JP2010258389A - Multiple patterning wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of preventing waste of a board material by making a cut region narrow, and effectively preventing the occurrence of flaws, dents, adhesion or the like to both surfaces of each product region when a plurality of the multiple patterning wiring boards are stacked on one another, and stably stackable by preventing the plurality of multiple patterning wiring boards from easily sliding on one another. <P>SOLUTION: In the multiple patterning wiring board 10, a plurality of product regions 3 each becoming a compact wiring board are arranged and formed side by side in a central part by interposing cut regions 4 therebetween, and a frame-like margin region 5 surrounding the central part is formed in an outer peripheral part. Projecting parts 7 having heights projecting from upper and lower surfaces of the product regions 3 and each formed of solder resist are formed on the upper and lower surfaces of at least either of the cut regions 4 and the margin regions 5. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  According to the present invention, a plurality of product areas to be small wiring boards are arranged in a row at a central portion with a cutting region interposed therebetween, and a frame-shaped discard margin region surrounding the central portion is formed on an outer peripheral portion. The present invention relates to a multi-cavity wiring board.

  2. Description of the Related Art Conventionally, a multi-piece wiring board has been used as a form for simultaneously handling a plurality of small wiring boards for mounting electronic elements such as semiconductor integrated circuit elements. This multi-cavity wiring board has a product area that becomes a plurality of small-sized wiring boards in the center, and is arranged side by side with a cutting area between them, and a frame-shaped discard margin area is formed integrally on the outside. Do it. Then, an electronic element such as a semiconductor integrated circuit element is mounted on each product area through, for example, a solder bump, and the electronic element is resin-sealed by, for example, a transfer mold method, and then cut along the cutting area. As a result, a large number of electronic devices in which electronic elements are mounted on a small wiring board and sealed with a resin are collectively manufactured.

  In such a multi-piece wiring board, wiring conductors for connecting to electrodes of electronic elements such as semiconductor integrated circuit elements are formed in each product region. The wiring conductor is made of, for example, copper plating and has a fine pattern with a width of about 10 to 20 μm in recent times. A part of the wiring conductor is exposed on the upper surface of each product region and is connected to the electrode of the electronic element. The connection pad for forming is formed. In many cases, solder bumps for connecting to the electrodes of the electronic elements are previously deposited on the surface of the connection pads.

  However, there are cases where such a multi-piece wiring board is handled by stacking a plurality of pieces at the time of handling. When multiple PCBs are stacked and handled, the upper PCB and the lower PCB are rubbed or pressed against each other, resulting in wiring conductors and solder in each product area. A bump or a dent may be formed on the bump. Such scratches and dents increase the risk of causing a disconnection or a short circuit in the wiring conductor, or causing a connection failure when connecting the electrode of the electronic element to the connection pad via the solder bump.

  Therefore, by providing dummy solder bumps that protrude beyond the solder bumps in the product area on the upper surface in the cutting area and the disposal allowance area of the multi-piece wiring board, soldering in the product area when the multi-piece wiring boards are stacked on each other is provided. A method for preventing scratches, dents, and the like generated on the bumps has been proposed. However, when a dummy solder bump is provided on the upper surface of the multi-cavity wiring board, a solder paste having a diameter of about 400 μm is printed on the cutting area of the multi-cavity wiring board so that the dummy solder bump has a sufficient height. Need to reflow. For this reason, the width of the cutting region becomes wider than at least 400 μm. Since such a wide cutting region is provided between the product regions, the substrate material to be used is likely to be wasted. Furthermore, since dummy solder bumps are provided only on the upper surface of the cutting area and the disposal allowance area, when a plurality of multi-cavity wiring boards are stacked, the upper multiple multi-cavity wiring board dummy solder bumps are removed. It directly hits the lower surface of the wiring board. Therefore, the dummy solder bumps of the lower multi-cavity wiring board and the lower surface of the product area of the upper multi-cavity wiring board rub against each other, and the lower multiple There is a risk that the components of the dummy solder bumps on the wiring board will adhere and the electrical insulation reliability in the product area of the upper multiple wiring board will be lowered. In addition, it is possible to form dummy solder bumps on both the upper and lower surfaces of the cutting area and discarding area, but in this case, the top surface of the solder bumps becomes a smooth spherical shape due to the surface tension when the solder melts, If the dummy solder bumps on the upper substrate and the dummy solder bumps on the lower substrate come into contact with each other, they will slip and shift, making it difficult to stack well.

JP 2003-218542 A

  An object of the present invention is to prevent a waste of substrate material by narrowing a cutting region, and when a plurality of multi-piece wiring boards are stacked, scratches or dents on both surfaces of each product region, or Another object of the present invention is to provide a multi-piece wiring board that can effectively prevent the occurrence of adhesion and the like and that can be stably stacked without slipping each other.

  The multi-cavity wiring board according to the present invention has a frame-like shape in which a plurality of product areas to be a small wiring board are arranged in a central part side by side with a cutting area in between, and a peripheral part surrounds the central part A multi-cavity wiring board having a disposal margin area formed thereon, and a protrusion comprising a solder resist having a height protruding from the upper and lower surfaces of the product area on the upper and lower surfaces of at least one of the cutting area and the disposal margin area Is formed.

  According to the multi-cavity wiring board of the present invention, since the upper and lower surfaces of at least one of the cutting region and the disposal margin region are formed with protrusions made of a solder resist having a height protruding from the upper and lower surfaces of the product region, When a plurality of multi-cavity wiring boards are stacked, the upper surface protrusions of the lower multi-cavity wiring board and the lower surface protrusions of the upper multi-cavity wiring board are at least partially overlapping each other. If a plurality of multi-layered wiring boards are stacked, the protrusions do not directly contact the upper and lower surfaces of the product area, so that the upper and lower surfaces of the product area are not damaged or dented. Can be protected.

  Also, if the upper surface side protrusion and the lower surface side protrusion are arranged so that the other is located adjacent to the inside of one of the upper surface side protrusions, a plurality of upper side The protrusion on the lower surface side of the multi-cavity wiring board and the protrusion on the upper surface side of the lower multi-cavity wiring board are engaged with each other in the horizontal direction, and a plurality of multi-cavity wiring boards are not displaced from each other. Can be stacked stably.

FIG. 1A is a top view showing an example of an embodiment of a multi-cavity wiring board according to the present invention, and FIG. 1B is a stack of the multi-cavity wiring boards shown in FIG. FIG. 2 is a cross-sectional view taken along a cutting line AA in FIG. 2A is a top view showing another example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 2B is a plan view of the multi-cavity wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.2 (a) at the time of stacking | stacking. FIG. 3A is a top view showing still another example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 3B is a plan view of the multi-cavity wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.3 (a) at the time of stacking two sheets. FIG. 4A is a top view showing still another example of the embodiment of the multi-piece wiring board of the present invention, and FIG. 4B shows the multi-piece wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.4 (a) at the time of stacking two sheets. FIG. 5A is a top view showing still another example of the embodiment of the multi-piece wiring board of the present invention, and FIG. 5B shows the multi-piece wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.5 (a) at the time of stacking two sheets. FIG. 6A is a top view showing still another example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 6B is a plan view of the multi-cavity wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.6 (a) at the time of stacking two sheets. FIG. 7A is a top view showing still another example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 7B is a plan view of the multi-cavity wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.7 (a) at the time of stacking two sheets. FIG. 8A is a top view showing still another example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 8B is a plan view of the multi-cavity wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.8 (a) at the time of stacking two sheets. FIG. 9A is a top view showing still another example of the embodiment of the multi-cavity wiring board of the present invention, and FIG. 9B is a plan view of the multi-cavity wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.9 (a) at the time of stacking two sheets. FIG. 10A is a top view showing still another example of the embodiment of the multi-piece wiring board of the present invention, and FIG. 10B shows the multi-piece wiring board shown in FIG. It is sectional drawing in the cutting line AA of Fig.10 (a) at the time of stacking two sheets. FIG. 11A is a top view showing still another example of the embodiment of the multi-piece wiring board of the present invention, and FIG. 11B shows the multi-piece wiring board shown in FIG. It is sectional drawing in cutting line AA of Fig.11 (a) at the time of stacking two sheets.

  Next, an example of an embodiment of the multi-piece wiring board according to the present invention will be described with reference to FIGS. 1 (a) and 1 (b). As shown in FIGS. 1A and 1B, the multi-piece wiring board 10 of this example includes wiring conductors 2 inside and on the surface of the insulating board 1. The insulating substrate 1 is made of, for example, a plurality of fiber-reinforced insulating resin materials obtained by impregnating a glass cloth with a thermosetting resin or filler-containing insulating resin materials obtained by dispersing an inorganic insulating filler such as silicon oxide in a thermosetting resin. The insulating layer is formed by laminating, and in each insulating layer, a through-hole called a through hole or a via hole for electrically connecting the wiring conductor 2 is formed. The wiring conductor 2 is formed by depositing a conductive material made of copper foil or a copper plating layer on each insulating layer in a predetermined pattern.

  In the central portion of the multi-piece wiring substrate 10, a rectangular product region 3 serving as a small wiring substrate for mounting an electronic element (not shown) such as a semiconductor integrated circuit element is provided with a band-shaped cutting region 4 therebetween. A plurality of rows are arranged side by side, and a rectangular frame-shaped discard margin region 5 is formed on the outer peripheral portion so as to surround the central portion. In this example, an example is shown in which six product regions 3 are formed in a 2 × 3 array. However, the number of product regions 3 to be arranged and the arrangement method may be appropriately changed as necessary.

  In each product region 4, wiring conductors 2 that are electrically connected to mounted electronic elements are arranged in a predetermined pattern including fine wiring having a width of, for example, about 10 to 20 μm from the upper surface to the lower surface. . A part of the wiring conductor 2 exposed on the upper surface of each product region 3 forms a connection pad that is electrically connected to the electrode terminal of the electronic element. The connection pad is electrically connected to the electrode terminal of the electronic element. Solder bumps 6 are attached for the purpose of connection. The wiring conductor 2 is formed by a known subtractive method, semi-additive method, transfer method, or the like. The solder bumps 6 are formed by a method of reflowing after printing a solder paste on the connection pads or a method of plating the connection pads with solder. In this example, the connection pad is circular, but the connection pad may have another shape such as a square or a rectangle.

  The cutting region 4 is a cutting allowance for integrally holding the plurality of product regions 3 by being interposed between the plurality of product regions 3 and cutting each product region 3 into a piece of wiring board, By cutting the cutting area 4 with a dicing machine, a router, a laser cutting device or the like, each product area 3 in the multi-piece wiring board 10 is cut out as a single wiring board and becomes independent.

  The disposal allowance area 5 is an area that functions as a support for facilitating the handling of the multi-cavity wiring board 10. The disposal allowance area 5 is a positioning part or holding part when processing the multi-cavity wiring board 10. As a result, it is possible to perform necessary processing on each product region 3.

  Furthermore, in the multi-cavity wiring substrate 10 of this example, protrusions 7 having a flat top surface made of solder resist are formed in a lattice pattern on the upper and lower surfaces in the disposal allowance region 5. The protrusions 7 are formed with a height that protrudes from the upper and lower surfaces of the product region 3 beyond the height of the solder bumps 6, and when a plurality of multi-chip wiring boards 10 are stacked vertically, the upper multi-chip wiring is formed. The protrusion 7 on the lower surface side of the substrate 10 and the protrusion 7 on the upper surface side of the lower multi-cavity wiring substrate 10 overlap each other. As described above, according to the multi-cavity wiring substrate 10 of this example, the protrusions 7 having a flat top surface made of a solder resist are formed in a lattice pattern on the upper and lower surfaces in the disposal allowance region 5, and a plurality of many When the multi-cavity wiring boards 10 are stacked one above the other, the lower projection 7 on the upper multi-cavity wiring board 10 and the upper projection 7 on the lower multi-wiring wiring board 10 overlap each other. Therefore, the protrusions 7 do not directly contact the upper and lower surfaces of the product region 3, so that the upper and lower surfaces of the product region 3 are effectively protected from scratches, dents, adhesion and the like. Furthermore, when a plurality of multi-cavity wiring boards 10 are stacked one above the other, even if the protrusions 7 of the upper multi-cavity wiring board 10 and the protrusions 7 of the lower multi-cavity wiring board 10 come into contact with each other. The abutment becomes abutment between flat top surfaces and can be stably stacked.

  Such protrusions 7 are formed by sticking a photosensitive dry film resist for solder resist on the upper and lower surfaces of the insulating substrate 1 and exposing the dry film resist to a predetermined pattern using a well-known photolithography technique. And after development, it is formed by heat curing and ultraviolet curing. Since the protrusion 7 is formed by subjecting the photosensitive dry film resist for solder resist to a predetermined pattern by exposure and development by a photolithographic technique, followed by thermosetting and ultraviolet curing, the top surface of the protrusion 7 is formed. Becomes flat and the width thereof can be narrow, for example, about 10 to 30 μm. Therefore, the waste of the substrate material in the multi-piece wiring board 10 can be reduced by setting the width of the cutting region 4 provided with the protrusions 7 to be as narrow as about 30 μm or less.

  According to the multi-cavity wiring substrate 10 of this example, an electronic element such as a semiconductor integrated circuit element is mounted on each product region 3 via, for example, the solder bumps 6 and the electronic element is resinated by, for example, transfer molding. After sealing, and then cutting along the cutting region 4, a large number of electronic devices in which electronic elements are mounted on a small wiring board and sealed with a resin are manufactured at once.

  Furthermore, other examples in the embodiment of the multi-piece wiring board of the present invention are shown in FIGS. 2 (a) and 2 (b) to FIGS. 11 (a) and 11 (b). In the example shown in FIGS. 2A and 2B to FIGS. 11A and 11B, substantially the same parts as those in the above-described embodiment are shown in FIGS. 1A and 1B. The same reference numerals are given, and detailed description thereof is omitted.

  The multi-cavity wiring board 20 in the example shown in FIGS. 2A and 2B has a frame-shaped projection 7 having a width of about 0.5 to 5 mm made of a solder resist in the discard margin area 5. . Since the multi-cavity wiring board 20 of this example has the wide frame-shaped protrusions 7 in the discard margin region 5 as described above, a plurality of multi-cavity wiring boards 20 of this example are vertically arranged. When stacked, the wide frame-shaped projections 7 provided in the disposal margin region 5 come into contact with each other, so that the upper and lower multi-piece wiring boards 20 can be stacked extremely stably. In addition, since the upper and lower surfaces in the disposal margin region 5 are flat surfaces, the frame-shaped protrusion 7 provided in the disposal margin region 5 and the mold of the transfer mold are excellent when resin sealing is performed by the transmold method. Can be adhered to.

  The multi-piece wiring board 30 in the example shown in FIGS. 3A and 3B has a frame-shaped protrusion 7 a on the inner peripheral portion of the upper surface in the disposal allowance area 5, and in the discard allowance area 5. A frame-like projection 7b having an inner circumference slightly larger than the outer circumference of the projection 7a is provided on the outer circumference of the lower surface. As described above, since the bottom surface of the discard margin region 5 has the frame-shaped protrusion 7b having an inner periphery slightly larger than the outer periphery of the upper protrusion 7a, a plurality of multi-piece wiring boards 30 are provided. When stacked one above the other, the outer peripheral edge of the upper-side projection 7a in the lower multi-cavity wiring board 30 and the inner periphery of the lower-side projection 7b in the upper multi-cavity wiring board 30 are locked together. As a result, a plurality of multi-piece wiring boards 30 can be stably stacked without being displaced from each other.

  4A and 4B has a strip-shaped protrusion 7a extending in the vertical direction of FIG. 4A on the upper surface of the cutting region 4, and in the cutting region 4. In the example shown in FIGS. The bottom surface has a belt-like protrusion 7b extending in the lateral direction of FIG. As described above, since the upper surface and the lower surface of the cutting region 4 have the protrusions 7a and 7b extending perpendicularly to each other, when a plurality of multi-piece wiring boards 40 are stacked one above the other, Even if the individual circuit boards 40 are slightly displaced from each other, the lower projection 7b on the upper multi-cavity wiring board 40 and the upper projection 7a on the lower multi-acquisition wiring board 40 are partially separated from each other. Therefore, the upper and lower surfaces of the product areas 3 can be effectively protected, and an electronic element such as a semiconductor integrated circuit element is mounted on each product area 3, and the electronic elements are sealed with a transfer mold method. In doing so, the mold resin can be made to flow well along the protrusions 7a and 7b.

  The multi-piece wiring board 50 in the example shown in FIGS. 5A and 5B has a cross-shaped protrusion 7 at the intersection in the cutting region 4. In this case, an electronic element such as a semiconductor integrated circuit element is mounted in each product region 3 and when the electronic element is resin-sealed by a transfer molding method, the region between adjacent protrusions 7 is placed in each product region 3. The mold resin can be flowed satisfactorily.

  The multi-cavity wiring board 60 in the example shown in FIGS. 6A and 6B has a belt-like protrusion 7 at a portion other than the intersection in the cutting region 4. Also in this case, an electronic element such as a semiconductor integrated circuit element is mounted on each product region 3 and the inside of each product region 3 is formed between adjacent protrusions 7 when the electronic device is resin-sealed by a transfer molding method. The mold resin can be made to flow well.

  The multi-piece wiring board 70 in the example shown in FIGS. 7A and 7B has a cross-shaped projection 7 at every other intersection in the cutting region 4. Also in this case, an electronic element such as a semiconductor integrated circuit element is mounted on each product region 3 and the inside of each product region 3 is formed between adjacent protrusions 7 when the electronic device is resin-sealed by a transfer molding method. The mold resin can be made to flow well.

  The multi-piece wiring board 80 in the example shown in FIGS. 8A and 8B has island-like protrusions 7 arranged intermittently in the cutting region 4. Also in this case, an electronic element such as a semiconductor integrated circuit element is mounted on each product region 3 and the inside of each product region 3 is formed between adjacent protrusions 7 when the electronic device is resin-sealed by a transfer molding method. The mold resin can be made to flow well.

  The multi-cavity wiring board 90 in the example shown in FIGS. 9A and 9B has island-like protrusions 7 arranged intermittently in a frame shape in the disposal margin region 5. As described above, the island-shaped protrusions 7 may be intermittently arranged in a frame shape in the discard margin region 5.

  10 (a) and 10 (b), in addition to the cutting region 4 and the disposal margin region 5, the multi-cavity wiring substrate 100 has an additional protrusion on the upper surface of the product region 3 so as to surround the entire solder bump 6. It has a portion 7c. In this case, the upper surface of the product region 3 can be more effectively protected.

  11A and 11B has an additional protrusion 7c on the upper surface of the product region 3 so as to surround each of the solder bumps 6 separately. In this case, the individual solder bumps 6 can be protected more effectively.

DESCRIPTION OF SYMBOLS 1 Insulation board | substrate 2 Wiring conductor 3 Product area 4 Cutting area 5 Discarding allowance area 6 Solder bump 7 Protrusion part

Claims (11)

  A plurality of product areas, which are small wiring boards in the center, are arranged side by side with a cutting area between them, and a plurality of frame-shaped discard margin areas surrounding the center are formed on the outer periphery. In the wiring board, a protrusion made of a solder resist having a height protruding from the upper and lower surfaces of the product region is formed on the upper and lower surfaces of at least one of the cutting region and the discarding region. Multi-piece wiring board.   2. The projections on the upper surface side and the projections on the lower surface side are arranged so as to at least partially overlap each other when the multi-piece wiring board is seen through vertically. Multi-cavity wiring board.   The multi-cavity wiring board according to claim 1, wherein the protrusion is formed in a lattice shape surrounding the product region in the cutting region.   The multi-cavity wiring board according to claim 1, wherein the protrusion is formed continuously in the cutting region.   The multi-cavity wiring board according to claim 1, wherein the protrusion is intermittently formed in the cutting region.   6. The projections on the upper surface side and the projections on the lower surface side are arranged so as to intersect at right angles when the multi-piece wiring board is seen through vertically. The multi-cavity wiring board according to any one of the above.   The multi-cavity wiring board according to claim 1, wherein the protrusion is formed in a frame shape in the discard margin region.   The multi-cavity wiring board according to claim 7, wherein the protrusion is formed continuously in the discard margin region.   The multi-cavity wiring board according to claim 7, wherein the protrusion is intermittently formed in the discard margin region.   When the multi-piece wiring board is seen through vertically, the protrusion on the upper surface side and the protrusion on the lower surface side are positioned so that the other protrusion is adjacent to the inside of the one protrusion. The wiring board according to claim 7, wherein the wiring board is arranged.   The multiple projections according to any one of claims 1 to 10, wherein another projection made of a solder resist having the same height as the projection is formed on at least one of the upper and lower surfaces of the product region. Wiring board.

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