JPH08198982A - Production of laminate - Google Patents

Production of laminate

Info

Publication number
JPH08198982A
JPH08198982A JP7008800A JP880095A JPH08198982A JP H08198982 A JPH08198982 A JP H08198982A JP 7008800 A JP7008800 A JP 7008800A JP 880095 A JP880095 A JP 880095A JP H08198982 A JPH08198982 A JP H08198982A
Authority
JP
Japan
Prior art keywords
resin
thickness
laminate
laminated
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP7008800A
Other languages
Japanese (ja)
Inventor
Masakatsu Tamei
政克 為井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7008800A priority Critical patent/JPH08198982A/en
Publication of JPH08198982A publication Critical patent/JPH08198982A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

PURPOSE: To provide a method for producing a laminate uniform in the thickness and used for electronic equipment or electric equipment. CONSTITUTION: In the method for producing the laminate by impregnating substrates (e.g. woven fabrics comprising polyester fibers) with a resin (e.g. an unsaturated polyester varnish), laminating the produced plural prepregs to each other, nipping the produced laminate 1 with molding plates (e.g. stainless mirror plates) 2, inserting the produced article 10 to be pressed between heated disks, and subsequently heating and pressing the article 10, the resin content in the central part of each of the prepregs is larger than that in the peripheral edge part, and the thickness in the peripheral edge part is smaller than that in the central part. Thereby, the pressure in the central part of the laminate 1 is lower than that in the peripheral part, and the flow of the resin from the peripheral part of the laminate 1 can be reduced. When the resin is flowed out from the peripheral part of the laminate 1, it can be prevented that the thickness of the laminate in the peripheral part is reduced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子機器、電気機器に用
いられる積層板の製造方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminated board used in electronic equipment and electric equipment.

【0002】[0002]

【従来の技術】従来から、基材に樹脂を含浸しプリプレ
グを作製し、このプリプレグを複数枚重ねた積層体を、
厚みが均一な成形プレートに挟み被圧体とし、この被圧
体を熱盤間に挿入し、加熱、及び加圧して積層板を得る
方法が知られている。しかし、加熱加圧の際、積層板の
周囲より樹脂が流出するため、積層板の周囲の板厚が中
央部より周縁部が薄くなる欠点があった。
2. Description of the Related Art Conventionally, a prepreg is prepared by impregnating a base material with a resin, and a laminate obtained by stacking a plurality of prepregs is
A method is known in which a pressed body is sandwiched between molding plates having a uniform thickness, the pressed body is inserted between heating plates, and heated and pressed to obtain a laminated plate. However, since the resin flows out from the periphery of the laminated plate during heating and pressing, there is a drawback that the peripheral thickness of the laminated plate is smaller in the peripheral portion than in the central portion.

【0003】[0003]

【発明が解決しようとする課題】この解決策として、厚
みが中央部より周縁部が薄い成形プレートを用いる方法
が知られているが、近年の高密度化に伴い、板厚のより
均一な積層板が求められている。
As a solution to this problem, there is known a method of using a molding plate having a thinner peripheral edge portion than the central portion, but with the recent increase in density, a more uniform lamination of plate thickness is achieved. A board is required.

【0004】本発明は上記事実に鑑みてなされたもの
で、その目的とするところは、板厚の均一な積層板の製
造方法を提供することにある。
The present invention has been made in view of the above facts, and an object of the present invention is to provide a method for producing a laminated plate having a uniform plate thickness.

【0005】[0005]

【課題を解決するための手段】本発明の請求項1に係る
積層板の製造方法は、基材に樹脂を含浸してプリプレグ
を作製し、このプリプレグを複数枚重ねた積層体を成形
プレートに挟んで被圧体とし、この被圧体を熱盤間に挿
入し、加熱、及び加圧する積層板の製造方法であって、
上記プリプレグの樹脂含有量が中央より基材の端縁部が
多く、且つ、上記成形プレートは周縁部の厚さが中央部
より薄いことを特徴とする。
A method for manufacturing a laminated board according to a first aspect of the present invention is to impregnate a base material with a resin to prepare a prepreg, and form a laminated body in which a plurality of the prepregs are stacked on a molding plate. A method for manufacturing a laminated plate, which comprises sandwiching a pressed body, inserting the pressed body between heating plates, and heating and pressing,
The resin content of the prepreg is larger in the edge portion of the base material than in the center, and the molding plate is thinner in the peripheral edge portion than in the central portion.

【0006】本発明の請求項2に係る積層板の製造方法
は、請求項1記載の積層板の製造方法において、上記熱
盤の周縁部の厚みが中央部より薄いことを特徴とする。
A method for manufacturing a laminated board according to a second aspect of the present invention is characterized in that, in the method for manufacturing a laminated board according to the first aspect, the thickness of the peripheral portion of the heating plate is thinner than that of the central portion.

【0007】本発明の請求項3に係る積層板の製造方法
は、請求項1又は請求項2記載の積層板の製造方法にお
いて、上記プリプレグの作製の際に、基材への樹脂含有
量を制御する一対の絞りロールの少なくともどちらか片
方が、中央部のロール径が端部のロール径より大きいロ
ールを用いたことを特徴とする。
The method for producing a laminated plate according to claim 3 of the present invention is the method for producing a laminated plate according to claim 1 or 2, wherein the resin content in the base material is adjusted when the prepreg is produced. At least one of the pair of squeezing rolls to be controlled uses a roll having a central roll diameter larger than the end roll diameter.

【0008】以下、本発明の積層板の製造方法を図面に
基づいて説明する。図1は本発明の一実施例に使用する
構成材料を分離して示した断面図であり、図2(a)は
本発明の一実施例に使用する成形プレートの平面図、
(b)は断面図である。図3は本発明の一実施例に使用
する含浸装置の要部側面図であり、図4(a)はこの含
浸装置の絞りロールを示した斜視図、(b)は断面図で
ある。
The method for manufacturing a laminated board of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view in which constituent materials used in one embodiment of the present invention are shown separately, and FIG. 2A is a plan view of a molding plate used in one embodiment of the present invention.
(B) is a sectional view. FIG. 3 is a side view of an essential part of an impregnating apparatus used in one embodiment of the present invention, FIG. 4 (a) is a perspective view showing a squeezing roll of this impregnating apparatus, and FIG. 4 (b) is a sectional view.

【0009】本発明の製造方法で得られる積層板は、基
材4に樹脂を含浸し、樹脂が半硬化したプリプレグが用
いられる。上記基材4としては、例えばガラス、アスベ
スト等の無機繊維やポリエステル、ポリアミド、ポリビ
ニルアルコール、アクリル等の有機合成繊維や木綿等の
天然繊維からなる織布、不織布、マット或いは紙又はこ
れらを組み合わせた基材が用いられる。上記樹脂として
は、例えばフェノール樹脂、エポキシ樹脂、ポリイミド
樹脂、不飽和ポリエステル樹脂、メラミン樹脂、フッ素
樹脂等の単独、変成物、混合物等が挙げられる。また、
樹脂は、アセトン、メチルアルコール、水等の溶剤、硬
化剤、充填剤等を必要に応じて適宜添加し、樹脂ワニス
6を得る。この樹脂ワニス6の状態で基材4に含浸する
のが汎用されている。上記プリプレグを複数枚重ね、必
要により銅箔等の金属箔を重ね積層体1を得る。この積
層体1を成形プレート2に挟み被圧体10とし、この被
圧体10を熱盤3の間に挿入し、加熱、及び加圧すると
積層板が得られる。
The laminated plate obtained by the manufacturing method of the present invention uses a prepreg obtained by impregnating the base material 4 with a resin and semi-curing the resin. The base material 4 is, for example, woven fabric, non-woven fabric, mat or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic and natural fibers such as cotton, or a combination thereof. A substrate is used. Examples of the above-mentioned resin include phenol resin, epoxy resin, polyimide resin, unsaturated polyester resin, melamine resin, fluororesin, etc. alone, modified products, and mixtures. Also,
As the resin, a solvent such as acetone, methyl alcohol, water, etc., a curing agent, a filler, etc. are appropriately added as necessary to obtain a resin varnish 6. It is generally used to impregnate the base material 4 in the state of the resin varnish 6. A plurality of the above prepregs are stacked, and if necessary, a metal foil such as a copper foil is stacked to obtain a laminated body 1. The laminated body 1 is sandwiched between the molding plates 2 to form a pressure-receiving body 10. The pressure-receiving body 10 is inserted between the heating plates 3 and heated and pressed to obtain a laminated plate.

【0010】本発明においては、図1及び図2に示す如
く、周縁部11の厚さが中央部12より薄い成形プレー
ト2が用いられる。上記成形プレート2は、積層板より
剛性が高い、ステンレス、鉄、アルミニウム、ニッケル
等の単独、合金からなる、例えば鏡板が用いられる。上
記成形プレート2の周縁部11及び中央部12の厚さは
限定しないが、例えば、中央部12の厚さが1〜3mm
ものを使用し、成形プレート2の四周縁からの長さbが
100〜200mm、中央部12と周縁部11の厚みの
差aが0.1〜0.2mm程度が例示される。上記成形
プレート2を用いて加圧すると、積層体1の中央部に比
較し周縁部にかかる圧力が低くなるため、積層体1の周
縁部からの樹脂の流出を少なくできる。
In the present invention, as shown in FIGS. 1 and 2, a molding plate 2 having a peripheral edge portion 11 thinner than the central portion 12 is used. The shaping plate 2 is made of stainless steel, iron, aluminum, nickel or the like alone or an alloy having a higher rigidity than the laminated plate, for example, a mirror plate is used. Although the thickness of the peripheral portion 11 and the central portion 12 of the molding plate 2 is not limited, for example, the thickness of the central portion 12 is 1 to 3 mm.
For example, the length b from the four peripheral edges of the molding plate 2 is 100 to 200 mm, and the thickness difference a between the central portion 12 and the peripheral edge portion 11 is about 0.1 to 0.2 mm. When pressure is applied using the molding plate 2, the pressure applied to the peripheral portion of the laminated body 1 is lower than that applied to the central portion of the laminated body 1, so that the outflow of resin from the peripheral portion of the laminated body 1 can be reduced.

【0011】また、積層体1の中央部に比較し周縁部に
かかる圧力を低くするために、被圧体10が挿入される
熱盤3において、熱盤3の周縁部13の厚みを中央部1
4より薄くしておくと、より大きい効果が得られる。熱
盤3の周縁部13の薄さは中央部14より0.1〜0.
2mm程度が例示される。
Further, in order to lower the pressure applied to the peripheral portion of the laminated body 1 as compared with the central portion thereof, in the heating plate 3 into which the pressure member 10 is inserted, the thickness of the peripheral portion 13 of the heating plate 3 is set to the central portion. 1
If it is made thinner than 4, a larger effect can be obtained. The thickness of the peripheral portion 13 of the hot platen 3 is 0.1 to 0.
For example, about 2 mm.

【0012】本発明においては、積層体1を構成するプ
リプレグとして、樹脂含有量が中央より基材4の端縁部
が多いものが用いられる。上記プリプレグの作製方法を
図3及び図4に基づいて説明する。プリプレグを作製す
る際に使用される含浸装置は図3に示す如く、樹脂ワニ
ス6が満たされた含浸槽8内に浸漬ロール7を備え、樹
脂ワニス6上に一対の絞りロール5を備える。上記基材
4は浸漬ロール7により樹脂ワニス6内に導かれ、樹脂
ワニス6を含浸した後に、上記絞りロール5,5の間を
通過する。この際、上記絞りロール5,5の間隔によ
り、基材4への樹脂含有量が制御される。図4に示す如
く、上記含浸装置の絞りロール5は、少なくともどちら
か片方の絞りロール5において、この絞りロール5の中
央部15のロール径が端部16のロール径より大きい形
状である。上記絞りロール5のロール径は限定はしない
が、端部16のロール径cは300mm程度で、中央部
15のロール径と端部16のロール径の差dは0.1〜
0.2mm程度が例示される。絞りロール5の端部16
の間隔が中央部15の間隔よる大きくなるので、プリプ
レグの中央の樹脂含有量が端縁部より多くなる。プリプ
レグの中央の樹脂含有量が端縁部より多くなると、加熱
加圧の際、積層体1の周囲より樹脂が流出しても、積層
板の周囲の板厚を従来に比較して、厚くすることができ
る。その結果、積層板の中央と周縁部の厚みが均一にで
きる。なお、本発明においては、プリプレグの作製方法
は図に示す方法に限定するものではない。
In the present invention, as the prepreg which constitutes the laminate 1, one having a resin content in which the edge portion of the base material 4 is larger than that in the center is used. A method for producing the prepreg will be described with reference to FIGS. 3 and 4. As shown in FIG. 3, the impregnating apparatus used for producing a prepreg includes an immersion roll 7 in an impregnation tank 8 filled with a resin varnish 6, and a pair of squeezing rolls 5 on the resin varnish 6. The substrate 4 is guided into the resin varnish 6 by the dipping roll 7, impregnated with the resin varnish 6, and then passes between the squeezing rolls 5 and 5. At this time, the resin content in the substrate 4 is controlled by the distance between the squeezing rolls 5 and 5. As shown in FIG. 4, the squeezing roll 5 of the impregnating device has a shape in which at least one of the squeezing rolls 5 has a roll diameter of the central portion 15 of the squeezing roll 5 larger than that of the end portion 16. Although the roll diameter of the squeezing roll 5 is not limited, the roll diameter c of the end portion 16 is about 300 mm, and the difference d between the roll diameter of the central portion 15 and the roll diameter of the end portion 16 is 0.1 to 10.
An example is about 0.2 mm. Edge 16 of squeezing roll 5
Is larger than that of the central portion 15, the resin content in the center of the prepreg is larger than that in the edge portion. When the resin content in the center of the prepreg is larger than that in the edge portion, the thickness of the periphery of the laminated plate is increased as compared with the conventional case even if the resin flows out from the periphery of the laminated body 1 during heating and pressing. be able to. As a result, the thickness of the central portion and the peripheral portion of the laminated plate can be made uniform. In addition, in the present invention, the method for producing the prepreg is not limited to the method shown in the drawings.

【0013】上述の如く、本発明の方法によって、積層
体1の中央部に比較し周縁部にかかる圧力を低くするこ
とにより、積層体1の周縁部からの樹脂の流出を少なく
すると共に、積層体1の周囲より樹脂が流出しても、積
層板の周囲の板厚が薄くなるのを防ぐ。その結果、板厚
の均一な積層板が得られる。
As described above, according to the method of the present invention, by lowering the pressure applied to the peripheral portion of the laminated body 1 as compared with the central portion thereof, the resin outflow from the peripheral portion of the laminated body 1 is reduced and the laminated body is laminated. Even if the resin flows out from the periphery of the body 1, the thickness of the periphery of the laminated plate is prevented from becoming thin. As a result, a laminated plate having a uniform plate thickness can be obtained.

【0014】[0014]

【作用】本発明の請求項1に係る積層板の製造方法にお
いては、プリプレグの樹脂含有量が中央より基材の端縁
部が多いので、積層体1の周囲より樹脂が流出しても積
層板の周囲の板厚が薄くなるのを防ぎ、さらに、成形プ
レート2は周縁部11の厚さが中央部12より薄いの
で、積層体1の中央部に比較し周縁部にかかる圧力が低
くなる。
In the method for manufacturing a laminated board according to the first aspect of the present invention, since the resin content of the prepreg is larger in the edge portion of the base material than in the center, even if the resin flows out from the periphery of the laminated body 1, it is laminated. It is possible to prevent the plate thickness around the plate from becoming thin. Further, since the peripheral edge portion 11 of the molding plate 2 is thinner than the central portion 12, the pressure applied to the peripheral edge portion is lower than that of the central portion of the laminated body 1. .

【0015】本発明の請求項2に係る積層板の製造方法
においては、熱盤3の周縁部13の厚みを中央部14よ
り薄くしておくので、積層体1の中央部に比較し周縁部
にかかる圧力が低くなる。
In the method for manufacturing a laminated board according to the second aspect of the present invention, since the thickness of the peripheral edge portion 13 of the heating platen 3 is made smaller than that of the central portion 14, the peripheral edge portion is compared with the central portion of the laminated body 1. The pressure applied to is low.

【0016】本発明の請求項3に係る積層板の製造方法
においては、プリプレグの作製の際に使用する一対の絞
りロール5,5の少なくともどちらか片方が、中央部1
5のロール径が端部16のロール径より大きいロールで
あるので、絞りロール5の端部16の間隔が中央部15
の間隔よる大きくなるので、プリプレグの中央の樹脂含
有量が端縁部より多くなる。
In the method for producing a laminated board according to the third aspect of the present invention, at least one of the pair of squeezing rolls 5 and 5 used in the production of the prepreg has the central portion 1
Since the roll diameter of No. 5 is larger than the roll diameter of the end portion 16, the interval between the end portions 16 of the squeezing roll 5 is the central portion 15
The resin content in the center of the prepreg becomes larger than that in the edge portion because the distance becomes larger than that at the edge portion.

【0017】[0017]

【実施例】【Example】

実施例1 基材2として、基材幅1060mm、重量135g/m
2のクラフト紙を用いた。樹脂ワニス6は、桐油変性レ
ゾール型フェノール樹脂をメタノールで希釈して用い
た。
Example 1 As the base material 2, a base material width of 1060 mm and a weight of 135 g / m
2 kraft papers were used. The resin varnish 6 was prepared by diluting a tung oil-modified resol type phenol resin with methanol.

【0018】プリプレグの作製は次の様に行った。図3
に示す含浸装置を使用し、この含浸装置は図4に示す絞
りロール5を一対備えていた。絞りロール5は幅が13
00mm、絞りロール5の端部16のロール径cは30
0mm、中央部15のロール径と端部16のロール径の
差dは0.1mmであった。プリプレグの中央の樹脂含
有量が48重量%となるように制御しながら含浸し、1
55℃で100秒間乾燥して、樹脂が半硬化した状態で
あるプリプレグを得た。
The prepreg was manufactured as follows. FIG.
The impregnating apparatus shown in FIG. 4 was used, and this impregnating apparatus was equipped with a pair of squeezing rolls 5 shown in FIG. The width of the squeezing roll 5 is 13
00 mm, the roll diameter c of the end portion 16 of the squeezing roll 5 is 30
0 mm, the difference d between the roll diameter of the central portion 15 and the roll diameter of the end portion 16 was 0.1 mm. Impregnation was performed while controlling the resin content in the center of the prepreg to be 48% by weight.
It was dried at 55 ° C. for 100 seconds to obtain a prepreg in which the resin was semi-cured.

【0019】得られたプリプレグを8枚重ね、片側の最
上層に厚さ0.035mmの接着剤付き銅箔を配設して積
層体1とした。図2に示す成形プレート2を使用した。
成形プレート2は、中央部12の厚さが1.5mm、成
形プレート2の四周縁からの長さbが200mm、中央
部12と周縁部11の厚みの差aが0.15mmであっ
た。上記積層体1をこの成形プレート2に挟み、被圧体
10とした。得た被圧体10を熱盤3に挿入した。熱盤
3は周縁部13が中央部より0.1mm薄いものを使用
した。圧力100kg/cm2、温度150℃で60分間成
形し、厚さ1.6mmの積層板を得た。
Eight sheets of the obtained prepreg were stacked, and a copper foil with an adhesive having a thickness of 0.035 mm was arranged on the uppermost layer on one side to obtain a laminate 1. The molding plate 2 shown in FIG. 2 was used.
In the molding plate 2, the thickness of the central portion 12 was 1.5 mm, the length b from the four peripheral edges of the molding plate 2 was 200 mm, and the thickness difference a between the central portion 12 and the peripheral portion 11 was 0.15 mm. The laminated body 1 was sandwiched between the molding plates 2 to form a body 10 to be pressed. The pressure target body 10 thus obtained was inserted into the heating platen 3. The hot platen 3 used had a peripheral edge portion 13 thinner than the central portion by 0.1 mm. Molding was performed at a pressure of 100 kg / cm 2 and a temperature of 150 ° C. for 60 minutes to obtain a laminated plate having a thickness of 1.6 mm.

【0020】この積層板の厚みを評価した。厚さはマイ
クロメータで基材の中央、及び、周縁から10mm内側
に入った個所を測定し、厚さの差を求めた。結果は表1
に示すとおり、中央と周縁部の厚さは差がなかった。
The thickness of this laminate was evaluated. The thickness was measured with a micrometer at the center of the base material and the location within 10 mm from the peripheral edge to determine the difference in thickness. The results are shown in Table 1.
As shown in, there was no difference in thickness between the center and the peripheral portion.

【0021】実施例2 熱盤として、周縁部と中央部の厚さが同じものを使用し
た以外は実施例1と同様にして積層板を得た。この積層
板の厚みを実施例1と同様に評価した。結果は表1に示
すとおり、中央と周縁部の厚さは差が0.01mmであ
った。
Example 2 A laminated board was obtained in the same manner as in Example 1 except that a hot plate having the same thickness at the peripheral portion and the central portion was used. The thickness of this laminate was evaluated in the same manner as in Example 1. As shown in Table 1, the difference in thickness between the center and the peripheral portion was 0.01 mm.

【0022】比較例1 絞りロールはロール径300mmの均一なものを、成形
プレートは厚さが1.5mmと均一なものを、熱盤は周
縁部と中央部の厚さが同じものを使用した以外は実施例
1と同様にして積層板を得た。この積層板の厚みを実施
例1と同様に評価した。結果は表1に示すとおり、中央
と周縁部の厚さは差が0.06mmであった。
Comparative Example 1 A squeeze roll having a uniform roll diameter of 300 mm, a molding plate having a uniform thickness of 1.5 mm, and a heating plate having the same thickness at the peripheral portion and the central portion were used. A laminated plate was obtained in the same manner as in Example 1 except for the above. The thickness of this laminate was evaluated in the same manner as in Example 1. As shown in Table 1, the difference in thickness between the center and the peripheral portion was 0.06 mm.

【0023】比較例2 成形プレートに実施例1で使用したものを用いた以外は
比較例1と同様にして積層板を得た。この積層板の厚み
を実施例1と同様に評価した。結果は表1に示すとお
り、中央と周縁部の厚さは差が0.03mmであった。
Comparative Example 2 A laminated plate was obtained in the same manner as Comparative Example 1 except that the molding plate used in Example 1 was used. The thickness of this laminate was evaluated in the same manner as in Example 1. As shown in Table 1, the difference in thickness between the center and the peripheral portion was 0.03 mm.

【0024】[0024]

【表1】 [Table 1]

【0025】[0025]

【発明の効果】本発明の積層板の製造方法によって、積
層体の中央部に比較し周縁部にかかる圧力を低くするこ
とにより、積層体の周縁部からの樹脂の流出を少なくす
ると共に、積層体の周囲より樹脂が流出しても、積層板
の周囲の板厚が薄くなるのを防ぐことができる。その結
果、板厚の均一な積層板が得られる。
According to the method of manufacturing a laminated plate of the present invention, by lowering the pressure applied to the peripheral portion of the laminated body as compared with the central portion of the laminated body, the outflow of the resin from the peripheral portion of the laminated body is reduced and the laminated body is laminated. Even if the resin flows out from the periphery of the body, it is possible to prevent the thickness of the periphery of the laminated plate from becoming thin. As a result, a laminated plate having a uniform plate thickness can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に使用する構成材料を分離し
て示した断面図である。
FIG. 1 is a cross-sectional view in which constituent materials used in one embodiment of the present invention are shown separately.

【図2】(a)は本発明の一実施例に使用する成形プレ
ートの平面図、(b)は断面図である。
2A is a plan view of a molding plate used in an embodiment of the present invention, and FIG. 2B is a sectional view.

【図3】本発明の一実施例に使用する含浸装置の要部側
面図である。
FIG. 3 is a side view of a main part of an impregnating apparatus used in one embodiment of the present invention.

【図4】(a)はこの含浸装置の絞りロールを示した斜
視図、(b)は断面図である。
FIG. 4A is a perspective view showing a squeezing roll of this impregnation device, and FIG. 4B is a sectional view.

【符号の説明】[Explanation of symbols]

1 積層体 2 成形プレート 3 熱盤 4 基材 5 絞りロール 6 樹脂ワニス 10 被圧体 11,13 周縁部 12,14 中央部 DESCRIPTION OF SYMBOLS 1 Laminated body 2 Forming plate 3 Hot plate 4 Base material 5 Drawing roll 6 Resin varnish 10 Pressed body 11,13 Peripheral part 12,14 Central part

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 基材に樹脂を含浸してプリプレグを作製
し、このプリプレグを複数枚重ねた積層体を成形プレー
トに挟んで被圧体とし、この被圧体を熱盤間に挿入し、
加熱、及び加圧する積層板の製造方法であって、上記プ
リプレグの樹脂含有量が中央より基材の端縁部が多く、
且つ、上記成形プレートは周縁部の厚さが中央部より薄
いことを特徴とする積層板の製造方法。
1. A prepreg is prepared by impregnating a base material with a resin, and a laminated body in which a plurality of prepregs are stacked is sandwiched between molding plates to form a body to be pressured, and the body to be pressured is inserted between hot plates,
A method for manufacturing a laminated plate by heating and pressing, wherein the resin content of the prepreg has more edge portions of the base material than the center,
The method of manufacturing a laminated plate is characterized in that the molding plate has a peripheral edge portion thinner than a central portion.
【請求項2】 上記熱盤の周縁部の厚みが中央部より薄
いことを特徴とする請求項1記載の積層板の製造方法。
2. The method for manufacturing a laminated board according to claim 1, wherein the thickness of the peripheral portion of the hot platen is smaller than that of the central portion.
【請求項3】 上記プリプレグの作製の際に、基材への
樹脂含有量を制御する一対の絞りロールの少なくともど
ちらか片方が、中央部のロール径が端部のロール径より
大きいロールを用いたことを特徴とする請求項1又は請
求項2記載の積層板の製造方法。
3. When manufacturing the prepreg, at least one of the pair of squeezing rolls for controlling the resin content in the base material uses a roll having a central roll diameter larger than the end roll diameter. The method for manufacturing a laminated board according to claim 1 or 2, wherein
JP7008800A 1995-01-24 1995-01-24 Production of laminate Withdrawn JPH08198982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7008800A JPH08198982A (en) 1995-01-24 1995-01-24 Production of laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7008800A JPH08198982A (en) 1995-01-24 1995-01-24 Production of laminate

Publications (1)

Publication Number Publication Date
JPH08198982A true JPH08198982A (en) 1996-08-06

Family

ID=11702939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7008800A Withdrawn JPH08198982A (en) 1995-01-24 1995-01-24 Production of laminate

Country Status (1)

Country Link
JP (1) JPH08198982A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230058428A (en) 2020-09-18 2023-05-03 가부시끼가이샤 레조낙 Method for manufacturing substrate material for semiconductor package, prepreg, and substrate material for semiconductor package
KR20240053065A (en) 2021-09-15 2024-04-23 가부시끼가이샤 레조낙 Method for manufacturing substrate material for semiconductor package, prepreg, and application of prepreg

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230058428A (en) 2020-09-18 2023-05-03 가부시끼가이샤 레조낙 Method for manufacturing substrate material for semiconductor package, prepreg, and substrate material for semiconductor package
KR20240053065A (en) 2021-09-15 2024-04-23 가부시끼가이샤 레조낙 Method for manufacturing substrate material for semiconductor package, prepreg, and application of prepreg

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