JPH01272416A - Manufacture of prepreg - Google Patents
Manufacture of prepregInfo
- Publication number
- JPH01272416A JPH01272416A JP10196788A JP10196788A JPH01272416A JP H01272416 A JPH01272416 A JP H01272416A JP 10196788 A JP10196788 A JP 10196788A JP 10196788 A JP10196788 A JP 10196788A JP H01272416 A JPH01272416 A JP H01272416A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- rolls
- base material
- drying chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 238000001035 drying Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000003825 pressing Methods 0.000 claims abstract 2
- 239000007788 liquid Substances 0.000 claims description 14
- 238000007654 immersion Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011889 copper foil Substances 0.000 abstract description 7
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 239000002759 woven fabric Substances 0.000 description 7
- 239000004744 fabric Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 235000013405 beer Nutrition 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、産業機器や電子機器用等の印刷配線板等に用
いる熱硬化性樹脂積層板の製造に用いられるプリプレグ
の製造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for producing prepreg used for producing thermosetting resin laminates used for printed wiring boards for industrial equipment, electronic equipment, etc. be.
産業機器や電子機器用等の印刷配線板の基板などとして
用いられる銅張積層板は、−膜内にプリプレグを複数枚
数重ね、さらに必要に応じてその片面あるいは両面に銅
箔を重ねてこれを加圧成形機で熱圧成形することによっ
て作製される。また、多層銅張積層板は内層用プリント
配線板の両側にプリプレグ、さらにその外側に銅箔を配
して熱圧成形することによって作製される。Copper-clad laminates, which are used as substrates for printed wiring boards for industrial equipment and electronic equipment, are made by layering multiple sheets of prepreg within a membrane and then layering copper foil on one or both sides as necessary. Manufactured by hot-press molding using a pressure molding machine. Moreover, a multilayer copper-clad laminate is produced by placing prepreg on both sides of an inner-layer printed wiring board, and further disposing copper foil on the outside thereof, and then hot-pressing the prepreg.
このプリプレグは、織布等の基材に樹脂液を含浸させ、
次いでこれを乾燥させ溶剤を飛散させることによってB
ステージ化させて作製する。このプリプレグを用いて熱
圧成形し銅張積層板や多層銅張積層板を作製した場合、
銅箔表面の光点の発生や、ビール強度の部分的な低下な
どの問題があった。This prepreg is made by impregnating a base material such as woven fabric with resin liquid,
Next, by drying this and scattering the solvent, B
Stage and produce. When a copper-clad laminate or a multilayer copper-clad laminate is produced by thermoforming using this prepreg,
There were problems such as the occurrence of light spots on the surface of the copper foil and a partial decrease in beer strength.
本発明は銅箔表面の光点の発生や、ビール強度の部分的
低下などの問題点がない銅張積層板や多層銅張積層板製
造用のプリプレグの製造方法を提供しようとするもので
ある。The present invention aims to provide a method for producing prepreg for producing copper-clad laminates and multilayer copper-clad laminates, which is free from problems such as the occurrence of light spots on the surface of copper foil and partial reduction in beer strength. .
本発明者らは従来の樹脂液を含浸させた後乾燥室に導か
れBステージ化されたプリプレグ表面の多数の樹脂突起
物が上記問題点の原因であることを究明し、さらにこの
樹脂突起物ができる原因として、樹脂塗工前の基材、例
えば織布そのものの表面にストランドからとび出したフ
ィラメントがあり、織布に樹脂液を含浸後乾燥室に導か
れる過程でこの部分に樹脂液がたまるためにBステージ
化されたプリプレグ表面に樹脂突起物ができることを見
出し、本発明を完成するに至った。The present inventors investigated that the cause of the above problem was the large number of resin protrusions on the surface of the prepreg, which was impregnated with a conventional resin liquid and then led to a drying chamber and turned into a B stage. The cause of this is that there are filaments protruding from the strands on the surface of the base material before resin coating, such as the woven fabric itself, and the resin liquid accumulates in these areas during the process of impregnating the woven fabric with resin liquid and leading it to the drying room. Therefore, it was discovered that resin protrusions are formed on the surface of B-staged prepreg, and the present invention was completed.
これまで、平坦なプリプレグを得ることを目的にガラス
布等の基材のフィラメントの部分的な飛び出しをなくす
ことを検討したが、ガラス布の欠陥を全く無くすことは
困難であった。Until now, attempts have been made to eliminate the partial protrusion of filaments from a base material such as glass cloth with the aim of obtaining a flat prepreg, but it has been difficult to completely eliminate defects in the glass cloth.
本発明は、以上の点に鑑みて樹脂突起物のない平坦なプ
リプレグを生産性を低下させることな(得ることのでき
るプリプレグの製造方法に関するもので、基材を樹脂液
中に通して浸漬後乾燥させることによってプリプレグを
製造する方法において、乾燥過程または乾燥終了後にプ
リプレグをロールで加圧することによってプリプレグ表
面に発生する凸状の樹脂突起物をつぶし表面の平滑性を
向上させることを特徴とするプリプレグの製造方法を提
供するものである。In view of the above points, the present invention relates to a method for manufacturing a prepreg that can produce a flat prepreg without resin protrusions without reducing productivity. A method for producing prepreg by drying, characterized in that during the drying process or after the completion of drying, the prepreg is pressed with a roll to crush convex resin protrusions that occur on the surface of the prepreg and improve the smoothness of the surface. The present invention provides a method for manufacturing prepreg.
このプリプレグの製造方法は、第1図に示すように基材
、例えば織布1を樹脂液2に通して織布1に樹脂液2を
含浸させこれを乾燥室3に導きBステージ化させること
によってプリプレグ6を製造するにあたって、乾燥室の
外部または内部に具備した一対またはこれを複数組みな
らべたロールでプリプレグを加圧することによりプリプ
レグ表面に発生する凸状の樹脂突起物をつぶし表面の平
滑性を向上させる。As shown in FIG. 1, this prepreg manufacturing method involves passing a base material, for example, a woven fabric 1, through a resin liquid 2 to impregnate the woven fabric 1 with the resin liquid 2, and then leading it to a drying chamber 3 to form a B stage. In manufacturing the prepreg 6, the prepreg is pressed by a pair of rolls or a plurality of rolls installed outside or inside the drying chamber to crush the convex resin protrusions that occur on the prepreg surface and improve the surface smoothness. improve.
図は、本発明の例を示すものでロール状に巻かれた基材
は、熱硬化性樹脂の樹脂液2などを供給して充満しであ
る樹脂液槽5を経由して過剰に付着した樹脂液を一対の
ロール等で所定の厚さに絞り、乾燥室3に導く。続いて
このプリプレグは乾燥室の外出部または内部に具備され
たロール40間を通過することによって加圧されプリプ
レグ6を得る。具備するロール材質は制限しないが、ロ
ール表面はプリプレグ樹脂が付着しないような処理を施
すことが好ましい、また一対のロールで各々のロール硬
度を多少変えるとプリプレグ表面により均一に圧力がか
かるようになるが、双方のロール硬度が同じであっても
よい、ロール温度は、プリプレグの温度が軟化点以上の
場合は特に加熱する必要はないが、軟化点以下の温度の
ときはロール温度を軟化点より多少高めの温度に設定す
ることが好ましい。この操作を乾燥室の外で行うことも
可能である。The figure shows an example of the present invention, in which a base material wound into a roll is passed through a resin liquid tank 5 which is filled with resin liquid 2 of a thermosetting resin, etc., and excessive adhesion occurs. The resin liquid is squeezed to a predetermined thickness using a pair of rolls, etc., and then introduced into the drying chamber 3. Subsequently, this prepreg is pressurized by passing between rolls 40 provided at the outside or inside of the drying chamber to obtain prepreg 6. There are no restrictions on the material of the rolls, but it is preferable to treat the roll surfaces so that the prepreg resin does not adhere to them.Also, by slightly changing the hardness of each roll in a pair of rolls, pressure can be applied more evenly to the prepreg surfaces. However, the hardness of both rolls may be the same.If the temperature of the prepreg is above the softening point, there is no need to particularly heat the roll, but if the temperature is below the softening point, the roll temperature should be lower than the softening point. It is preferable to set the temperature to a slightly higher temperature. It is also possible to carry out this operation outside the drying chamber.
本発明はプリプレグを製造するための基材として織布、
特にガラス布などの長繊維から製造されたものを用いる
ときに好適に適用できる。樹脂液は、エポキシ樹脂、ポ
リエステル樹脂、ポリイミド樹脂等の各種熱硬化性樹脂
の溶液はもちろん、無溶剤樹脂でもよく特に制限はない
。The present invention uses woven fabric as a base material for producing prepreg.
It is particularly suitable for use when using long fibers such as glass cloth. The resin liquid may be a solution of various thermosetting resins such as epoxy resin, polyester resin, or polyimide resin, or may be a solvent-free resin without any particular limitation.
実施例1
硬化剤を混合したエポキシ樹脂のメチルエチルケトン溶
液である粘度が1ボイズ(25°C)樹脂分65重量%
の樹脂液を用い、厚み0.18閣、坪量209g/nf
のガラス布を用いてたで型塗工機で含浸後150℃で乾
燥し乾燥室出口直後に設けたロールでプリプレグを加圧
してBステージ化したプリプレグを作製した。このプリ
プレグ表面を観察した結果、樹脂の突起物のない平坦な
プリプレグを得ることができた。Example 1 A methyl ethyl ketone solution of epoxy resin mixed with a curing agent, viscosity 1 void (25°C) resin content 65% by weight
Using resin liquid, thickness 0.18mm, basis weight 209g/nf
A B-staged prepreg was prepared by impregnating a glass cloth with a wafer coater, drying it at 150°C, and pressurizing the prepreg with a roll installed immediately after the exit of the drying chamber. As a result of observing the surface of this prepreg, it was possible to obtain a flat prepreg with no resin protrusions.
比較例1
実施例と同一の樹脂液及びガラス布を用い実施例と同様
に含浸させた後にBステージ化しプリプレグを得た。こ
のプリプレグ表面を観察した結果、樹脂の突起物が多数
発生していた。Comparative Example 1 A prepreg was obtained by impregnating the same resin liquid and glass cloth as in the example in the same manner as in the example and then converting it into a B stage. As a result of observing the surface of this prepreg, it was found that many resin protrusions were generated.
このようにして得られたプリプレグは、所定の寸法に切
断されたり連続して巻き取られたりしてそれぞれの用途
に合わせて用いられる。実施例1のプリプレグを用いて
熱圧成形した積層板、多層銅張積層板の銅箔表面には光
点の発生がないうえビール強度の部分的な低下も生じな
かった。The prepreg obtained in this way is cut into predetermined dimensions or continuously wound up and used according to each purpose. There were no light spots on the copper foil surfaces of the laminates and multilayer copper-clad laminates that were thermoformed using the prepreg of Example 1, and there was no local decrease in beer strength.
本発明により製造されたプリプレグは表面に樹脂の突起
物がないためこれを用いて熱圧成形した積層板、多層銅
張積層板はその銅箔表面に光点の発生がないうえビール
強度の部分的な低下がなく優れた品質を有している。Since the prepreg manufactured according to the present invention has no resin protrusions on its surface, the laminates and multilayer copper-clad laminates made using this prepreg do not have any light spots on the copper foil surface and have a beer-strength area. It has excellent quality with no physical deterioration.
第1図は、本発明の詳細な説明する側面概略説明図であ
る。
符号の説明
1、織布 2.樹脂液FIG. 1 is a schematic side view explaining the present invention in detail. Explanation of symbols 1. Woven fabric 2. resin liquid
Claims (1)
ってプリプレグを製造する方法において、乾燥過程また
は乾燥終了後にプリプレグをロールで加圧することによ
ってプリプレグ表面に発生する凸状の樹脂突起物をつぶ
し表面の平滑性を向上させることを特徴とするプリプレ
グの製造方法。1. In a method of manufacturing prepreg by passing a base material into a resin liquid and drying it after immersion, convex resin protrusions that occur on the surface of the prepreg are removed by pressing the prepreg with a roll during the drying process or after drying. A method for producing prepreg characterized by improving the smoothness of the crushed surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10196788A JPH01272416A (en) | 1988-04-25 | 1988-04-25 | Manufacture of prepreg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10196788A JPH01272416A (en) | 1988-04-25 | 1988-04-25 | Manufacture of prepreg |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01272416A true JPH01272416A (en) | 1989-10-31 |
Family
ID=14314640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10196788A Pending JPH01272416A (en) | 1988-04-25 | 1988-04-25 | Manufacture of prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01272416A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002034023A1 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Circuit forming board producing method, circuit forming board, and material for circuit forming board |
KR20170141203A (en) | 2015-05-01 | 2017-12-22 | 히타치가세이가부시끼가이샤 | Method for manufacturing FRP precursor and apparatus for manufacturing the same |
KR20170141204A (en) | 2015-05-01 | 2017-12-22 | 히타치가세이가부시끼가이샤 | Method for manufacturing FRP precursor and apparatus for manufacturing the same |
WO2018181513A1 (en) | 2017-03-28 | 2018-10-04 | 日立化成株式会社 | Method for manufacturing frp precursor and method for manufacturing frp |
KR20240015640A (en) | 2021-06-01 | 2024-02-05 | 가부시끼가이샤 레조낙 | Prepreg, laminate, metal clad laminate, printed wiring board, semiconductor package, prepreg manufacturing method, and metal clad laminate manufacturing method |
-
1988
- 1988-04-25 JP JP10196788A patent/JPH01272416A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002034023A1 (en) * | 2000-10-16 | 2002-04-25 | Matsushita Electric Industrial Co., Ltd. | Circuit forming board producing method, circuit forming board, and material for circuit forming board |
US6833042B2 (en) | 2000-10-16 | 2004-12-21 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
US7754321B2 (en) | 2000-10-16 | 2010-07-13 | Panasonic Corporation | Method of manufacturing clad board for forming circuitry, clad board and core board for clad board |
KR20170141203A (en) | 2015-05-01 | 2017-12-22 | 히타치가세이가부시끼가이샤 | Method for manufacturing FRP precursor and apparatus for manufacturing the same |
KR20170141204A (en) | 2015-05-01 | 2017-12-22 | 히타치가세이가부시끼가이샤 | Method for manufacturing FRP precursor and apparatus for manufacturing the same |
US10933562B2 (en) | 2015-05-01 | 2021-03-02 | Showa Denko Materials Co., Ltd. | Method for producing FRP precursor and device for producing same |
WO2018181513A1 (en) | 2017-03-28 | 2018-10-04 | 日立化成株式会社 | Method for manufacturing frp precursor and method for manufacturing frp |
KR20190126821A (en) | 2017-03-28 | 2019-11-12 | 히타치가세이가부시끼가이샤 | Method for producing FRP precursor and method for producing FRP |
US11446845B2 (en) | 2017-03-28 | 2022-09-20 | Showa Denko Materials Co., Ltd. | Method for manufacturing FRP precursor and method for manufacturing FRP |
KR20240015640A (en) | 2021-06-01 | 2024-02-05 | 가부시끼가이샤 레조낙 | Prepreg, laminate, metal clad laminate, printed wiring board, semiconductor package, prepreg manufacturing method, and metal clad laminate manufacturing method |
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