JPH04185408A - Manufacture of thermosetting resin laminate - Google Patents
Manufacture of thermosetting resin laminateInfo
- Publication number
- JPH04185408A JPH04185408A JP2313248A JP31324890A JPH04185408A JP H04185408 A JPH04185408 A JP H04185408A JP 2313248 A JP2313248 A JP 2313248A JP 31324890 A JP31324890 A JP 31324890A JP H04185408 A JPH04185408 A JP H04185408A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- plates
- laminated
- prepreg
- cushion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 25
- 239000011347 resin Substances 0.000 title claims abstract description 25
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000011888 foil Substances 0.000 claims abstract description 10
- 239000002648 laminated material Substances 0.000 claims abstract description 8
- 239000004744 fabric Substances 0.000 claims abstract description 7
- 239000002966 varnish Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 abstract description 4
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000000123 paper Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- -1 niracle Chemical compound 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、産業機器、電子部品、電気機器用のプリント
配線板に好適な熱硬化性樹脂積層板の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing a thermosetting resin laminate suitable for printed wiring boards for industrial equipment, electronic parts, and electrical equipment.
〈従来の技術〉
従来、積層板は、プリプレグ、金属箔からなる積層祠料
を鏡面板に挟んだものを1〜20組重ねた外側に、クッ
ション材、キャリア板を介して熱板間に挟み、加熱加圧
成形して得られる。<Conventional technology> Conventionally, laminates are made by stacking 1 to 20 sets of prepreg and metal foil laminated abrasives sandwiched between mirror plates, and sandwiching them between hot plates via cushioning material and carrier plates. , obtained by heating and pressure molding.
上記鏡面板としては、1〜5mm厚みの金属製平板を用
いている。As the mirror plate, a metal flat plate with a thickness of 1 to 5 mm is used.
この加熱加圧成形における積層方法としては、圧ツノを
かけておいてから昇温する、いわゆるコールド−ホット
−コールド方式と、所望の温度に熱板を暖めておき、圧
ノコをかけるホット−コールド方式がある。The laminating method in this heat and pressure molding is the so-called cold-hot-cold method, in which a pressure saw is applied and then the temperature is raised, and the hot-cold method, in which a hot plate is warmed to the desired temperature and then a pressure saw is applied. There is a method.
そして、いずれの方法においてもクッション材はキャリ
ア板および熱板の「ひずみ」を製品、鏡面板に転写する
のを防止し、かつ使用する積層材料のバラツキによる「
ひずみ」をキャリア板および熱板に転写するのを防ぐ目
的で使用されている。In either method, the cushioning material prevents the "strain" of the carrier plate and hot plate from being transferred to the product or mirror plate, and also prevents the "strain" caused by the variation in the laminated materials used.
It is used to prevent "strain" from being transferred to the carrier plate and heating plate.
〈発明が解決しようとする課題〉
しかしながら、従来の熱硬化性樹脂積層板の製造方法に
おいては、熱板間に一度に挟み成形する積層材料が、製
品厚みの合計で12〜26mo+と多くなっているが、
これは生産助字・成形性面からも制約であり、仕込んだ
積層+」料が多く、厚みのバランA゛も大きいため、ク
ッション材Aにおいても、そのクッション材果の大きい
ことか必要であり、1ひずみJの防止には効果的であ2
)。<Problems to be Solved by the Invention> However, in the conventional method for manufacturing thermosetting resin laminates, the amount of laminate material that is sandwiched and formed at one time between hot plates increases to a total product thickness of 12 to 26 mo+. There are, but
This is a constraint from the viewpoint of production and moldability, and since there is a large amount of laminated material and the thickness balance A is large, it is necessary for cushion material A to have a large cushion material. , 1 is effective in preventing strain J, and 2
).
しかし、その反曲、成形特製品の端部から樹脂のはみ出
【、か多くなり、製品の板厚のバラツギが大きくなり、
耐熱性、寸法特性等諸特性のバラツキを(」6.じさせ
る結果毫なり、積層板の品質を低下゛させるという欠点
か指摘されている。However, due to the bending, the resin protrudes from the edges of the molded special product, and the variation in the thickness of the product increases.
It has been pointed out that this is a drawback in that it causes variations in various properties such as heat resistance and dimensional properties, resulting in a deterioration in the quality of the laminate.
この現象は、コールド°−ホットーコールド方式、ホッ
ト−コールド方式のいずれの方式によ1いても見られる
。1
本発明は、このような事情に鑑みてなされたもので、本
発明の目的とづるところは、成形時、製品の端部から樹
脂のはみ出し、を規制°づることにコ、す、製品の板厚
バラツキを小さく抑え、耐熱性、」展性性等の諸性性を
改善させた熱硬化性樹脂積層板の製造方法を提供り”る
ことにある。This phenomenon is observed in both the cold-hot-cold method and the hot-cold method. 1 The present invention was made in view of the above circumstances, and the purpose of the present invention is to control the protrusion of resin from the edges of the product during molding. The object of the present invention is to provide a method for manufacturing a thermosetting resin laminate that suppresses variation in plate thickness and improves various properties such as heat resistance and malleability.
〈課題を解決するだめの手r′ト〉
J、記1−」的を達成rるために、本発明は、紙または
布基祠に熱硬化性樹脂・り;4:、ヌ5を含浸させたプ
リプレグと金属箔とからなる積層祠事:1を鏡面板の間
に挟み、多数積層させC、クッション材、キャリア板を
介し、て熱板間に配置させ、熱板苓加熱加圧することに
より形成さ4する熱硬化性樹脂積層板の製造)J法?ご
おいで1
前記クッション材(、」、各々の辺に沿った突起がその
表1i側に形成さねていることを特徴とする。<Measures to Solve the Problems> In order to achieve the objective, the present invention impregnates paper or cloth with a thermosetting resin. A laminated shrine consisting of pre-preg and metal foil: 1 is sandwiched between mirror plates, laminated in large numbers, placed between hot plates with cushioning material and carrier plates interposed, and formed by heating and pressurizing the hot plates. 4) Production of thermosetting resin laminates) J method? 1. The cushioning material is characterized in that protrusions along each side are formed on the front side of the cushioning material.
本発明に使用する熱硬化性樹脂としては、)Jノール樹
脂、クレゾール樹脂、エポキン樹脂、ポリイミド樹脂、
ポリエステル樹脂、メラミン樹脂等の熱硬化性樹脂の単
独物、あるいは変成物、混合物等が用いられる。Thermosetting resins used in the present invention include) J-nor resin, cresol resin, Epoquin resin, polyimide resin,
Thermosetting resins such as polyester resins and melamine resins may be used alone, modified products, or mixtures thereof.
基月としては、ガラス、アスベスト等の無機繊維や、ポ
リエステル、ポリアミド、アクリル等の合成繊維や、木
綿等の天然繊維からなる織布、不織布、マット、あるい
は紙またはこれらのinn i’iわせ基材か使用され
る。The substrate may be woven fabrics, non-woven fabrics, mats, or paper made of inorganic fibers such as glass and asbestos, synthetic fibers such as polyester, polyamide, and acrylic, and natural fibers such as cotton, or their inn i'i bases. material is used.
さらに、金属箔としては、銅、アルミニラl1、鉄、ニ
ラクル、亜鉛等の単独、合金、複合品てあり、必要”、
に応しC接着面を化学処理または物理処理、またはこれ
らをijl用し、さらに必要に応じて接着剤層を設けた
ものである。Furthermore, metal foils include single, alloy, and composite products such as copper, aluminium, iron, niracle, and zinc.
Depending on the situation, the C adhesive surface is subjected to chemical treatment or physical treatment, or these are applied, and an adhesive layer is further provided as necessary.
また、鏡面板としては、即:さ1〜5關の鉄、アルミニ
ウム、銅、ニッケル等の中独物、合金、複合品てあ1・
へ枠の祠負も同様である。In addition, as a mirror plate, there are 1 to 5 sizes of iron, aluminum, copper, nickel, etc., alloys, and composites.
The same goes for the shrine in the frame.
また、鏡面板の表面に必要に応じて離型層を設けること
も可能である。Furthermore, it is also possible to provide a release layer on the surface of the mirror plate, if necessary.
加えて、クッション材としては、ゴム、合成樹脂、布、
紙、板等のように弾性を有づるものであればよく、また
クッション材の表面に設けられる突起も、ゴム、合成樹
脂、布、紙、板、金属等のように弾性をflするもので
も、ないものでも、いずれも使用することが可能である
。In addition, cushioning materials include rubber, synthetic resin, cloth,
Any material that has elasticity such as paper, board, etc. may be used, and the protrusions provided on the surface of the cushion material may also be made of material that has elasticity such as rubber, synthetic resin, cloth, paper, board, metal, etc. , it is possible to use either one even if there is no one.
〈作用〉
以ト、の措I戊から明らかなように、クッション材の表
面には各辺に沿った突起が形成さねでいるた杓、プレス
成形時、栢層祠料の外周縁部か他の部分に比へ圧力が高
くなり、成形時、内部の樹脂が列部にはみ出ずことか少
ない。<Function> As is clear from the following section, protrusions are formed along each side on the surface of the cushion material. The pressure is relatively high in other parts, so the internal resin does not protrude into the rows during molding.
〈実施例〉
以下、本発明に係る熱硬化性樹脂積層板の製造方法の〜
実施例について、詳細に説明する。<Example> Hereinafter, the method for producing a thermosetting resin laminate according to the present invention will be described.
Examples will be described in detail.
第1−図は本発明方法の〜実施例を示す概要図である。FIG. 1 is a schematic diagram showing an embodiment of the method of the present invention.
第1図において、紙または布基祠に熱硬化性樹脂ワニス
を含浸させたプリプレグ1と、このプリプレグ1の上下
面に配置される金属箔2とから積層材料が構成されてお
り、鏡面板3の間にVXX層材料挾んだものを図示する
ように、複数組積層させて、熱板4の間にキャリア板5
、クッション月6を介して配置させ、熱板4によるプレ
ス加工を行ない、プリプレグ1と金属箔2とからなる積
層l1を所定厚みに成形する。In FIG. 1, a laminated material is composed of a prepreg 1 made of paper or fabric impregnated with thermosetting resin varnish, and metal foils 2 placed on the top and bottom surfaces of this prepreg 1. As shown in the figure, a plurality of sets of VXX layer material are sandwiched between them, and a carrier plate 5 is placed between the hot plates 4.
, are arranged with cushion moons 6 interposed therebetween, and press working is performed using a hot plate 4 to form a laminated layer 11 consisting of prepreg 1 and metal foil 2 to a predetermined thickness.
このとき、クッション材6の各辺に沿って突起7か形成
されており、プレス成彩時、この突起7により積層材#
:4は周縁部がほかの部位に比ベプレス圧が高くなるた
め、プリプレグ1内の溶融樹脂のはみ出しが可及的に防
止Cきる。At this time, protrusions 7 are formed along each side of the cushioning material 6, and during press coloring, these protrusions 7 cause the laminated material #
:4: Since the press pressure is higher at the peripheral edge than at other parts, the molten resin in the prepreg 1 can be prevented from spilling out as much as possible.
次いで、本発明方法を適用した実施例について、具体的
に説明する。Next, examples to which the method of the present invention is applied will be specifically described.
実施例1
厚さ0. 2mmのガラス布に、エポキシ樹脂(シェル
化学(株)製、エピコート1001)100重量部、ジ
シアンジアミド4重量部、ベンジルジメチルアミン0.
2重量部、メチルオキジドール100重量部からなるエ
ポキシ樹脂ワニスを、乾燥後樹脂量が500重量部にな
るように含浸、乾燥して得たプリプレグ3枚の上下面に
、厚さ0.035mn+の銅箔を置いた積層材料10組
を厚さ3mmの鏡面板の間に挟み、第1図に示す方法に
より熱硬化性樹脂積層板を成形した。Example 1 Thickness 0. 100 parts by weight of an epoxy resin (Epicoat 1001 manufactured by Shell Chemical Co., Ltd.), 4 parts by weight of dicyandiamide, and 0.0 parts by weight of benzyldimethylamine were placed on a 2 mm glass cloth.
An epoxy resin varnish consisting of 2 parts by weight and 100 parts by weight of methyl oxidol was impregnated so that the amount of resin after drying was 500 parts by weight, and dried. Ten sets of laminated materials with copper foil placed thereon were sandwiched between 3 mm thick mirror plates, and a thermosetting resin laminate was molded by the method shown in FIG.
比較例1
クッション材として突起のないフラット状のものを使用
し、実施例1と同様の方法により銅張り積層板を得た。Comparative Example 1 A copper-clad laminate was obtained in the same manner as in Example 1, using a flat cushioning material without protrusions.
実施例1および比較例1で作成した試料の特性を表1に
示す。Table 1 shows the characteristics of the samples prepared in Example 1 and Comparative Example 1.
表1
半田耐熱性: PCT処理2Hr、260°C寸法変化
率:150℃30分処理
表1から明らかなように、本発明方法を使用すれば、板
厚のバラツキが小さく制御でき、加えて半田耐熱性、寸
法変化率が比較例1のものに比べ、優れていることが明
らかである。Table 1 Soldering heat resistance: PCT treatment for 2 hours at 260°C Dimensional change rate: 150°C for 30 minutes It is clear that the heat resistance and dimensional change rate are superior to those of Comparative Example 1.
〈発明の効果〉
以」二説明した通り、本発明による熱硬化性樹脂積層板
の製造方法は、「ひずみ」を吸収するクッション材の表
面に、その各辺に沿う突起を設けるという簡易な構成で
あるけれども、積層板の板厚偏差を小さく制御でき、半
田耐熱性および寸法特性等を従来のものに比べ著しく改
善することができるという効果を有する。<Effects of the Invention> As explained in section 2 below, the method for manufacturing a thermosetting resin laminate according to the present invention has a simple structure in which projections are provided along each side of the surface of the cushioning material that absorbs "strain". However, it has the effect that the thickness deviation of the laminate can be controlled to be small, and the soldering heat resistance, dimensional characteristics, etc. can be significantly improved compared to conventional ones.
第1図は本発明方法の概略構成を示す断面図である。 1・・・プリプレグ 2・・・金属箔 3・・・鏡面板 4・・・熱板 5・・・キャリア板 6・・・クッション材 7・・・突起 1−−−プリプレグ 2−−一金IK箔 3−鏡面板 4− 熱板 5−−−キャリア板 第1図 FIG. 1 is a sectional view showing a schematic configuration of the method of the present invention. 1...Prepreg 2...Metal foil 3...Mirror plate 4...Hot plate 5...Carrier board 6...Cushion material 7... Protrusion 1---Prepreg 2--One gold IK foil 3-Mirror plate 4- Hot plate 5---Carrier plate Figure 1
Claims (1)
プリプレグと金属箔とからなる積層材料を鏡面板の間に
挟み、多数積層させて、クッション材、キャリア板を介
して熱板間に配置させ、熱板を加熱加圧することにより
形成される熱硬化性樹脂積層板の製造方法において、 前記クッション材は、各々の辺に沿った突起がその表面
側に形成されていることを特徴とする熱硬化性樹脂積層
板の製造方法。1. A laminated material consisting of prepreg and metal foil, which is a paper or cloth base material impregnated with thermosetting resin varnish, is sandwiched between mirror plates, laminated in large numbers, and placed between hot plates via a cushioning material and a carrier plate, In the method of manufacturing a thermosetting resin laminate formed by heating and pressurizing a hot plate, the cushioning material is a thermosetting resin laminate, characterized in that the cushioning material has protrusions along each side formed on its surface side. A method for manufacturing a synthetic resin laminate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2313248A JPH04185408A (en) | 1990-11-19 | 1990-11-19 | Manufacture of thermosetting resin laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2313248A JPH04185408A (en) | 1990-11-19 | 1990-11-19 | Manufacture of thermosetting resin laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04185408A true JPH04185408A (en) | 1992-07-02 |
Family
ID=18038908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2313248A Pending JPH04185408A (en) | 1990-11-19 | 1990-11-19 | Manufacture of thermosetting resin laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04185408A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319071A (en) * | 2005-05-11 | 2006-11-24 | Denso Corp | Method for manufacturing multi-layer circuit board |
JP2014100821A (en) * | 2012-11-19 | 2014-06-05 | Sanko Gosei Ltd | Contouring molding method and fiber-reinforced resin molding |
-
1990
- 1990-11-19 JP JP2313248A patent/JPH04185408A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006319071A (en) * | 2005-05-11 | 2006-11-24 | Denso Corp | Method for manufacturing multi-layer circuit board |
JP4548210B2 (en) * | 2005-05-11 | 2010-09-22 | 株式会社デンソー | Multilayer circuit board manufacturing method |
JP2014100821A (en) * | 2012-11-19 | 2014-06-05 | Sanko Gosei Ltd | Contouring molding method and fiber-reinforced resin molding |
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