JP2009267320A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component for manufacturing a laminated ceramic electronic component without cutting any sheet laminates, reliably and stably exposing an internal electrode outside a chip without polishing each chip, and stabilizing the shape of the exposed portion. <P>SOLUTION: In a sheet body 110, a ceramic green sheet 103 is formed in the through-hole of a frame layer 102 having a formed through-hole 102a, and an internal electrode 12 is provided on the ceramic green sheet 103 in the through-hole 102a, while projecting to a prescribed position along an anti-base opposite face 102B from an opening 102c at the other end side of the through-hole 102a. The sheet laminate manufactured by laminating a plurality of sheet bodies is baked in a baking process. The prescribed position is decided so that extension end edges 12A of the internal electrode 12 do not overlap mutually in the lamination direction of the sheet bodies 110 in the sheet laminate manufactured by a lamination process. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component.

2. Description of the Related Art Conventionally, a method for manufacturing a multilayer ceramic electronic component in which ceramic green sheets are stacked to manufacture a multilayer ceramic electronic component is known. For example, Japanese Patent Laying-Open No. 2002-270459 (Patent Publication 1) describes a method for manufacturing such a multilayer ceramic electronic component. In the method for manufacturing a multilayer ceramic electronic component, a conductor layer for an internal electrode is formed on a ceramic green sheet, and a dividing line made of a burning paste is formed on the top and bottom sides of the conductor layer for the internal electrode. A dividing line made of a burning paste is formed at the center and on the left and right sides of the layer. And the ceramic green sheet manufactured in this way is laminated | stacked, the laminated green sheet formed by laminating | stacking the said ceramic green sheet is heated, and at least one part of a parting line is removed. Then, the laminated green sheet is divided into individual chips using an appropriate dividing device. An external electrode is formed on the chip, and the external electrode and the internal electrode conductor layer are connected in an electrode manner.
JP 2002-270459 A

  However, in the method for manufacturing a multilayer ceramic electronic component described in the above publication, although a part of the dividing line is removed, the internal electrode conductor layer and the ceramic green sheet are individually formed in the multilayer green sheet as individual chips. The electrode conductor layers and the individual ceramic green sheets are connected without being divided, and it is necessary to divide them into individual chips by using an appropriate dividing device as described above. As described above, if each chip is formed by using an appropriate cutting device, the connected internal electrode conductor layer cannot be cut at a desired position, and may be broken or missing, or the internal electrode conductor layer may be cut off. May become unstable and become buried inside individual chips.

  For this reason, after dividing into individual chips, in order to electrically connect the internal electrode conductor layers to the external electrodes provided on the individual chips, the internal electrode conductor layers must be reliably exposed to the outside of the chip. Therefore, it is necessary to perform a step of polishing the end face of each chip to expose the internal electrode conductor layer to the outside of the chip.

  Therefore, the present invention can manufacture a multilayer ceramic electronic component without cutting the sheet laminate, and reliably exposes the internal electrodes to the outside of the chip without polishing the individual chips, and the exposed It is an object of the present invention to provide a method for manufacturing a multilayer ceramic electronic component capable of stabilizing the shape of the portion.

  In order to achieve the above object, the present invention provides a frame layer made of a combustible material and having a plurality of through-holes formed on a base material, and the direction in which the through-holes cross the upper surface of the base material. A step of closing the opening on one end side of the through-hole with the upper surface of the base material, the upper surface of the frame layer being open on the base material facing surface facing the upper surface of the base material, and the plurality of through-holes The ceramic slurry is injected into the plurality of through holes from the other end side opening of the ceramic, and a ceramic slurry supplying step of filling the entire space in the plurality of through holes with the ceramic slurry; and drying the ceramic slurry in the plurality of through holes A ceramic green sheet forming step of forming a semi-cured ceramic green sheet, and an internal electrode forming step of forming an internal electrode on the ceramic green sheet at the other end side opening of the plurality of through holes A sheet body manufacturing process for manufacturing a sheet body having the frame layer, the ceramic green sheet, and the internal electrode, and a plurality of the sheet bodies manufactured by performing the sheet body manufacturing process a plurality of times. The ceramic green sheets and the internal electrodes are alternately stacked so that the through-holes of the sheet bodies are in a positional relationship in which the through holes of the sheet bodies coincide with each other in a direction substantially perpendicular to the substrate-facing surface of the frame layer. And laminating the sheet body, removing the base material from the sheet body to produce a sheet laminated body, and burning the sheet laminated body to burn the frame layer and the ceramic green A firing step of curing a sheet laminate in which sheets and the internal electrodes are alternately laminated, and in the internal electrode forming step, the other end side opening of the through hole and the substrate opposite the substrate I cross the face And from the one through hole to the other position between the one through hole and the other through hole adjacent to the one through hole until reaching a predetermined position on the surface opposite to the substrate. Provided is a method for manufacturing a multilayer ceramic electronic component that performs an electrode extension forming step of extending toward a through hole to form the internal electrode.

  A frame layer made of a flammable material and provided with a plurality of through holes is provided on the base material so that the penetration direction of the through holes intersects the top surface of the base material. A step of closing the opening on one end side of the through hole opened on the surface facing the substrate with the upper surface of the substrate, and injecting ceramic slurry into the plurality of through holes from the other end side opening of the plurality of through holes. A ceramic slurry supply step of filling the entire space in the through hole with ceramic slurry, and burning the sheet laminate to burn the frame layer and curing the sheet laminate in which the ceramic green sheets and the internal electrodes are alternately laminated. Therefore, by burning the frame layer, the frame layer is burned out, and a plurality of chip-shaped fired products can be obtained. Since it is not necessary to cut the sheet laminated body in this way, it is not necessary to cause the deformation of the sheet laminated body due to the cutting, and the fired product formed in a chip shape has a well-formed shape accuracy without deformation. Can be expensive. Moreover, the process of cutting the sheet laminate can be omitted, and the manufacturing process can be simplified.

  Furthermore, since a plurality of chip-like fired products can be obtained by the firing process, the fired products are not reattached to each other, and it is not necessary to take measures to prevent defects that are attached to each other. The process can be further simplified.

  In the internal electrode forming step, the internal electrode is formed so as to straddle the anti-base material facing surface of the frame layer and the opening at the other end of the through hole. It will be in the state which protruded from the opening of the other end side of a through-hole, and it can prevent that an internal electrode enters into the inside of a baked product at the time of baking. For this reason, it is possible to reliably electrically connect the external electrode provided to the fired product without performing the step of polishing the end face of each chip and exposing the internal electrode to the outside of the chip. Further, when the frame layer is burned off during firing, the portion of the internal electrode protruding from the opening on the other end side of the through hole in the direction along the surface opposite to the base material is deformed, and the portion of the protruding internal electrode is a fired product. It is possible to more reliably prevent the internal electrode from being caught inside the fired product and entering the fired product during firing.

  Further, in the internal electrode forming step, from one through hole to another through hole until reaching a predetermined position on the surface opposite to the base material between one through hole and another through hole adjacent to the one through hole. In order to perform the electrode extension forming process of extending toward the inside to form the internal electrode, the internal electrode formed in the other end side opening of one through hole and the other end side opening of the other through hole were formed. It can be prevented that the internal electrode is connected. For this reason, it is not necessary to divide into individual chips by using a cutting device or the like, and the connected internal electrodes are broken off due to the cutting, or the shape of the internal electrodes becomes unstable and buried inside each chip. It is possible to prevent the situation from being lost.

  The present invention also provides a small ceramic green sheet forming step in which a plurality of small ceramic green sheets are formed in a positional relationship spaced apart from each other on the upper surface of the substrate, and between the small ceramic green sheets on the upper surface of the substrate. A frame layer made of a flammable material in a state in which a plurality of through-holes are formed and the small ceramic green sheets are filled in the entire space in the plurality of through-holes by filling and curing a slurry made of a flammable material. The through hole is provided on the base material so that the penetrating direction of the through hole intersects the upper surface of the base material, and the frame layer opens at the base material facing surface facing the upper surface of the base material. A step of closing one end side opening of the plurality of through holes by the upper surface of the base material, and an internal electrode for forming an internal electrode on the ceramic green sheet at the other end side opening of the plurality of through holes. A sheet body manufacturing process for manufacturing a sheet body including the frame layer, the ceramic green sheet, and the internal electrode, and a plurality of the manufacturing processes performed by performing the sheet body manufacturing process a plurality of times. The ceramic green sheets and the internal electrodes are alternately arranged so that the sheet bodies are in a positional relationship in which the through holes of the sheet bodies coincide with each other in a direction substantially perpendicular to the substrate-facing surface of the frame layer. Laminating the sheet body to be laminated, removing the base material from the sheet body to produce a sheet laminate, and burning the frame layer by burning the sheet laminate A firing step of curing a sheet laminate in which the ceramic green sheets and the internal electrodes are alternately laminated, and in the internal electrode forming step, the other end side opening of the through hole and the opposite of the frame layer Substrate facing surface From the one through hole until reaching a predetermined position on the surface opposite to the base material between the one through hole and the other through hole adjacent to the one through hole. Provided is a method for manufacturing a multilayer ceramic electronic component that performs an electrode extension forming step of extending toward the other through hole to form the internal electrode.

  A small ceramic green sheet forming process for forming a plurality of small ceramic green sheets spaced apart from each other on the upper surface of the substrate, and a slurry made of a flammable material between the small ceramic green sheets on the upper surface of the substrate By curing and curing, a frame layer made of a combustible material in a state in which a plurality of through holes are formed and a small ceramic green sheet is filled in the entire space in the plurality of through holes is formed on the base material in the through hole penetration direction. Provided in a direction that intersects with the upper surface of the base material, the openings on one end side of the plurality of through holes that open on the base material facing surface facing the upper surface of the base material of the frame layer are blocked by the upper surface of the base material. The sheet layered body in which the ceramic layer and the internal electrodes are alternately laminated, and the frame layer is burned by firing the sheet laminated body. Because having a firing step of the frame layer is destroyed by burning the frame layer may be a plurality of chip-like fired product. Since it is not necessary to cut the sheet laminated body in this way, it is not necessary to cause the deformation of the sheet laminated body due to the cutting, and the fired product formed in a chip shape has a well-formed shape accuracy without deformation. Can be expensive. Moreover, the process of cutting the sheet laminate can be omitted, and the manufacturing process can be simplified.

  Furthermore, since a plurality of chip-like fired products can be obtained by the firing process, the fired products are not reattached to each other, and it is not necessary to take measures to prevent defects that are attached to each other. The process can be further simplified.

  In the internal electrode forming step, the internal electrode is formed so as to straddle the anti-base material facing surface of the frame layer and the opening at the other end of the through hole. It will be in the state which protruded from the opening of the other end side of a through-hole, and it can prevent that an internal electrode enters into the inside of a baked product at the time of baking. For this reason, it is possible to reliably electrically connect the external electrode provided to the fired product without performing the step of polishing the end face of each chip and exposing the internal electrode to the outside of the chip. Further, when the frame layer is burned off during firing, the portion of the internal electrode protruding from the opening on the other end side of the through hole in the direction along the surface opposite to the base material is deformed, and the portion of the protruding internal electrode is a fired product. It is possible to more reliably prevent the internal electrode from being caught inside the fired product and entering the fired product during firing.

  Further, in the internal electrode forming step, from one through hole to another through hole until reaching a predetermined position on the surface opposite to the base material between one through hole and another through hole adjacent to the one through hole. In order to perform the electrode extension forming process of extending toward the inside to form the internal electrode, the internal electrode formed in the other end side opening of one through hole and the other end side opening of the other through hole were formed. It can be prevented that the internal electrode is connected. For this reason, it is not necessary to divide into individual chips by using a cutting device or the like, and the connected internal electrodes are broken off due to the cutting, or the shape of the internal electrodes becomes unstable and buried inside each chip. It is possible to prevent the situation from being lost.

  Here, in the electrode extension forming step, the predetermined position is set so that the extension edges of the internal electrodes do not overlap each other in the stacking direction of the sheet member in the sheet laminate manufactured by the stacking step. It is preferable to determine.

  In the electrode extension forming step, the frame layer is formed in the firing step to determine a predetermined position so that the extension edges of the internal electrodes do not overlap each other in the stacking direction of the sheet member in the sheet laminate manufactured by the lamination step. When burning the flame, it is possible to ensure a wide path through which the burned frame layer is burned out, and to facilitate the burning of the frame layer. Also, after the firing step, the internal electrode formed in the other end opening of one through hole and the internal electrode formed in the other end opening of the other through hole are attached to each other and connected to each other. Therefore, it is not necessary to take measures for preventing the problem that the internal electrodes adhere to each other, and the manufacturing process can be further simplified.

  In the electrode extension forming step, it is preferable that the predetermined position is a position closer to the one through hole than a central position between the one through hole and the other through hole.

  In the electrode extension forming process, the predetermined position is set closer to the first through hole than the central position between the first through hole and the other through hole, so the path through which the burned frame layer is burned out It can be ensured more widely. In addition, after the firing process, the internal electrode formed in the other end opening of one through hole and the internal electrode formed in the other end opening of the other through hole are more reliably prevented from being connected. can do.

  As described above, the present invention can produce a multilayer ceramic electronic component without cutting the sheet laminate, reliably exposing the internal electrode to the outside of the chip without polishing the individual chip, It is possible to provide a method for manufacturing a multilayer ceramic electronic component capable of stabilizing the shape of the exposed portion.

  A method for manufacturing a multilayer ceramic electronic component according to the first embodiment of the present invention will be described. First, a multilayer ceramic electronic component manufactured by a method for manufacturing a multilayer ceramic electronic component will be described with reference to FIGS. More specifically, the multilayer ceramic electronic component 1 is a multilayer ceramic capacitor. The multilayer ceramic electronic component 1 has a small chip shape in which ceramic green sheets are stacked, and the outer shape is a substantially rectangular parallelepiped shape. The multilayer ceramic electronic component 1 is configured by a ceramic green sheet (hereinafter referred to as “ceramic sintered body 11”) whose outer shell is laminated and fired, and a bottom surface thereof is interposed through the ceramic sintered body 11 inside. A total of four internal electrodes 12 to 15 are provided in parallel with 1A and the upper surface 1B.

  Of the four internal electrodes 12 to 15, the first 12 and the third 14 from the bottom of FIG. 2 protrude from the left side wall 1 </ b> C of FIG. 2 of the ceramic sintered body 11 to the left side wall 1 </ b> C. It is electrically connected to the external electrode 16 provided. Of the four internal electrodes 12 to 15, the second 13 and the fourth 15 from the bottom of FIG. 2 protrude from the right side wall 1D of FIG. 2 of the ceramic sintered body 11 to the right side wall 1D. It is electrically connected to the external electrode 17 provided. When the dimensions of the multilayer ceramic electronic component 1 are small, for example, the vertical dimension is 0.4 mm, the horizontal dimension is 0.2 mm, and the height is approximately 0.2 mm. The height is about 2.5 mm.

  Next, a method for manufacturing a multilayer ceramic electronic component will be described with reference to FIGS. In the method for manufacturing a multilayer ceramic electronic component, a sheet body manufacturing process is first performed. In the sheet body manufacturing process, first, a light-transmitting PET sheet 101 is prepared, and a frame layer 102 is provided on the upper surface 101A of the PET sheet 101. The PET sheet 101 corresponds to a base material. The frame layer 102 is made of a flammable non-translucent photosensitive resin that burns away in a baking process described later, and a plurality of frame layers 102 are manufactured by batch processing by exposure processing and development processing.

  As shown in FIG. 3, the frame layer 102 has nine through-holes 102a having substantially the same rectangular parallelepiped shape as the outer shape of the multilayer ceramic electronic component 1, and as shown in FIG. 3B. The through hole 102a penetrates the frame layer 102 in a direction perpendicular to the upper surface 101A of the PET sheet 101. One end side opening 102b, which is the lower end side opening of the through hole 102a, is closed by the PET sheet 101, and the surface of the frame layer 102 facing the upper surface 101A of the PET sheet 101 forms the base material facing surface 102A. The surface opposite to the substrate facing surface 102A, that is, the upper surface of the frame layer 102 shown in FIG. 3B forms an anti-substrate facing surface 102B. The thickness of the frame layer 102 in the direction connecting the base material facing surface 102A and the anti-base material facing surface 102B is about 0.5 μm to 20 μm.

  Next, a ceramic slurry supply process is performed. In the ceramic slurry supply step, as shown in FIG. 4, the ceramic slurry 103 ′ is applied over the entire anti-base material facing surface 102 </ b> B of the frame layer 102. Thus, the ceramic slurry 103 ′ is injected into the through hole 102 a from the other end side opening 102 c that is the upper end side opening of the through hole 102 a, and the entire space in the through hole 102 a is filled with the ceramic slurry 103 ′. Further, the ceramic slurry 103 ′ is also provided on the opposite surface 102 </ b> B of the frame layer 102. The applied ceramic slurry 103 'is made of a material having photocurability.

  Next, the ceramic green sheet formation process which dries ceramic slurry 103 'and makes it the ceramic green sheet 103 is performed. Next, an exposure process for exposing the ceramic green sheet 103 through the PET sheet 101 is performed. The ceramic green sheet 103 in the through hole 102a is exposed to light through the light-transmitting PET sheet 101 and photocured, but the ceramic green sheet 103 on the opposite surface 102B of the frame layer 102 is exposed to light. In this case, the frame layer 102 is not translucent so that it is not exposed. For this reason, the ceramic green sheet 103 on the opposite surface 102B of the frame layer 102 is not photocured. Further, the portion of the ceramic green sheet 103 that protrudes upward in FIG. 4B from the other end side opening 102c of the through hole 102a does not reach the light due to the exposure and is not photocured.

  Next, a removal process is performed. In the removing step, the PET sheet 101 in which the ceramic green sheet 103 is applied to the frame layer 102 is immersed in a developing solution, and the ceramic green sheet 103 that is not photocured is removed. As a result, as shown in FIG. 5 (b), the anti-base material facing surface 102B of the frame layer 102 and the upper surface 103A of FIG. 5 (b) of the ceramic green sheet 103 in the semi-cured through hole 102a are surfaced. Flattened and flattened.

  Next, an internal electrode forming step is performed. In the internal electrode forming step, the internal electrode 12 is formed on the ceramic green sheet 103 by screen printing. Since the internal electrodes 12 to 15 of the multilayer ceramic electronic component 1 are the same, only the formation of the internal electrode 12 will be described here. In other words, the internal electrode 12 extends over the ceramic green sheet 103 that is semi-cured in the other end side opening 102c of the through hole 102a and the anti-base material facing surface 102B of the frame layer 102. From the left end edge of the other end side opening 102c (FIG. 6 (b)) of the right three through holes 102a shown in FIG. 6 (a), from the left end edge of the other end side opening 102c of the middle three through holes 102a, At the predetermined positions on the anti-base material facing surface 102B along the anti-base material facing surface 102B toward the right edge of the three through holes 102a in the middle adjacent to these through holes 102a and the three through holes 102a on the left side. It is provided to extend so as to protrude from each other.

  The predetermined positions are such that the extending edges 12A to 15A (FIG. 8) of the internal electrodes 12 to 15 (FIG. 8) are in the stacking direction of the sheet body 110, that is, FIG. (B) is determined so as not to overlap with each other in the vertical direction. Specifically, the interior extends from the three through holes 102a on the right side of FIG. 6 (a) to the three through holes 102a in the middle. In the case of the electrode 12, the position is closer to the three through holes 102a on the right side than the center position between the three through holes 102a on the right side and the three through holes 102a in the middle in FIG. . In the case of the internal electrode 12 extending from the three through holes 102a in the middle of FIG. 6 (a) to the three through holes 102a on the left, the three through holes 102a in the middle of FIG. The center position between the three through holes 102a is closer to the right three through holes 102a than the central position.

  More specifically, between the three through holes 102a on the right side of FIG. 6A and the three through holes 102a in the middle, the three through holes 102a in the middle of FIG. 6A and the three through holes on the left side. The width of the opposite surface 102B of the frame layer 102 between the hole 102a is about 100 μm, and the three through holes 102a on the right side and the internal electrodes 12 extending from the three through holes 102a in the middle are extended. A predetermined position of the edge 12A is determined at a position near the three through holes 102a on the right side of the center position of the width and a position near the three through holes 102a in the middle. The vertical length of the through hole 102a shown in FIG. 6A is about 500 μm, and the horizontal length is about 1 mm.

  Since the internal electrode 12 is provided in this manner, the internal electrode 12 protrudes from the other end side opening 102c of the through hole 102a in the direction along the anti-base material facing surface 102B, and the internal electrode 12 is formed during firing. Can be prevented from entering the fired product 150 (FIG. 9), and can be reliably electrically connected to the external electrode 16 provided for the fired product 150 as described later. Further, when the frame layer 102 is burned out during firing, the portion of the internal electrode 12 protruding from the other end side opening 102c of the through hole 102a is deformed in the direction along the anti-base material facing surface 102B, and the protruding internal electrode The portion 12 is caught by the side walls 1 </ b> C and 1 </ b> D of the fired product 150, and the internal electrode 12 can be more reliably prevented from entering the fired product 150 during firing.

  Also, the three through holes 102a on the right side shown in FIG. 6A and the three through holes in the middle adjacent to these through holes 102a from the left edge of the other end side opening 102c of the three through holes 102a in the middle. 102a is provided so as to extend toward the right edge of the three through holes 102a on the left side along the anti-base material facing surface 102B until it reaches a predetermined position on the anti-base material facing surface 102B. The other end side opening 102c of the right three through holes 102a, the internal electrode 12 formed in the other end side opening 102c of the middle three through holes 102a, and the other end side opening 102c of the middle three through holes 102a It is possible to prevent the internal electrodes 12 formed in the other end side opening 102c of the three through holes 102a on the left side from being connected to each other. For this reason, it is not necessary to divide into individual chips by using a cutting device or the like, and the connected internal electrodes are broken off due to the cutting, or the shape of the internal electrodes becomes unstable and buried inside each chip. It is possible to prevent the situation from being lost.

  Further, the predetermined positions are such that the extended edges 12A to 15A of the internal electrodes 12 to 15 do not overlap with each other in the stacking direction of the sheet body 110 in the sheet laminate 140 manufactured by the lamination process described later. Therefore, when the frame layer 102 is burned in the firing step, a wide path for burning the burned frame layer 102 can be secured, and the frame layer 102 can be easily burned.

  Further, after the firing step, the internal electrode 12 formed in the other end side opening 102c of the right three through holes 102a and the internal electrode 12 formed in the other end side opening 102c of the middle three through holes 102a are mutually connected. It is possible to prevent the two electrodes from adhering to each other and connect to the internal electrode 12 formed in the other end side opening 102c of the three through holes 102a in the middle and the other end side opening 102c of the three left side through holes 102a. The formed internal electrode 12 can be prevented from adhering to each other and connected to each other, and it is not necessary to take measures to prevent the internal electrode 12 from adhering to each other, thereby further simplifying the manufacturing process. can do.

  Further, in the case of the internal electrode 12 extending from the three through holes 102a on the right side in FIG. 6 (a) to the three through holes 102a in the middle, the predetermined position is on the right side in FIG. 6 (a). The position is closer to the three through holes 102a on the right side than the central position between the three through holes 102a and the middle three through holes 102a, and the left side of the three through holes 102a in the middle of FIG. In the case of the internal electrode 12 extending to the three through-holes 102a, the right middle than the center position between the three through-holes 102a in the middle and the three through-holes 102a on the left in FIG. Therefore, the path through which the burned frame layer 102 is burned out can be surely secured more widely. In addition, after the firing step, the other end opening 102c of the right three through holes 102a, the internal electrode 12 formed in the other end opening 102c of the middle three through holes 102a, and the other three middle through holes 102a It is possible to more reliably prevent the end side opening 102c and the internal electrode 12 formed in the other end side opening 102c of the three through holes 102a on the left side from being connected.

  The above is the sheet body manufacturing process. A plurality of sheet bodies 110 are manufactured by performing the above sheet body manufacturing process a plurality of times. Further, a plurality of sheet bodies 120 (such as FIG. 7B) that do not have the internal electrode 12 are obtained by performing a process that does not have only the internal electrode forming process in the above-described sheet body manufacturing process a plurality of times. To manufacture. The portion of the thickness of the sheet body 110 in the direction connecting the base material facing surface 102A and the anti-base material facing surface 102B, excluding the internal electrode 12, that is, the ceramic green that becomes the ceramic sintered body 11 by the firing process described later. The thickness of the portion of the sheet 103 is about 0.5 μm to 20 μm.

  Next, a lamination process is performed. In the laminating step, first, the sheet body 120-1 (FIG. 7B) that does not have the internal electrodes 12 to 15 described above is turned upside down corresponding to FIG. The adhesive sheet 131 whose adhesiveness is lowered is pasted by pressing the adhesive sheet 131 so that the positions of the through holes 102a coincide with each other in the direction perpendicular to the substrate facing surface 102A. Then, the PET sheet 101 is peeled off. Next, the sheet body 120-2 (FIG. 7B) that does not have the internal electrodes 12 to 15 is turned upside down corresponding to FIG. 6B, and a through hole is formed in a direction perpendicular to the substrate facing surface 102A. The PET sheet 101 is peeled off by being attached to the sheet body 120-1 so that the positions of the positions 102a coincide with each other.

  Next, the sheet body 110-1 having the internal electrode 12 (FIG. 7B) is turned upside down in FIG. 6B, and the positions of the through holes 102a coincide with each other in the direction perpendicular to the substrate facing surface 102A. It sticks to the sheet | seat body 120-2 which does not have the internal electrodes 12-15 so that it may become a positional relationship, and peels the PET sheet | seat 101. FIG. Next, the sheet body 110-2 having the internal electrode 13 (FIG. 7B) is turned upside down in FIG. 6B, and the right and left direction in FIG. 6A is reversed to be perpendicular to the substrate facing surface 102A. In this direction, the positions of the through-holes 102a are affixed to the sheet body 110-1 having the internal electrodes 12 so as to coincide with each other, and the PET sheet 101 is peeled off. Next, the sheet body 110-3 (FIG. 7B) having the internal electrode 14 is turned upside down in FIG. 6B, and the positions of the through holes 102a coincide with each other in the direction perpendicular to the substrate facing surface 102A. The PET sheet 101 is peeled off by being attached to the sheet body 110-2 having the internal electrode 13 so as to be in a positional relationship. Next, the sheet 110-4 having the internal electrode 15 (FIG. 7B) is turned upside down in FIG. 6B and the left-right direction in FIG. 6A is reversed to be perpendicular to the substrate facing surface 102A. In this direction, the positions of the through-holes 102a are affixed to the sheet 110-3 having the internal electrodes 14 so as to coincide with each other, and the PET sheet 101 is peeled off.

  Next, the sheet body 120-3 (FIG. 7B) that does not have the internal electrodes 12 to 15 is turned upside down in FIG. 6B, and the through hole 102a is formed in a direction perpendicular to the substrate facing surface 102A. The PET sheet 101 is peeled off as shown in FIG. 6 (b), and is attached to the sheet body 110-4 having the internal electrodes 15 so that the positions coincide with each other. Through the above-described lamination process, as shown in FIG. 7B, the sheet laminate 140 having a positional relationship in which the internal electrodes 12 to 15 are alternately shifted in the horizontal direction in the drawing is manufactured.

  Next, the sheet laminate 140 is heated to 150 ° C. or higher, and the adhesive sheet 131 is peeled off as shown in FIG. 8 and pressed by applying a predetermined pressure in the lamination direction of the sheet laminate 140. Next, a binder removal process is performed. In the binder removal process, the sheet laminate 140 is heated to about 300 ° C., and the binder in the ceramic green sheet 103 is gradually removed.

  Since the binder removal process is performed, the binder (resin component) in the ceramic green sheet 103 can be gradually removed as described above, and the ceramic green sheet 103 can be uniformly reduced. For this reason, it is possible to prevent the resin content in the ceramic green sheet 103 from being suddenly removed during firing and causing cracks in the fired product 150. Further, a part of the frame layer 102 is burned and burnt out in the binder removal process as in the baking process described later.

  Next, a baking process is performed. In the firing step, the ceramic green sheet 103 is cured and fired by firing the sheet laminate 140 at approximately 1000 ° C. to obtain a fired product 150 as shown in FIG. When firing, the frame layer 102 burns and burns out. Thus, nine fired products 150 are obtained from one sheet laminate 140.

  Next, an external electrode forming step is performed. In the external electrode forming step, external electrodes 16 and 17 (FIG. 1 and the like) made of a solder film or the like are provided on the right side wall 1D and the left side wall 1C shown in FIG. 9 of the fired product 150, and the right side wall 1D and left side wall of the fired product 150 are provided. The external electrodes 16 and 17 are electrically connected to the internal electrodes 12 to 15 protruding from 1C. The multilayer ceramic electronic component 1 is manufactured through the above steps.

  A frame layer 102 formed with a through-hole 102a and made of a combustible material is provided on the PET sheet 101 so that the penetration direction of the through-hole 102a intersects the upper surface 101A of the PET sheet 101. A step of closing the one end side opening 102b of the through hole 102a opened in the substrate facing surface 102A facing the upper surface 101A of the PET sheet 101 with the upper surface 101A of the PET sheet 101, and a through hole from the other end side opening 102c of the through hole 102a. A ceramic slurry supply process for injecting ceramic slurry 103 ′ into 102 a and filling the entire space in through-hole 102 a with ceramic slurry 103 ′; a ceramic green sheet forming process for drying ceramic slurry 103 ′ to form ceramic green sheet 103; And fire the sheet laminate 140 In this manner, the frame layer 102 is burned and the ceramic green sheet 103 is cured, so that the frame layer 102 is burned out by burning the frame layer 102 to form a plurality of chip-shaped fired products 150. it can. Since it is not necessary to cut the sheet laminated body 140 in this way, it is not necessary to cause deformation of the sheet laminated body 140 due to the cutting, and the fired product 150 formed in a chip shape has a shape without deformation. The shape accuracy can be high. Moreover, the process of cutting the sheet laminate 140 can be omitted, and the manufacturing process can be simplified.

  Furthermore, since a plurality of chip-shaped fired products 150 can be obtained by the firing process, the fired products 150 are not reattached to each other, and a measure for preventing a problem in which the fired products 150 are attached to each other. The manufacturing process can be further simplified.

  Further, since the ceramic green sheet 103 is made of a material having photosensitivity, the ceramic green sheet 103 can be easily flattened on the side opposite to the substrate of the frame layer 102 by exposure. Further, by adjusting the intensity of light to be exposed, a portion where the ceramic green sheet 103 is photocured and a portion which is not photocured in the direction connecting the base material facing surface 102A and the anti-base material facing surface 102B, Can be easily adjusted.

  Further, since the frame layer 102 is formed of a photosensitive resin, the frame layer 102 can be easily formed by batch processing by performing exposure. In addition, since a plurality of frame layers 102 are formed by using exposure and development processes, the through holes 102a of the frame layer 102 can be formed with micron order and high dimensional accuracy.

  Further, when the sheet laminate 140 is cut with a cutting blade such as a dicer as in the prior art, the smaller the multilayer ceramic electronic component 1 is, the larger the portion to be discarded as unnecessary cutting margin becomes. In the case where the frame layer 102 is used as described above, this can be prevented.

  Next, a method for manufacturing a multilayer ceramic electronic component according to the second embodiment will be described with reference to FIGS. The manufacturing method of the multilayer ceramic electronic component according to the second embodiment is the first in that the frame layer 102 is provided after the small ceramic green sheet 103 ″ made of the ceramic green sheet 103 is provided on the upper surface 101A of the PET sheet 101. This embodiment is different from the embodiment, and is the same as the first embodiment except for these points. Therefore, the same members and the like as those in the first embodiment are described with the same reference numerals, and only the portions different from those in the first embodiment will be described.

  In the method for manufacturing a multilayer ceramic electronic component, first, a small ceramic green sheet forming step of a sheet body manufacturing step is performed. In the small piece ceramic green sheet forming step, first, a light-transmitting PET sheet 101 is prepared, and a ceramic slurry 103 ′ is applied to the upper surface 101 </ b> A of the PET sheet 101 in a rectangular shape as shown in FIG. 10. The applied ceramic slurry 103 'is made of a material having photocurability. Next, the ceramic slurry 103 ′ is dried to form a ceramic green sheet 103.

  Next, the ceramic green sheet 103 is exposed. More specifically, a mask having non-translucency (not shown) is applied to the upper surface of FIG. 10B of the ceramic green sheet 103 at a position other than a position where a through hole 102a described later is formed, Exposure is performed through the mask from above in FIG. The portion of the ceramic green sheet 103 corresponding to an unillustrated portion of the ceramic green sheet 103 is exposed to light and cured, but the ceramic green sheet corresponding to an unillustrated portion of the mask is applied. The portion 103 is not exposed because a mask (not shown) has non-translucency. For this reason, the portion of the ceramic green sheet 103 corresponding to the portion on which the mask (not shown) is applied is not photocured.

  Next, the PET sheet 101 provided with the ceramic green sheet 103 is immersed in a developer, and the portion of the ceramic green sheet 103 that is not photocured is removed. As a result, as shown in FIG. 11A, rectangular small ceramic green sheets 103 ″ are formed on the PET sheet 101 in three rows and three columns. The above is the small ceramic green sheet forming step.

  Next, on 101A on the upper surface of the PET sheet 101, as shown in FIG. 12, combustibility having photo-curing properties so as to cover between the small ceramic green sheets 103 '' and the entire nine small ceramic green sheets 103 ''. The slurry made of the material is filled, supplied, and cured by drying. Next, exposure is performed from below in FIG. 12B, which is the lower surface 101B side of the PET sheet 101. A small ceramic green sheet 103 ″ and a slurry of a combustible material cured (hereinafter referred to as “combustible combustible slurry 102 ′”) are light transmissive and combustible slurry cured product 102 ′. Photocuring proceeds to a portion corresponding to the upper surface position of the small ceramic green sheet 103 ″ shown in FIG. 12B, but from the bottom to the top of FIG. 12B. Since the light is weakened in the small piece ceramic green sheet 103 ″ and the combustible slurry cured product, the upper position of the small piece ceramic green sheet 103 ″ shown in FIG. The combustible slurry cured product 102 'is exposed so as not to be photocured.

  Next, the PET sheet 101 on which the small piece ceramic green sheet 103 ″ and the combustible slurry cured product 102 ′ are formed is immersed in the developer, and the portion of the combustible slurry cured product 102 ′ that is not photocured is removed. As a result, as shown in FIG. 5, the nine through holes 102a are formed and the small ceramic green sheet 103 ″ (ceramic green sheet 103) is combustible in a state where the entire space in the nine through holes 102a is filled. The frame layer 102 made of a conductive material is provided on the PET sheet 101 so that the penetrating direction of the through hole 102a is perpendicular to the upper surface 101A of the PET sheet 101, and the plurality of through holes opened in the substrate facing surface 102A The one end side opening 102b of the hole 102a is closed by the upper surface 101A of the PET sheet 101. Next, the internal electrode forming step and the subsequent steps are the same as in the first embodiment.

  The manufacturing method of the multilayer ceramic electronic component of the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made within the scope described in the claims. For example, the frame layer 102 is made of a non-light-transmitting material, but the frame layer may be made of a light-transmitting material. In this case, the ceramic green sheet 103 on the anti-substrate facing surface 102B of the frame layer 102 may be prevented from being photocured by adjusting the intensity of light to be exposed again.

  Further, in the removing step, as shown in FIG. 5B, the anti-base material facing surface 102B of the frame layer 102 and the upper surface 103A of FIG. 5B of the ceramic green sheet 103 in the semi-cured through hole 102a Is flush, but it doesn't have to be flush. For example, there is no ceramic green sheet 103 on the opposite surface 102B of the frame layer 102, and the ceramic green sheet 103 protrudes upward in FIG. 5B from the other end side opening 102c of the through hole 102a. The protruding end surface of the ceramic green sheet 103 protruding from the other end side opening 102c of the through hole 102a may be flattened.

  Moreover, you may comprise a ceramic green sheet with the photosensitive material which has the solubility to a developing solution by exposing. In this case, instead of the ceramic green sheet forming step according to the first embodiment, a ceramic green sheet forming step is performed in which the entire ceramic slurry is dried to form a ceramic green sheet. After the ceramic green sheet forming step, Before the internal electrode formation step, the ceramic green sheet is exposed from the side opposite to the base PET sheet 101 with respect to the frame layer 102, and the other end side opening 102c of the through hole 102a is exposed from the through hole 102a. The protruding portion of the ceramic green sheet and the portion of the ceramic green sheet provided on the counter-substrate facing surface 102B are given solubility in a developer, and the portion of the ceramic green sheet to which this solubility is given is added. What is necessary is just to remove with a developing solution etc. If it does in this way, the PET sheet 101 which is a base material can be comprised with the material which has non-light-transmitting property.

  With such a configuration, by adjusting the intensity of light to be exposed, the ceramic green sheet is given solubility in the developer in the direction connecting the base material facing surface 102A and the anti-base material facing surface 102B. It is possible to easily adjust the boundary position between the portion and the portion not provided.

  For this reason, in the removal process, the surface of the ceramic green sheet on the side opposite to the base material 102B can be easily flattened. Further, the surface opposite to the substrate 102B and the surface of the ceramic green sheet in the other end side opening 102c in the through hole 102a can be easily flushed. Such flattening and flushing can be easily performed even when the frame layer 102 does not have translucency.

  Further, although a plurality of frame layers 102 are manufactured and provided by batch processing by exposure processing and development processing, they may be manufactured by a method other than such a method. For example, the frame layer 102 may be formed by pattern printing of a resin or the like, or a hollow portion may be formed by punching or laser processing the resin sheet. Therefore, the frame layer 102 is made of a photosensitive resin, but is not limited to the photosensitive resin.

  In the ceramic slurry supplying step, the ceramic slurry 103 ′ is injected into the through hole 102 a from the other end side opening 102 c of the through hole 102 a by applying the ceramic slurry 103 ′ over the entire surface opposite the base material 102 B of the frame layer 102. The entire space in the through hole 102a is filled with the ceramic slurry 103 ′, but the present invention is not limited to this method. For example, the non-photosensitive ceramic slurry may be applied over the entire anti-base material facing surface 102B of the frame layer 102, and then the anti-substrate facing surface of the frame layer 102 may be leveled with a blade or the like. Ceramic slurry may be injected every 102a.

  The multilayer ceramic electronic component 1 is a multilayer ceramic capacitor, but is not limited to a capacitor. Further, the number of sheet bodies 110 and 120 is not limited to the number in the present embodiment.

  Further, in the laminating step, the anti-base material facing surface 102B side of the frame layer 102 is attached to the pressure-sensitive adhesive sheet 131, but other sheets may be used instead of the pressure-sensitive adhesive sheet 131, and other means, for example, A means may be used in which air is sucked through a sheet having good air permeability to adsorb the opposite surface 102B of the frame layer 102, and the adsorption is terminated when the laminating process is completed. In addition, the sheet laminate 140 is heated to 150 ° C. or more and the adhesive sheet 131 is peeled off. However, it does not adversely affect the quality and characteristics of the multilayer ceramic electronic component 1 that is a product in the steps after the binder removal process. For example, you may make it burn with the frame layer 102 in a baking process, without peeling.

  Further, in the method of manufacturing the multilayer ceramic electronic component according to the second embodiment, the upper surface of FIG. 10B of the ceramic green sheet 103, which is not illustrated in a position other than the position where the through hole 102a is formed. Although it exposed through the said mask from the upper direction of FIG.10 (b) with the mask which has translucency, it is not limited to this, For example, it is the lower surface 101B of PET sheet 101, and the position in which the through-hole 102a is formed A mask having a non-light-transmitting property (not shown) may be put on a position other than that and exposed through the mask from the lower side of FIG.

  Further, in the method of manufacturing the multilayer ceramic electronic component according to the second embodiment, the combustible slurry cured product 102 ′ was exposed from the lower side of FIG. 12B on the lower surface 101 B side of the PET sheet 101. For example, the cured combustible slurry is made of a photosensitive material that is soluble in a developer by being exposed to light, and combustible from above in FIG. 12A on the upper surface 101A side of the PET sheet 101. The cured slurry may be exposed.

  In this way, the cured combustible slurry has solubility in the developer up to a position corresponding to the upper surface position of the small piece ceramic green sheet 103 '' shown in FIG. The part of the combustible slurry cured product in the lower part of FIG. 12B than the upper surface position of the small ceramic green sheet 103 ″ shown in FIG. 12B does not have solubility in the developer. be able to. Then, by immersing the PET sheet 101 on which the small piece ceramic green sheet 103 ″ and the combustible slurry cured product are formed in the developer, the portion of the combustible slurry cured product having solubility in the developer is removed. The frame layer 102 can be formed.

  The method for producing a multilayer ceramic electronic component of the present invention is useful in the field of multilayer ceramic electronic components that require dimensional accuracy of the outer shape.

The top view which shows the multilayer ceramic electronic component manufactured by the manufacturing method of the multilayer ceramic electronic component by embodiment of this invention. 1 is a side sectional view showing a multilayer ceramic electronic component manufactured by a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention. It is a figure which shows a mode that the frame layer was provided on the PET sheet in the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the ceramic slurry supply process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the ceramic green sheet formation process and removal process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the internal electrode formation process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the lamination process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the process of heating a sheet | seat laminated body, peeling an adhesive sheet, and pressing in the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) Is a side sectional view. It is a figure which shows the binder removal process and baking process of the manufacturing method of the multilayer ceramic electronic component by the 1st Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the small piece ceramic green sheet formation process of the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows the small piece ceramic green sheet formation process of the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing. It is a figure which shows a mode that the combustible slurry hardened | cured material was formed in the manufacturing method of the multilayer ceramic electronic component by the 2nd Embodiment of this invention, (a) is a top view, (b) is side sectional drawing.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Multilayer ceramic electronic components 12-15 Internal electrode 101 PET sheet 102 Frame layer 103 Ceramic green sheet 103 'Ceramic slurry 102a Through-hole 102b One end side opening 102c Other end side opening 102A Base material opposing surface 102B Anti-base material opposing surface 110 Sheet body 140 Sheet laminate

Claims (4)

A frame layer made of a combustible material and provided with a plurality of through holes is provided on the base material such that the through direction of the through holes intersects the upper surface of the base material. A step of closing an opening on one end side of the through hole that opens on the substrate facing surface facing the upper surface of the substrate with the upper surface of the substrate, and the inside of the plurality of through holes from the other end side opening of the plurality of through holes A ceramic slurry is injected into the ceramic slurry to fill the entire space in the plurality of through holes with the ceramic slurry, and the ceramic slurry in the plurality of through holes is dried to form a semi-cured ceramic green sheet. A ceramic green sheet forming step, and an internal electrode forming step of forming an internal electrode on the ceramic green sheet at the other end side opening of the plurality of through holes, the frame layer and the ceramic green A sheet process of manufacturing a sheet member having a seat and internal electrodes,
A positional relationship in which the plurality of sheet bodies manufactured by performing the sheet body manufacturing process a plurality of times are such that the through holes of the sheet bodies coincide with each other in a direction substantially perpendicular to the substrate-facing surface of the frame layer. And laminating the sheet body so that the ceramic green sheets and the internal electrodes are alternately laminated, and removing the base material from the sheet body to produce a sheet laminate, ,
Firing the sheet laminate to burn the frame layer and curing the sheet laminate in which the ceramic green sheets and the internal electrodes are alternately laminated,
In the internal electrode formation step, one through hole and another adjacent to the one through hole so as to straddle the other end side opening of the through hole and the opposite surface of the frame layer to the base material. An electrode extension forming step of forming the internal electrode by extending from the one through hole toward the other through hole until reaching a predetermined position on the surface opposite the base material between the through hole; A method for producing a multilayer ceramic electronic component, comprising: A small ceramic green sheet forming step for forming a plurality of small ceramic green sheets on the upper surface of the base material in a spaced relationship with each other, and a slurry made of a combustible material between the small ceramic green sheets on the upper surface of the base material The frame layer made of a combustible material in a state where a plurality of through-holes are formed and the small ceramic green sheets are filled in the entire space in the plurality of through-holes is formed on the substrate. One end of the plurality of through-holes that are provided so that the penetration direction of the through-hole intersects with the upper surface of the base material and opens in the substrate facing surface of the frame layer facing the upper surface of the base material And a step of forming an internal electrode on the ceramic green sheet at the other end side opening of the plurality of through holes. A seat body manufacturing process for manufacturing a sheet having a said frame layer and the ceramic green sheet and the internal electrode,
A positional relationship in which the plurality of sheet bodies manufactured by performing the sheet body manufacturing process a plurality of times are such that the through holes of the sheet bodies coincide with each other in a direction substantially perpendicular to the substrate-facing surface of the frame layer. And laminating the sheet body so that the ceramic green sheets and the internal electrodes are alternately laminated, and removing the base material from the sheet body to produce a sheet laminate, ,
Firing the sheet laminate to burn the frame layer and curing the sheet laminate in which the ceramic green sheets and the internal electrodes are alternately laminated,
In the internal electrode formation step, one through hole and another adjacent to the one through hole so as to straddle the other end side opening of the through hole and the opposite surface of the frame layer to the base material. An electrode extension forming step of forming the internal electrode by extending from the one through hole toward the other through hole until reaching a predetermined position on the surface opposite the base material between the through hole; A method for producing a multilayer ceramic electronic component, comprising:   In the electrode extension forming step, the predetermined position is determined so that the extension edges of the internal electrodes do not overlap each other in the stacking direction of the sheet member in the sheet laminate manufactured by the lamination step. The method for producing a multilayer ceramic electronic component according to claim 1, wherein:   4. The electrode extension forming step, wherein the predetermined position is a position closer to the one through hole than a central position between the one through hole and the other through hole. The manufacturing method of the multilayer ceramic electronic component of description.

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