JPS5894450A - Manufacture of laminated board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laminate for use in equipment, electronic equipment, electronic parts, etc., and its purpose is to improve productivity.

Conventionally, it was normal to obtain one laminate between metal plates, and in rare cases, attempts were made to obtain two laminates between metal plates, but in the case of thin laminates, However, because the thickness of the prepreg is thin, the pressure cushion is small and air bubbles are easily incorporated into the laminate.

This invention solves the above-mentioned drawbacks.The prepreg layer is provided on the upper and lower surfaces of the prepreg layer that does not contain a metal layer with a release film interposed therebetween, and the pressing force of the pressurizing cushion is reduced because the prepreg layer is heated and pressurized between the metal plates. It is possible to obtain multiple laminated plates that are large and do not contain air bubbles at a time between metal plates.

The method of the present invention will be explained in detail below. The base material for the laminate used in the present invention is glass, asbestos, etc., non-maple fibers, polyester, polyamide, polyvinyl alcohol, acrylic, and other organic synthetic fibers, and cotton, etc., natural fibers. A woven fabric consisting of
General substrates for laminates, such as nonwoven fabrics, mats, paper, or combinations thereof. In addition, resins for laminates include phenol resin, epoxy resin, unsaturated polyester IIi resin, melamine resin, polyimide resin, polysulfone, polybutadiene, mm fluoride, polybutylene ethylene phthalate, polyether ether ketone, etc. alone or modified. impregnating the base material for the laminate with the varnish, using a varnish to which a solvent such as water, methyl alcohol, acetone, cyclobenzenone, styrene, etc. is added as necessary to adjust the viscosity; A prepreg is obtained by drying. The release film is not particularly limited as long as it is a film or sheet that has both heat resistance and heel properties such as polyester, polypropylene, fluorinated resin, triacetate, nylon, etc. The metal layer may be copper, aluminum, Stainless steel, brass, nickel, iron, etc. are used. As the metal plate, materials conventionally used such as stainless steel, hard aluminum alloy, iron, etc. can be used as they are, and a prepreg layer is placed on the top and bottom surfaces of the prepreg layer that does not contain the metal layer via a release film. By applying heat and pressure between the metal plates, it is possible to obtain a plurality of laminates with no built-in air bubbles. or,
The prepreg layers can be repeatedly applied via the release film, and the number of laminates produced between the metal plates is correspondingly increased, resulting in a noticeable improvement in productivity. Furthermore, a metal layer can be included only in the outermost prepreg layer, making it possible to obtain a metal-clad laminate.

An embodiment of the present invention will be described below with reference to the drawings.

1 is a paper-based phenolic resin prepreg layer with a thickness of 0.2-0, which does not include a metal layer, and a layer with a thickness of 0.2-0 on the top and bottom surfaces of the prepreg 1.
．． Paper base phenolic resin prepreg layer 5.3 with a thickness of 0.21 through a polyester film 2.2' of 0.055
' is set at a molding pressure of 100ν between metal plates 4 and 4'.
The product was heated and pressed at a molding temperature of 160° C. for 60 minutes to obtain a laminate of three -[K] sheets with no built-in air bubbles between the metal plates.

As explained above, according to the laminate processing method of the present invention, it is possible to obtain a laminate that does not have -111:l air bubbles between the metal plates, thereby greatly improving productivity. This is what was created.

[Brief explanation of the drawing]

The drawings are simplified cross-sectional views illustrating the inventive method. 1 is a prepreg layer not containing a metal layer, 2.2' is a release film 5.3' is a prepreg layer, and 4.4' is a metal plate. Patent applicant: Matsushita Electric Works, patent attorney: Toshimaru Takemoto (two idiots)

Claims (3)

[Claims] (1) A method for manufacturing a laminate, which comprises providing a prepreg layer on the upper and lower surfaces of a prepreg layer that does not contain a metal layer with a release film interposed therebetween, and heating and pressurizing the prepreg layer between metal plates. (2) A method for manufacturing a laminate according to claim 1, characterized in that prepreg layers are repeatedly provided with a release film interposed therebetween. (3) A method for manufacturing a laminate according to FIA Items 1 and 2, characterized in that only the outermost prepreg layer contains a metal layer.