JPH01294017A - Preparation of laminated sheet - Google Patents

Abstract

PURPOSE:To transmit uniform pressure and heat to the whole laminated sheet between hot plates and to prepare a laminated sheet having a uniform characteristics, by shortening the molding time of the highest temp. in compression molding and holding at a temp. lower than the highest molding temp. for the shortened period. CONSTITUTION:A laminated sheet is prepd. by pinching the upper face and the lower face of seven sheets of resin-impregnated base materials with metal plates made of stainless steel. Ten sets of these laminated sheets are piled up and carrier plates made of iron are put on the upper face and the lower face outside thereof through cushion materials. They are inserted between hot plates. They are pressed, molded at the highest molding temp. (which is shortened by 20-50% of an ordinarily required time), cooled under pressing and dwelled at a temp. being 10-40 deg.C lower than the highest molding temp. Irregularity in the characteristics of the laminated sheets in the neighborhood of the hot plates and the center of the hot plates are largely decreased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for laminating a laminate for WLgC used for VIL equipment, computer equipment, exaggeration equipment, and the like.

[Conventional technology]

Conventionally, vItgC laminates have been made by stacking 5 to 20 sets of laminates consisting of a resin-impregnated base material and metal foil sandwiched between metal plates, and placing a carrier plate on the outside with cranium material interposed between the hot plates. It is obtained by heat and pressure lamination molding at the maximum temperature for the required forming time, but as the number of laminates inserted between the hot plates increases, the distance between the laminates near the hot plate and the hot platen increases. Buffiness in the performance of the laminate due to the difference in heat transfer with the laminate near the center was unavoidable.

[Problem that the invention seeks to solve]

As described in the related art section, the larger the number of laminates inserted between press hot platens, the more buffiness occurs in the performance of the laminates. As a countermeasure to this problem, we need to consider the resin content and degree of curing of the resin-impregnated base material. + temperature, full external pressure molding was considered, but it was not possible to eliminate the performance buffiness, and rather the problem of prolonging the molding time occurred. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a method for manufacturing IfIHI boards without variations in performance.

[Means for solving problems]

In the present invention, a large number of laminates made of a resin-impregnated base material and gold (foil) are stacked between press hot platens, and a metal plate is placed on the top and/or bottom of each laminate. The required molding time is reduced by 3 to 50%, and the shortened amount is reduced by 910 to 40 degrees Celsius below the maximum molding temperature. It is possible to make the pressure and heat transfer uniform throughout the inter-plate laminated body, and therefore it is possible to eliminate the performance buffiness of the laminated plates obtained in many cases between the hot plates.The present invention will be described in detail below. .

As the resin for the resin-impregnated base material used in the present invention, phenol
/L/Resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. It is used alone, modified products, mixtures, etc., and if necessary, a solvent such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. is added to adjust the viscosity.As a base material, inorganic fibers such as sulfur, asbestos, etc. The base materials include woven fabrics, nonwoven fabrics, mats, paper, or combinations thereof made of organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, and natural fibers such as cotton. Gold 11i[,! : Single, alloy, or composite products of copper, aluminum, iron, nickel, zinc, etc. The adhesive surface is chemically and/or physically treated as necessary, and an adhesive layer is provided as necessary. It is something. The metal plate may be made of iron, aluminum, steel, nickel, etc. alone, alloy, or composite with a thickness of 1 to 2M, and a female layer may be provided on the surface if necessary. The required molding time at the maximum molding temperature needs to be reduced by 25-50%.

That is, if it is less than 25%, it will not be possible to sufficiently uniformize the pressure and heat applied to the large number of laminates between the hot platens, and if it exceeds 50%, the curing of the laminates will be insufficient. The material for the cushion may be any elastic material such as rubber, synthetic rubber, paper, cloth, board, plywood, or resin-impregnated paper cloth, and the thickness is 1 to 1.
Preferably, the size is 1°. As for the carrier plate, up to 41 ordinary ones can be used.

The present invention will be explained below based on examples.

Example 1 A glass cloth with a thickness of 0.2H was coated with 100 parts of an epoxy resin (Shell Chemical Co., Ltd., product name: Epicoat 1001), 4 parts of dianediamide, and 0.0 parts of benzyldimethylamine. 2 parts, methyl oxide-A/
The epoxy resin varnish consisting of 100 parts was impregnated so that the resin amount after drying was % by weight (hereinafter simply referred to as customer), and dried to coat the upper and lower surfaces of 7 resin-impregnated substrates with a thickness of 0.
．． 035gg of copper foil is arranged on each stack with a thickness of Iff.
10H thick kraft paper with a thickness of 1lrII on the outside, sandwiched between stainless steel mourning metal plates and overlaid gold 1O2! / = Insert an iron ring carrier plate with a thickness of 5 mm, sandwich it between hot plates, and apply a molding pressure of 40 kg to 1 layer.
80"C for 70 minutes (Q1 molding part left to cool under pressure and reached 170"C in 10 minutes! 14 Warm it to 170"C while under pressure. Volume for 1 minute, 1 mold and 10 blows. Sa1.6
All double-sided steel cladding was made of Evokin resin end laminate.

Example 2 Ten sets of the same laminates as in Example 1 were molded under a molding pressure of 40 kg/d.
After lamination molding at 180''C for a leap time, the temperature was lowered to 160''C for a minute under pressure, and lamination molding was performed at 160°C under pressure for a lead minute. Two laminates were obtained.

Example 3 The same laminate 10 Mi as in Example 1 was molded at a pressure of 40 kq.
/d, after lamination molding at 180℃ for ω minutes, cool under pressure and I
The process was carried out in the same manner as in Example 1, except that the temperature was lowered to 160°C for 10 minutes, and Tamama laminated molding was performed at 160°C under pressure.
A total of 7V plates were obtained.

Comparative Example The same laminate as Example 1 was molded under a molding pressure of 40 kg, f.
d. Ten laminates were obtained in the same manner as in Example 1, except that laminate molding was carried out at 180''C for 120 minutes.

The product of Examples 1 to 3 and the comparative example and the performance of the W plate are as shown in Table 1.

Note to Table 1: Spicy Pressure Cooker Test [Effects of the Invention] The present invention is constructed as described above. The method for manufacturing a laminate having the structure described in claim 1 has the effect of significantly reducing the buffiness of the laminate.

Claims (1)

[Claims] (1) When stacking a large number of laminates made of resin-impregnated base materials and metal foils between press hot platens and arranging metal plates on the top and/or bottom surfaces of each laminate for laminate molding, the required maximum molding temperature A method for manufacturing a laminate, characterized in that the molding time is shortened by 25 to 50%, and the shortened time is left to cool to a temperature 10 to 40°C lower than the maximum molding temperature, and then maintained at that temperature.