JP2007207934A - Sheet-like aggregate substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-like aggregate substrate exhibiting high rigidity as the whole substrate in which damage such as cracking or chipping does not occur in the entire production process, good handling performance is ensured during production, handling is simplified, and excellent productivity is ensured. <P>SOLUTION: The integral sheet-like aggregate substrate 10 comprises a plurality of constitutive member forming regions A where a structural member constituting an electronic component is formed are arranged in matrix. A marginal region B provided at the outermost circumferential edge of the sheet-like aggregate substrate has a thickness thicker than that at the plurality of constitutive member forming regions constituting the sheet-like aggregate substrate. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a sheet-like collective substrate for forming a structural member constituting an electronic component used when forming an electronic component used in an electronic device such as a portable communication device.

  Conventionally, a large number of various electronic components are used in electronic devices such as portable communication devices. As one of these electronic components, a piezoelectric device such as a piezoelectric vibrator or a piezoelectric oscillator having a piezoelectric vibration element mounted therein is used to generate a reference signal in the electronic apparatus. As an example of such a conventional piezoelectric device, a crystal resonator in which a crystal resonator element using crystal as a piezoelectric material is mounted inside a container body constituting the piezoelectric device will be described as an example.

  As a conventional surface-mount type crystal resonator, a crystal vibration as a piezoelectric vibration element is formed on a bottom surface in a concave space opened on one main surface of a container body formed by laminating insulating substrates made of a ceramic material or the like. The element is mounted in such a manner that the element is held only at one end side of the short side, and further, the metal is formed on the sealing conductor pattern formed so as to surround the opening on the side surface of the opening of the container body. 2. Description of the Related Art There is known a structure in which a lid is placed so as to cover an opening, and a quartz vibrating element in a space is hermetically sealed by fixing the lid and a conductor pattern.

  Further, in the manufacture of such a crystal resonator, a plurality of container body forming regions constituting a container body which is one of the structural members constituting the crystal resonator as shown in FIG. Formed as an integrated sheet-like collective substrate 40, and a quartz resonator element 42 is inserted and mounted in each of the concave space portions 41 formed in each container body formation region, and each space portion 41 is covered. Then, the lid body 43 is placed and fixed on the sheet-like aggregate substrate 40. Thereafter, a method of simultaneously obtaining a plurality of crystal resonators by cutting the sheet-like aggregate substrate 40 along a cutting line on the outer periphery of each container body forming region is used.

The following prior art documents are disclosed for piezoelectric devices such as piezoelectric vibrators and piezoelectric oscillators, which are one of electronic components, manufactured using the sheet-like collective substrate as described above.
Japanese Patent Laid-Open No. 2004-253865 JP 2003-298000 A Japanese Patent Laid-Open No. 10-289967

  In addition, the applicant did not find any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the above prior art document information.

  In the sheet-like collective substrate used in the manufacturing method as described above, when the electronic component to be manufactured (piezoelectric device in the above-described example) is significantly thinned, a sheet for forming a structural member constituting the electronic component The thickness of the entire aggregated substrate is also reduced. When an electronic component is manufactured using such a thin sheet-like collective substrate, the rigidity of the substrate is weak, so when the sheet-like collective substrate is divided and cut using a dicing blade, the sheet In the worst case, the stress generated by the rotating or sliding contact of the dicing blade to the outermost peripheral edge of the collective substrate causes cracks, chipping, etc. to reach the entire sheet-like collective substrate, thereby constituting an electronic component. There was a drawback that the structural member (the container body 1 in the above example) would be defective.

  In addition, in the process of manufacturing electronic components, when a sheet-like collective substrate is transported within a manufacturing apparatus or between manufacturing apparatuses in each process, it is necessary to handle the sheet-like collective substrate. Then, due to the stress applied to the sheet-like aggregate substrate during handling (for example, handling in such a manner that the side surfaces of the opposite sides of the sheet-like aggregate substrate are sandwiched toward the center of the sheet-like aggregate substrate) There was the fault that it broke. This also has the disadvantage that the productivity of the electronic components of the piezoelectric device is reduced.

  The present invention has been devised to solve the above-mentioned drawbacks, and its purpose is high rigidity as a whole substrate, without causing cracks and chipping in the whole manufacturing process, and good handling at the time of manufacturing, The object is to provide a sheet-like aggregate substrate that is easy to handle and excellent in productivity.

  The sheet-like collective substrate according to the present invention is an integrated sheet-like collective substrate in which a plurality of constituent member forming regions in which structural members constituting electronic components are formed are arranged and arranged in a matrix. The thickness of the surplus area provided in the outermost peripheral edge is thicker than the thickest part in the plurality of constituent member forming area portions constituting the sheet-like aggregate substrate.

  In addition, at least one of the first substrates of the first substrate constituting the sheet-like collective substrate in which the marginal region of the outermost peripheral edge of the sheet-like collective substrate is formed with the maximum thickness in the component member forming region as the maximum thickness. The substrate is formed by disposing and bonding a base body having a predetermined thickness on the outermost peripheral portion of the surface, which is made of the same material as that of the first substrate.

  Further, the substrate formed on the marginal region of the outermost peripheral edge portion of the first substrate is configured to surround all of the plurality of component member forming regions.

  According to the sheet-like collective substrate of the present invention, the thickness of the abandoned region provided at the outermost peripheral edge of the sheet-like collective substrate is set to be the thickest in the plurality of component member forming region portions constituting the sheet-like collective substrate. The first substrate constituting the sheet-like collective substrate is made thicker than the thick portion and the means for making the thickest portion thicker than the thickest portion in the plurality of constituent member forming region portions constituting the sheet-like collective substrate. By using a base material of the same material as the first substrate and having a predetermined thickness on the marginal area of the outermost peripheral portion of at least one main surface, the rigidity of the sheet-like aggregate substrate (particularly, It is possible to increase the rigidity of the outermost peripheral edge portion, and it is possible to prevent the occurrence of cracks and chipping due to stress generated when the sheet-like aggregate substrate is cut and divided.

  In addition, it is possible to prevent the sheet-like collective substrate from being damaged during handling, which has occurred when the sheet-like collective substrate is transported in the manufacturing process during the manufacture of electronic components. Furthermore, since the stop of the manufacturing process due to the breakage of the sheet-like aggregate substrate during handling can be prevented, the productivity of electronic components can be improved.

  Therefore, according to the present invention, there is an effect of providing a sheet-like collective substrate that has a good yield during manufacture and is easy to handle in the manufacturing process.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In each of the drawings, a part of the structure is not shown, and some dimensions are exaggerated for the sake of clarity. In particular, the thickness dimension of each part is shown exaggerated significantly from the actual dimension.

  FIG. 1 is a sheet-like collective substrate of structural members (in this embodiment, a container body constituting a piezoelectric vibrator is taken as an example) constituting an electronic component (a piezoelectric vibrator is taken as an example in this embodiment) according to the present invention. 10 is a perspective view showing one embodiment of FIG. FIG. 2 is a plan view of a part of the sheet-like collective substrate 10 shown in FIG. 1 as viewed from above. Further, FIG. 3 is a schematic process diagram showing a part of a process in the case of manufacturing a piezoelectric vibrator which is one of electronic components using the sheet-like collective substrate disclosed in FIG. Note that the piezoelectric vibrator disclosed in FIG. 3 is roughly a container body 1, a crystal resonator element 2 as a piezoelectric resonator element mounted in the container body 1, and a space in which the crystal resonator element 2 is mounted. It is comprised with the cover body 3 which airtightly seals a part.

  The main part of the sheet-like collective substrate 10 disclosed in FIGS. 1 and 2 is formed by laminating a plurality of insulating substrates made of a ceramic material such as glass-ceramic and alumina ceramic. The outer shape is applied to the shape, and the insulating substrates are laminated and fired in a predetermined order, whereby the sheet-like collective substrate 10 having an integral desired outer shape is obtained.

  The sheet-like collective substrate 10 disclosed in FIG. 1 and FIG. 2 includes a plurality (16 pieces in FIG. 1) of container body forming regions constituting a container body 1 that is a structural member constituting a piezoelectric vibrator that is one of electronic components. In a form in which the part A is arranged and assembled in a matrix while sandwiching the disposal area part B between each container body forming area part A, and in a form surrounding a group of a plurality of arranged container body forming area parts A Further, a margin area B is formed.

  In each container body forming region A, a concave space 11 having a rectangular opening is formed to mount a crystal resonator element 2 described later as a container 1. On the bottom surface in each space portion 11, there is an element connection electrode pad 12 that is electrically connected to the excitation electrode formed in the crystal resonator element 2 and mechanically holds the crystal resonator element 2. A pair is formed. The element mounting electrode pad 12 is one of the sheet-like collective substrates 10 in which the opening portions of the space portions 11 are formed by conductive wires or via holes formed in each container body forming region portion A. Is electrically connected to a predetermined electrode terminal of the external connection electrode terminals 13 as a piezoelectric vibrator, which is formed in each container body forming region A on the other main surface opposite to the main surface. It is.

  In addition, a band-shaped sealing conductor used for fixing a lid 3 (to be described later) to the container body 1 on one main surface of the sheet-like collective substrate 10 in a form surrounding the opening of each space portion 11. A pattern portion 14 is formed. For example, the sealing conductor pattern 14 has a thickness of 10 μm to 25 μm by sequentially depositing a nickel (Ni) layer and a gold (Au) layer on the surface of a base layer made of tungsten (W), molybdenum (Mo), or the like. It is formed in thickness.

  These various structural members are formed, and the separation region portion B is formed around the plurality of container body formation region portions A that are arranged in a group with the separation region portion B interposed therebetween. Thus, the first substrate 16 is formed. A group of said container body formation area part A on the main surface by which the opening part of the space part 11 is formed among the disposal area parts B formed around these container body formation area parts A. The base 15 having a form surrounding the base portion 15 is disposed and joined to the disposal region portion B. The base body 15 is made of a ceramic material such as glass-ceramic or alumina ceramic constituting the container body forming area part A or the disposal area part B, and when the container body forming area part A or the disposal area part B is laminated and formed. At the same time, it is disposed on the disposal region portion B, and is baked and joined. With respect to the thickness dimension of the base body 15, cracks such that the rigidity of the sheet-like aggregate substrate provided with the base body 15 can withstand the load of various stresses during the manufacturing process and reach the container body forming region A in the base body 15. The thickness dimension is appropriately determined depending on the outer size of the sheet-like collective substrate and the thickness of the container body forming region A (the same as the thickness of the container body 1 as a product). .

  In the sheet-like collective substrate 10 disclosed in FIG. 1, the form of the base body 15 is disclosed as a form surrounding a group of container body forming region portions A. However, the form of the base body 15 is the form disclosed in FIG. 1. It is not limited. For example, if the weight point of stress applied to the sheet-like collective substrate 10 is limited to a portion having the abandoned region portion B, the effect of the present invention can be achieved even in the form in which the base body 15 is formed only on the stress weight point portion. It becomes possible to play. Further, in the sheet-like collective substrate 10 of FIG. 1, a total of 16 container body formation region portions A are arranged in four rows and four rows, but this is shown for ease of explanation. In industrial and industrial use, a sheet-like collective substrate in which the number of formed container body forming regions A is further increased is used.

Next, one step of a method for manufacturing a piezoelectric vibrator using quartz as a piezoelectric material, which is one of electronic components, using the sheet-like collective substrate 10 described above will be described with reference to FIG. Here, each figure of Fig.3 (a)-(c) is a perspective view showing each structural member in each process.
(Process A)
First, as shown in FIG. 3A, a sheet substrate 10 as described above and disclosed in FIG. 1 is prepared. The prepared sheet-like collective substrate 10 is handled and supplied to a predetermined position in the manufacturing apparatus during the manufacturing process (not shown). In order to prevent the sheet-like collective substrate 10 from being damaged due to the stress applied to the sheet-like collective substrate 10 during the handling of the sheet-like collective substrate 10 during such a manufacturing process, the structure shown in FIG. Is used.

(Process B)
Next, as shown in FIG. 3 (b), a crystal is placed in the space portion 11 formed in each container body forming region portion A in the sheet-like collective substrate 10 which is arranged and fixed at a predetermined position in the apparatus. The vibration element 2 is inserted and disposed, and the crystal vibration element 2 is conductively fixed to the element mounting electrode pad 12. Thereafter, the lid 3 in a form covering the opening of the space 11 is disposed on the sealing conductor pattern 14 formed so as to surround the opening of the space 11 on which the crystal resonator element 2 is mounted. Then, the sealing conductor pattern 14 and the lid 3 are heat bonded to hermetically seal the space 11 in which the crystal resonator element 2 is mounted.

  The lid 3 is manufactured by adopting a conventionally known metal processing method and molding a metal plate such as 42 alloy into a predetermined shape. The lid 3 has a structure in which a nickel (Ni) layer is formed on one main surface of a main metal plate, and a clad gold-tin (Au-Sn) layer is formed on the Ni layer. Is formed. In addition, when arrange | positioning the cover body 3 on the conductor pattern 14 for sealing, it arrange | positions in the form which this Au-Sn layer contacts the conductor pattern 14 for sealing. The thickness of the Au—Sn layer is 10 μm to 30 μm, and for example, the component ratio is 80% for gold and 20% for tin.

(Process C)
After the crystal resonator elements are mounted on all the container body forming area portions A in the sheet-like collective substrate 10 and hermetically sealed with the lid 3, the container body forming area section A and the disposal area section B (base 15 Dicing is performed along a cutting line C between the separation region portion B and the separation region portion B), and the container body formation region portion A and the separation region portion B are separated from each other, as shown in FIG. Separate the transducer.

  At the time of this cutting process, the base 15 is joined and formed on the outermost peripheral region B provided on the outermost periphery of the group of container body forming region portions A of the sheet-like collective substrate 10, so that the dicing blade becomes a sheet. The sheet-like collective substrate 10 can be rigid enough to withstand the stress applied to the sheet-like collective substrate 10 and can be prevented from being cracked, chipped or damaged. Moreover, since the stop of the manufacturing process due to the damage of the sheet-like aggregate substrate 10 or the like is prevented, the productivity can be improved.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention. For example, in the above-described embodiment, the piezoelectric vibrator is illustrated as an example of the electronic component. However, the present invention is not limited to the case of the above-described embodiment, and includes a piezoelectric device such as a piezoelectric oscillator or a surface acoustic wave filter. Even when manufacturing other electronic components, in the case where the structural members constituting the electronic components are manufactured using a sheet-like aggregate substrate, the present invention is achieved by using the sheet-like aggregate substrate having the structure as in the present invention. It is possible to achieve the same effects as the invention.

FIG. 1 is a perspective view showing an embodiment of a sheet-like collective substrate 10 of a structural member (container body) constituting an electronic component (piezoelectric vibrator) in the present invention. FIG. 2 is a plan view of a part of the sheet-like collective substrate 10 shown in FIG. 1 as viewed from above. FIG. 3 is a schematic process diagram showing a part of a process in manufacturing a piezoelectric vibrator, which is one of electronic components, using the sheet-like aggregate substrate disclosed in FIG. FIG. 4 is a perspective view showing a sheet-like collective substrate used when manufacturing a conventional electronic component (piezoelectric vibrator).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Container body 2 ... Piezoelectric vibration element (crystal vibration element)
DESCRIPTION OF SYMBOLS 3 ... Lid body 10 ... Sheet-like collective substrate 11 ... Space part 12 ... Electrode pad for element mounting 14 ... Conductive pattern for sealing 15 ... Base | substrate 16 ... 1st Substrate A: Structural member forming region (container forming region)
B ... Abandonment area C ... Cutting line

Claims (3)

In an integrated sheet-like collective substrate formed by arranging a plurality of constituent member forming region portions in which a structural member constituting an electronic component is formed in a matrix,
The thickness of the marginal area provided at the outermost peripheral edge of the sheet-like collective substrate is thicker than the thickest part of the plurality of component forming area portions constituting the sheet-like collective substrate. A sheet-like collective substrate characterized by the above.   The discard area portion formed at the outermost peripheral edge portion of the sheet-like collective substrate constitutes a first aggregate that forms the sheet-like collective substrate in which the maximum thickness in the constituent member forming region portion is formed as the maximum thickness. The substrate is formed by disposing and bonding a base body having the same material as the first substrate and having a predetermined thickness on the marginal region of the outermost peripheral portion of at least one main surface of the substrate. The sheet-like collective substrate according to claim 1.   3. The structure according to claim 1, wherein the base formed on the marginal region of the outermost peripheral edge of the first substrate surrounds all of the plurality of component member forming regions. Sheet-like collective substrate.

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