JP2002270459A - Manufacturing method for laminated ceramic electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a laminated ceramic electronic component which can shorten the time needed to divide a laminated green sheet into individual chips after thermocompression bonding. SOLUTION: Parting lines 4a and 4b consisting of dotted holes, dotted recessed parts, or recessed streaks are previously formed an green sheets 2-1 to 2-3 before thermocompression bonding. After the green sheets 2-1 to 2-3 are stacked and bonded by thermocompression, the laminated green sheet 5 is divided along the parting lines 4a and 4b in the laminating direction. The laminated green sheet after the thermocompression bonding has the parting lines 4a and 4b in the lamination direction and is much less in strength where the parting lines 4a and 4b are present than at other parts, so the laminated green sheet 5 after the thermocompression bonding is applied with pressure by using a proper dividing device and can easily be divided along the parting lines 4a and 4b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a multilayer ceramic electronic component useful for a multilayer ceramic capacitor and the like.

[0002]

2. Description of the Related Art A multi-layer ceramic capacitor of the simultaneous firing type (a type in which a chip, a conductor layer for internal electrodes and a conductor layer for external electrodes are simultaneously fired), which is one type of multilayer ceramic electronic components, is described in the following (a). To (j). (A) Green sheet forming process: PET prepared by applying a slurry prepared in advance by a doctor blade method or the like.
Is applied to a predetermined thickness on a base film made of the same. (B) Step of forming conductor layer for internal electrode: A conductor paste prepared in advance is printed on a green sheet in a predetermined thickness, a predetermined shape and a predetermined arrangement by a printing method such as a screen printing method. (C) Laminating step: The printed green sheet is cut into a predetermined unit size, taken out of the base film, and a required number of the taken out green sheets are stacked. (D) Crimping step: The stacked green sheets are temporarily crimped, and then fully crimped. (E) Dividing step: The laminated green sheet after the final pressure bonding is cut by a blade such as a rotating blade or a lifting blade to divide it into individual chips. (F) Polishing step: The divided chips are put into a polishing machine such as a barrel polishing machine and polished for a predetermined time. (G) Binder removal step: The chip after polishing is put into a de-bubbling furnace, and the binder contained in the chip is removed under predetermined conditions such as temperature and time. (H) Step of forming conductor layer for external electrode: A conductor paste prepared in advance is applied to both ends of the chip after de-buying with a predetermined thickness and a predetermined shape by a coating method such as a roller coating method or a dipping method. (I) Firing step: The chip after the external electrode conductor layer is formed is put into a firing furnace, and the chip, the internal electrode conductor layer and the external electrode conductor layer are subjected to a predetermined temperature and time condition. Simultaneous firing. (J) plating step: a first plating layer made of Ni or the like on the surface of the external electrode of the fired chip by electroplating;
A second plating layer made of n, solder, or the like is formed.

[0003]

Generally, the above slurry is prepared by adding a binder, a plasticizer, a dispersant, a solvent and the like to a dielectric material powder such as BaTiO ₃ or Pb and stirring the mixture.
Made by mixing. Incidentally, a polyvinyl butyral resin, a cellulose resin, an acrylic resin, or the like is used for the binder, an ester-based plasticizer such as dioctyl phthalate or diethyl phthalate is used for the plasticizer, and a nonionic surfactant is used for the dispersant. And an anionic surfactant. Ketones, hydrocarbons, alcohols, esters, ether alcohols, chlorinated hydrocarbons and the like are used as the solvent.

[0004] The laminated green sheet after the pressure bonding step contains the binder and the plasticizer and the like and has stickiness. Therefore, when the laminated green sheet is cut in the dividing step, a rotating blade, a lifting blade or the like is used. The load applied to the blade is large, and the cutting speed cannot be increased due to the influence of the load, so that it is difficult to reduce the time required for the cutting step.

[0005] The above problems are not limited to the production of the co-fired type multilayer ceramic capacitor. The step (h) of forming the conductor layer for external electrodes and the step (i) of firing the conductor layer for external electrodes are performed.
Production of a non-simultaneous firing type (type in which firing of the chip and the conductor layer for the internal electrode and firing of the conductor layer for the external electrode are performed separately) between the step (j) and the step (j); The same can occur in the manufacture of other multilayer ceramic electronic components such as multilayer ceramic inductors having the same manufacturing steps as non-co-fired multilayer ceramic capacitors.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a laminated ceramic electronic component which can reduce the time required to divide a laminated green sheet after compression into individual chips. Is to do.

[0007]

In order to achieve the above object, according to the first aspect of the present invention, after a step of stacking and crimping green sheets having a conductor layer formed thereon, the laminated green sheets after crimping are individually formed. In the method for manufacturing a multilayer ceramic electronic component provided with a step of cutting into chips, a cutting line composed of a dotted line-shaped hole, a dotted line-shaped concave portion or a concave strip is formed in a green sheet before crimping, and the green sheets are stacked and crimped. This is characterized in that the laminated green sheet is divided or cut into individual chips along a dividing line arranged in the laminating direction later.

According to this manufacturing method, the cut lines are arranged in the stacking direction in the laminated green sheet after the pressure bonding, and the strength of the portion where the cut line exists is much lower than that of the other portions. Therefore, the laminated green sheet after the pressure bonding can be easily divided or cut along the dividing lines arranged in the laminating direction.

Further, the invention according to claim 2 is a multilayer ceramic comprising a step of stacking green sheets on which a conductor layer is formed and compressing them, and then dividing the laminated green sheets after compression into individual chips. In the method for manufacturing an electronic component, a cutting line made of a combustible material is formed in advance on a green sheet before pressing, and at least a part of the cutting line is removed by heat-treating the laminated green sheet after stacking and pressing the green sheets. Forming a linear cavity in the location where the dividing line exists, heat-treating the laminated green sheet, and then dividing or cutting the laminated green sheet along the linear cavity arranged in the laminating direction to separate the individual chips. Features.

According to this manufacturing method, the linear cavities are arranged in the laminating direction in the laminated green sheet after the heat treatment, and the strength of the portion where the linear cavities exist is much higher than that of the other portions. Since the laminated green sheet is weakened, the laminated green sheet after the pressure bonding can be easily divided or cut along the linear cavities arranged in the laminating direction.

The above and other objects, constitutional features, and operational effects of the present invention will become apparent from the following description and the accompanying drawings.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] The present invention is described below in connection with the manufacture of a multilayer ceramic capacitor of the simultaneous firing type (type in which the chip, the internal electrode conductor layer and the external electrode conductor layer are simultaneously fired). A first embodiment applied to the first embodiment will be described with reference to FIGS.

When manufacturing a co-fired type multilayer ceramic capacitor, first, a slurry prepared in advance is applied to a base film 1 made of PET or the like with a predetermined thickness by a coating method such as a doctor blade method to form a green sheet. 2 (see FIG. 1). The components of the slurry are the same as those described in the section of the prior art.

Next, a conductor paste prepared in advance is printed in a predetermined thickness, a predetermined shape and a predetermined arrangement on the green sheet 2 by a printing method such as a screen printing method to form a conductor layer 3 for internal electrodes (FIG. 1). reference). Incidentally, the conductive paste is made of a noble metal such as Pd, Ag-Pd, or N.
It is made by adding a binder such as polyvinyl butyral resin, cellulose resin or acrylic resin to a base metal-based metal powder such as i, Cu, etc., and stirring and mixing the binder.

Next, on the upper and lower sides of each conductor layer 3 of the printed green sheet 2, a dividing line 4a composed of a dotted line hole, a dotted line concave portion or a concave line is formed. Then, a similar dividing line 4b is formed (see FIG. 2). Also, on the green sheet 2 where the internal electrode conductor layer 3 is not formed, the same dividing lines 4a and 4b as described above are formed at the same vertical, horizontal, and vertical intervals (see FIG. 5).

The dividing lines 4a and 4b shown in FIG. 2 and FIG. 5 correspond to the Y direction toward the green sheet 2 while linearly moving the printed green sheet 2 in two directions different by 90 degrees.
It is formed by a method of intermittently irradiating a laser beam such as AG or a method of making a thin sheet having a convex portion corresponding to a hole, a concave portion or a concave streak bite into the green sheet 2. Incidentally, the width of each dividing line 4a and 4b is 20 to 300 μm.

Next, the green sheet 2 (see FIG. 2) after the dividing lines 4a and 4b are formed is cut into a predetermined unit size by a rectangular frame-shaped blade, so that the arrangement pattern of the conductor layers 3 is different. Types of printed green sheets 2-1 and 2
-2 (see FIGS. 3 and 4) is taken out of the base film 1, and the green sheet 2 (see FIG. 5) after the dividing lines 4a and 4b are formed is cut by a rectangular frame-shaped blade to have the same unit dimensions as described above. To remove the non-printing green sheet 2-3 having no conductor layer 3 (see FIG. 6) from the base film 1, and printing the non-printing green sheet 2-3 on the stacked non-printing green sheets 2-3. -1 and 2
-2 are stacked alternately on the required number of sheets, and a plurality of non-printing green sheets 2-3 are stacked thereon.

Next, the stacked green sheets 2-1
２2-3 are temporarily press-bonded and then fully press-bonded. The above-mentioned temporary pressure bonding may be performed every time a predetermined number of green sheets 2-1 to 2-3 are stacked. FIG. 7 is a partial longitudinal sectional view showing a state after the final pressure bonding. In the laminated green sheet 5, the dividing lines 4a and 4b (4b are not shown) are arranged in a laminating direction.

Next, the laminated green sheet 5 after the final pressure bonding
Is placed on a suitable splitting device (not shown), for example, a device in which the laminated green sheet 5 is inserted between two rotating rollers to apply pressure from the roller to the surface of the laminated green sheet 5, or placed on an elastic plate. The laminated green sheet 5 is divided into individual chips 6 using a device or the like that applies pressure to the surface of the laminated green sheet 5 (see FIG. 8).

As described above, in the laminated green sheet 5 after the final pressure bonding, the dividing lines 4a and 4b are arranged in the laminating direction, and the strength of the portion where the dividing lines 4a and 4b exist is different. When the pressure is applied to the laminated green sheet 5 by the dividing device, the laminated green sheet 5 is easily and instantly divided along the dividing lines 4a and 4b arranged in the laminating direction. Is done.

Next, the divided chips 6 are put into a polishing machine such as a barrel polishing machine and polished for a predetermined time. In this polishing step, the edge of the chip 6 is polished so as to be rounded, and at the same time, the unevenness of the divided surface is leveled, so that the edge of the conductor layer 3a is clearly exposed on the divided surface.

Next, the polished chip 6 is put into a de-bubbling furnace, and the binder contained in the chip 6 is removed under predetermined conditions such as temperature and time.

Next, a conductor paste prepared in advance is applied in a predetermined thickness and a predetermined shape to both ends of the chip 6 after de-buying by a coating method such as a roller coating method or a dip method, and the conductive layer for external electrodes (shown in the drawing). (Omitted). The conductive paste used here is the same as the conductive paste used when forming the internal electrode conductive layer 3.

Next, the chip 6 after the formation of the external electrode conductor layer is put into a firing furnace, and the chip 6, the internal electrode conductor layer 3 and the external electrode The conductor layers are co-fired.

Next, a first plating layer made of Ni or the like (not shown) and a second plating layer made of Sn, solder, or the like (not shown) are formed on the surface of the external electrode of the fired chip 6 by electroplating. I do.

As described above, according to the above-described manufacturing method, the laminated green sheet 5 after the final pressure bonding is such that the dividing lines 4a and 4b formed of the dotted line holes, the dotted line concave portions or the concave lines are arranged in the laminating direction. And the dividing lines 4a and 4b
Since the strength of the part where is present is much weaker than the other parts, the laminated green sheet 5 after the final compression is applied by applying pressure to the laminated green sheet 5 after the final compression by using an appropriate dividing device. Division can be easily performed along the division lines 4a and 4b arranged in the stacking method.

In other words, according to the above-described manufacturing method, the step of cutting the laminated green sheet 5 after the final pressure bonding into individual chips by a blade is unnecessary, and the laminated green sheet 5 after the pressure bonding is divided into individual chips. The time can be greatly reduced, which can greatly contribute to a reduction in manufacturing costs and unit costs.

Since the cutting lines 4a and 4b are arranged in the laminating direction in the laminated green sheet 5 after the compression, the laminated green sheet 5 after the final compression by a blade such as a rotating blade or a lifting blade. Is cut along the dividing lines 4a and 4b, even when the laminated green sheet 5 is cut by the blade, the cutting speed by the blade can be improved and the time required for the dividing step can be reduced.

In the above description, the debinding step is performed after the laminated green sheet after the compression is divided into individual chips, but the debinding step is performed between the compression step and the division step. Even if it is implemented, the same operation and effect as described above can be obtained.

[Second Embodiment] Hereinafter, the present invention is applied to the manufacture of a multilayer ceramic capacitor of the simultaneous firing type (type in which the chip, the internal electrode conductor layer and the external electrode conductor layer are simultaneously fired). Two embodiments will be described with reference to FIGS.

When a co-fired type multilayer ceramic capacitor is manufactured, first, a slurry prepared in advance is coated on a base film 1 made of PET or the like with a predetermined thickness by a coating method such as a doctor blade method to form a green sheet. 2 (see FIG. 9). The components of the slurry are the same as those described in the section of the prior art.

Next, a conductive paste prepared in advance is printed on the green sheet 2 in a predetermined thickness, a predetermined shape and a predetermined arrangement on the green sheet 2 by a printing method such as a screen printing method to form the internal electrode conductive layer 3 (FIG. 9). reference). Incidentally, the conductive paste is made of a noble metal such as Pd, Ag-Pd, or N.
It is made by adding a binder such as polyvinyl butyral resin, cellulose resin or acrylic resin to a base metal-based metal powder such as i, Cu, etc., and stirring and mixing the binder.

Next, on the upper and lower sides of each conductor layer 3 of the printed green sheet 2, dividing lines 7a made of combustible paste are formed.
And the same dividing line 7b is formed at the center and on both left and right sides of each conductor layer 3 (see FIG. 10). Also,
Green sheet 2 without conductor layer 3 for internal electrodes
Also, the same dividing lines 7a and 7b are formed at the same vertical, horizontal, and horizontal intervals (see FIG. 13).

The dividing line 7a shown in FIGS. 10 and 13
And 7b are green sheets 2 obtained by printing a combustible paste prepared in advance by a printing method such as a screen printing method.
It is formed by printing on the upper and non-printing green sheets 2 in a predetermined arrangement. Incidentally, the combustible paste is made by adding a binder such as a polyvinyl butyral resin, a cellulose resin or an acrylic resin to carbon powder and stirring and mixing the binder.
Incidentally, the width of each dividing line 7a and 7b is 20-30.
0 μm.

Next, the green sheet 2 (see FIG. 10) after the division lines 7a and 7b are formed is cut into a predetermined unit size by a rectangular frame-shaped blade, so that the arrangement patterns of the conductor layers 3 are different. The types of printed green sheets 2-1 and 2-2 (see FIGS. 11 and 12) are taken out of the base film 1, and the green sheet 2 (see FIG. 13) after the dividing lines 7a and 7b are formed is rectangular. A plurality of non-printed green sheets are cut by the frame-shaped blade at the same unit size as described above, and the non-printed green sheets 2-3 (see FIG. 14) having no conductor layer 3 are taken out from the base film 1. The required number of printing green sheets 2-1 and 2-2 are alternately stacked on the 2-3, and a plurality of non-printing green sheets 2-3 are stacked thereon.

Next, the stacked green sheets 2-1
２2-3 are temporarily press-bonded and then fully press-bonded. The above-mentioned temporary pressure bonding may be performed every time a predetermined number of green sheets 2-1 to 2-3 are stacked. FIG. 15 is a partial vertical cross-sectional view showing a state after the final pressure bonding. The laminating green sheet 8 has the dividing lines 7a and 7b (7b not shown) arranged in the laminating direction.

Next, the laminated green sheet 8 after the pressure bonding is put into a heating furnace, and at least a part of the dividing lines 7a and 7b is removed. By this heat treatment, the dividing line 7a
And binder contained in 7b is decomposed by all or most of the heat, the carbon does not remain almost be decomposed into CO _2, H ₂ O. The temperature during the heat treatment is higher than the boiling point of the binder contained in the dividing lines 7a and 7b,
In addition, it is set within a range lower than the firing temperature.

In this heat treatment stage, the green sheet 2
-1 to 2-3 and a part of the binder contained in the internal electrode conductor layer 3 may be removed. However, when the dividing lines 7a and 7b are positively removed at the same stage, the dividing lines 7a and 7b Green sheet 2-1 as binder for
2-3 and a binder having a boiling point lower than that of the binder contained in the internal electrode conductor layer 3 is used. The temperature at the time of the heat treatment is adjusted to the boiling point of the green sheet and the binder contained in the internal electrode conductor layer 3 and the dividing line 7a. And the boiling point of the binder contained in 7b.

By the heat treatment, at least a part of the dividing lines 7a and 7b of the laminated green sheet 8 after the final compression is removed, and as shown in FIG.
The linear cavities 9 are formed in a state where the linear cavities 9 are arranged in the laminating direction at the position where b was present.

Next, the laminated green sheet 8 after the heat treatment
Is placed on a suitable splitting device (not shown), for example, a device in which the laminated green sheet 8 is inserted between two rotating rollers to apply pressure to the surface of the laminated green sheet 8 from the roller, or placed on an elastic plate. The laminated green sheet 8 is divided into individual chips 6 using a device or the like that applies pressure to the surface of the laminated green sheet 8 (see FIG. 17).

As described above, in the laminated green sheet 5 after the heat treatment, the linear cavities 9 are arranged in the laminating direction, and the strength of the portion where the linear cavities 9 exist is different from that of the other portions. When pressure is applied to the laminated green sheet 8 after the heat treatment by the above-mentioned dividing device, the laminated green sheet 8 becomes linear cavities 9 arranged in the laminating direction.
Is easily and instantaneously divided.

Next, the chip 6 after division is put into a polishing machine such as a barrel polishing machine and polished for a predetermined time. In this polishing step, the edge of the chip 6 is polished so as to be rounded, and at the same time, the unevenness of the divided surface is leveled, so that the edge of the conductor layer 3a is clearly exposed on the divided surface.

Next, the polished chip 6 is put into a de-built furnace, and the binder contained in the chip 6 is removed under predetermined conditions such as temperature and time.

Next, a conductor paste prepared in advance is applied in a predetermined thickness and a predetermined shape to both end portions of the chip 6 after de-buying by a coating method such as a roller coating method or a dip method, and the conductive layer for external electrodes (shown in the figure). (Omitted). The conductive paste used here is the same as the conductive paste used when forming the internal electrode conductive layer 3.

Next, the chip 6 after the external electrode conductor layer is formed is put into a firing furnace, and the chip 6, the internal electrode conductor layer 3 and the external electrode The conductor layers are co-fired.

Next, a first plating layer made of Ni or the like (not shown) and a second plating layer made of Sn or solder (not shown) are formed on the surfaces of the external electrodes of the fired chip 6 by electroplating. I do.

As described above, according to the manufacturing method described above, the linear cavities 9 are arranged in the stacking direction in the green sheet 8 after the heat treatment, and the strength of the portion where the linear cavities 9 exist is different. Since the pressure is applied to the laminated green sheet 8 after the final pressure bonding by using an appropriate dividing device, the laminated green sheet 8 after the heat treatment is linearly laid out in a line with the laminating method. Can be easily split along.

In other words, according to the above-described manufacturing method, the step of cutting the laminated green sheet 8 after the final pressure bonding into individual chips by a blade is unnecessary, and the laminated green sheet 8 after the pressure bonding is divided into individual chips. The time can be greatly reduced, which can greatly contribute to a reduction in manufacturing costs and unit costs.

Further, since the linear cavities 9 are arranged in the laminating direction in the laminated green sheet 8 after the heat treatment, the laminated green sheet 8 after the compression is drawn by a blade such as a rotating blade or a lifting blade. By cutting the laminated green sheet 8 by using the blades 9, the cutting speed by the blades can be improved and the time required for the cutting step can be reduced even when the laminated green sheets 8 are cut by the blades.

In the above description, the dividing line 7 is formed by a combustible paste containing carbon powder and a binder.
Although the case where a and 7b are formed is shown, the same operation and effect as described above can be obtained even when one or a mixture of binders such as polyvinyl butyral resin, cellulose resin, acrylic resin and polyvinyl alcohol is used as a combustible paste. be able to. Further, as long as the material can be removed at a temperature lower than the firing temperature, a material other than the above-described combustible paste can be appropriately used. For example, the same operation and effect as described above can be obtained even if a linear object made of natural or synthetic fibers is provided on the green sheet 2 in the same arrangement as described above, and this linear object is eliminated by the heat treatment. be able to.

In the above description, the laminated green sheet after the heat treatment is divided into individual chips and then the binder removal step is performed. However, the one that can be removed under the heat treatment conditions in the binder removal step is described. When used as the combustible material, a binder removal step may be performed instead of the heat treatment step.

As described above, in the first and second embodiments, the present invention is applied to the production of the co-fired type multilayer ceramic capacitor. However, the steps of forming the external electrode conductor layer and the external electrode conductor Non-simultaneous firing type (type in which firing of the chip and the conductive layer for the internal electrode and firing of the conductive layer for the external electrode are performed separately) in which the layers are fired between the firing step and the plating step. The present invention can be applied to the manufacture of a multilayer ceramic electronic component such as a multilayer ceramic inductor having the same manufacturing process as that of a non-co-fired multilayer ceramic capacitor, and the same operation and effect as described above can be obtained. Can be.

[0053]

As described in detail above, according to the present invention,
The time required to divide the laminated green sheet after bonding into individual chips is greatly reduced, which can greatly contribute to a reduction in manufacturing cost and unit cost.

[Brief description of the drawings]

FIG. 1 is a view showing a step of forming a green sheet and a step of forming a conductor layer for an internal electrode according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a process of forming a division line for a printing green sheet according to the first embodiment of the present invention.

FIG. 3 is a top view of one printed green sheet according to the first embodiment of the present invention.

FIG. 4 is a top view of the other printed green sheet according to the first embodiment of the present invention.

FIG. 5 is a diagram illustrating a process of forming a division line for a non-printing green sheet according to the first embodiment of the present invention.

FIG. 6 is a top view of a non-printing green sheet according to the first embodiment of the present invention.

FIG. 7 is a partial vertical cross-sectional view showing a state of the laminated green sheet after the final pressure bonding according to the first embodiment of the present invention.

FIG. 8 is a partial longitudinal sectional view showing a state after the laminated green sheet after the final pressure bonding is divided according to the first embodiment of the present invention.

FIG. 9 is a view showing a green sheet forming step and an internal electric conductor layer forming step according to a second embodiment of the present invention.

FIG. 10 is a diagram illustrating a process of forming a division line for a printed green sheet according to a second embodiment of the present invention.

FIG. 11 is a top view of one printed green sheet according to a second embodiment of the present invention.

FIG. 12 is a top view of the other printed green sheet according to the second embodiment of the present invention.

FIG. 13 is a diagram illustrating a process of forming a division line for a non-printing green sheet according to the second embodiment of the present invention.

FIG. 14 is a top view of a non-printing green sheet according to a second embodiment of the present invention.

FIG. 15 is a partial vertical cross-sectional view showing a state of a laminated green sheet after final press bonding according to a second embodiment of the present invention.

FIG. 16 is a partial longitudinal sectional view showing a state after a heat treatment is performed on the laminated green sheet after the final pressure bonding according to the second embodiment of the present invention.

FIG. 17 is a partial longitudinal sectional view showing a state after the heat-treated laminated green sheet is divided according to the second embodiment of the present invention.

[Explanation of symbols]

1. Base film, 2. Green sheet, 2-1 and 2-2
... printed green sheet, 2-3 ... non-printed green sheet,
3, 3a: conductor layer for internal electrode, 4a, 4b: dividing line, 5: laminated green sheet, 6: chip, 7a, 7b
... Division line, 8 ... Laminated green sheet, 9 ... Linear cavity.

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Koichi Ando 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Denki Co., Ltd. F-term (reference) 4G055 AA08 AC01 AC09 BA22 BB05 BB16 BB18 5E001 AB03 AH00 AH05 AH06 AJ01 AJ02

Claims (3)

[Claims] 1. A method for manufacturing a laminated ceramic electronic component, comprising: a step of stacking green sheets on which a conductor layer is formed and compressing the laminated sheets, and a step of dividing the laminated green sheets after the compression into individual chips. A cutting line composed of a dotted line hole, a dotted line concave portion or a concave line is formed in advance in the green sheet, the green sheets are stacked and pressed, and then the laminated green sheet is divided or cut along the dividing line arranged in the laminating direction. A method for manufacturing a multilayer ceramic electronic component, comprising: 2. A method for manufacturing a laminated ceramic electronic component, comprising: a step of stacking green sheets on which a conductor layer is formed and pressing them, and a step of cutting the pressed green sheets into individual chips. In advance, a cutting line made of a combustible material is formed on the green sheet, and after stacking and pressing the green sheets, the laminated green sheet is heat-treated to remove at least a part of the cutting line, thereby forming a linear cavity at a position where the cutting line exists. Forming and heat-treating the laminated green sheet, and then dividing or cutting the laminated green sheet along linear cavities arranged in the laminating direction to divide the individual chips into individual chips. . 3. The method for manufacturing a multilayer ceramic electronic component according to claim 2, wherein the combustible material is made of a combustible paste containing a component decomposable at a predetermined temperature.