JPH01255526A - Manufacture of laminated sheet - Google Patents
Manufacture of laminated sheetInfo
- Publication number
- JPH01255526A JPH01255526A JP63083417A JP8341788A JPH01255526A JP H01255526 A JPH01255526 A JP H01255526A JP 63083417 A JP63083417 A JP 63083417A JP 8341788 A JP8341788 A JP 8341788A JP H01255526 A JPH01255526 A JP H01255526A
- Authority
- JP
- Japan
- Prior art keywords
- base materials
- laminate
- heating
- electromagnetic
- laminates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 230000005674 electromagnetic induction Effects 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 9
- 230000006698 induction Effects 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- -1 etc. alone Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気機器、電子機器、電子計算機、通信機器等
に用いられるＭ層板の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing M-layer plates used in electrical equipment, electronic equipment, electronic computers, communication equipment, etc.
従来、電気機器等に用いられる積層板は多段プレス方式
で、約美段位の黙然の各熱盤間に約巧組位の積層体を成
形プレートを介して挿入し加熱加圧成形するもので、各
積層体への加熱はｆｋ気、熱水、熱油等の熱媒体によっ
て伝熱加熱されていた。Conventionally, laminates used for electrical equipment, etc. are produced using a multi-stage press method, in which a laminate of approximately the same level is inserted between each heat plate at approximately the same level via a forming plate, and then heated and pressed. Each laminate was heated by heat transfer using a heat medium such as FK air, hot water, or hot oil.
従来の技術で述べたように現在の多段プレス成形におい
ては、熱盤間に約Ｌ５組位の積層体が存在するので黙然
に近い積層体と、熱盤間の中央部に位置する積層体とで
は伝熱速度が異なり受熱量も異な９１回の積層成形で得
られる積層板の品質ノくフツキの最大原因となっていた
。又熱盤内には熱媒体が入っているので黙然寸法が大と
なシ、プレス寸法も大きくなるのは避けられなかった。As mentioned in the conventional technology, in current multi-stage press forming, there are about L5 sets of laminates between the hot plates, so there is a difference between the laminates that are close to each other and the laminates located in the center between the hot plates. In this case, the heat transfer rate and amount of heat received were different, which was the biggest cause of the unevenness in the quality of the laminate obtained by 91 times of lamination molding. In addition, since a heating medium is contained in the heating plate, the size of the plate becomes large, and it is inevitable that the press size also becomes large.
更に黙然からの放熱ロスも大きくエネルギー損失も大な
るものであった。本発明は従来の技術における上述の問
題点に鑑みてなされたもので、その目的トスるところは
、品質バフツキのないＭ層板が得られ、プレス寸法を小
さくでき、且つエネルギー効率のよい積層板の製造方法
を提供することにある。Furthermore, the heat radiation loss from silence was also large, and the energy loss was also large. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to obtain an M-layer board with no quality buffing, to reduce the press size, and to produce an energy-efficient laminate. The purpose of this invention is to provide a method for manufacturing the same.
本発明は所要枚数の樹脂含浸基材を重ね、更に必要に応
じてその上面及び又は下面に金属箔を載置した積層体を
電磁誘導加熱により積層成形することを特徴とする積層
板の製造方法のため、積層体間の成形プレートを直接加
熱することができるので、各ｖｌｔ層体の加熱は均一と
なシバラッキを発生することがなくなり、又熱盤内に熱
源を収納する必要がなくなったのでその分寸法を減少さ
せることができる。更に黙然からの放熱がないのでエネ
ルギーを節約することができるもので、以下本発明の詳
細な説明する。The present invention is a method for producing a laminate, which comprises stacking a required number of resin-impregnated base materials, and then, if necessary, placing metal foil on the upper and/or lower surfaces of the laminate to form a laminate by electromagnetic induction heating. Therefore, since the molding plates between the laminated bodies can be directly heated, the heating of each VLT laminated body is uniform and no cracking occurs, and there is no need to store a heat source in the heating plate. The size can be reduced accordingly. Furthermore, since there is no heat dissipation, energy can be saved.The present invention will be described in detail below.
本発明に用いる樹脂含浸基材の樹脂としては、フェノー
ル樹脂、クレゾール樹脂、エポキシ樹脂、不飽和ポリエ
ステル樹脂、メフミン樹脂、ポリイミド樹脂、ポリアミ
イミド樹脂、ジアリルレフタレ、−ト樹脂等の単独、混
合物、変性物等の熱硬化性樹脂全般を用いることができ
る。基材としてはがフス、アスベスト等の無機繊維やポ
リエステル樹脂、ポリアミド樹脂、ポリビニルアルコ−
／１／樹脂、ポリアミイミド樹脂、ポリフレタン樹脂等
の有機合成繊維や木綿等の天然繊維からなる織布、不織
布、寒冷紗、マット或は紙又はこれらの組合せ基材等で
ある。金属箔としては銅、ニッケル、アルミニウム、鉄
等の単独又は合金からなる金属箔を用い必要に応じて金
属箔の片面に接着層や鍍金層や粗面化等の活性化処理を
施し更に接着性を向上させることもできるものである。The resins of the resin-impregnated base material used in the present invention include phenolic resins, cresol resins, epoxy resins, unsaturated polyester resins, mefmin resins, polyimide resins, polyamimide resins, diallyl phthalate resins, etc. alone, mixtures, and modified resins. Thermosetting resins in general can be used. Base materials include inorganic fibers such as glue and asbestos, polyester resin, polyamide resin, and polyvinyl alcohol.
/1/ Woven fabrics, nonwoven fabrics, cheesecloth, mats, paper, or combinations of these materials are made of organic synthetic fibers such as resins, polyamiimide resins, and polyurethane resins, and natural fibers such as cotton. The metal foil is made of copper, nickel, aluminum, iron, etc. alone or in an alloy, and if necessary, one side of the metal foil is treated with an adhesive layer, a plating layer, or an activation treatment such as roughening to improve adhesiveness. It is also possible to improve the
電磁誘導加熱としては、熱盤間に電磁波誘導装置を設置
し、熱盤間で電磁波を発生、加熱することが好ましいが
、特に限定するものではない。As for electromagnetic induction heating, it is preferable to install an electromagnetic wave induction device between the heating plates and generate electromagnetic waves between the heating plates to heat the heating, but there is no particular limitation.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚さ０．１８Ｍの２工ノール樹脂含浸紙８枚を重ねた上
、下面に厚さ語ミクロンの接着層付銅箔の接着層側を樹
脂含浸基材と対向させて配設した積層体を成形プレート
に挾んだもの５組を電磁波誘導装置を備えた熱盤間に挾
み成形圧力１００にη１、積層体が１６０″Ｃになるよ
うに電磁誘導加熱しω分間ｖ！Ｊ層成形して積層板を得
た。Example: Laminate of 8 sheets of paper impregnated with 2-produced resin with a thickness of 0.18M, and a copper foil with an adhesive layer of micron thickness on the bottom surface, with the adhesive layer side facing the resin-impregnated base material. Five pairs of bodies sandwiched between molding plates were placed between heating plates equipped with an electromagnetic wave induction device, and the molding pressure was 100 η1, and the laminate was heated by electromagnetic induction to a temperature of 160″C for ω minutes v!J layer. A laminate was obtained by molding.
従来例
、実施例のＭＨＩ体を成形プレートに挾んだもの３組を
蒸気加熱式黙然に挾み、成形圧カニｏ ｏ ｋｇ／ｅｄ
、１６０″Ｃでω分間積層成形して積層板を得た。Three sets of MHI bodies of the conventional example and the example were sandwiched between molding plates in a steam-heated manner, and the molding pressure was set to 0 kg/ed.
, 160″C for ω minutes to obtain a laminate.
実施例と従来例の積層板の反り、吸水率、プレス高さ寸
法及びエネルギー消費は第１表のようである。Table 1 shows the warpage, water absorption, press height, and energy consumption of the laminates of the example and the conventional example.
第１表 注 帯ｌ ＪＩＳ−Ｋ・６４８１による。Table 1 note Band l According to JIS-K 6481.
奈２ 従来を１００とした場合の比である。N2 This is the ratio when the conventional value is set to 100.
本発明は上述した如く構成されている。特許請求の範囲
第１項に記載した構成を有するｍ層板の製造方法におい
ては、積層板の品質バラツキをなくし、プレス寸法を小
さくすることができ、更にエネルギ・−を節約すること
のできる効果を有している。The present invention is constructed as described above. In the method for manufacturing an m-layer board having the structure described in claim 1, the quality variation of the laminate can be eliminated, the press size can be reduced, and energy can be further saved. have.
Claims (1)
てその上面及び又は下面に金属箔を載置した積層体を積
層成形する積層板の製造方法において、電磁誘導加熱に
より加熱することを特徴とする積層板の製造方法。(1) In a method for manufacturing a laminate in which a required number of resin-impregnated substrates are stacked and, if necessary, metal foil is placed on the upper and/or lower surfaces of the laminate, the laminate is laminated and formed by heating by electromagnetic induction heating. A method for manufacturing a laminate, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63083417A JPH01255526A (en) | 1988-04-05 | 1988-04-05 | Manufacture of laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63083417A JPH01255526A (en) | 1988-04-05 | 1988-04-05 | Manufacture of laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01255526A true JPH01255526A (en) | 1989-10-12 |
Family
ID=13801861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63083417A Pending JPH01255526A (en) | 1988-04-05 | 1988-04-05 | Manufacture of laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01255526A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999007550A1 (en) * | 1997-08-06 | 1999-02-18 | Nitta Corporation | Method of preheating laminate, and method and apparatus for producing the same |
| WO2004103042A1 (en) * | 2003-05-15 | 2004-11-25 | Cedal Equipment Srl | Process for producing printed electronic circuits, including multilayer, by endothermic induction heating |
| JP2019072962A (en) * | 2017-10-18 | 2019-05-16 | 東洋インキＳｃホールディングス株式会社 | Exfoliation preventive sheet for electromagnetic induction heating, adhesion structure and method for producing the same, and structure and method for producing the same |
| US11148384B2 (en) | 2015-12-28 | 2021-10-19 | Cedal Equipment Co., Ltd. | Thermo induction press for welding printed circuits and method carried out thereof |
-
1988
- 1988-04-05 JP JP63083417A patent/JPH01255526A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999007550A1 (en) * | 1997-08-06 | 1999-02-18 | Nitta Corporation | Method of preheating laminate, and method and apparatus for producing the same |
| US6359273B1 (en) * | 1997-08-06 | 2002-03-19 | Nitta Corporation | Method and apparatus for producing a unified laminated body by dielectric heating and method for dielectrically preheating a laminate structure for the unified laminated body |
| WO2004103042A1 (en) * | 2003-05-15 | 2004-11-25 | Cedal Equipment Srl | Process for producing printed electronic circuits, including multilayer, by endothermic induction heating |
| US11148384B2 (en) | 2015-12-28 | 2021-10-19 | Cedal Equipment Co., Ltd. | Thermo induction press for welding printed circuits and method carried out thereof |
| JP2019072962A (en) * | 2017-10-18 | 2019-05-16 | 東洋インキＳｃホールディングス株式会社 | Exfoliation preventive sheet for electromagnetic induction heating, adhesion structure and method for producing the same, and structure and method for producing the same |
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