JP2010021386A - Method for manufacturing ceramic part - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic part, which forms the interconnection of a fine pattern comparatively simply and securely, and furthermore at low cost. <P>SOLUTION: In a laser processing process, green ceramic shaped bodies 31, 32, 33 containing ceramic powder, and a non-sintered conductor 37 containing conductive metal powder are contactingly arranged. In such an arranged state, by removing a part of the non-sintered conductor 37 with a laser for the non-sintered conductor 37, a non-sintered conductor portion 38 in a predetermined shape is formed. In a sintering process after the laser processing process, the green ceramic shaped bodies 31, 32, 33 and the non-sintered conductor portion 37 are simultaneously heated and sintered. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a ceramic component including a ceramic base portion and a conductor portion, and more particularly to a method for manufacturing a ceramic component characterized by a pattern forming method for the conductor portion.

  In recent years, semiconductor integrated circuit elements (IC chips) used as computer microprocessor units (MPUs) have become increasingly faster and more functional, with an accompanying increase in the number of terminals and the pitch between terminals. Tend to be narrower. In general, a large number of terminals are densely arranged on the bottom surface of an IC chip, and such a terminal group is connected to a terminal group on the motherboard side in the form of a flip chip. However, it is difficult to connect the IC chip directly on the mother board because there is a large difference in the pitch between the terminals on the IC chip side terminal group and the mother board side terminal group. For this reason, a method is generally employed in which a package is prepared by mounting an IC chip on an IC chip mounting wiring board, and the package is mounted on a motherboard.

Various insulating materials can be used for the IC chip mounting wiring board constituting this type of package, and ceramic substrates using ceramics are well known as an example. In this type of ceramic substrate, for example, a ceramic material mainly composed of alumina is used for the insulator portion, and a metal (for example, tungsten) that can be fired simultaneously with alumina is used for the conductor portion.
Hereinafter, a conventional method for manufacturing a ceramic substrate will be exemplified.

  First, a slurry is prepared by mixing alumina powder, an organic binder, a solvent, a plasticizer and the like. Then, this slurry is formed into a sheet shape by a conventionally well-known method to produce a ceramic green sheet. The ceramic green sheet is then subjected to a conventionally known punching (punching) process to form via holes that penetrate the front and back surfaces of the sheet. Next, a via paste is filled with a conductor paste mainly composed of tungsten or the like using a conventionally known paste printing apparatus. Further, a conductor paste is applied to the surface of the ceramic green sheet according to a screen printing method. Here, the conductive paste is printed and formed in a predetermined pattern using a mask having a predetermined pattern corresponding to the circuit wiring to be formed. Thereafter, a plurality of ceramic green sheets are laminated, and a predetermined load is applied in the thickness direction using a conventionally known laminating apparatus, so that these are pressed and integrated to form a laminated body. Then, the baking process which heats this laminated body to the predetermined temperature which an alumina can sinter is performed. After this firing, the ceramic green sheets and the conductive paste are sintered to obtain a ceramic substrate.

As described above, for example, Patent Literature 1 discloses a technique for patterning a wiring (conductor portion) according to a screen printing method. Patent Document 2 discloses a technique for trimming a conductor pattern formed on the surface of an insulating base material by laser processing.
JP 2007-261209 A JP 2003-133690 A

  Incidentally, in the above-described method for manufacturing a ceramic component such as a ceramic substrate, there is a demand for forming fine wiring (conductor portion) with high accuracy. Increasing the accuracy of the pattern greatly affects the electrical characteristics of the ceramic parts, and in particular, it is important to reduce the variation in the insulation interval. In other words, the electrical characteristics of the ceramic component become unstable due to variations in the insulation interval. Further, miniaturization of the pattern is an indispensable matter for reducing the size of the entire part.

  However, in the case of a ceramic substrate, it is difficult to form a fine pattern as compared with a resin substrate, and at most, a line and space (L / S) of wiring is about 50 μm / 50 μm has been put into practical use. In a conventional method for manufacturing a ceramic substrate, a wiring pattern is formed by a screen printing method using a mask or the like. However, formation of fine wiring using a mask may be disadvantageous in terms of cost. For example, although it is possible to manufacture a mask of about L / S = 30 μm / 30 μm, when manufacturing a small amount of prototype, the mask cost increases and the cost becomes high. In addition, the strength of the mask is weakened, the durability is deteriorated, and the life is shortened.

  When a mask for forming a fine pattern is used, it is necessary to frequently clean the mask in order to remove the conductive paste attached to the mask, which causes a problem that the productivity is impaired. In addition, when printing the conductor paste, it is necessary to position the mask with high accuracy with respect to the ceramic substrate, and there is a problem that work is troublesome in production. Furthermore, it is necessary to produce a plurality of types of masks according to the circuit wiring pattern, which causes high costs. Furthermore, the fine conductor pattern formed by printing tends to cause undulation and thickness variation in itself, and the degree of undulation is so severe that it may cause disconnection. In addition, if the insulating interval of the conductor pattern is narrowed, the printing is blurred, causing a short circuit or the like. As described above, in the conventional ceramic substrate, L / S = about 30 μm / 30 μm is the lower limit, which is a limit value applicable to products.

  Further, as a technique for miniaturizing wiring on a ceramic substrate, there is a technique of trimming a conductor pattern in a sintered body by laser processing as disclosed in Patent Document 2. However, trimming of the outer conductor pattern exposed on the substrate surface is possible to some extent, but it is impossible to trim the inner conductor pattern. Further, when trimming the outer-layer conductor pattern on the ceramic substrate, the portion may be burnt by the laser, which may deteriorate the appearance.

Further, in the case of a ceramic component made of a ceramic sintered body, warpage and undulation are often caused in the entire component due to the difference in firing shrinkage between the conductor portion and the ceramic insulating portion. Therefore, even if trimming is performed on the same plane, the focal point of the laser is deviated, and it is very difficult to perform laser processing with high accuracy, so that it is difficult to form fine pattern wiring.
The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of manufacturing a ceramic component capable of forming a fine pattern wiring relatively easily and reliably at low cost.

  Means for solving the above problems (Means 1) is a method of manufacturing a ceramic part including a ceramic base portion and a conductor portion, and includes a green ceramic molded body including a ceramic powder and a conductive metal powder. In a state where the unsintered conductor is disposed in contact with the unsintered conductor, a part of the unsintered conductor is removed by a laser to form an unsintered conductor portion having a predetermined shape, and the laser processing There is a method for manufacturing a ceramic part, comprising a firing step of simultaneously sintering the green ceramic body and the green conductor portion after the step.

  Therefore, according to the ceramic part manufacturing method described in the means 1, the laser processing step is performed before the sintering step, and a part of the unsintered conductor is removed by the laser, whereby the unsintered conductor having a predetermined shape is obtained. Part is formed. Here, the unsintered ceramic molded body before sintering has less warpage and higher surface flatness than the sintered ceramic base portion. Therefore, the laser can be reliably focused on the unsintered conductor disposed in contact with the unsintered ceramic molded body, and a fine pattern can be formed. As a result, a ceramic component having fine wiring can be manufactured relatively easily and reliably.

  A specific method for placing the green ceramic body and the green conductor in contact with each other is not particularly limited. For example, the green body is printed on the green ceramic body. It is preferable to arrange them. When the green conductor is printed and formed in this way, sufficient adhesion between the green ceramic molded body and the green conductor can be secured, and the ceramic base portion and the conductor portion obtained through the firing process can be secured. Adhesion can be sufficiently secured. In this case, the unsintered conductor may be printed and formed in a rough pattern shape in advance. For this reason, the pattern formed on the mask becomes thick, the durability of the mask can be sufficiently secured, and the cleaning frequency of the mask can also be reduced. Furthermore, it is not necessary to prepare a different mask for each circuit wiring pattern, and a common mask can be used, so that mask costs can be greatly reduced.

  More preferably, the green conductor is printed and formed in a shape that approximates the shape of the green conductor portion. When the unsintered conductor is printed and formed in this way, it is sufficient to perform laser processing only on a portion where a fine pattern needs to be formed, and processing costs can be reduced.

  The unsintered conductor printed on the unfired ceramic molded body is preferably a conductor paste thin film having a thickness of 30 μm or less, for example. As described above, when the unsintered conductor is formed in a thin film shape, a part of the unsintered conductor can be reliably removed by the laser beam having a relatively weak output.

  The method for placing the green ceramic body and the green conductor in contact with each other is not limited to the printing method as described above. For example, the non-sintered conductor formed in the form of a sheet may be placed on the non-sintered ceramic molded body by pressure bonding, or the non-sintered conductor is formed by applying a conductive material on the non-sintered ceramic molded body. It may be arranged.

  Preferable examples of the material forming the ceramic base portion include alumina, beryllia, aluminum nitride, boron nitride, silicon nitride, and low-temperature fired ceramic. Further, when the ceramic substrate is a dielectric layer in a ceramic capacitor, it is preferable to select barium titanate, strontium titanate, or the like.

  The conductive metal powder contained in the unsintered conductor needs to have a melting point higher than the firing temperature of the ceramic base portion. For example, when the ceramic substrate is made of a so-called high-temperature fired ceramic (for example, alumina), tungsten (W), molybdenum (Mo), manganese (Mn), etc., and alloys thereof as the metal powder in the unsintered conductor Can be selected. When the ceramic substrate is made of a so-called low-temperature fired ceramic (for example, glass ceramic or the like), copper (Cu), silver (Ag), or an alloy thereof can be selected as the metal powder in the unsintered conductor.

  Prior to the firing step, it is preferable to include a non-sintered conductor filling step of forming holes in the non-sintered ceramic molded body with a laser and filling the non-sintered conductors in the holes. According to this process, not only the unsintered conductor extending along the surface direction of the unsintered ceramic molded body but also the unsintered conductor extending along the thickness direction can be formed. In addition, since the laser processing device can be shared, the cost of the device can be reduced compared with the case of forming holes by punching or the like, and deformation of the unsintered ceramic molded body due to the addition of mechanical stress Can be prevented in advance. In addition, the unsintered conductor with which it filled in the hole becomes a via conductor through a sintering process.

  The ceramic component may be a single-layer ceramic substrate, but is preferably a multilayer ceramic substrate in which ceramic insulating portions and conductor portions are alternately laminated. In this case, the method includes a laminating step of laminating and integrating a plurality of the sintered ceramic molded bodies on which the unsintered conductor portions are formed after the laser processing step and before the firing step. preferable. Here, it is preferable that the unsintered ceramic molded body is a green sheet produced by press molding or sheet molding. Such green sheets are laminated after the conductive paste is printed and patterned by laser processing. Then, through the firing step, the green sheet is fired to become a ceramic insulating part, and the unsintered conductor part is fired to become a conductor part. When a multilayer ceramic substrate is manufactured through such a process, a fine pattern can be formed by laser processing on the inner conductor portion in addition to the outer conductor portion. As a result, the multilayer ceramic substrate can be reduced in size as compared with the conventional substrate.

  In the laser processing step, the wide-area conductor paste printing layer is removed in a ring shape with a line width of 30 μm or less by the laser at predetermined locations of the large-area conductor paste printing layer printed and formed on the ceramic green sheet. It is preferable to form island-like conductor portions independently in the inside. Here, for example, when the island-shaped conductor portion is formed by the screen printing method, the island-shaped conductor portion is short-circuited with the surrounding conductor portion due to printing blurring, and thus the island-shaped conductor having a line width (insulation interval) of 30 μm or less. It is virtually impossible to form the part. On the other hand, by performing laser processing as in the present invention, it is possible to reliably form island-like conductor portions having an insulation interval of 30 μm or less.

  The laser used in the laser processing step is not particularly limited, but is preferably a YAG laser, for example. The YAG laser is suitable for forming a fine pattern so that the line and space (L / S) is 20 μm / 20 μm or less.

  Examples of the package using the multilayer ceramic substrate include a crystal package, a SAW filter package, an MPU package, a C-MOS package, a CCD package, and an LED package.

  Examples of the ceramic component include a chip capacitor and a ceramic capacitor in addition to the ceramic substrate. Further, the present invention is not limited to a flat plate-like component such as a general ceramic substrate, and the present invention may be embodied in a ceramic component having a more three-dimensional shape (for example, a cube shape or a spherical shape). In this case, the unsintered ceramic molded body is not limited to a sheet molded product, and a press molded product or the like can also be used.

Hereinafter, a multilayer ceramic substrate and a manufacturing method thereof according to embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIG. 1, the multilayer ceramic substrate 11 (ceramic component) of the present embodiment is a rectangular flat plate member having an upper surface 12 and a lower surface 13, and is used for mounting an electronic component element. The multilayer ceramic substrate 11 is a multilayer substrate obtained by alternately laminating ceramic sintered layers 14, 15, 16 (ceramic insulating portions) and conductor layers 18 (conductor portions). In the present embodiment, each of the ceramic sintered layers 14 to 16 is made of an alumina sintered body. The conductor layer 18 is a metallized metal layer mainly composed of tungsten, for example. Although the ceramic substrate 11 of the present embodiment has a three-layer structure, a two-layer structure may be employed, or a multilayer structure having four or more layers may be employed.

  On the upper surface 12 of the ceramic substrate 11 (ceramic sintered layer 14), a plurality of terminal pads 21 (conductor portions) for element mounting are formed in a pattern. A plurality of terminal pads 22 (conductor portions) for electrical connection with a mother board (not shown) are formed on the lower surface 13 of the ceramic substrate 11 (ceramic sintered layer 16). These terminal pads are also metallized metal layers mainly composed of tungsten. The conductor layer 18 is patterned at the interface between the ceramic sintered layer 14 and the ceramic sintered layer 15 and at the interface between the ceramic sintered layer 15 and the ceramic sintered layer 16.

  Each ceramic sintered layer 14, 15, 16 has a plurality of via holes 24, and via conductors 25 (conductor portions) mainly composed of tungsten are provided in each via hole 24. The via conductor 25 electrically connects each conductor layer 18 and the terminal pads 21 and 22 to each other.

  Next, a method for manufacturing the multilayer ceramic substrate 11 having the above structure will be described with reference to FIGS.

  First, the preparatory process which prepares an unsintered ceramic molded object is implemented. Specifically, an alumina powder as an ceramic powder, an organic binder, a solvent, a plasticizer, and the like are mixed to prepare a slurry. And this slurry is shape | molded by the conventionally well-known method (For example, a doctor blade method or a calender roll method), and the ceramic green sheets 31, 32, and 33 (unsintered ceramic molded object) as shown in FIG. Make a sheet.

  In the subsequent drilling step, via holes 24 are formed through the ceramic green sheets 31, 32, and 33, respectively (see FIG. 3). These via holes 24 are formed by a conventionally known punching process.

  In the subsequent unsintered conductor filling step, via metallization filling is performed by a conventionally known paste printing apparatus, and the conductor paste 35 (unsintered conductor) is filled in the via holes 24 (see FIG. 4). Here, a tungsten paste containing a tungsten metal powder (conductive metal powder) is used as the conductor paste 35. Then, a conductive paste printing layer 37 is formed by printing a tungsten paste on the ceramic green sheets 31, 32, 33 using a mask (not shown) (see FIG. 5). As a result, the conductor paste printed layer 37 which is an unsintered conductor is disposed in contact with the ceramic green sheets 31, 32 and 33. The thickness of the conductor paste print layer 37 is about 20 μm. The conductor paste printing layer 37 is printed and formed in a rough pattern shape that approximates the pattern of the terminal pads 21 and the conductor layer 18 to be formed later.

  Thereafter, a laser processing step using a YAG laser is performed to remove a part of the conductor paste print layer 37, whereby the conductor paste print layer 37 has a predetermined shape corresponding to the pattern of the terminal pad 21 and the conductor layer 18. A conductor pattern 38 (unsintered conductor portion) is formed (see FIG. 6).

  A specific example will be described. As shown in FIG. 7, an island-shaped via pattern 38A (island-shaped conductor portion) connected to the via conductor 25 and a large-area ground pattern 38B provided around the island-shaped via pattern 38A are provided. When forming the conductor pattern 38 having a large area, first, a conductor paste print layer 37 having a large area is printed and formed (see FIG. 8). Then, a laser beam having a beam diameter of 10 μm is irradiated while shifting at a pitch of 3 μm, and the conductor paste of the conductor paste printed layer 37 is baked and removed in an annular shape (see FIG. 9). As a result, island-like via patterns 38A are independently formed in the ground pattern 38B formed of the large-area conductor paste print layer 37 (see FIG. 7). Here, the insulation interval between the island-shaped via pattern 38A and the ground pattern 38B is about 10 μm to 15 μm.

  Further, as shown in FIG. 10, when two parallel conductor patterns 38C are formed, an island-shaped conductor paste print layer 37 is printed (see FIG. 11). Then, a laser beam having a beam diameter of 10 μm is irradiated while being shifted at a pitch of 3 μm to remove the central portion of the conductor paste print layer 37 in a line shape (see FIG. 10). As a result, two conductor patterns 38C are formed. Here, the line width L and the insulation interval S of each conductor pattern 38C are about 10 μm to 15 μm. Thus, the fine conductor pattern 38C is formed by performing laser processing.

  FIG. 12 is a cross-sectional view taken along line AA in FIG. As shown in FIG. 12, the conductor pattern 38C formed by laser processing has a sharper pattern edge than the conductor pattern formed by screen printing, and the pattern 38C has a uniform thickness and width. The output conditions of the YAG laser are set such that the conductive paste print layer 37 is removed and the ceramic green sheets 31 to 33 that are the base materials are hardly removed.

  A laminating process is performed after the laser processing process described above. In this lamination process, the intermediate ceramic green sheet 32 and the upper ceramic green sheet 31 are sequentially laminated on the lower ceramic green sheet 33, and a predetermined load is applied in the thickness direction using a conventionally known laminating apparatus, These are crimped and integrated to form a laminate 40 (see FIG. 13).

  Then, the baking process which heats the laminated body 40 to the predetermined | prescribed temperature (for example, temperature of about 1500 degreeC-1800 degreeC) which an alumina can sinter is performed. After this firing, the ceramic green sheets 31, 32, 33 are sintered and the ceramic substrate 11 is obtained. Further, the conductor layer 18, the terminal pads 21, 22 and the via conductor 25 are formed by sintering the tungsten paste. In addition, it can be grasped | ascertained that the thing of this state is a wiring board for multi-piece taking of the structure which arranged the product area | region which should become the ceramic substrate 11 vertically and horizontally along the plane direction. Then, a plurality of multilayer ceramic substrates 11 shown in FIG. 1 are obtained simultaneously by dividing the multi-cavity wiring substrate along break grooves (not shown).

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the case of the present embodiment, a laser processing step is performed before the sintering step, and a portion of the conductor paste print layer 37 is removed by irradiating the conductor paste print layer 37 with a laser. . As a result, a conductor pattern 38 having a predetermined shape corresponding to the conductor layer 18 and the terminal pad 21 is formed. In this case, the ceramic green sheets 31, 32, and 33 before sintering are less warped and have higher surface flatness than the sintered ceramic layers 14, 15, and 16 after sintering. Therefore, the laser can be reliably focused on the conductive paste print layer 37 disposed in contact with the ceramic green sheets 31, 32, 33, and a fine pattern can be formed. As a result, the ceramic substrate 11 having fine wiring (conductor layer 18 and terminal pad 21) can be relatively easily and reliably manufactured.

  (2) In the case of the present embodiment, the conductor paste print layer 37 is formed by printing tungsten paste on the ceramic green sheets 31, 32, 33. As described above, when the conductor paste print layer 37 is printed and formed, the adhesion between the ceramic green sheets 31, 32 and 33 and the conductor paste print layer 37 can be sufficiently secured. The conductor paste print layer 37 is printed and formed in a rough pattern shape approximate to the pattern of the conductor layer 18 and the terminal pad 21. In this case, a relatively inexpensive mask having no fine wiring pattern or insulating pattern can be used. Accordingly, the durability of the mask can be sufficiently secured, and the frequency of cleaning the mask can be reduced. Furthermore, when the conductor paste is printed, it is not necessary to accurately align the mask and work efficiency can be improved. Further, in the laser processing step, it is only necessary to perform laser processing only on a portion where a fine pattern needs to be formed, and processing costs can be reduced.

  (3) In the case of the present embodiment, the ceramic green sheets 31 to 33 are laminated after the conductor paste print layer 37 is printed and patterned by laser processing. And by passing through a baking process, the tungsten paste of each ceramic green sheets 31-33 and the conductor paste printed layer 37 sinters, and the multilayer ceramic substrate 11 is obtained. In this way, in addition to the outer conductor portion (terminal pads 21 and 22), the inner conductor portion (conductor layer 18) can be formed with a fine pattern by laser processing. As a result, the multilayer ceramic substrate 11 can be reduced in size and performance.

  (4) In the case of the present embodiment, a predetermined portion of the conductor paste print layer 37 having a large area printed on the ceramic green sheets 31 to 33 is annularly removed with a YAG laser at a line width of about 10 μm to 15 μm. The island-shaped via pattern 38A is independently formed in the wide area ground pattern 38B. Here, when the island-shaped via pattern is formed by the screen printing method as in the prior art, the via pattern is short-circuited with the surrounding ground pattern due to the printing blurring, so that the via pattern having a line width (insulation interval) of 30 μm or less. Is virtually impossible to form. On the other hand, the via pattern 38A having a line width (insulation interval) of 30 μm or less can be reliably formed by performing laser processing as in the present embodiment. Therefore, it is possible to ensure insulation between the via pattern 38A and the surrounding ground pattern 38B.

  (5) In the case of the present embodiment, the conductor paste print layer 37 is trimmed into a fine conductor pattern 38 by laser processing. The conductor pattern 38C (see FIG. 12) formed by laser processing has a sharper pattern edge than the conventional conductor pattern 41 (see FIG. 14) formed by screen printing, and the conductor pattern 38C. The thickness and width are uniform. For this reason, the electrical characteristics of the conductor pattern 38C are stabilized, and the reliability of the multilayer ceramic substrate 11 can be enhanced.

  (6) In the present embodiment, the conductive paste print layer 37 is printed using a mask having no fine wiring pattern or insulating pattern. Here, when using a mask for forming a fine pattern of about L / S = 30 μm / 30 μm as in the prior art, a period of several weeks is required to produce the mask. On the other hand, in this embodiment mode, it is not necessary to form a fine wiring pattern or insulating pattern, so that the mask can be manufactured in a short period of time. Furthermore, it is not necessary to prepare a different mask for each circuit wiring pattern, and a common mask can be used, so that mask costs can be greatly reduced. Therefore, as a result, the manufacturing cost of the multilayer ceramic substrate 11 can be reduced.

  (7) In the present embodiment, the multilayer ceramic substrate 11 is manufactured by performing a sintering process after the laser processing process. In this case, the portion burned and burnt by the laser processing in the conductor paste printed layer 37 is burnt away by the subsequent simultaneous firing. Further, since the inner conductor layer 18 is completely hidden, the problem that the appearance of the ceramic substrate 11 deteriorates is solved.

  In addition, you may change embodiment of this invention as follows.

  In the above embodiment, the process of forming the via hole 24 and the via conductor 25 is performed before the laser processing process, but the process of forming the via hole 24 and the via conductor 25 may be performed after the laser processing process. However, when the laser processing step is performed in a subsequent step as in the above embodiment, the shape of the fine pattern is reliably maintained, which is practically preferable.

  In the above embodiment, the via hole 24 is formed by punching, but may be formed by a technique such as laser processing or drilling. In particular, when the via hole 24 is formed by laser processing, the same laser processing apparatus as that in the laser processing step can be used, so that the apparatus cost can be reduced. Moreover, if a common laser processing apparatus is used, alignment in each process can be simplified. Further, according to such a laser processing method, since stress is not applied to the ceramic green sheets 31 to 33, the flatness of the sheet surface can be maintained in a good state, and the conductor pattern 38 is trimmed by laser processing. It can be done more accurately.

  In the laser processing step in the above embodiment, the YAG laser is used, but other lasers such as a carbon dioxide laser and an excimer laser may be used.

  In the above embodiment, the present invention is embodied in the multilayer ceramic substrate 11 having a three-layer structure, but may be embodied in a ceramic substrate including a ceramic sintered layer (ceramic base portion) having a one-layer structure. Of course, the present invention is not limited to the ceramic substrate, and the present invention may be applied to other ceramic parts such as a ceramic capacitor.

  In the above embodiment, pattern formation is performed by trimming a predetermined portion of a large-area conductor paste printed layer printed on a ceramic green sheet with a laser. Instead of such a pattern formation method, for example, after a conductor paste print layer is formed by normal pattern printing, the pattern shape is corrected by trimming a spot where bleeding due to printing occurs with a laser. May be.

Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiments described above are listed below.
(1) A method for producing a ceramic component comprising a ceramic base portion and a conductor portion, wherein a ceramic green sheet containing ceramic powder and a conductor paste printed layer containing conductive metal powder are arranged in contact with each other, A part of the conductor paste print layer is removed by a laser to form a conductor paste print layer having a predetermined shape, and the ceramic green sheet and the conductor paste print layer are simultaneously fired after the laser process. In the laser processing step, by removing a predetermined portion of the large-area conductor paste printed layer printed on the ceramic green sheet in an annular shape with a line width of 30 μm or less by the laser, Island-like conductor portions are independently formed in the large-area conductor paste printed layer. Method of manufacturing the ceramic parts.

  (2) In the technical idea (1), the L / S of the conductor pattern formed on the conductor paste printed layer after the laser processing step is 20 μm / 20 μm or less, and the method of manufacturing a ceramic part.

  (3) In the technical idea (1) or (2), the laser used for the laser processing is a YAG laser.

  (4) In any one of the technical ideas (1) to (3), the conductor paste printed layer is printed and formed in advance in a rough pattern shape.

1 is a schematic cross-sectional view showing a multilayer ceramic substrate of an embodiment embodying the present invention. Sectional drawing for demonstrating the manufacturing method of a multilayer ceramic substrate. Sectional drawing for demonstrating the manufacturing method of a multilayer ceramic substrate. Sectional drawing for demonstrating the manufacturing method of a multilayer ceramic substrate. Sectional drawing for demonstrating the manufacturing method of a multilayer ceramic substrate. Sectional drawing for demonstrating the manufacturing method of a multilayer ceramic substrate. The top view for demonstrating the manufacturing method of a multilayer ceramic substrate. The top view for demonstrating the manufacturing method of a multilayer ceramic substrate. The top view for demonstrating the manufacturing method of a multilayer ceramic substrate. The top view for demonstrating the manufacturing method of a multilayer ceramic substrate. The top view for demonstrating the manufacturing method of a multilayer ceramic substrate. Sectional drawing in the AA in FIG. Sectional drawing for demonstrating the manufacturing method of a multilayer ceramic substrate. Sectional drawing which shows the conventional conductor pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Multilayer ceramic substrate 14-16 ... Ceramic sintered part as a ceramic insulation part and a ceramic base part 18 ... Conductor layer as a conductor part 21, 22 ... Terminal pad as a conductor part 24 ... Via hole as a hole 25 ... Conductor Via conductors 31 to 33... Ceramic green sheet as an unsintered ceramic molded body 35. Conductor paste as an unsintered conductor 37... Conductor paste printed layer as an unsintered conductor 38, 38 C. Conductor pattern as part 38A ... Via pattern as unsintered conductor part 38B ... Ground pattern as unsintered conductor part

Claims (5)

A method of manufacturing a ceramic component comprising a ceramic base portion and a conductor portion,
In a state where the unsintered ceramic molded body including the ceramic powder and the unsintered conductor including the conductive metal powder are arranged in contact with each other, a predetermined shape is obtained by removing a part of the unsintered conductor with a laser. A laser processing step of forming an unsintered conductor portion of
A method of manufacturing a ceramic component, comprising: a sintering step of simultaneously sintering the green ceramic molded body and the green conductor portion after the laser processing step.   2. The method of manufacturing a ceramic part according to claim 1, wherein the green conductor is printed and formed on the green ceramic body.   3. The method of manufacturing a ceramic part according to claim 2, wherein the green conductor is printed and formed in a shape approximate to the shape of the green conductor portion.   2. The unsintered conductor filling step of forming a hole in the unsintered ceramic molded body by a laser and filling the unsintered conductor in the hole prior to the firing step. The manufacturing method of the ceramic component of description.   The ceramic component is a multilayer ceramic substrate in which ceramic insulating portions and conductor portions are alternately laminated, and the green conductor portion is formed after the laser processing step and before the firing step. The method for producing a ceramic component according to claim 1, further comprising a laminating step of laminating and integrating a plurality of unsintered ceramic molded bodies.

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