JPH05309758A - Manufacture of laminate - Google Patents

Manufacture of laminate

Info

Publication number
JPH05309758A
JPH05309758A JP4113549A JP11354992A JPH05309758A JP H05309758 A JPH05309758 A JP H05309758A JP 4113549 A JP4113549 A JP 4113549A JP 11354992 A JP11354992 A JP 11354992A JP H05309758 A JPH05309758 A JP H05309758A
Authority
JP
Japan
Prior art keywords
resin
laminate
elongation
metal foil
laminated plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4113549A
Other languages
Japanese (ja)
Inventor
Shigehiro Okada
茂浩 岡田
Soichi Horibata
壮一 堀端
Tetsuo Mito
哲郎 三刀
Shuji Makino
秀志 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4113549A priority Critical patent/JPH05309758A/en
Publication of JPH05309758A publication Critical patent/JPH05309758A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)

Abstract

PURPOSE:To provide the manufacturing method for a laminate of superior dimension stability and having no warp nor torsion. CONSTITUTION:A continuous laminate with continuous foil of 10-50% elongation at 150-200 deg.C disposed on the upper or lower face of a resin impregnated continuous base is continuously laminate molded under no-pressure, and then cut into the required dimension, and then after-cured at the temperature of glass transition point and quenched in the manufacturing method.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電子機器、電気機器、
コンビュ−タ−、通信機器等に用いられる積層板の製造
方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic equipment, electric equipment,
The present invention relates to a method for manufacturing a laminated board used for a computer, a communication device and the like.

【0002】[0002]

【従来の技術】従来、無圧連続製造方法で得られる積層
板は、通常の金属箔即ち150〜200℃での伸び率が
1〜7%の金属箔を用いている。この金属箔は従来のプ
レス工法による加熱加圧成形では、加圧されるので加
熱、冷却によっても金属箔は波打ち状態になることはな
い。しかし無圧連続製造方法では加圧されないので加熱
によっても金属箔の伸びは少なく追従しないので金属箔
は波打ち状態となり、そのまま硬化固定化され外観不良
になる欠点があった。
2. Description of the Related Art Conventionally, a laminate obtained by a pressureless continuous production method uses a normal metal foil, that is, a metal foil having an elongation of 1 to 7% at 150 to 200 ° C. Since this metal foil is pressed by the conventional heating and pressurizing method using a press method, the metal foil does not become wavy even by heating and cooling. However, in the pressureless continuous manufacturing method, there is a drawback that the metal foil stretches little even when heated and does not follow because it is not pressed, and the metal foil is in a corrugated state and hardened and fixed as it is, resulting in poor appearance.

【0003】[0003]

【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の無圧連続製造方法で得られる積層板には外
観不良が発生しやすいという問題点があった。本発明は
従来の技術における上述の問題点に鑑みてなされたもの
で、その目的とするところは無圧連続製造方法で反り、
ねじれが小さく、寸法安定性のよい積層板を提供するこ
とにある。
As described in the prior art, the laminated plate obtained by the conventional pressureless continuous manufacturing method has a problem that a defective appearance is apt to occur. The present invention has been made in view of the above problems in the prior art, the object is to warp in a pressureless continuous manufacturing method,
An object of the present invention is to provide a laminated plate having small twist and good dimensional stability.

【0004】[0004]

【課題を解決するための手段】本発明は、所要枚数の樹
脂含浸長尺基材の上面及び又は下面に、150〜200
℃での伸び率が10〜50%の長尺金属箔を配設した長
尺積層体を、連続的に無圧で積層成形後、所要寸法に切
断し、ガラス転移点以上の温度にてアフターキュアー
後、急冷することを特徴とする積層板の製造方法のた
め、無圧であっても加熱下では金属箔の伸び率が大きく
追従するので金属箔は波打ち状態とならず外観のよい積
層板を得ることができるものである。
According to the present invention, a required number of resin-impregnated long base materials are provided on the upper surface and / or lower surface with 150 to 200
After continuously laminating and molding a long laminate having a long metal foil having an elongation at 10 ° C of 10 to 50%, cut it to the required size, and after-sales at a temperature above the glass transition point. Due to the method of manufacturing a laminated plate, which is characterized by rapid cooling after curing, the elongation of the metal foil greatly follows under heating even without pressure, so the metallic foil does not become wavy and has a good appearance. Is what you can get.

【0005】以下本発明を詳細に説明する。本発明に用
いる樹脂含浸長尺基材の基材は、ガラス、セラミック、
アスベスト等の無機質繊維や、ビニルアルコ−ル、ポリ
イミド、ポリエチレンテレフタレート、ポリブチレンテ
レフタレート、ポリアミド、ポリフエニレンサルフアイ
ド、ポリフエニレンオキサイド、フッ素樹脂等の有機質
繊維や木綿等の天然繊維からなる織布、不織布、紙等で
ある。基材に含浸させる樹脂としては、フェノ−ル樹
脂、エポキシ樹脂、不飽和ポリエステル樹脂、ビニルエ
ステル樹脂(エポキシアクリレート樹脂とも言う)の単
独、変性樹脂、混合物が用いられ、必要に応じてタル
ク、クレ−、炭酸カルシュウム、水酸化アルミニュ−
ム、シリカ等の無機質粉末充填剤や、ガラス繊維、アス
ベスト繊維、パルプ繊維、合成繊維、セラミック繊維等
の繊維質充填剤を添加することができる。更に樹脂は同
一の樹脂のみによる含浸でもよいが、同系樹脂で1次含
浸を低粘度樹脂とし、2次含浸をより高粘度樹脂による
含浸としてもよく、また架橋剤や異系樹脂により1次含
浸、2次含浸というように含浸を複数にし、より含浸が
均一になるようにしてもよい。かくして基材に樹脂を含
浸して樹脂含浸基材を得るものである。樹脂含浸基材は
必要とする積層板厚みに応じて所要枚数用いることがで
き、織布、不織布、紙を併用することもできる。金属箔
としては150〜200℃での伸び率が10〜50%の
銅、アルミニュウム、真鍮、ニッケル、鉄等の単独、合
金、複合箔が用いられ、必要に応じて金属箔の片面に接
着剤層を設けておくことができる。即ち150〜200
℃は樹脂の硬化時に必要な温度であり、伸び率10〜5
0%は上記温度で金属箔に波打ちを発生させないために
必要な金属箔の伸び率である。かくして上記樹脂含浸基
材の上面及び又は下面に、上記金属箔を配設した長尺積
層体を無圧で積層成形ー体化して積層板を得るものであ
る。長尺積層体の無圧積層成形一体化は樹脂、基材、厚
さ等で、硬化時間、硬化温度を選択することができる
が、硬化温度は上記150〜200℃であることが望ま
しい。積層成形後は、カッター等で所要寸法に切断後、
ガラス転移点以上の温度にて10〜60分間アフターキ
ュアーしてから、急冷して積層板を得るものである。急
冷処理は30℃以下に30秒以内空冷、水冷、液体窒素
冷却等するものであるが、水冷が簡単で処理しやすく望
ましいことである。
The present invention will be described in detail below. The base material of the resin-impregnated long base material used in the present invention is glass, ceramic,
Inorganic fibers such as asbestos, vinyl alcohol, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyamide, polyphenylene sulfide, polyphenylene oxide, woven fabric made of organic fibers such as fluororesin and natural fibers such as cotton, Non-woven fabric, paper, etc. As the resin with which the base material is impregnated, a phenol resin, an epoxy resin, an unsaturated polyester resin, a vinyl ester resin (also referred to as an epoxy acrylate resin) alone, a modified resin or a mixture is used. -, Calcium carbonate, aluminum hydroxide-
Inorganic powder fillers such as silica and silica, and fibrous fillers such as glass fibers, asbestos fibers, pulp fibers, synthetic fibers and ceramic fibers can be added. Furthermore, the resin may be impregnated only with the same resin, but the primary impregnation with the same resin may be a low-viscosity resin and the secondary impregnation may be an impregnation with a higher-viscosity resin, and the primary impregnation with a crosslinking agent or a heterogeneous resin. It is also possible to make the impregnation more uniform so as to make the impregnation more uniform, such as secondary impregnation. Thus, the base material is impregnated with the resin to obtain the resin-impregnated base material. The required number of resin-impregnated base materials can be used according to the required laminate thickness, and woven cloth, non-woven cloth, and paper can also be used in combination. As the metal foil, a single, alloy, or composite foil of copper, aluminum, brass, nickel, iron or the like having an elongation of 10 to 50% at 150 to 200 ° C. is used, and an adhesive is applied to one side of the metal foil as necessary. Layers can be provided. That is, 150 to 200
C is the temperature required for curing the resin, and the elongation rate is 10 to 5
0% is the elongation rate of the metal foil required to prevent the corrugation of the metal foil at the above temperature. Thus, a long laminated body having the above-mentioned metal foil provided on the upper surface and / or the lower surface of the resin-impregnated base material is laminated and formed into a body without pressure to obtain a laminated plate. In the pressureless lamination molding integration of the long laminate, the curing time and the curing temperature can be selected depending on the resin, the base material, the thickness, etc., but the curing temperature is preferably 150 to 200 ° C. After lamination molding, after cutting to the required dimensions with a cutter,
After being subjected to after-curing for 10 to 60 minutes at a temperature above the glass transition point, it is rapidly cooled to obtain a laminated plate. The rapid cooling treatment is carried out at 30 ° C. or lower within 30 seconds by air cooling, water cooling, liquid nitrogen cooling, etc., but water cooling is preferable because it is easy and easy to process.

【0006】以下本発明を実施例に基づいて説明する。The present invention will be described below based on examples.

【0007】[0007]

【実施例1】厚み0.15mm、幅105cmのガラス
布に、ビニルエステル樹脂(昭和高分子株式会社製、品
番R806−DA)を樹脂量が50重量%になるように
含浸した長尺ビニルエステル樹脂含浸ガラス布7枚の上
下面に、180℃での伸び率が10%の幅105cm、
厚さ0.035mmの長尺銅箔を配設した長尺積層体を
無圧で160℃で30分間連続して積層成形後、カッタ
ーで100cm角に切断後、165℃で10分間アフタ
ーキュアーしてから、10℃にて25秒間急冷して厚さ
1.2mmの積層板を連続的に得た。
Example 1 A long vinyl ester in which a glass cloth having a thickness of 0.15 mm and a width of 105 cm is impregnated with a vinyl ester resin (manufactured by Showa Polymer Co., Ltd., product number R806-DA) so that the resin amount is 50% by weight. Width 105 cm with an elongation of 10% at 180 ° C on the upper and lower surfaces of seven resin-impregnated glass cloths,
A long laminate having a long copper foil with a thickness of 0.035 mm is continuously laminated and formed at 160 ° C. for 30 minutes without pressure, cut into 100 cm squares with a cutter, and after-cured at 165 ° C. for 10 minutes. Then, it was rapidly cooled at 10 ° C. for 25 seconds to continuously obtain a laminated plate having a thickness of 1.2 mm.

【0008】[0008]

【実施例2】180℃での伸び率が30%の長尺銅箔を
用いた以外は、実施例1と同様に処理して厚さ1.2m
mの積層板を連続的に得た。
Example 2 The same process as in Example 1 was carried out except that a long copper foil having an elongation at 180 ° C. of 30% was used, and the thickness was 1.2 m.
m laminates were continuously obtained.

【0009】[0009]

【実施例3】180℃での伸び率が50%の長尺銅箔を
用いた以外は、実施例1と同様に処理して厚さ1.2m
mの積層板を連続的に得た。
Example 3 The same process as in Example 1 was carried out except that a long copper foil having an elongation at 180 ° C. of 50% was used, and a thickness of 1.2 m.
m laminates were continuously obtained.

【0010】[0010]

【比較例1】アフターキュアー後の急冷処理をしない以
外は、実施例1と同様に処理して厚さ1.2mmの積層
板を連続的に得た。
Comparative Example 1 A laminated plate having a thickness of 1.2 mm was continuously obtained in the same manner as in Example 1 except that the quenching treatment after after-curing was not performed.

【0011】[0011]

【比較例2】アフターキュアー後の急冷処理をしない以
外は、実施例2と同様に処理して厚さ1.2mmの積層
板を連続的に得た。
[Comparative Example 2] A laminated plate having a thickness of 1.2 mm was continuously obtained in the same manner as in Example 2 except that the quenching treatment after after-curing was not performed.

【0012】[0012]

【比較例3】アフターキュアー後の急冷処理をしない以
外は、実施例3と同様に処理して厚さ1.2mmの積層
板を連続的に得た。
Comparative Example 3 A laminated plate having a thickness of 1.2 mm was continuously obtained in the same manner as in Example 3 except that the quenching treatment after after-curing was not performed.

【0013】[0013]

【比較例4】180℃での伸び率が1.5%の長尺銅箔
を用いた以外は、実施例1と同様に処理して厚さ1.2
mmの積層板を連続的に得た。
[Comparative Example 4] The same treatment as in Example 1 was carried out except that a long copper foil having an elongation at 180 ° C of 1.5% was used to obtain a thickness of 1.2.
mm laminates were continuously obtained.

【0014】[0014]

【比較例5】180℃での伸び率が7%の長尺銅箔を用
いた以外は、実施例1と同様に処理して厚さ1.2mm
の積層板を連続的に得た。
[Comparative Example 5] A 1.2 mm thick sheet was prepared in the same manner as in Example 1 except that a long copper foil having an elongation at 180 ° C of 7% was used.
The laminated plate of was obtained continuously.

【0015】[0015]

【比較例6】180℃での伸び率が1.5%の長尺銅箔
を用い、アフターキュアー後の急冷処理をしない以外
は、実施例1と同様に処理して厚さ1.2mmの積層板
を連続的に得た。
[Comparative Example 6] A long copper foil having an elongation at 180 ° C of 1.5% was used and the same treatment as in Example 1 was carried out except that no rapid cooling treatment was performed after after-curing. Laminates were obtained continuously.

【0016】[0016]

【比較例7】180℃での伸び率が7%の長尺銅箔を用
い、アフターキュアー後の急冷処理をしない以外は、実
施例1と同様に処理して厚さ1.2mmの積層板を連続
的に得た。
[Comparative Example 7] A laminated plate having a thickness of 1.2 mm was processed in the same manner as in Example 1 except that a long copper foil having an elongation rate at 180 ° C of 7% was used and no rapid cooling treatment after after-curing was performed. Was continuously obtained.

【0017】実施例1乃至3と比較例1乃至7の積層板
の性能は表1、表2のようである。
The performances of the laminated plates of Examples 1 to 3 and Comparative Examples 1 to 7 are shown in Tables 1 and 2.

【0018】[0018]

【表1】 [Table 1]

【0019】[0019]

【表2】 成形後の反りは成形後の両面銅箔張積層板の300×2
50mmサイズの反りでmm単位である。片面剥離後反
りは上記積層板の片面の銅箔を除去した後の反りをmm
単位で示したものである。寸法変化率Aはエッチング処
理後、30分間80℃で乾燥した時の寸法変化率を%で
示したものである。寸法変化率Bは寸法変化率A処理
後、更に170℃で30分間加熱した時の寸法変化率を
%で示したものである。なお寸法変化率は全て収縮であ
る。
[Table 2] Warpage after molding is 300 x 2 for double-sided copper foil-clad laminate after molding
Warpage of 50 mm size in mm. The warp after peeling on one side is the warp after removing the copper foil on one side of the laminated plate in mm.
It is shown in units. The dimensional change rate A shows the dimensional change rate in% after drying at 80 ° C. for 30 minutes after the etching treatment. The dimensional change rate B is the dimensional change rate in% after heating at 170 ° C. for 30 minutes after the dimensional change rate A treatment. The rate of dimensional change is all shrinkage.

【0020】[0020]

【発明の効果】本発明は上述したごとく構成されてい
る。特許請求の範囲に記載した構成を有する積層板の製
造方法においては、得られる積層板の反り、ねじれを小
さくし、寸法安定性をよくすることができ、本発明の優
れていることを確認した。
The present invention is constructed as described above. In the method for producing a laminated plate having the structure described in the claims, it is confirmed that the obtained laminated plate is less warped and twisted, and that dimensional stability can be improved, and that the present invention is excellent. ..

───────────────────────────────────────────────────── フロントページの続き (72)発明者 牧野 秀志 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideshi Makino 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 所要枚数の樹脂含浸長尺基材の上面及び
又は下面に、150〜200℃での伸び率が10〜50
%の長尺金属箔を配設した長尺積層体を、連続的に無圧
で積層成形後、所要寸法に切断し、ガラス転移点以上の
温度にてアフターキュアー後、急冷することを特徴とす
る積層板の製造方法。
1. The elongation percentage at 150 to 200 ° C. is 10 to 50 on the upper surface and / or the lower surface of a required number of resin-impregnated long base materials.
% Of a long metal foil is continuously laminated without pressure, cut into a required size, after-cured at a temperature of a glass transition point or higher, and then rapidly cooled. A method for manufacturing a laminated board.
JP4113549A 1992-05-06 1992-05-06 Manufacture of laminate Pending JPH05309758A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4113549A JPH05309758A (en) 1992-05-06 1992-05-06 Manufacture of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4113549A JPH05309758A (en) 1992-05-06 1992-05-06 Manufacture of laminate

Publications (1)

Publication Number Publication Date
JPH05309758A true JPH05309758A (en) 1993-11-22

Family

ID=14615125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4113549A Pending JPH05309758A (en) 1992-05-06 1992-05-06 Manufacture of laminate

Country Status (1)

Country Link
JP (1) JPH05309758A (en)

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