JPS6457610A - Manufacture of electronic component of laminated ceramic - Google Patents
Manufacture of electronic component of laminated ceramicInfo
- Publication number
- JPS6457610A JPS6457610A JP62213973A JP21397387A JPS6457610A JP S6457610 A JPS6457610 A JP S6457610A JP 62213973 A JP62213973 A JP 62213973A JP 21397387 A JP21397387 A JP 21397387A JP S6457610 A JPS6457610 A JP S6457610A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic laminate
- ceramic
- conductive layer
- plates
- margin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To prevent cracks or the like from occurring in the elements by hot-pressing a ceramic laminate using plates having projecting parts formed corresponding to the margin parts of the ceramic laminate on which no conductive layer is formed, whereby the compressive force is absorbed in the conductive layer section and the margin parts do not molded with a low density. CONSTITUTION:Predetermined conductive layers 2 are formed on a ceramic raw sheet 1, and after pressing by thermocompression of a ceramic laminate 3 consisting of a plurality of stacked ceramic raw sheets 1 to integrate them, chip elements 4 are obtained by cutting the ceramic laminate 3 at predetermined positions and are fired. In manufacturing a laminated ceramic electronic component 6, using plates 16, on at least one surface of which a projecting part 13 is formed corresponding to the margin part in which no conductive layer 2 is formed, said ceramic laminate 3 is sandwiched and pressed by thermocompression. With this, the compressive force applied from the plates to the ceramic laminate is absorbed in the conductive layer part and the margin parts do not molded with a low density, so that, when the respective chip elements are obtained by cutting the ceramic laminate, the occurrence of cracks in the edge faces or the peeling of the electrode will be eliminated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62213973A JP2742414B2 (en) | 1987-08-27 | 1987-08-27 | Manufacturing method of multilayer ceramic electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62213973A JP2742414B2 (en) | 1987-08-27 | 1987-08-27 | Manufacturing method of multilayer ceramic electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6457610A true JPS6457610A (en) | 1989-03-03 |
JP2742414B2 JP2742414B2 (en) | 1998-04-22 |
Family
ID=16648130
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62213973A Expired - Fee Related JP2742414B2 (en) | 1987-08-27 | 1987-08-27 | Manufacturing method of multilayer ceramic electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2742414B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07106656A (en) * | 1993-09-30 | 1995-04-21 | Nec Corp | Piezoelectric actuator and manufacture thereof |
JP2004096071A (en) * | 2002-03-18 | 2004-03-25 | Seiko Epson Corp | Method of manufacturing piezoelectric actuator and liquid jetting head, and actuator mother member |
JP2005012192A (en) * | 2003-05-22 | 2005-01-13 | Seiko Instruments Inc | Ultrasonic motor using laminated piezoelectric element, electronic apparatus therewith, and manufacturing method thereof |
JP2006319071A (en) * | 2005-05-11 | 2006-11-24 | Denso Corp | Method for manufacturing multi-layer circuit board |
JP2007201371A (en) * | 2006-01-30 | 2007-08-09 | Denso Corp | Method for manufacturing multilayer circuit board |
JP2009076789A (en) * | 2007-09-21 | 2009-04-09 | Tdk Corp | Manufacturing method of multilayer electronic component, and manufacturing method of green sheet with electrode pattern |
JP2009260217A (en) * | 2008-04-11 | 2009-11-05 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing laminating ceramic capacitor |
JP2011061220A (en) * | 2003-05-22 | 2011-03-24 | Seiko Instruments Inc | Laminated piezoelectric element, ultrasonic motor, electronic apparatus, stage, and method of manufacturing laminated piezoelectric element |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59100510A (en) * | 1982-11-30 | 1984-06-09 | 日本電気ホームエレクトロニクス株式会社 | Method of producing laminated ceramic condenser |
JPS6080213A (en) * | 1983-10-07 | 1985-05-08 | 日本電気株式会社 | Method of producing laminated ceramic capacitor |
-
1987
- 1987-08-27 JP JP62213973A patent/JP2742414B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59100510A (en) * | 1982-11-30 | 1984-06-09 | 日本電気ホームエレクトロニクス株式会社 | Method of producing laminated ceramic condenser |
JPS6080213A (en) * | 1983-10-07 | 1985-05-08 | 日本電気株式会社 | Method of producing laminated ceramic capacitor |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07106656A (en) * | 1993-09-30 | 1995-04-21 | Nec Corp | Piezoelectric actuator and manufacture thereof |
JP2004096071A (en) * | 2002-03-18 | 2004-03-25 | Seiko Epson Corp | Method of manufacturing piezoelectric actuator and liquid jetting head, and actuator mother member |
JP2005012192A (en) * | 2003-05-22 | 2005-01-13 | Seiko Instruments Inc | Ultrasonic motor using laminated piezoelectric element, electronic apparatus therewith, and manufacturing method thereof |
JP2011061220A (en) * | 2003-05-22 | 2011-03-24 | Seiko Instruments Inc | Laminated piezoelectric element, ultrasonic motor, electronic apparatus, stage, and method of manufacturing laminated piezoelectric element |
JP2006319071A (en) * | 2005-05-11 | 2006-11-24 | Denso Corp | Method for manufacturing multi-layer circuit board |
JP2007201371A (en) * | 2006-01-30 | 2007-08-09 | Denso Corp | Method for manufacturing multilayer circuit board |
JP2009076789A (en) * | 2007-09-21 | 2009-04-09 | Tdk Corp | Manufacturing method of multilayer electronic component, and manufacturing method of green sheet with electrode pattern |
JP2009260217A (en) * | 2008-04-11 | 2009-11-05 | Samsung Electro-Mechanics Co Ltd | Method of manufacturing laminating ceramic capacitor |
Also Published As
Publication number | Publication date |
---|---|
JP2742414B2 (en) | 1998-04-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |