7 having the wiring conductors 2 and the metal frame 4 imprinted and embedded on both sides or one side are laminated and a heat press is used. By hot pressing at 150-240 ℃ for several hours,
The multi-cavity wiring board of the present invention can be obtained by curing and integrating the insulating sheet 7 and the thermosetting resin precursor in the penetrating conductor 3.

Thus, according to the method for manufacturing a multi-cavity wiring board of the present invention, since the metal frames 4 are arranged between the wiring board regions 5 of the respective insulating sheets 7 and on the outer periphery thereof, the thickness of the multi-cavity wiring board is increased. Even when the thickness is reduced to about 50 to 150 μm, the metal frame 4 retains the rigidity of the multi-cavity wiring board,
The multi-cavity wiring board does not bend, and as a result, when electrically inspecting the multi-cavity wiring board, the electrical inspection probe can be reliably brought into contact with the wiring conductor 2 on the surface of the multi-cavity wiring board. It is possible to obtain a multi-cavity wiring board that can obtain accurate electrical inspection results.

The multi-cavity wiring board is divided into a large number of wiring board areas 5 by cutting between the wiring board areas 5 and the metal frame 4 with a cutting machine such as a router.

The present invention is not limited to the above-mentioned embodiments, and may be within the scope of the present invention.
It goes without saying that various modifications are possible.

[0041]

According to the multi-cavity wiring board of the present invention,
Since the metal frame is provided between the outer periphery and the many wiring board regions arranged in the central portion of the mother board formed by stacking a plurality of insulating layers, the thickness of the multi-cavity wiring board is about 200 to 500 μm. Even when thinned, the metal frame maintains the rigidity of the multi-cavity wiring board, and the multi-cavity wiring board does not bend. As a result, when electrically inspecting the multi-cavity wiring board,
The electrical inspection probe can be reliably brought into contact with the wiring conductor on the surface of the multi-cavity wiring board, and a multi-cavity wiring board can be obtained in which an accurate electrical inspection result can be obtained.

According to the multi-cavity wiring board of the present invention, the metal frame has a thickness of 5 to 50 μm and the width of the metal frame between the wiring board regions is 0.5 to 2.0 mm. Even if the individual wiring board has a large area, the rigidity does not decrease, and as a result, the number of wiring boards can be increased, and a multi-cavity wiring board with high production efficiency can be obtained.

Further, according to the multi-cavity wiring board of the present invention, since the metal frame is made of the same metal as the wiring conductor in the wiring board region, the metal frame and the wiring conductor can be formed at the same time and the reinforcing plate. There is no increase in extra steps such as mounting, and a multi-cavity wiring board with high production efficiency can be obtained.

Further, according to the method for manufacturing a wiring board of the present invention, since the above steps are sequentially performed, it is considered that the viscosity of the thermosetting resin precursor is lowered when a plurality of insulating sheets are laminated and hot pressed. However, the metal frame prevents the flow of the thermosetting resin precursor and the wiring conductor in the wiring substrate area is not deformed. As a result, the position of the through conductor and the wiring conductor connected to it is displaced, resulting in a short circuit or disconnection. It is possible to provide a multi-cavity wiring board that is excellent in connection reliability and that does not cause a problem.

[Brief description of drawings]

1A and 1B are a plan view and a cross-sectional view showing an example of an embodiment of a multi-cavity wiring board of the present invention, respectively.

FIG. 2A to FIG. 2D are process drawings for each process for explaining the method for manufacturing a wiring board according to the present invention.

[Explanation of symbols]

1 ... Insulating layer 2 ... Wiring conductor 3 ... Penetration conductor 4 ... Metal frame 5 ・ ・ Wiring board area 6 ... Mother board 7 ... Insulation sheet 8 ... Transfer sheet

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/40 H05K 3/40 E 3/46 3/46 G NTZ F term (reference) 5E317 AA24 BB02 BB03 BB12 CC22 CC25 CD29 CD31 CD32 GG09 GG11 GG16 5E338 AA03 AA16 BB02 BB13 BB25 BB45 BB72 CC01 CD22 EE28 EE32. FF18 GG26 GG28 HH07 HH11 HH33

Claims (4)

[Claims] 1. A wiring conductor is formed on a surface of the insulating layer in a central portion of a mother substrate formed by laminating a plurality of insulating layers, and the wiring conductors located vertically above and below the insulating layer are electrically connected to each other. A large number of wiring board regions in which penetrating conductors to be connected are formed, and a metal frame is arranged between the wiring board regions on the surface of the insulating layer and in the outer peripheral portion. Wiring board. 2. The metal frame has a thickness of 5 to 50 μm and a width between the wiring board regions of 0.5 to 2.0.
The multi-cavity wiring board according to claim 1, wherein the wiring board has a multi-wiring structure. 3. The multi-cavity wiring board according to claim 1, wherein the metal frame is made of the same metal as the wiring conductor. 4. An insulating sheet comprising a thermosetting resin precursor and a heat resistant fiber, wherein a large number of wiring board regions are arranged in the central portion, and a transfer sheet substrate made of a heat resistant resin on the wiring board region. A step of preparing a transfer sheet in which a wiring conductor having a predetermined pattern is formed in corresponding portions and a metal frame is formed between the wiring substrate areas and portions corresponding to the outer peripheral portion, and the insulating sheet is penetrated into the wiring substrate area. Forming a through hole and forming a through conductor in the through hole; and pressing the transfer sheet against the insulating sheet to transfer and embed the wiring conductor and the metal frame in the insulating sheet, and the through conductor. And a step of electrically connecting the wiring conductor to the wiring conductor, and a step of peeling the transfer sheet base material from the insulating sheet in which the wiring conductor and the metal frame are transfer-embedded. A step of stacking a plurality of insulating sheets in which the wiring conductors and the metal frame are transfer-embedded and curing the thermosetting resin precursor to integrate them into a multi-cavity wiring. Substrate manufacturing method.