JPH01157822A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH01157822A JPH01157822A JP31665787A JP31665787A JPH01157822A JP H01157822 A JPH01157822 A JP H01157822A JP 31665787 A JP31665787 A JP 31665787A JP 31665787 A JP31665787 A JP 31665787A JP H01157822 A JPH01157822 A JP H01157822A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- resin
- laminate
- vacuum
- initial pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000011888 foil Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000012298 atmosphere Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 238000000465 moulding Methods 0.000 abstract description 8
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 239000002648 laminated material Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 7
- 239000004744 fabric Substances 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 etc. can be used Substances 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000008141 laxative Substances 0.000 description 1
- 230000002475 laxative effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
本発明はプリント配線板などとして用いる積層板の製造
方法に関する。The present invention relates to a method for manufacturing a laminate used as a printed wiring board or the like.
従来上り、内層材と樹脂含浸基材と金属箔などを積み重
ねた積層体が複数組真空囲い込みプレス機構を具備した
熱盤間に配置され、減圧下加熱加圧されて積層板が製造
されているが、樹脂含浸基材の樹脂含有量のむら、熱盤
内での温度上昇の差などに起因して成形された積層板に
はボイドによるかすれが発生してしまっていた。
このかすれの防止のため、高圧成形がなされているが、
この場合には積層板に大きな反り、ねじれが発生してし
まうという問題があった。Conventionally, multiple sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, metal foil, etc., are placed between hot plates equipped with a vacuum enclosing press mechanism, and heated and pressurized under reduced pressure to produce a laminate. However, due to unevenness in the resin content of the resin-impregnated base material, differences in temperature rise within the heating plate, and other factors, voids caused scratches in the molded laminate. In order to prevent this blurring, high-pressure molding is used.
In this case, there was a problem in that the laminate would be greatly warped and twisted.
本発明は上記事情に鑑みて為されたものであり。
その目的とするところは、かすれがなく、しかも反り、
ねじれの小さな積層板を製造することにある。The present invention has been made in view of the above circumstances. The goal is to avoid blurring and warping.
The purpose is to manufacture laminates with small twists.
本発明の積層板の製造方法は、内層材と樹脂含浸基材と
金属箔などを積み重ねた積層体を複数組減圧雰囲気下加
熱加圧する積層板の製造方法であって、低い初期圧で所
定の減圧状態に達するまで加圧し、次いで初期圧よりも
高い圧力で加圧することを特徴とするものであり、この
構成により上記目的が達成されたものである。
本発明における樹脂含浸基材としては紙、有機a維によ
り形成した布、不織布、又はガラス、アスベスト等の無
機繊維の単独もしくは混紡による布、不織布などの基材
を樹脂フェスに浸漬して樹脂を含浸し、乾燥させて形成
される。基材としては好ましくは厚みが0.10−0.
30+am、重量が100−300g/m”のガラス布
であり、この特定の厚み及び重量以外のがラス布は樹脂
含浸性が悪く含有する気泡が多くなってしまうものであ
る。樹脂フェスの樹脂としてはエポキシ樹脂、ポリイミ
ドuノ脂又はこれらの変性物、フェノール樹脂、不飽和
ポリエステル樹脂等の熱硬化性樹脂を採用できる。この
場合基材への樹脂の含浸はワニス槽を減圧して減圧下で
、又はワニス槽内に配置した上下2個のロール間に基材
を通すことにより加圧した後、除圧して行う。加圧下の
場合、例えばロールが3段で、圧力10kg/am2下
で含浸を行う。樹脂の含浸量は固形分で35〜65重量
%である。減圧下又は加圧下で行うことにより、ワニス
槽中での基材への気泡の巻き込みを少なくできるもので
ある。もちろん常圧下で含浸させてもよい。
この樹脂含浸基材を複数枚積み重ねた積層体を複数組熱
盤間に配置し、熱盤間をいわゆる真空囲い込みし、減圧
雰囲気下、加熱加圧して積層板を成形する。真空度は1
00 ’rorr以下であり、成形圧力は5−150
kg/am2、成形温度は100−200℃、成形時間
は30〜100分程度である。
初期圧は5〜10 kg/ am2であり、真空度が5
00〜100Torrになるまで加圧する。この場合、
積層体の最外層に金属箔を配置しておいてもよい。
金属箔としては銅箔、アルミニウム箔、しんちゅう箔、
ニッケル箔、ステンレス銅箔、鉄箔などを使用でき、こ
の金属箔の片面に接着剤層を設けておき、接着性を高め
てもよい、又、積層体が、内層材の両面に樹脂含浸基材
を配し、その最外層に金属箔を重ねたものでもよい。
このようにして得られた金属箔張り積層板は常法により
外層回路パターンが形成されてプリント配線板としたあ
るいは多層プリント配線板として実用に供される。
次に、本発明の実施例を具体的に説明する。
(実施例1)
ガラス布にエポキシ樹脂を含浸させ乾燥させて得た樹脂
含浸基材を複数枚積み重ね、このものを−姐として複数
組熱盤間に配置し、温度165〜175℃で初期圧5
kg/ 0m2で加圧後、真空度が100Torrに達
した時点で、30 kg/ am2で加圧し、厚み1.
61の積層板を得た。真空度は100Torr、成形時
間は約120分であった(第1図参照)。この積層板の
がすれ発生率、1 wX 1 m品の常態での反り、板
厚のばらつきを測定した。結果を1i表に示す。
(実施例2)
初期圧10 kg/ 0m2で真空度が300 Tor
rに達するまで加圧した以外は実施例1と同様にして積
層板を製造した。この積層板についても実施例1と同様
の測定を行った。結果を第1表に示す。(実施例3)
初期圧10kg/am2で真空度が500 Torrに
達した時点で無圧にした以外は実施例1と同様にして積
層板を製造した。この積層板についても実施例1と同様
の測定を行った。結果を第1表に示す。
(比較例)
真空度100 Torr、圧力60 kg/ 0m2と
した以外は実施例1と同様にして積層板を製造した(第
2図参照)。この積層板についても実施例1と同様の測
定を行った。結果を第1表に示す。
第1表
実施例 比較例
かすれ発生率 0 0 4 5
(%)
反り 8 8 10 15
(輸m)
板厚の
ばらつき幅 0.08 0.08 0,09 0.1
5all+1
本発明のいずれの実施例も比較例よりもかすれ発生率、
反り、板厚のばらつき幅が小さいことが判る。そして、
初期圧が小さく、初期圧を解除する時の真空度が小さい
程これら特性は優れることが理解される。これは、減圧
効果が高まることによる。The method for manufacturing a laminate of the present invention is a method for manufacturing a laminate in which multiple sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, metal foil, etc., are heated and pressurized in a reduced-pressure atmosphere, and a predetermined level is achieved at a low initial pressure. This feature is characterized in that the pressure is increased until a reduced pressure state is reached, and then the pressure is increased at a pressure higher than the initial pressure, and this configuration achieves the above object. In the present invention, the resin-impregnated base material may be paper, cloth made of organic a-fiber, non-woven fabric, or cloth made of inorganic fibers such as glass or asbestos alone or in a blend, or non-woven fabric, and the like is dipped in a resin face to soak the resin. Formed by impregnation and drying. The thickness of the base material is preferably 0.10-0.
30+am and weighs 100-300 g/m". Glass cloth other than this specific thickness and weight has poor resin impregnation properties and contains a large number of air bubbles. As a resin for a resin face. Thermosetting resins such as epoxy resins, polyimide resins or modified products thereof, phenolic resins, and unsaturated polyester resins can be used for the resin.In this case, the resin is impregnated into the base material under reduced pressure by reducing the pressure in the varnish bath. Alternatively, pressure is applied by passing the base material between two upper and lower rolls arranged in a varnish tank, and then the pressure is removed.In the case of pressurization, for example, there are three rolls, and impregnation is carried out under a pressure of 10 kg/am2. The amount of resin impregnated is 35 to 65% by weight in terms of solid content.By carrying out the process under reduced pressure or increased pressure, it is possible to reduce the entrainment of air bubbles into the base material in the varnish bath. Impregnation may also be carried out under pressure. A plurality of laminates made by stacking a plurality of these resin-impregnated substrates are placed between heating platens, a so-called vacuum is enclosed between the heating plates, and the laminate is heated and pressurized in a reduced pressure atmosphere. Form.Vacuum degree is 1
00'rorr or less, and the molding pressure is 5-150
kg/am2, molding temperature is 100-200°C, and molding time is about 30-100 minutes. The initial pressure is 5-10 kg/am2, and the degree of vacuum is 5
Pressurize until the pressure reaches 00 to 100 Torr. in this case,
A metal foil may be placed on the outermost layer of the laminate. Metal foils include copper foil, aluminum foil, brass foil,
Nickel foil, stainless steel copper foil, iron foil, etc. can be used, and an adhesive layer may be provided on one side of this metal foil to improve adhesion.Also, the laminate may have a resin-impregnated base on both sides of the inner layer material. It may also be one in which metal foil is layered on the outermost layer. The metal foil-clad laminate thus obtained is used in practical use as a printed wiring board or a multilayer printed wiring board by forming an outer layer circuit pattern by a conventional method. Next, examples of the present invention will be specifically described. (Example 1) A plurality of resin-impregnated base materials obtained by impregnating glass cloth with epoxy resin and drying them were stacked, and the plurality of sets were placed between heating plates, and the initial pressure was set at a temperature of 165 to 175°C. 5
After pressurizing at 30 kg/am2, when the degree of vacuum reached 100 Torr, pressurizing at 30 kg/am2 and reducing the thickness to 1.
61 laminates were obtained. The degree of vacuum was 100 Torr, and the molding time was about 120 minutes (see Figure 1). The rate of occurrence of peeling of this laminate, the warping of the 1 w x 1 m product under normal conditions, and the variation in plate thickness were measured. The results are shown in Table 1i. (Example 2) Initial pressure 10 kg/0 m2 and vacuum degree 300 Tor
A laminate was produced in the same manner as in Example 1, except that the pressure was applied until it reached r. The same measurements as in Example 1 were also performed on this laminate. The results are shown in Table 1. (Example 3) A laminate was manufactured in the same manner as in Example 1 except that the initial pressure was 10 kg/am2 and the pressure was turned off when the degree of vacuum reached 500 Torr. The same measurements as in Example 1 were also performed on this laminate. The results are shown in Table 1. (Comparative Example) A laminate was produced in the same manner as in Example 1 except that the degree of vacuum was 100 Torr and the pressure was 60 kg/0 m2 (see FIG. 2). The same measurements as in Example 1 were also performed on this laminate. The results are shown in Table 1. Table 1 Example Comparative Example Fading incidence 0 0 4 5 (%) Warpage 8 8 10 15
(Import) Dispersion width of plate thickness 0.08 0.08 0.09 0.1
5all+1 All of the examples of the present invention have a higher blurring occurrence rate than the comparative example.
It can be seen that the variations in warpage and plate thickness are small. and,
It is understood that these characteristics are better as the initial pressure is smaller and the degree of vacuum is smaller when the initial pressure is released. This is due to the increased pressure reduction effect.
本発明は内層材と樹脂含浸基材と金属箔などを積み重ね
た積層体を複数組減圧雰囲気下剤熱加圧する積層板の製
造方法であって、低い初期圧で所定の減圧状態に達する
まで加圧し、次いで初期圧よりも高い圧力で加圧するの
で、低い初期圧下樹脂含浸基材中の樹脂が溶融した常態
で減圧することになり、樹脂中に含まれるボイドを効率
良く除 去でき、成形された積層板にボイドによるか
すれの発生を抑制することができるものであり、しかも
ボイドを効率より除去で外るので、成形圧もそれだけ低
圧にでき、積層板の反り、板厚のばらつき幅を小さくで
きるものである。The present invention is a method for manufacturing a laminate in which multiple sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, metal foil, etc., are heated and pressed in a reduced pressure atmosphere under a laxative. Then, since the pressure is applied at a higher pressure than the initial pressure, the pressure is reduced in the normal state where the resin in the resin-impregnated base material is molten, and the voids contained in the resin can be efficiently removed and molded. It is possible to suppress the occurrence of scratches due to voids in the laminate, and since the voids are removed by removal rather than efficiency, the molding pressure can be lowered to that extent, and the warpage of the laminate and the width of variation in board thickness can be reduced. It is something.
第1図は本発明の一実施例における圧力と真空度の関係
を示すグラフ、第2図は従来例における圧力と真空度の
関係を示すグラフである。
代理人 弁理士 石 1)艮 七FIG. 1 is a graph showing the relationship between pressure and vacuum degree in an embodiment of the present invention, and FIG. 2 is a graph showing the relationship between pressure and vacuum degree in a conventional example. Agent Patent Attorney Ishi 1) Ai Shichi
Claims (4)
積層体を複数組減圧雰囲気下加熱加圧する積層板の製造
方法であって、低い初期圧で所定の減圧状態に達するま
で加圧し、次いで初期圧よりも高い圧力で加圧すること
を特徴とする積層板の製造方法。(1) A method for manufacturing a laminate in which multiple sets of laminates, each consisting of an inner layer material, a resin-impregnated base material, metal foil, etc., are heated and pressurized in a reduced pressure atmosphere, and the pressure is applied at a low initial pressure until a predetermined reduced pressure state is reached. , and then pressurizing at a higher pressure than the initial pressure.
外層に金属箔を重ねて成ることを特徴とする特許請求の
範囲第1項記載の積層板の製造方法。(2) The method for manufacturing a laminate according to claim 1, wherein the laminate is formed by stacking a plurality of resin-impregnated base materials and overlapping a metal foil on the outermost layer.
の最外層に金属箔を重ねて成ることを特徴とする特許請
求の範囲第1項記載の積層板の製造方法。(3) The method for manufacturing a laminate according to claim 1, wherein the laminate is formed by disposing resin-impregnated base materials on both sides of an inner layer material and overlapping metal foil on the outermost layer.
ことを特徴とする特許請求の範囲第1項記載の積層板の
製造方法。(4) The method for manufacturing a laminate according to claim 1, wherein the laminate is formed by stacking a plurality of resin-impregnated base materials.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31665787A JPH01157822A (en) | 1987-12-15 | 1987-12-15 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31665787A JPH01157822A (en) | 1987-12-15 | 1987-12-15 | Manufacture of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01157822A true JPH01157822A (en) | 1989-06-21 |
Family
ID=18079456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31665787A Pending JPH01157822A (en) | 1987-12-15 | 1987-12-15 | Manufacture of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01157822A (en) |
-
1987
- 1987-12-15 JP JP31665787A patent/JPH01157822A/en active Pending
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