JPH01225521A - Manufacture of cushioning material and laminate - Google Patents
Manufacture of cushioning material and laminateInfo
- Publication number
- JPH01225521A JPH01225521A JP5183988A JP5183988A JPH01225521A JP H01225521 A JPH01225521 A JP H01225521A JP 5183988 A JP5183988 A JP 5183988A JP 5183988 A JP5183988 A JP 5183988A JP H01225521 A JPH01225521 A JP H01225521A
- Authority
- JP
- Japan
- Prior art keywords
- cushioning material
- resin
- laminates
- laminate
- metallic foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229910052751 metal Inorganic materials 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 19
- 239000011888 foil Substances 0.000 claims abstract description 18
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000002648 laminated material Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000000123 paper Substances 0.000 description 5
- -1 Nisokaru Chemical compound 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003925 fat Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000011354 acetal resin Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/061—Cushion plates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、計算機器、通信機器等に用いられる
電気用積層板の製造方法およびそれに用するクッシ冒ン
材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method of manufacturing an electrical laminate used in electrical equipment, computing equipment, communication equipment, etc., and a cushioning material used therein.
従来、・電気用積層板は樹脂含浸基材、金属箔からなる
積層体を金属プレートに挾んだものを1〜15組重ねた
外側にクッシ■ン材を介してキャリア板を配し熱盤間に
挾み加熱加圧積層成形して得られるものであるが、クリ
シ曹ン材としては紙、布、ゴム板等が用いられている。Conventionally, electrical laminates are made by stacking 1 to 15 sets of laminates consisting of a resin-impregnated base material and metal foil sandwiched between metal plates, and placing a carrier plate on the outside with a cushion material interposed between them. Paper, cloth, rubber plate, etc. are used as the carbon material, which is obtained by lamination molding under heat and pressure.
従来の技術で述べたように紙、布、ゴム板等のクリシ日
ン材は紙、布にあっては熱伝導性が悪くキャリア板に凹
状変形を発生させ、且つ、−回の使用で永久歪が発生し
、2回目以降はクツV[ン性が大巾に低下するという問
題があり、ゴム板り噌シ曹ン材は熱伝導性が悪く、且つ
り雫シ璽ン材自身の変形が大で積層板の板厚偏差を大に
させるという問題があった。本発明は従来の技術におけ
る上述の問題点に鑑みてなされたもので、その目的とす
るところは板厚偏差、成形性のよい積層板の製造一方法
とそれに用いるり呼シ叢ン材を提供することにある。As described in the conventional technology, paper, cloth, rubber plates, etc., have poor thermal conductivity and cause concave deformation in the carrier plate, and may become permanent after one use. There is a problem in that distortion occurs and the shoe resistance deteriorates significantly from the second time onwards, and the rubber board material has poor thermal conductivity, and the hanging drop material itself deforms. There was a problem in that the thickness deviation of the laminate was large due to the large thickness. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide a method for manufacturing a laminate with good thickness deviation and formability, and a resin thin material used therein. It's about doing.
本発明は2枚の金属箔間に熱可塑性樹脂含有熱硬化性樹
脂層を配設一体化してなることを特徴とするり−jVH
ン材および樹脂含浸基材、金属箔からなる積層体を金属
プレート、クー7V!lン材、キャリア板を用いて積層
成形するに際し、り9シ璽ン材として2枚の金属箔間に
熱可塑性樹脂含有熱硬化性樹脂層を配設一体化してなる
クッション材を用込ることを特徴とする積層板の製造方
法であるため、積層成形に際して金属箔により熱伝導性
がよく、クラシラン材の変形もなくしかも積層成形時の
加熱加圧により樹脂層中の熱可塑性樹脂成分が軟化しり
呼シ1ン材として有効に作用するもので、以下本発明の
詳細な説明する。The present invention is characterized in that a thermosetting resin layer containing a thermoplastic resin is integrated between two metal foils.
A laminate consisting of a resin-impregnated base material, a metal foil, and a metal plate, Ku7V! When performing laminated molding using lumber and carrier plates, a cushioning material made by disposing and integrating a thermosetting resin layer containing a thermoplastic resin between two sheets of metal foil is used as a binder material. This method of manufacturing laminates is characterized by the fact that the metal foil has good thermal conductivity during laminate molding, there is no deformation of the Crasilan material, and the thermoplastic resin component in the resin layer is removed by heating and pressing during laminate molding. This material effectively acts as a softening seal material, and the present invention will be described in detail below.
本発明のり呼ジョン材に用いる金属箔としては銅、アル
ミニウム、鉄、二噌ケル、亜鉛等の単独、合金、複合品
を用することができ、必要に応じて接着面を化学処理及
び又は物理処理し接着性を向上させることができる。金
属箔の厚みは特に限定するものではないが、好ましくシ
よ0,018〜0.1nが耐久性、熱伝導性の点もよく
望まし論ことである。金属箔間に配設する熱硬化性樹脂
としては、フェノール樹脂、クレゾール樹脂、エポキシ
樹脂、不飽和ポリエステル樹脂、メラミン樹脂、ポリイ
ミド等の単独、変性物、混合物からなる熱硬化性樹脂全
般を周込ることができるが、好ましくは耐熱性に優れた
フェノール樹脂、エボキs’ w 脂、不飽和ポリエス
テル樹脂、ポリイミド樹脂を周込ることが望ましいが、
上記熱硬化性樹脂中には必らずポリアミド、ポリウレタ
ン、ポリアクリル、アクリロニトリルブタジェンスチレ
ン共1合体、スチレンブタジェンコポリマー、ブチラー
ル樹脂等のアセタール樹脂等の熱可塑性樹脂を含有させ
ることが必要である。これら熱可塑性樹脂の鐵は特に限
定するものではないが、好ましくは樹脂成分中の20〜
80重蓋幅(以下嵐に俤と記す)であることが望まし論
。即ち20%未満ではクッション!生が低下し、80憾
をこえると変形性が大となる傾向にあるからである。樹
脂層は塗布層、フィルム層、シート層、樹脂含浸紙、布
の形 で配設することができる。樹脂層の厚みは0.0
5〜2.Offが好ましい。かくして得られたクラシラ
ン材は1枚で使用してもよく、″41数枚重ねて使用し
てもよく任意である。As the metal foil used for the adhesive bonding material of the present invention, single, alloy, or composite products of copper, aluminum, iron, Nisokaru, zinc, etc. can be used, and the adhesive surface may be chemically treated and/or physically treated as necessary. Can be treated to improve adhesion. The thickness of the metal foil is not particularly limited, but it is preferably 0.018 to 0.1 nm in terms of durability and thermal conductivity. The thermosetting resin to be placed between the metal foils includes all types of thermosetting resins including phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, etc. alone, modified products, and mixtures. However, it is preferable to use phenol resin, epoxy resin, unsaturated polyester resin, or polyimide resin, which have excellent heat resistance.
The above thermosetting resin must necessarily contain a thermoplastic resin such as polyamide, polyurethane, polyacrylic, acrylonitrile butadiene styrene monomer, styrene butadiene copolymer, acetal resin such as butyral resin, etc. . The iron content of these thermoplastic resins is not particularly limited, but is preferably 20 to 20% in the resin component.
It is preferable to have a width of 80 layers (hereinafter referred to as ``arashi ni tou''). In other words, if it is less than 20%, it is a cushion! This is because the deformability tends to increase when the elasticity decreases and exceeds 80 degrees. The resin layer can be provided in the form of a coating layer, a film layer, a sheet layer, a resin-impregnated paper, or a cloth. The thickness of the resin layer is 0.0
5-2. Off is preferable. The Crasilan material thus obtained may be used as a single sheet, or may be used in a stack of several sheets as desired.
又、本発明に用いる樹脂含浸基材のa(脂としては、フ
ェノール樹脂、クレゾール樹脂、エボキV便脂、不飽和
ポリエステル樹脂、メラミン樹脂、ポリイミド、ポリブ
タジェン、ポリアミド、ポリアミドイミド、ポリスルフ
ォン、ポリフェニレンサルファイド、ポリフェニレンオ
キサイド、ポリブチレンテレフタレート、ポリエーテル
エーテルケトン、弗化樹脂等の単独、変性勿、混合物等
が用すられ必要に応じて粘度調整に水、メチルアルコー
ル、アセトン、シクロヘキサノン、スチレン等の溶媒を
添加したもので基材としては、ガラス、アスベスト等の
無機繊維やポリエステル、ボ11アミド、ポリビニルア
ルコール、アクリル等の有機合成繊維や木綿等の天然繊
維からなる織布、不織布、マプト或は紙又はこれらの組
合せ基材等である。金4箔としては銅、アルミニウム、
妖、ニッケル、亜鉛等の単独、合金、複合品であり、必
要に応じて接着面を化学処理及び又は勿理処理し史に必
要に応じて接4刑層を設けたものである。In addition, a of the resin-impregnated base material used in the present invention (as fats, phenolic resin, cresol resin, Ebuki V stool fat, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide) , polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. are used alone, modified or in mixtures, and if necessary, a solvent such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. is used to adjust the viscosity. The base material for the added material is woven fabric, non-woven fabric, Maputo or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, bo-11 amide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. These combination base materials etc.The four gold foils include copper, aluminum,
These are single, alloy, or composite products made of metal, nickel, zinc, etc., and the adhesive surface is chemically and/or naturally treated to provide a four-layer contact layer as necessary.
金属プレートとしては厚さ1〜5鰭の鉄、アルミニウム
、鋼、二9ケル等の単独、合金、嶺金品であり、必要に
応じて表面に離型層を設けることができる。キャリア板
としては従来用いられてbるものをそのまま用いること
ができる。The metal plate may be made of iron, aluminum, steel, 29K, etc., with a thickness of 1 to 5 fins, or an alloy, or a metal plate, and a release layer may be provided on the surface if necessary. As the carrier plate, conventionally used carrier plates can be used as they are.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施列1乃至3
厚さQ、0711m1の2枚の銅箔間に第1表に示すよ
うな樹脂フェスを厚さ0.5flになるように注入し1
70℃で120分間加熱してクツシーン材を得た。Implementation rows 1 to 3 A resin face as shown in Table 1 was injected between two copper foils of thickness Q and 0711 m1 to a thickness of 0.5 fl.
A shoe sheen material was obtained by heating at 70° C. for 120 minutes.
第 1 表
注
秦 Vエル化学株式会社製、品名エピコート828別に
厚さQ、2 ffのガ゛ラス布に、エポキシ樹脂(シェ
ル化学株式会社製、品名エビコー) Wool)100
重量部(以下皐に部と記す)、ジンアンジアミド4部、
ベンジルジメチルアミン0.2部、メチルオキシトール
100部からなるエポキシ樹脂ワニスを、乾燥後樹脂量
が50条になるように含浸、乾燥して得た樹脂含浸基材
7枚の上下面に厚さQ、035jlffの鋼箔を夫々配
設した積層体lO組の夫々の間及び最外側に厚さ2朋の
ステンレス鋼製金属プレートを配し、更に最外側に上記
り呼シ日ン材を夫々3枚づつ介して厚さ5flの鉄製キ
ャリア板を配設してから熱盤間に挾み、成形圧力40K
g/d、 165℃で120分間加熱加圧成形して10
枚の厚さ1.6flの両面鋼張積層板を得た。Table 1 Note: Epoxy resin (manufactured by Shell Chemical Co., Ltd., product name Ebiko Wool) 100 was applied to a glass cloth with a thickness of Q and 2 ff.
Parts by weight (hereinafter referred to as parts), 4 parts of diandiamide,
An epoxy resin varnish consisting of 0.2 parts of benzyldimethylamine and 100 parts of methyloxytol was impregnated so that the amount of resin after drying became 50 strips, and the upper and lower surfaces of 7 resin-impregnated base materials obtained by drying were coated to a thickness of 50 parts. A stainless steel metal plate with a thickness of 2 mm is arranged between and on the outermost side of each set of laminated bodies 10 in which steel foil of 035jlff is arranged, and furthermore, the above-mentioned aluminum foil is placed on the outermost side. Three 5fl thick iron carrier plates were placed between each plate, and the molding pressure was 40K.
g/d, heated and pressure molded at 165℃ for 120 minutes.
A double-sided steel clad laminate with a thickness of 1.6 fl was obtained.
比較例
クリシ目ン材として厚さ0.2Hのクラフト紙を10枚
重ねて用すた以外は実施例と同様に処理して厚さ1.6
mの両面鋼張積層板を得た。Comparative Example A paper sheet with a thickness of 1.6 mm was processed in the same manner as in the example except that 10 sheets of kraft paper with a thickness of 0.2H were stacked and used as the crepe material.
A double-sided steel clad laminate with a diameter of m was obtained.
実施例1乃至3と比較例の積層板の板厚偏差及び成形性
は、@2表のようである。The plate thickness deviation and formability of the laminates of Examples 1 to 3 and Comparative Example are as shown in Table @2.
本発明は上述した如く構成されてbる。特許請求の範囲
第1項に記載した構成を有するクツシ目ン材においては
反復使用性を向上させる効果力Sある。The present invention is constructed as described above. The comb material having the structure described in claim 1 has the effect of improving repeatability.
又、特許請求の範囲第2項に記載した構成を有する積層
板の製造方法においては、積層板の板厚偏差を小さく、
成形性を向上させる効果を有している。Furthermore, in the method for manufacturing a laminate having the configuration described in claim 2, the thickness deviation of the laminate is reduced;
It has the effect of improving moldability.
Claims (2)
層を配設一体化してなることを特徴とするクッション材
。(1) A cushioning material characterized by being formed by integrally disposing a thermosetting resin layer containing a thermoplastic resin between two metal foils.
ート、クッション材、キャリア板を用いて積層成形する
に際し、クッション材として2枚の金属箔間に熱可塑性
樹脂含有熱硬化性樹脂層を配設一体化してなるクッショ
ン材を用いることを特徴とする積層板の製造方法。(2) When layer-molding a laminate consisting of a resin-impregnated base material and metal foil using a metal plate, cushioning material, and carrier plate, a thermosetting resin layer containing a thermoplastic resin is placed between two metal foils as a cushioning material. A method for producing a laminate, characterized by using a cushioning material formed by integrally disposing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5183988A JPH01225521A (en) | 1988-03-04 | 1988-03-04 | Manufacture of cushioning material and laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5183988A JPH01225521A (en) | 1988-03-04 | 1988-03-04 | Manufacture of cushioning material and laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01225521A true JPH01225521A (en) | 1989-09-08 |
Family
ID=12898028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5183988A Pending JPH01225521A (en) | 1988-03-04 | 1988-03-04 | Manufacture of cushioning material and laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01225521A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009012195A (en) * | 2007-06-29 | 2009-01-22 | Nippon Sheet Glass Co Ltd | Heat-resistant cushioning sheet material for hot press and hot press molding method |
CN102837483A (en) * | 2012-09-20 | 2012-12-26 | 广东生益科技股份有限公司 | Cushioning method for thermal lamination and lamination structure of thermal lamination |
-
1988
- 1988-03-04 JP JP5183988A patent/JPH01225521A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009012195A (en) * | 2007-06-29 | 2009-01-22 | Nippon Sheet Glass Co Ltd | Heat-resistant cushioning sheet material for hot press and hot press molding method |
CN102837483A (en) * | 2012-09-20 | 2012-12-26 | 广东生益科技股份有限公司 | Cushioning method for thermal lamination and lamination structure of thermal lamination |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH01225521A (en) | Manufacture of cushioning material and laminate | |
JPS60258232A (en) | Laminated board of fluorine-containing resin | |
JP2000013024A (en) | Manufacture of multilayer board and plate for multilayer board manufacture | |
JPH0522400Y2 (en) | ||
JPH05475A (en) | Cushioning material | |
JP3915260B2 (en) | Multilayer board manufacturing method | |
JPH01294017A (en) | Preparation of laminated sheet | |
JPS5894450A (en) | Manufacture of laminated board | |
JPH01225519A (en) | Manufacture of laminate | |
JPH0220327A (en) | Production of laminate | |
JPS62234696A (en) | Cushion material for molding press | |
JPS6032649A (en) | Manufacture of laminated board | |
JPH01225520A (en) | Manufacture of laminate | |
JPH01225517A (en) | Manufacture of laminate | |
JPH01225544A (en) | Single-side metal clad laminated sheet | |
JPH01294018A (en) | Preparation of laminated sheet | |
JPH01225518A (en) | Manufacture of laminate | |
JPS6013537A (en) | Glass cloth for laminated board and electrical laminated board using said cloth | |
JPH04357024A (en) | Cushioning material for laminated sheet | |
JPS59101356A (en) | Copper foil and laminated board for electricity using said foil | |
JPH01294019A (en) | Preparation of multi-layer wiring base | |
JPH0315527A (en) | Preparation of laminated sheet | |
JPH08198982A (en) | Production of laminate | |
JPH03285391A (en) | Manufacture of multilayer wiring board | |
JPS60145840A (en) | Single-side metallic foil lined laminated board |