JPS63214411A - Production of prepreg - Google Patents
Production of prepregInfo
- Publication number
- JPS63214411A JPS63214411A JP4852687A JP4852687A JPS63214411A JP S63214411 A JPS63214411 A JP S63214411A JP 4852687 A JP4852687 A JP 4852687A JP 4852687 A JP4852687 A JP 4852687A JP S63214411 A JPS63214411 A JP S63214411A
- Authority
- JP
- Japan
- Prior art keywords
- woven fabric
- prepreg
- bubbles
- resin
- roll
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 49
- 239000011347 resin Substances 0.000 claims abstract description 49
- 239000002759 woven fabric Substances 0.000 claims abstract description 34
- 238000001035 drying Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 28
- 238000007598 dipping method Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 6
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 210000001061 forehead Anatomy 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Reinforced Plastic Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、産業機器や電子機器用等の印刷配線板の基板
などに用いる熱硬化性樹脂積層板の製造に用いられるプ
リプレグの製造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for producing prepreg used for producing thermosetting resin laminates used for substrates of printed wiring boards for industrial equipment, electronic equipment, etc. It is something.
産業機器や電子機器用等の印刷配線板の基板などとして
用いられる積層板は一般的に、織布に樹脂を含浸させこ
れを乾燥させ溶剤を飛ばすことによってBステージ化し
たプリプレグを作製し、このプリプレグを複数枚重ねて
さらに必要に応じてその片面あるいは両面に金属箔を重
ねこれを加圧成形機で熱圧成形するこによって得られる
。このプリプレグを作製するにあたっては、織布を樹脂
液に通して樹脂液を織布に含浸させる操作を行う。Laminated boards used as substrates for printed wiring boards for industrial equipment and electronic equipment are generally made by impregnating woven fabric with resin, drying it, and removing the solvent to create a B-stage prepreg. It can be obtained by stacking a plurality of prepregs, further stacking metal foil on one or both sides of the prepreg as needed, and then hot-pressing the prepreg using a pressure molding machine. In producing this prepreg, a woven fabric is passed through a resin liquid to impregnate the woven fabric with the resin liquid.
含浸方法としては、樹脂液に織布を浸漬する方法、樹脂
液に浸漬した状態で一対のロールで絞る方法、キスロー
ルを用いて織布の片面から樹脂液を含浸する方法等の含
浸工程を経た後に過剰に付着した樹脂液を一対のロール
等で所定の厚さに絞り、乾燥室に導き溶剤を除去する方
法が通常行われている。これらの方法で製造されたプリ
プレグは、織布のストランド内から気泡が抜けず、プリ
プレグ内には数十μmから長いもので数鶴の長さをもつ
気泡が多く発生したままBステージ化される。このため
、これを積層して印刷配線板として用いたりその接着シ
ートとして用いる場合は、特性に悪影響がないように熱
圧成形時に多大の圧力をかけることで気泡を除去してい
る。The impregnation methods include immersing the woven fabric in the resin liquid, squeezing it with a pair of rolls while immersed in the resin liquid, and impregnating the woven fabric from one side with the resin liquid using a kiss roll. Afterwards, a method is generally used in which the excess resin liquid is squeezed to a predetermined thickness using a pair of rolls, etc., and then introduced into a drying chamber to remove the solvent. In prepregs manufactured by these methods, air bubbles do not escape from within the strands of the woven fabric, and the prepregs are converted to the B stage with many air bubbles ranging in length from several tens of micrometers to several cranes generated inside the prepregs. For this reason, when this is laminated and used as a printed wiring board or as an adhesive sheet for the same, air bubbles are removed by applying a large amount of pressure during hot-press molding so as not to adversely affect the properties.
しかしながら、このように熱圧成形時に多大の圧力をか
けると、成形品に残留応力が発生しやすく、再加熱時に
残留応力が解放され、寸法安定性の低下やそり、ねじれ
が大きくなる問題を生じる。However, when a large amount of pressure is applied during hot-pressing molding, residual stress is likely to occur in the molded product, and the residual stress is released during reheating, resulting in problems such as decreased dimensional stability and increased warping and twisting. .
特に、ストランド内に長い気泡が多く発生した場合は、
成形時にBステージ化された樹脂で埋めきれずにそのま
ま気泡として積層板内に残留し、耐水性や耐熱性、電気
特性等の特性に悪影響を及ぼし信頼性の低下も生じる。In particular, if many long air bubbles occur within the strand,
During molding, the B-staged resin cannot be filled completely and remains in the laminate as bubbles, which adversely affects properties such as water resistance, heat resistance, and electrical properties, resulting in a decrease in reliability.
寸法安定性に優れ、そり、ねじれ、気泡のない積層板を
得るには低圧で成形することが好ましいが、従来のプリ
プレグでは気泡が多いため気泡の発生していないプリプ
レグが必要となる。In order to obtain a laminate with excellent dimensional stability and no warping, twisting, or bubbles, it is preferable to mold it at low pressure, but since conventional prepregs have many bubbles, a prepreg without bubbles is required.
これまで、気泡の発生していないプリプレグを得るため
に、樹脂液中に織布を長時間浸漬する方法や樹脂液を介
して織布に超音波をかける方法や真空中で含浸させる方
法が検討されている。Up until now, in order to obtain prepreg without bubbles, methods of immersing the woven fabric in a resin liquid for a long time, applying ultrasonic waves to the woven fabric through the resin liquid, and impregnating the woven fabric in a vacuum have been studied. has been done.
しかしながら、これらの方法にはそれぞれ生産効率の低
下や発熱、連続織布の生産が困難であるなどの問題が生
じるため現実的でない。However, these methods are not realistic because they each have problems such as decreased production efficiency, heat generation, and difficulty in producing continuous woven fabrics.
本発明は、以上の点に鑑みてなされたもので、気泡のな
いプリプレグを生産性を低下させることなく得ることの
できるプリプレグの製造方法を提供することを目的とす
る。The present invention has been made in view of the above points, and an object of the present invention is to provide a prepreg manufacturing method that can obtain a prepreg without air bubbles without reducing productivity.
本発明者はプリプレグに用いる織布に樹脂を含浸する方
法について検討した結果、織布を樹脂に浸漬する前に、
あらかじめ特定なロールを用いて樹脂を塗布しておくこ
とにより、前記目的を達成し得ることを見出し、本発明
を完成するに至った。The present inventor investigated a method of impregnating a woven fabric used for prepreg with resin, and found that, before immersing the woven fabric in resin,
The inventors have discovered that the above object can be achieved by applying the resin in advance using a specific roll, and have completed the present invention.
すなわち、本発明は、織布を樹脂液中に通して浸漬後乾
燥させることによってプリプレグを製造する方法におい
て、樹脂液に織布を通す前に、キスロールとねじ山付ロ
ールとの間を通して樹脂を塗布することを特徴とする。That is, the present invention provides a method for producing prepreg by passing a woven fabric through a resin liquid, dipping it, and then drying it, in which the resin is passed between a kiss roll and a threaded roll before passing the woven fabric through the resin liquid. It is characterized by being applied.
以下、本発明を図面に従って説明する。第1図は本発明
のプリプレグの製造方法に用いる装置の一例を、示す概
略図である。The present invention will be explained below with reference to the drawings. FIG. 1 is a schematic diagram showing an example of an apparatus used in the prepreg manufacturing method of the present invention.
1はプリプレグの基材となる織布で、通常ガラスなどの
長繊維から製造されたものが使用される。1 is a woven fabric that serves as the base material of the prepreg, and is usually made from long fibers such as glass.
樹脂液槽7.8には織布に含浸させる樹脂液2が充満し
である。キスロール4は樹脂液槽7に一部を浸漬し常に
一定量の樹脂液を持ち上げるように回転するようになっ
ており、キスロールの回転に合わせてねじ山付ロールも
回転するようになっている。キスロール4とねじ山付ロ
ール5の圧力は、織布の繊維切れや凹曲がりが発生しな
い範囲で織布の全中に均一にかかればよい。The resin liquid tank 7.8 is filled with resin liquid 2 to be impregnated into the fabric. The kiss roll 4 is partially immersed in the resin liquid tank 7 and is rotated so as to always lift a certain amount of the resin liquid, and the threaded roll is also rotated in accordance with the rotation of the kiss roll. The pressure of the kiss roll 4 and the threaded roll 5 may be uniformly applied throughout the woven fabric within a range that does not cause fiber breakage or concave bending of the woven fabric.
1本のキスロールに設置するねし山付ロールの数は複数
にしてもよく、さらにはこのような組み合わせのキスロ
ールを複数組設置してもよい、ねじ山付ロールのねし山
の形は台形かそれに近い形状のものが好ましいが、ねじ
山の先端は平面でも曲面でもよく、特に限定するもので
はない。ねじ山の高さは、ねじの谷の部分から織布内の
気泡が外部へ抜けやすいように1.0鶴以上とすること
が好ましい。The number of threaded rolls installed on one kiss roll may be plural, and moreover, multiple kiss rolls in such a combination may be installed.The threaded thread shape of the threaded roll is trapezoidal. Although it is preferable to have a shape similar to that of the thread, the tip of the thread may be flat or curved, and is not particularly limited. It is preferable that the height of the thread is 1.0 or more so that air bubbles in the fabric can easily escape from the valley of the thread to the outside.
本発明方法においては、織布を樹脂液中に通して浸漬す
る前に、前記のキスロールとねし山付ロールとの間を通
して樹脂を塗布することが必要である。In the method of the present invention, it is necessary to pass the resin between the kiss roll and the threaded roll before passing the woven fabric through the resin solution and immersing it.
織布は、回転するねじ山付ロールでしごかれながら通過
することによって織布のストランド内で樹脂の移動が起
こり、気泡が極めて細か(分断されやすくなり、またね
じ出で押圧されるため気泡が織布の巾方向に移動するた
め、ストランド内の気泡が抜けやす(なる。As the woven fabric passes through a rotating threaded roll while being squeezed, the resin moves within the strands of the woven fabric, causing very fine air bubbles (easily broken up), and air bubbles being compressed by the screwing process. As the strands move in the width direction of the woven fabric, air bubbles within the strands can easily escape.
キスロールとねじ山付ロールの間を通した織布は樹脂液
槽8に導かれ、樹脂液中に浸漬され、プリプレグとして
必要とされる量の樹脂液を付着させる。The woven fabric passed between the kiss roll and the threaded roll is led to a resin liquid tank 8 and immersed in the resin liquid, thereby depositing the amount of resin liquid required for the prepreg.
本発明において樹脂液としては、エポキシ樹脂、ポリエ
ステル樹脂、ポリイミド樹脂等の各種の熱硬化性樹脂の
溶液が用いられる。In the present invention, solutions of various thermosetting resins such as epoxy resins, polyester resins, and polyimide resins are used as the resin liquid.
次いで、樹脂液を含浸された織布lは乾燥ゾーン9へと
導入されプリプレグ3となる。このようにして得られた
プリプレグ3は気泡がほとんどないため、低圧で圧熱成
形しても気泡がない積層板を得ることが可能となる。こ
の低圧成形の実現によって寸法変化に優れ、そり、ねじ
れの少ない積層板や多層印刷配線板を製造することがで
きる。Next, the woven fabric 1 impregnated with the resin liquid is introduced into a drying zone 9 and becomes a prepreg 3. Since the prepreg 3 thus obtained has almost no air bubbles, it is possible to obtain a air bubble-free laminate even when pressure molded at low pressure. By realizing this low-pressure molding, it is possible to manufacture laminates and multilayer printed wiring boards with excellent dimensional change and less warpage and twisting.
実施例1
硬化剤を混合したエポキシ樹脂のメチルエチルケトンか
らなる粘度3.5ボイズ(25℃)、樹脂分70%の樹
脂液を用い、厚み0.18m、秤量210g/rrfの
ガラス布(日東紡社製、商品名W218K)を用い、外
径400mキスロール1本に対して、ねじ山の形が台形
、山の高さが1.3fl、ピッチが2.5皿のねし山を
もった外径300mのねし山付ロール1本を組み合わせ
たものを2組設置し、この間にガラス布を通過させたの
ち、所定の樹脂を塗布し、16α℃の乾燥ゾーンを通し
てプリプレグを得た。このプリプレグを顕微鏡で80倍
で観察して気泡の発生状態を調べたが、最大50μm以
上の長さをもつ気泡は全くなかった。Example 1 Using a resin liquid of methyl ethyl ketone, an epoxy resin mixed with a curing agent and having a viscosity of 3.5 voids (25°C) and a resin content of 70%, a glass cloth (Nittobo Co., Ltd.) with a thickness of 0.18 m and a weight of 210 g/rrf was used. (manufactured by Manufacturer, product name: W218K), and for one kiss roll with an outer diameter of 400 m, an outer diameter with a trapezoidal thread shape, a thread height of 1.3 fl, and a thread pitch of 2.5 counters is used. Two sets of one 300 m threaded roll were installed, a glass cloth was passed between them, a prescribed resin was applied, and a prepreg was obtained through a drying zone at 16α°C. This prepreg was observed under a microscope at a magnification of 80 times to examine the state of bubble generation, but no bubbles with a maximum length of 50 μm or more were found.
比較例1
ねじ山付ロールを用いない他は、実施例と同一の樹脂液
及びガラス布を用い、樹脂液槽にガラス布を実施例と同
じ時間をかけて浸漬させて後、実施例と同一条件で乾燥
してプリプレグを得た。このプリプレグを上記実施例と
同一条件で観察してプリプレグ中の気泡の発生状態を調
べた結果、最大で5額の長さをもつ気泡が全面に発生し
ていた。Comparative Example 1 The same resin liquid and glass cloth as in the example were used, except that the threaded roll was not used, and the glass cloth was immersed in the resin liquid bath for the same time as in the example, and then A prepreg was obtained by drying under the following conditions. As a result of observing this prepreg under the same conditions as in the above-mentioned example to examine the state of air bubble generation in the prepreg, it was found that air bubbles having a maximum length of five foreheads were generated over the entire surface.
本発明の製造方法により気泡がほとんどないプリプレグ
を生産性を低下させることなく得ることができた。この
プリプレグは低圧で熱圧成形が可能であり、その結果、
寸法変化に優れ、そり、ねじれの少ない積層板や多層印
刷配線板を製造することができるようになった。By the manufacturing method of the present invention, a prepreg with almost no bubbles could be obtained without reducing productivity. This prepreg can be thermoformed at low pressure, and as a result,
It has become possible to produce laminates and multilayer printed wiring boards with excellent dimensional change and less warpage and twisting.
第1図は、本発明に用いる装置の一例を示す概略説明図
である。
符号の説明
1、織布 2.樹脂液
3、プリプレグ 4.キスロール5、ねじ山付
ロール 6.樹脂液
7、樹脂液槽 8.樹脂液槽9、乾燥ゾーン
第1図FIG. 1 is a schematic explanatory diagram showing an example of an apparatus used in the present invention. Explanation of symbols 1. Woven fabric 2. Resin liquid 3, prepreg 4. Kiss roll 5, threaded roll 6. Resin liquid 7, resin liquid tank 8. Resin liquid tank 9, drying zone Figure 1
Claims (1)
ってプリプレグを製造する方法において、樹脂液に織布
を通す前に、あらかじめキスロールとねじ山付ロールと
の間を通して樹脂を塗布することを特徴とするプリプレ
グの製造方法。1. In a method of manufacturing prepreg by passing a woven fabric through a resin liquid and drying it after dipping, the resin is applied by passing the woven fabric between a kiss roll and a threaded roll in advance before passing the woven fabric through the resin liquid. A method for producing prepreg characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4852687A JPS63214411A (en) | 1987-03-03 | 1987-03-03 | Production of prepreg |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4852687A JPS63214411A (en) | 1987-03-03 | 1987-03-03 | Production of prepreg |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63214411A true JPS63214411A (en) | 1988-09-07 |
Family
ID=12805804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4852687A Pending JPS63214411A (en) | 1987-03-03 | 1987-03-03 | Production of prepreg |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63214411A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008059603A1 (en) * | 2006-11-15 | 2008-05-22 | Sumitomo Bakelite Co., Ltd. | Prepreg manufacturing method and prepreg |
TWI381925B (en) * | 2006-11-16 | 2013-01-11 | Sumitomo Bakelite Co | Prepreg manufacturing method and prepreg |
-
1987
- 1987-03-03 JP JP4852687A patent/JPS63214411A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008059603A1 (en) * | 2006-11-15 | 2008-05-22 | Sumitomo Bakelite Co., Ltd. | Prepreg manufacturing method and prepreg |
TWI381925B (en) * | 2006-11-16 | 2013-01-11 | Sumitomo Bakelite Co | Prepreg manufacturing method and prepreg |
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