JPH01157821A - Manufacture of laminated sheet - Google Patents

Manufacture of laminated sheet

Info

Publication number
JPH01157821A
JPH01157821A JP62316656A JP31665687A JPH01157821A JP H01157821 A JPH01157821 A JP H01157821A JP 62316656 A JP62316656 A JP 62316656A JP 31665687 A JP31665687 A JP 31665687A JP H01157821 A JPH01157821 A JP H01157821A
Authority
JP
Japan
Prior art keywords
pressure
laminate
resin
given
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62316656A
Other languages
Japanese (ja)
Other versions
JP2510638B2 (en
Inventor
Yasufumi Fukumoto
福本 恭文
Sadahisa Takaura
高浦 禎久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62316656A priority Critical patent/JP2510638B2/en
Publication of JPH01157821A publication Critical patent/JPH01157821A/en
Application granted granted Critical
Publication of JP2510638B2 publication Critical patent/JP2510638B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE:To remove voids contained in resin efficiently and control the generation of thin spots developed by the voids on a molded laminated sheet by pressurizing the sheet to the state of a given reduced pressure by a given initial pressure, applying zero pressure for a given period of time, and then pressurizing with a pressure lower than the initial pressure. CONSTITUTION:A laminated material is pressurized up to the state of a given reduced pressure with a given initial pressure, and then zero pressure is applied thereon, followed by an applied pressure lower than the initial pressure in the manufacturing method of a laminated sheet in which a plurality of laminated materials consisting of piled up inner layer materials, resin impregnating bases, metal foils and the like are heated and pressurized under the pressure reduced atmosphere. A plurality of laminated materials consisting of a plurality of piled up resin impregnating bases are disposed between hot platens to, vacuum atmosphere, and a laminated sheet is manufactured by heating and pressurizing under the reduced atmosphere. The degree of vacuum is around 600-100Torr and molding pressure is 5-150kg/cm<2>, while molding temperature is 100-200 deg.C and molding time is approximately 30-100min. For example, the initial pressure of 50-70kg/cm<2> is applied, and when the degree of vacuum reaches 700-300Torr, zero pressure is applied, and after 10-80sec, the pressure of 10-30kg/cm<2> is applied.

Description

【発明の詳細な説明】[Detailed description of the invention] 【技術分野】【Technical field】

本発明はプリント配線板などとして用いる積層板の製造
方法に関する。
The present invention relates to a method for manufacturing a laminate used as a printed wiring board or the like.

【背景技術】[Background technology]

従来より、内層材と樹脂含浸基材と金属箔などを積み重
ねた積層体が複数組真空囲い込みプレス機構を具備した
熱盤間に配置され、減圧下加熱加圧されて積層板が製造
されでいるが、樹脂含浸基材の樹脂含有量のむら、熱盤
内での温度上昇の差などに起因して成形された積層板に
はボイドによるかすれが発生してし*つていた。 このかすれの防止のため、高圧成形がなされているが、
この場合には積層板に大きな反り、ねじれが発生してし
まうという問題があった。
Conventionally, multiple sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, metal foil, etc., have been placed between hot plates equipped with a vacuum enclosing press mechanism, and then heated and pressurized under reduced pressure to produce a laminate. However, due to unevenness in the resin content of the resin-impregnated base material, differences in temperature rise within the heating plate, etc., the formed laminates were prone to scratches due to voids. In order to prevent this blurring, high-pressure molding is used.
In this case, there was a problem in that the laminate would be greatly warped and twisted.

【発明の目的】[Purpose of the invention]

本発明は上記事情に鑑みて為されたものであり、その目
的とするところは、かすれがなく、シかも反り、ねじれ
の小さな積層板を製造することにある。
The present invention has been made in view of the above-mentioned circumstances, and its purpose is to produce a laminate plate that is free from scratches and has minimal warping, warping, and twisting.

【発明の開示】[Disclosure of the invention]

本発明の積層板の製造方法は、内層材と樹脂含浸基材と
金属箔などを積み重ねた積層体を複数組減圧雰囲気下前
熱加圧する積層板の製造方法であって、所定の初期圧で
所定の減圧状態に達するまで加圧し、次いで所定時開無
圧にし、この後初期圧よりも低い圧力で加圧することを
特徴とするものであり、この構成により上記目的が達成
されたものである。 本発明における樹脂含浸基材としては紙、有機繊維によ
り形成した布、不織布、又はガラス、アスベスト等の無
機繊維の単独もしくは混紡による布、不織布などの基材
を樹脂フェスに浸漬して樹脂を含浸し、乾燥させて形成
される。基材としては好ましくは厚みが0.10〜0.
30a+m、重量が100〜300g/n2のがラス布
であり、この特定の厚み及び重量以外のガラス布は樹脂
含浸性が悪く含有する気泡が多くなってしまうものであ
る。樹脂フェスの樹脂としてはエポキシ樹脂、ポリイミ
ド樹脂又はこれらの変性物、7エ/−ル樹脂、不飽和ポ
リエステル樹脂等の熱硬化性樹脂を採用できる。この場
合基材への樹脂の含浸はフェス槽を減圧して減圧下で、
又はフェス槽内に配置した上下2個のロール間に基材を
通すことにより加圧した後、除圧して行う6加圧下の場
合、例えばロールが3段で、圧力10kg/am2下で
含浸を行う、樹脂の含浸量は固形分で35〜65重量%
である。減圧下又は加圧下で行うことにより、フェス槽
中での基材への気泡の巻き込みを少なくできるものであ
る。もちろん常圧下で含浸させてもよい。 この樹脂含浸基材を複数枚積み重ねた8を屠体を複数組
熱盤間に配置し、熱盤間をいわゆる真空囲い込みし、減
圧雰囲気下、加熱加圧して積層板を成形する。真空度は
600〜100Torr程度であり、成形圧力は5〜1
50 kg/cm2、成形温度は100〜200℃、成
形時間は30〜100分程度である0例えば、初期圧5
0〜70 kg/ cm2に加圧し、真空度が700〜
300 Torrに達した後無圧にして10−80秒後
、10−30kg/am2で加圧する。この場合、積層
体の最外層に金属箔を配置しておいてもよい。會Mlと
しては#!箔、アルミニウム箔、しんちゅう箔、ニッケ
ル箔、ステンレス銅箔、鉄箔などを使用でき、この金属
箔の片面に接着剤層を設けておき、接着性を高めてもよ
い。又、積層体が、内層材の両面に樹脂含浸基材を配し
、その最外層に金属箔を重ねたものでもよい。 このようにして得られた金属箔張り積層板は常法により
外層回路パターンが形成されてプリント配線板としであ
るいは多層プリント配線板として実用に供される。 次に、本発明の実施例を具体的に説明する。 (実施例1) ガラス布にエポキシ樹脂を含浸させ乾燥させて得た樹脂
含浸基材を複数枚積み重ね、このものを−組として複数
組熱盤間に配置し、温度165〜175℃で初期圧力6
0kg/cm2で加圧後、真空度が300 Torrに
達した時点で無圧(Okg/ cm”)にし、30〜6
0秒後、20kg/am2で加圧し、厚み1.6mmの
積層板を得た。真空度は100T。 r「、成形時間は約120分であった(!@1図参照)
。 この積層板のかすれ発生率、lmX1w品の常態での反
り、板厚のばらつきを測定した。結果を第1表に示す。 (実施例2) 真空度が400 Torrに達した時点で無圧にした以
外は実施例1と同様にして積層板を製造した。 この積層板についても実施例1と同様の測定を行った。 結果を第1表に示す。 (実施例3) 真空度が500 Torrに達した時点で無圧にした以
外は実施例1と同様にして積層板を製造した。 この積層板についても実施例1と同様の測定を行った。 結果をtjSi表に示す。 (比較例) 真空度100 Torr、圧力60 kg/ cm2と
した以外は実施例1と同様にして積層板を製造した(f
f!2図参照)。この積層板についても実施例1と同様
の測定を行った。結果を第1表に示す。 実施例     比較例 かすれ発生率  0 0 4   5 (%) 反り       88815 (+ui) 板厚の ばらつき幅 0.07  G、07 0.08   G
、015論論 本発明のいずれの実施例も比較例よりもかすれ発生率、
反り、板厚のばらつき幅が小さいことが判る。そして、
初期圧力を解除する時の真空度が小さい程これら特性は
優れることが理解される。 これは、減圧効果が高まることによる。
The method for producing a laminate of the present invention is a method for producing a laminate in which a plurality of sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, a metal foil, etc., are pre-heated and pressed in a reduced pressure atmosphere, and the method comprises: It is characterized by pressurizing until it reaches a predetermined reduced pressure state, then opening and unpressurizing at a predetermined time, and then pressurizing at a pressure lower than the initial pressure, and with this configuration, the above object is achieved. . In the present invention, the resin-impregnated base material includes paper, cloth made of organic fibers, nonwoven fabric, or cloth made of inorganic fibers such as glass and asbestos alone or in a blend, or nonwoven fabric, which is dipped in a resin face and impregnated with resin. It is formed by drying. The base material preferably has a thickness of 0.10-0.
A glass cloth having a thickness of 30 a+m and a weight of 100 to 300 g/n2 is a glass cloth, and glass cloth having a thickness other than this specific thickness and weight has poor resin impregnation properties and contains many air bubbles. As the resin for the resin face, thermosetting resins such as epoxy resins, polyimide resins or modified products thereof, 7-ether resins, and unsaturated polyester resins can be used. In this case, the resin is impregnated into the base material under reduced pressure by reducing the pressure in the festival tank.
Alternatively, in the case of 6 pressurization, which is carried out by passing the base material between two upper and lower rolls arranged in a festival tank and then removing the pressure, for example, there are three rolls and impregnation is carried out under a pressure of 10 kg/am2. The amount of resin impregnation is 35 to 65% by weight in terms of solid content.
It is. By carrying out the process under reduced pressure or increased pressure, the entrainment of air bubbles into the base material in the festival tank can be reduced. Of course, the impregnation may be carried out under normal pressure. A plurality of carcasses 8 made by stacking a plurality of resin-impregnated base materials are placed between heating plates, the space between the heating plates is enclosed in a so-called vacuum, and a laminate is formed by heating and pressurizing in a reduced pressure atmosphere. The degree of vacuum is about 600 to 100 Torr, and the molding pressure is about 5 to 1
50 kg/cm2, the molding temperature is 100 to 200°C, and the molding time is about 30 to 100 minutes. For example, the initial pressure is 5.
Pressure is applied to 0 to 70 kg/cm2, and the degree of vacuum is 700 to 700.
After reaching 300 Torr, the pressure is reduced to zero and after 10-80 seconds, the pressure is increased to 10-30 kg/am2. In this case, a metal foil may be placed on the outermost layer of the laminate. # as a member of the club! Metal foil, aluminum foil, brass foil, nickel foil, stainless steel copper foil, iron foil, etc. can be used, and an adhesive layer may be provided on one side of this metal foil to improve adhesiveness. Alternatively, the laminate may be one in which a resin-impregnated base material is arranged on both sides of an inner layer material, and a metal foil is layered on the outermost layer. The thus obtained metal foil-clad laminate is formed with an outer layer circuit pattern by a conventional method and is put to practical use as a printed wiring board or a multilayer printed wiring board. Next, examples of the present invention will be specifically described. (Example 1) A plurality of resin-impregnated base materials obtained by impregnating glass cloth with epoxy resin and drying them are stacked, and these are placed between heating plates as a set, and the initial pressure is set at a temperature of 165 to 175°C. 6
After pressurizing at 0 kg/cm2, when the degree of vacuum reached 300 Torr, it was set to no pressure (Okg/cm") and 30 to 6
After 0 seconds, pressure was applied at 20 kg/am2 to obtain a laminate with a thickness of 1.6 mm. The degree of vacuum is 100T. r", the molding time was about 120 minutes (! @ see figure 1)
. The rate of occurrence of scratching on this laminate, warpage in normal conditions of the 1mX1w product, and variation in board thickness were measured. The results are shown in Table 1. (Example 2) A laminate was produced in the same manner as in Example 1, except that the pressure was turned off when the degree of vacuum reached 400 Torr. The same measurements as in Example 1 were also performed on this laminate. The results are shown in Table 1. (Example 3) A laminate was manufactured in the same manner as in Example 1 except that the pressure was turned off when the degree of vacuum reached 500 Torr. The same measurements as in Example 1 were also performed on this laminate. The results are shown in the tjSi table. (Comparative Example) A laminate was manufactured in the same manner as in Example 1 except that the degree of vacuum was 100 Torr and the pressure was 60 kg/cm2 (f
f! (See Figure 2). The same measurements as in Example 1 were also performed on this laminate. The results are shown in Table 1. Example Comparative example Fading occurrence rate 0 0 4 5 (%) Warpage 88815 (+ui) Plate thickness variation width 0.07 G, 07 0.08 G
, 015 Theory All of the examples of the present invention have a higher blurring occurrence rate than the comparative example,
It can be seen that the variations in warpage and plate thickness are small. and,
It is understood that these characteristics are better as the degree of vacuum is lower when the initial pressure is released. This is due to the increased pressure reduction effect.

【発明の効果】【Effect of the invention】

本発明は内層材と樹脂含浸基材と金属箔などを積み重ね
た積層体を複数組減圧雰囲気上加熱加圧する積層板の製
造方法であって、所定の初期圧で所定の減圧状態に達す
るまで加圧し、次いで所定時間無圧にし、この後初期圧
よりも低い圧力で加圧するので、樹脂含浸基材中の樹脂
が溶融した常態で初期圧を解除し減圧することになり、
樹脂中に含まれるボイドを効率良く除去でき、成形され
た積層板にボイドによるかすれの発生を抑制することが
できるものであり、しかもボイドを効率より除去できる
ので、成形圧もそれだけ低圧にでき、積層板の反り、板
厚のばらつき幅を小さくでさるものである。
The present invention is a method for producing a laminate in which a plurality of laminates, each consisting of an inner layer material, a resin-impregnated base material, a metal foil, etc., are heated and pressurized in a reduced pressure atmosphere, and the method is to heat and press a plurality of laminates in a reduced pressure atmosphere at a predetermined initial pressure until a predetermined reduced pressure state is reached. Pressure is applied, then there is no pressure for a predetermined period of time, and then the pressure is applied at a pressure lower than the initial pressure, so the initial pressure is released and the pressure is reduced while the resin in the resin-impregnated base material is melted.
It can efficiently remove the voids contained in the resin and suppress the occurrence of scratches due to voids on the molded laminate. Furthermore, since the voids can be removed more efficiently, the molding pressure can be lowered accordingly. This reduces the warpage of the laminate and the variation in plate thickness.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例における圧力と真空度の関係
を示すグラフ、第2図は従来例における圧力と真空度の
関係を示すグラフである。 代理人 弁理士 石 1)艮 七 第1図 第2図
FIG. 1 is a graph showing the relationship between pressure and vacuum degree in an embodiment of the present invention, and FIG. 2 is a graph showing the relationship between pressure and vacuum degree in a conventional example. Agent Patent Attorney Ishi 1) Ai 7 Figure 1 Figure 2

Claims (4)

【特許請求の範囲】[Claims] (1)内層材と樹脂含浸基材と金属箔などを積み重ねた
積層体を複数組減圧雰囲気下加熱加圧する積層板の製造
方法であって、所定の初期圧で所定の減圧状態に達する
まで加圧し、次いで所定時間無圧にし、この後初期圧よ
りも低い圧力で加圧することを特徴とする積層板の製造
方法。
(1) A method for manufacturing a laminate in which multiple sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, metal foil, etc., are heated and pressurized in a reduced pressure atmosphere, and the method is to heat and press a plurality of laminates at a predetermined initial pressure until a predetermined reduced pressure state is reached. 1. A method for manufacturing a laminate, which comprises applying pressure, then leaving it unpressurized for a predetermined period of time, and then applying pressure at a pressure lower than the initial pressure.
(2)積層体が複数枚の樹脂含浸基材を積み重ねその最
外層に金属箔を重ねて成ることを特徴とする特許請求の
範囲第1項記載の積層板の製造方法。
(2) The method for manufacturing a laminate according to claim 1, wherein the laminate is formed by stacking a plurality of resin-impregnated base materials and overlapping a metal foil on the outermost layer.
(3)積層体が内層材の両面に樹脂含浸基材を配し、そ
の最外層に金属箔を重ねて成ることを特徴とする特許請
求の範囲第1項記載の積層板の製造方法。
(3) The method for manufacturing a laminate according to claim 1, wherein the laminate is formed by disposing resin-impregnated base materials on both sides of an inner layer material and overlapping metal foil on the outermost layer.
(4)積層体が複数枚の樹脂含浸基材を積み重ねて成る
ことを特徴とする特許請求の範囲第1項記載の積層板の
製造方法。
(4) The method for manufacturing a laminate according to claim 1, wherein the laminate is formed by stacking a plurality of resin-impregnated base materials.
JP62316656A 1987-12-15 1987-12-15 Laminated board manufacturing method Expired - Fee Related JP2510638B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62316656A JP2510638B2 (en) 1987-12-15 1987-12-15 Laminated board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62316656A JP2510638B2 (en) 1987-12-15 1987-12-15 Laminated board manufacturing method

Publications (2)

Publication Number Publication Date
JPH01157821A true JPH01157821A (en) 1989-06-21
JP2510638B2 JP2510638B2 (en) 1996-06-26

Family

ID=18079445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62316656A Expired - Fee Related JP2510638B2 (en) 1987-12-15 1987-12-15 Laminated board manufacturing method

Country Status (1)

Country Link
JP (1) JP2510638B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796255B1 (en) * 2000-07-29 2008-01-21 에스엠에스 데마그 악티엔게젤샤프트 Method and device for band-edge orientated displacement of intermediate cylinders in a 6 cylinder frame
CN102688889A (en) * 2011-03-23 2012-09-26 宝山钢铁股份有限公司 Intermediate roll form of cold continuous mill

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100796255B1 (en) * 2000-07-29 2008-01-21 에스엠에스 데마그 악티엔게젤샤프트 Method and device for band-edge orientated displacement of intermediate cylinders in a 6 cylinder frame
CN102688889A (en) * 2011-03-23 2012-09-26 宝山钢铁股份有限公司 Intermediate roll form of cold continuous mill

Also Published As

Publication number Publication date
JP2510638B2 (en) 1996-06-26

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