JPH0193312A - Manufacture of laminate - Google Patents
Manufacture of laminateInfo
- Publication number
- JPH0193312A JPH0193312A JP25181387A JP25181387A JPH0193312A JP H0193312 A JPH0193312 A JP H0193312A JP 25181387 A JP25181387 A JP 25181387A JP 25181387 A JP25181387 A JP 25181387A JP H0193312 A JPH0193312 A JP H0193312A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- laminate
- laminates
- molding
- minutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 230000002950 deficient Effects 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機器、通信機器等に
用いられる積層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a method for manufacturing a laminate used for electrical equipment, electronic equipment, computing equipment, communication equipment, etc.
従来、電気機器等に用いられる積層板は、紙、ガラス布
等の基材に樹脂ワニスを含浸、乾燥せしめた樹脂含浸基
材の所要枚数に金属箔を重ねた積層体を8〜15組熱盤
間黙然み加熱加圧成形して得られるものであるが、黙然
に近い積層体と熱盤間の中央部の積層体とでは、中央部
積層体の温度上昇が黙然に近い積層体に比して遅くなシ
、成形時間の延長、熱盤側積層体と中央部積層体の品質
差は避けられないものであった。Conventionally, laminates used for electrical equipment, etc. are made by impregnating a base material such as paper or glass cloth with resin varnish and drying it, then stacking 8 to 15 sets of metal foil on top of the required number of resin-impregnated base materials. It is obtained by heat-pressing molding between the plates, but the temperature rise in the center laminate is higher than that of the laminate in the center between the hot plates. The process is slow, the molding time is extended, and the quality difference between the hot platen side laminate and the center laminate is unavoidable.
本発明の目的とするところは積層成形時間の短縮と熱盤
間積層体の品質バラツキをなくすることにある。The object of the present invention is to shorten the lamination molding time and to eliminate variations in quality of the laminated body between hot plates.
本発明は所要枚数の樹脂含浸基材を重ね、更にその上面
及び又は下面に金属箔を配設した積層体を所要枚数、プ
レス熱盤間に挾み、積層体成形最適温度より2〜20℃
熱盤温度を高温にして10〜90分間加熱加圧後、熱盤
温度を積層体成形最適温度に低下させ加熱加圧成形する
ことを特徴とする積層板の製造方法のため、熱盤間の中
央部積層体の温度上昇が速くなシ全成形時間が短縮され
ると共に熱盤間積層体の品質を均一にすることができる
もので、以下本発明の詳細な説明する。In the present invention, a required number of resin-impregnated base materials are stacked, and a required number of laminates with metal foil arranged on the upper and/or lower surfaces are sandwiched between press hot plates, and the laminate is formed at a temperature of 2 to 20°C above the optimum temperature for forming the laminate.
The laminate manufacturing method is characterized by heating and pressurizing the hot platen at a high temperature for 10 to 90 minutes, then lowering the hot platen temperature to the optimum temperature for forming the laminate, and then heating and press forming. Since the temperature of the central laminate increases quickly, the total molding time can be shortened and the quality of the laminate between hot plates can be made uniform.The present invention will be described in detail below.
本発明に用いる樹脂含浸基材の樹脂としては、フェノ−
1L/樹脂、クレゾー/L’樹脂、エポキシ樹脂、不飽
和ポリエステ/1/樹脂、メラミン樹脂、ポリイミド、
ジアリルフタレート樹脂等のような熱硬化性樹脂全般の
単独、変性物、混合物を用いることができる。基材とし
てはガフス、アスベスト等の無機繊維やポリエステル、
ポリアミド、ポリビニルアルコール、ポリアクリル、ボ
リクレタン、ポリイミド等の有機合成繊維や木綿等の天
然繊維から織布、不織布、マット或は紙又はこれらの組
合せ基材等である。金属箔としては銅、7〜ミニクム、
鉄、ニッケル、亜鉛等の単独、合金の箔を用い、必要に
応じてその片面に接着剤層を設け、接着性を向上させる
こともできる。先ず積層体成形最適温度より熱盤温度を
2〜20℃高温にして10〜90分間加熱加圧するもの
でちるが、2°C未満、10分未満では熱盤間中心部の
温度上昇を速くすることができず、頷°Cをこえ、90
分をこえると熱盤側積層体の硬化度が大にな多品質不良
となる。As the resin for the resin-impregnated base material used in the present invention, phenol
1L/resin, creso/L' resin, epoxy resin, unsaturated polyester/1/resin, melamine resin, polyimide,
Thermosetting resins in general such as diallyl phthalate resins can be used singly, modified products, or mixtures. Base materials include gaffs, inorganic fibers such as asbestos, polyester,
Base materials include organic synthetic fibers such as polyamide, polyvinyl alcohol, polyacrylic, polycrethane, and polyimide, natural fibers such as cotton, woven fabrics, nonwoven fabrics, mats, paper, and combinations thereof. Metal foils include copper, 7 to minicum,
It is also possible to use a foil made of iron, nickel, zinc, etc. alone or an alloy, and if necessary, provide an adhesive layer on one side of the foil to improve adhesiveness. First, heat and press the hot platen temperature 2 to 20 degrees higher than the optimum temperature for forming the laminate for 10 to 90 minutes, but if it is less than 2 degrees Celsius or less than 10 minutes, the temperature at the center between the hot platens will increase quickly. Unable to do so, the temperature exceeded 90°C.
If the temperature exceeds 10 minutes, the degree of hardening of the laminated body on the hot platen side will be greatly reduced, resulting in many quality defects.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
樹脂量艶重量%(以下単に%と記す)のフェノール樹脂
フェスに厚さ0.2門のクラフト紙を樹脂量がW%にな
るように含浸、乾燥して樹脂含浸基材を得た。次に該樹
脂含浸基材8枚を重ね、更にその上下面に厚さ0.03
5flの接着剤層付銅箔を、接着削り側を樹脂含浸基材
と対向させて配設した積層体13姐を熱盤間に挾み、成
形圧力1o okg/cd、熱盤温度170″Cで卯分
間加熱加圧後、成形圧力はそのままで熱盤温度を160
″Cに低下させ(至)分間加熱加圧成形して厚さ1.6
馴の銅張積届板劇枚を得た。Example: A phenolic resin face with a resin amount glossy weight% (hereinafter simply referred to as %) was impregnated with kraft paper having a thickness of 0.2 so that the resin amount was W%, and dried to obtain a resin-impregnated base material. . Next, stack 8 sheets of the resin-impregnated base material, and further coat the upper and lower surfaces with a thickness of 0.03 mm.
A laminate 13, in which 5 fl of copper foil with an adhesive layer was arranged with the adhesive-shaving side facing the resin-impregnated base material, was sandwiched between hot plates, and the molding pressure was 10 kg/cd, and the hot plate temperature was 170''C. After heating and pressurizing the plate with the same molding pressure, the temperature of the hot plate was increased to 160℃.
"C" and heated and pressure molded for (up to) minutes to a thickness of 1.6
I got a copy of the familiar copper cladding report board.
比較例
実施例と同じ積層体13組を熱盤間に挾み、成形圧力1
00 kg/cd 、熱盤温度160°Cで90分間(
80分間では硬化不足)加熱加圧成形して厚さ1.6f
fの銅張積層板B枚を得た。Comparative Example Thirteen sets of the same laminates as in the example were sandwiched between hot platens, and a molding pressure of 1 was applied.
00 kg/cd for 90 minutes at a heating plate temperature of 160°C (
80 minutes is insufficient curing) Heat and pressure molding to a thickness of 1.6f
A copper clad laminate B of f was obtained.
実施例と比較例の積層板の硬rヒ度、成形時間は第1表
で明白なように本発明の積層板の製造方法で得られたも
のの性能はよく、本発明の優れていることを確認した。As is clear from Table 1, the hardness and molding time of the laminates of Examples and Comparative Examples obtained by the method of manufacturing laminates of the present invention had good performance, demonstrating the superiority of the present invention. confirmed.
第1表Table 1
Claims (1)
び又は下面に金属箔を配設した積層体を所要数、プレス
熱盤間に挾み、積層体成形最適温度より2〜20℃熱盤
温度を高温にして10〜90分間加熱加圧後、熱盤温度
を積層体成形最適温度に低下させ加熱加圧成形すること
を特徴とする積層板の製造方法。(1) Layer the required number of resin-impregnated base materials, and then place the required number of laminates with metal foil on the top and/or bottom surfaces between press hot plates, 2 to 20°C above the optimum temperature for laminate molding. 1. A method for manufacturing a laminate, which comprises raising the temperature of the hot platen to a high temperature, heating and pressing for 10 to 90 minutes, and then lowering the hot platen temperature to the optimum temperature for forming the laminate, and carrying out heating and pressing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25181387A JP2551032B2 (en) | 1987-10-06 | 1987-10-06 | Laminated board manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25181387A JP2551032B2 (en) | 1987-10-06 | 1987-10-06 | Laminated board manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0193312A true JPH0193312A (en) | 1989-04-12 |
JP2551032B2 JP2551032B2 (en) | 1996-11-06 |
Family
ID=17228300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25181387A Expired - Lifetime JP2551032B2 (en) | 1987-10-06 | 1987-10-06 | Laminated board manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2551032B2 (en) |
-
1987
- 1987-10-06 JP JP25181387A patent/JP2551032B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2551032B2 (en) | 1996-11-06 |
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