JPS61204920A - Forming of laminate ceramic element - Google Patents
Forming of laminate ceramic elementInfo
- Publication number
- JPS61204920A JPS61204920A JP60044917A JP4491785A JPS61204920A JP S61204920 A JPS61204920 A JP S61204920A JP 60044917 A JP60044917 A JP 60044917A JP 4491785 A JP4491785 A JP 4491785A JP S61204920 A JPS61204920 A JP S61204920A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- sheet
- conductive pattern
- printed
- organic binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、−設電子機器に使用される積層セラミック回
路基板、積層セラミックコンデンサ、圧着セラミック振
動子等の電子部品の製造法に関し。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for manufacturing electronic components such as multilayer ceramic circuit boards, multilayer ceramic capacitors, and press-bonded ceramic vibrators used in electronic equipment.
さらに具体的に述べれば、積層セラミック素子の成形方
法に関するものである。More specifically, the present invention relates to a method for molding a laminated ceramic element.
（従来の技術）
従来の技術として、例えば特公昭３８−１４６２３号の
発明があるが、しかしこの方法では寸法精度の維持が難
しいため、特公昭４０−１９９７５号の発明が提案され
た。しかしこの方法にも自動化が難かしく量産性に問題
があった。さらに、この対策として特公昭５９−４５６
３１号の発明により自動化に適応する方法が提案されて
いる。(Prior Art) As a conventional technique, for example, there is an invention disclosed in Japanese Patent Publication No. 38-14623, but since it is difficult to maintain dimensional accuracy with this method, the invention disclosed in Japanese Patent Publication No. 40-19975 was proposed. However, this method was also difficult to automate and had problems with mass production. Furthermore, as a countermeasure for this issue,
The invention of No. 31 proposes a method adapted to automation.
（発明が解決しようとする問題点）
しかしながら、従来の方法では、積層数が多くなるとセ
ラミック生シートに印刷される導電パターンの厚さが累
積して大きな数値となり、加圧接着時に導電パターンの
厚さの累積分を全部吸収することができず、焼成したと
きに亀裂が生じたり。(Problem to be solved by the invention) However, in the conventional method, as the number of laminated layers increases, the thickness of the conductive pattern printed on the raw ceramic sheet accumulates to a large value, and the thickness of the conductive pattern when bonded under pressure increases. It is not possible to absorb all the accumulated amount of heat, and cracks occur when fired.
あるいは部品の半田付けを行ったときに熱衝撃によって
ひび割れが入るという問題点があった。Another problem is that when parts are soldered, cracks may occur due to thermal shock.
本発明は上記の問題点を解決するもので、亀裂やひび割
れの発生がない積層セラミック素子を提供しようとする
ものである。The present invention is intended to solve the above-mentioned problems and to provide a multilayer ceramic element that is free from cracks and crazing.
（問題点を解決するための手段）
セラミック生シートに導電パターンが印刷された部分と
、印刷されない生シートのままの部分とを同一の厚さに
する方法として、加熱、加圧して導電体をセラミック生
シートの中に埋設させる方法と、導電体を印刷したキャ
リアシー１〜上にセラミック生シートを形成した後、導
電体とともに剥離する方法とがある。しかし、前者では
厚さが減少すると同時に圧延されて導電パターンの面積
が変化する欠点があり、後者ではキャリアシー１−から
剥離を容易にするためキャリアシート上１こ離形剤を塗
布する必要があり、そのため導電パターンを印刷すると
きに印刷斑が生ずる欠点があった。(Means for solving the problem) As a method to make the part of the raw ceramic sheet with the conductive pattern printed on it and the part of the raw sheet without printing to the same thickness, the conductor is heated and pressurized. There is a method of embedding it in a green ceramic sheet, and a method of forming a green ceramic sheet on a carrier sheet 1 to which a conductor is printed and then peeling it off together with the conductor. However, the former has the disadvantage that the area of the conductive pattern changes as it is rolled at the same time as the thickness decreases, and the latter requires a release agent to be applied on the carrier sheet to facilitate peeling from the carrier sheet. Therefore, there was a drawback that printing spots occurred when printing a conductive pattern.
本発明は、セラミック生シートを形成した後。After the present invention forms a ceramic raw sheet.
導電パターンとともに導電パターンの周辺にセラミック
ペーストを印刷することにより、厚みの均一なセラミッ
ク生シー１−を得ようとするものである。By printing a ceramic paste along with a conductive pattern around the conductive pattern, it is attempted to obtain a ceramic green sheet 1- with a uniform thickness.
（作 用）
このように、セラミック生シートに導電パターンを印刷
し、さらに導電パターンの印刷されない部分にセラミッ
クペ・−ス１−を印刷して厚さを均一化した生シートは
、これを多数積層して加圧接着しても、歪が発生せず、
従って焼成したときに歪が原因の亀裂の発生を防止する
ことができる。また、半田付は時の熱衝撃によるひび割
れの発生も防止できる。(Function) In this way, a raw ceramic sheet with a uniform thickness by printing a conductive pattern on the raw ceramic sheet and printing ceramic paste 1 on the part where the conductive pattern is not printed can be produced by printing a large number of raw sheets. No distortion occurs even when laminated and bonded under pressure.
Therefore, it is possible to prevent the occurrence of cracks caused by strain during firing. Additionally, soldering can prevent cracks from occurring due to thermal shock.
（実施例）
本発明による積層セラミック素子の成形方法について第
１図ないし第３図により説明する。(Example) A method for molding a multilayer ceramic element according to the present invention will be explained with reference to FIGS. 1 to 3.
第１図および第２図は、それぞれ本発明によるセラミッ
ク生シー［・の平面図およびＡ−Ａ’で切断した断面図
である。FIG. 1 and FIG. 2 are a plan view and a cross-sectional view taken along line AA' of a ceramic green seam according to the present invention, respectively.
セラミック生シート１の表面に導電パターン２を印刷し
、さらにこの導電パターン２の周辺にセラミックペース
１〜３を印刷する。A conductive pattern 2 is printed on the surface of a raw ceramic sheet 1, and ceramic pastes 1 to 3 are further printed around the conductive pattern 2.
第３図は印刷の終了した上記のセラミック生シートを一
枚毎に左右が逆になるように積み重ねたもので、加圧接
着の後、破線に沿って切断することにより、複数個の積
層体が得ら九る。Figure 3 shows the printed ceramic green sheets stacked one on top of the other with the left and right sides reversed. After pressure bonding, the sheets are cut along the broken lines to form a plurality of laminates. is obtained.
（発明の効果）
本発明によれば、印刷された導電パターンの厚さと同じ
厚さで、セラミックペーストが印刷されているため、セ
ラミック生シートを含め全面が同一の厚さとなり、積層
後加圧接着するときに歪が生ぜず、焼成時の亀裂や半田
付は時のひび割れの発生が皆無となり、製品の歩留りと
信頼性を向上する著しい効果がある。(Effects of the Invention) According to the present invention, since the ceramic paste is printed with the same thickness as the printed conductive pattern, the entire surface including the raw ceramic sheet has the same thickness, and the pressure is applied after lamination. There is no distortion during bonding, no cracking during firing, and no cracking during soldering, which has the remarkable effect of improving product yield and reliability.
第１、図および第２図は本発明により印刷されたセラミ
ック生シー１−の平面図および断面図、第３図は上記の
セラミック生シートを積み重ねた状態を示す断面図であ
る。
〕 ・・・セラミック生シー１−１２ ・・・導電体、
３ ・・・セラミックペースト。
特許出願人 松下電器産業株式会社
第１図1, 2, and 2 are a plan view and a cross-sectional view of a green ceramic sheet 1- printed according to the present invention, and FIG. 3 is a cross-sectional view showing the state in which the ceramic green sheets described above are stacked. ] ... Ceramic raw sea 1-12 ... Conductor,
3...Ceramic paste. Patent applicant Matsushita Electric Industrial Co., Ltd. Figure 1
Claims (1)
結剤および必要により可塑剤と、溶媒とを混合し、これ
を混練したものをキャリアシート上に所定幅となるよう
連続的に形成してセラミック生シートを生成した後、高
融点金属粉末を有機粘結剤からなる導電ペーストで上記
のセラミック生シート上に所定の導電パターンを印刷し
、さらに上記セラミック生シートに用いたセラミック粉
末と有機粘結剤からなるセラミックペーストで上記の導
電パターンの印刷してない部分に印刷し、この印刷され
たセラミック生シートを複数枚積層し圧着してなる積層
セラミック素子の成形方法。Ceramic powder, which becomes ceramic when fired, is mixed with an organic binder, a plasticizer if necessary, and a solvent, and the mixture is kneaded and continuously formed into a predetermined width on a carrier sheet to produce a raw ceramic sheet. After that, a predetermined conductive pattern is printed on the above green ceramic sheet using a conductive paste consisting of a high melting point metal powder and an organic binder, and then a predetermined conductive pattern is printed on the above ceramic green sheet using a conductive paste consisting of a high melting point metal powder and an organic binder. A method of forming a laminated ceramic element by printing a ceramic paste on the unprinted part of the conductive pattern, and laminating and pressing a plurality of printed ceramic green sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044917A JPS61204920A (en) | 1985-03-08 | 1985-03-08 | Forming of laminate ceramic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60044917A JPS61204920A (en) | 1985-03-08 | 1985-03-08 | Forming of laminate ceramic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61204920A true JPS61204920A (en) | 1986-09-11 |
Family
ID=12704813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60044917A Pending JPS61204920A (en) | 1985-03-08 | 1985-03-08 | Forming of laminate ceramic element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61204920A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01208824A (en) * | 1988-02-16 | 1989-08-22 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic part |
| JPH04219914A (en) * | 1990-12-20 | 1992-08-11 | Taiyo Yuden Co Ltd | Manufacture of laminated porcelain capacitor |
| JP2006210813A (en) * | 2005-01-31 | 2006-08-10 | Tdk Corp | Process for manufacturing multilayer electronic component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5342353A (en) * | 1976-09-29 | 1978-04-17 | Nippon Electric Co | Laminated ceramic capacitor |
| JPS5928304A (en) * | 1982-08-10 | 1984-02-15 | Toko Inc | Manufacture of inductance element |
-
1985
- 1985-03-08 JP JP60044917A patent/JPS61204920A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5342353A (en) * | 1976-09-29 | 1978-04-17 | Nippon Electric Co | Laminated ceramic capacitor |
| JPS5928304A (en) * | 1982-08-10 | 1984-02-15 | Toko Inc | Manufacture of inductance element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01208824A (en) * | 1988-02-16 | 1989-08-22 | Murata Mfg Co Ltd | Manufacture of laminated ceramic electronic part |
| JPH04219914A (en) * | 1990-12-20 | 1992-08-11 | Taiyo Yuden Co Ltd | Manufacture of laminated porcelain capacitor |
| JP2006210813A (en) * | 2005-01-31 | 2006-08-10 | Tdk Corp | Process for manufacturing multilayer electronic component |
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