JPS6457610A - Manufacture of electronic component of laminated ceramic - Google Patents

Manufacture of electronic component of laminated ceramic

Info

Publication number
JPS6457610A
JPS6457610A JP62213973A JP21397387A JPS6457610A JP S6457610 A JPS6457610 A JP S6457610A JP 62213973 A JP62213973 A JP 62213973A JP 21397387 A JP21397387 A JP 21397387A JP S6457610 A JPS6457610 A JP S6457610A
Authority
JP
Japan
Prior art keywords
ceramic laminate
ceramic
conductive layer
plates
margin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62213973A
Other languages
Japanese (ja)
Other versions
JP2742414B2 (en
Inventor
Toshio Shioda
Sadao Uno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP62213973A priority Critical patent/JP2742414B2/en
Publication of JPS6457610A publication Critical patent/JPS6457610A/en
Application granted granted Critical
Publication of JP2742414B2 publication Critical patent/JP2742414B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To prevent cracks or the like from occurring in the elements by hot-pressing a ceramic laminate using plates having projecting parts formed corresponding to the margin parts of the ceramic laminate on which no conductive layer is formed, whereby the compressive force is absorbed in the conductive layer section and the margin parts do not molded with a low density. CONSTITUTION:Predetermined conductive layers 2 are formed on a ceramic raw sheet 1, and after pressing by thermocompression of a ceramic laminate 3 consisting of a plurality of stacked ceramic raw sheets 1 to integrate them, chip elements 4 are obtained by cutting the ceramic laminate 3 at predetermined positions and are fired. In manufacturing a laminated ceramic electronic component 6, using plates 16, on at least one surface of which a projecting part 13 is formed corresponding to the margin part in which no conductive layer 2 is formed, said ceramic laminate 3 is sandwiched and pressed by thermocompression. With this, the compressive force applied from the plates to the ceramic laminate is absorbed in the conductive layer part and the margin parts do not molded with a low density, so that, when the respective chip elements are obtained by cutting the ceramic laminate, the occurrence of cracks in the edge faces or the peeling of the electrode will be eliminated.
JP62213973A 1987-08-27 1987-08-27 Manufacturing method of multilayer ceramic electronic component Expired - Fee Related JP2742414B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62213973A JP2742414B2 (en) 1987-08-27 1987-08-27 Manufacturing method of multilayer ceramic electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62213973A JP2742414B2 (en) 1987-08-27 1987-08-27 Manufacturing method of multilayer ceramic electronic component

Publications (2)

Publication Number Publication Date
JPS6457610A true JPS6457610A (en) 1989-03-03
JP2742414B2 JP2742414B2 (en) 1998-04-22

Family

ID=16648130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62213973A Expired - Fee Related JP2742414B2 (en) 1987-08-27 1987-08-27 Manufacturing method of multilayer ceramic electronic component

Country Status (1)

Country Link
JP (1) JP2742414B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106656A (en) * 1993-09-30 1995-04-21 Nec Corp Piezoelectric actuator and manufacture thereof
JP2004096071A (en) * 2002-03-18 2004-03-25 Seiko Epson Corp Method of manufacturing piezoelectric actuator and liquid jetting head, and actuator mother member
JP2005012192A (en) * 2003-05-22 2005-01-13 Seiko Instruments Inc Ultrasonic motor using laminated piezoelectric element, electronic apparatus therewith, and manufacturing method thereof
JP2006319071A (en) * 2005-05-11 2006-11-24 Denso Corp Method for manufacturing multi-layer circuit board
JP2007201371A (en) * 2006-01-30 2007-08-09 Denso Corp Method for manufacturing multilayer circuit board
JP2009076789A (en) * 2007-09-21 2009-04-09 Tdk Corp Manufacturing method of multilayer electronic component, and manufacturing method of green sheet with electrode pattern
JP2009260217A (en) * 2008-04-11 2009-11-05 Samsung Electro-Mechanics Co Ltd Method of manufacturing laminating ceramic capacitor
JP2011061220A (en) * 2003-05-22 2011-03-24 Seiko Instruments Inc Laminated piezoelectric element, ultrasonic motor, electronic apparatus, stage, and method of manufacturing laminated piezoelectric element

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100510A (en) * 1982-11-30 1984-06-09 日本電気ホームエレクトロニクス株式会社 Method of producing laminated ceramic condenser
JPS6080213A (en) * 1983-10-07 1985-05-08 日本電気株式会社 Method of producing laminated ceramic capacitor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100510A (en) * 1982-11-30 1984-06-09 日本電気ホームエレクトロニクス株式会社 Method of producing laminated ceramic condenser
JPS6080213A (en) * 1983-10-07 1985-05-08 日本電気株式会社 Method of producing laminated ceramic capacitor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07106656A (en) * 1993-09-30 1995-04-21 Nec Corp Piezoelectric actuator and manufacture thereof
JP2004096071A (en) * 2002-03-18 2004-03-25 Seiko Epson Corp Method of manufacturing piezoelectric actuator and liquid jetting head, and actuator mother member
JP2005012192A (en) * 2003-05-22 2005-01-13 Seiko Instruments Inc Ultrasonic motor using laminated piezoelectric element, electronic apparatus therewith, and manufacturing method thereof
JP2011061220A (en) * 2003-05-22 2011-03-24 Seiko Instruments Inc Laminated piezoelectric element, ultrasonic motor, electronic apparatus, stage, and method of manufacturing laminated piezoelectric element
JP2006319071A (en) * 2005-05-11 2006-11-24 Denso Corp Method for manufacturing multi-layer circuit board
JP2007201371A (en) * 2006-01-30 2007-08-09 Denso Corp Method for manufacturing multilayer circuit board
JP2009076789A (en) * 2007-09-21 2009-04-09 Tdk Corp Manufacturing method of multilayer electronic component, and manufacturing method of green sheet with electrode pattern
JP2009260217A (en) * 2008-04-11 2009-11-05 Samsung Electro-Mechanics Co Ltd Method of manufacturing laminating ceramic capacitor

Also Published As

Publication number Publication date
JP2742414B2 (en) 1998-04-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees