JP2008010674A - Electronic component and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of improving the reliability of the connection between the internal electrode such as a leader electrode and the external electrode, thereby being capable of relaxing the barrel polishing condition. <P>SOLUTION: The manufacturing method of the electronic component comprises the steps of forming an unbaked leader electrode 112A on an unbaked insulating layer 111A formed on a carrier film 100; forming a curing resin layer 120A whose ends are arranged on the unbaked leader electrodes 112A and 112B, and on the sides of the parts connected to external electrodes 13A and 13B; forming an unbaked lamination 111 by alternately laminating the unbaked insulating layer 111A, an unbaked conductor pattern 112C, and a through-hole conductor 112D on the unbaked leader electrodes 112A, 112 and the curing resin layer 120A; and forming voids 15'A and 15'B by baking the lamination 111 to burn and eliminate the curing resin layer 120A. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer electronic component, and more particularly to a method for manufacturing an electronic component such as a multilayer inductor used in a mobile phone, an electronic device, and the like, and the electronic component.

  As this type of technology, for example, there is an inductor described in Patent Document 1 and a manufacturing method thereof. For example, as shown in FIG. 4, the inductor includes a laminated body 1 in which a plurality of insulating layers 1 </ b> A are laminated, a coil 2 formed in the laminated body 1, and upper and lower lead electrodes 2 </ b> A and 2 </ b> B of the coil 2. And a pair of left and right external electrodes 3A, 3B covering both end faces of the laminate 1 and terminal electrodes (not shown) electrically connected to the external electrodes 3A, 3B and formed on the lower surface of the laminate 1 ) And is configured as a multilayer inductor. The coil 2 includes a coil conductor 2C formed in a plurality of stages in the horizontal direction and a through-hole conductor 2D that electrically connects the upper and lower coil conductors 2C, and is formed as a rectangular spiral extending in the vertical direction. Has been.

  The inductor shown in FIG. 4 is generally manufactured as shown in FIGS. 5A to 5D and FIGS. 6A to 6C. First, as shown in FIG. 5A, for example, a photosensitive conductive paste is printed on both left and right ends of the carrier film 100, exposed and developed, and then dried to be terminal electrode portions 4′A, 4 'B is formed. A photosensitive insulating paste is printed on these terminal electrode portions 4'A, 4'B, exposed and cured to form an insulating layer 1'A shown in FIG. A photosensitive conductor paste is applied thereon, exposed and developed to form a lead electrode portion 2'A as shown in FIG. Subsequently, printing, exposure, and development are performed using a photosensitive insulating paste to form an insulating layer portion 1′A having a through hole H as shown in FIG. A photosensitive conductor paste is applied thereon, exposed and developed to form a lead electrode portion 2′A, a coil conductor portion 2′C and a through-hole conductor portion 2′D as shown in FIG. To do. These steps are repeated, and the insulating layer portions and the coil conductor portions are alternately laminated according to the desired characteristics to produce a collective substrate of the unfired laminated body 1 ′ shown in FIG.

  Thereafter, the carrier film 100 is removed from the aggregate substrate, the aggregate substrate is divided into a predetermined chip size, and then fired at a predetermined temperature. As shown in FIG. 1 is obtained, external electrodes 3A and 3B are formed on both end faces of the laminate 1 by a dip method using, for example, a conductive paste.

JP2005-109097

  However, in the above-described conventional method for manufacturing an electronic component, after firing, due to a difference in shrinkage rate during firing between the insulating layer portion 1′A and the coil 2 ′ including the extraction electrode portions 2′A and 2′B. Since the lead electrode portions 2A and 2B are pulled into the laminated body 1, it is necessary to expose the lead electrodes 2A and 2B from the end face of the laminated body 1 by barrel polishing the laminated body 1. In addition, since barrel polishing conditions vary depending on the material of the insulating layer 1A and the coil 2, due to the barrel polishing condition setting and the variation in barrel polishing amount, the end surfaces of the stacked body 1 of the extraction electrodes 2A and 2B are not sufficiently exposed, The connection reliability with the electrodes 3A and 3B may be reduced, resulting in an open defect and a Q characteristic defect.

  The present invention has been made to solve the above-described problems, and can improve the connection reliability between an internal electrode such as a lead electrode and an external electrode, and thus can relax the conditions of barrel polishing. An object of the present invention is to provide an electronic component manufacturing method and an electronic component.

  According to a first aspect of the present invention, there is provided a method of manufacturing an electronic component comprising: an internal electrode formed in a laminated body in which a plurality of insulating layers are laminated; and an end of the internal electrode exposed from the end surface of the laminated body. And an external electrode formed on the end face of the laminate, and an unfired electrode connected to the external electrode on an unfired insulating layer formed on a substrate. A step of forming an internal electrode, a step of forming a resin layer on the unfired internal electrode and on the connection portion side with the external electrode, the unfired internal electrode and the resin layer A step of alternately laminating unfired insulating layers and other unfired internal electrodes to produce an unfired laminate, and firing the unfired laminate to eliminate the resin layer and voids And a step of forming the structure.

  According to a second aspect of the present invention, there is provided a method for manufacturing an electronic component according to the first aspect of the present invention, comprising the step of forming an external electrode that fills the gap by applying a conductive paste to an end face of the laminate. It is characterized by having.

  According to a third aspect of the present invention, there is provided a method for manufacturing an electronic component according to the first or second aspect, wherein the resin layer is formed using a photosensitive resin paste. It is.

  According to a fourth aspect of the present invention, in the method for manufacturing an electronic component according to the first or second aspect, the resin layer is formed using a non-photosensitive resin paste. Is.

  The electronic component according to claim 5 of the present invention is connected to an internal electrode formed in a laminated body in which a plurality of insulating layers are laminated, and an end portion of the internal electrode exposed from an end surface of the laminated body. And an external electrode formed on the end face of the laminate, and a part of the external electrode protrudes inward from the end face of the laminate and is joined to the internal electrode. It is characterized by this.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of an electronic component and electronic component which can improve the connection reliability of internal electrodes, such as an extraction electrode, and an external electrode and can ease a barrel grinding | polishing condition by extension are provided. be able to.

  Hereinafter, the present invention will be described based on the embodiment shown in FIGS. In each figure, FIG. 1 is a cross-sectional view showing an embodiment of the electronic component of the present invention, and FIGS. 2 (a) to 2 (f) show the main part of the method of manufacturing the electronic component shown in FIG. FIGS. 3A to 3C are cross-sectional views showing the subsequent steps of the step shown in FIG.

  The electronic component 10 of the present embodiment is formed in a multilayer body 11 in which a plurality of insulating layers 11A are stacked and a substantially rectangular spiral in the vertical direction inside the multilayer body 11 as shown in FIG. A conductor pattern 12 and a pair of external electrodes 13A and 13B that are electrically connected to both ends of the conductor pattern 12 and formed on both left and right side surfaces of the multilayer body 11 are provided. The lower surface of the laminate 11 is formed as a mounting surface when the electronic component 10 is mounted on a mounting board such as a mother board as shown in the figure, and a pair of left and right ends of the insulating layer 11A forming this mounting surface Terminal electrodes 14A and 14B are provided.

  The conductor pattern 12 electrically connects the lead electrodes 12A and 12B connected to the external electrodes 13A and 13B, the coil portion 12C formed at the interface between the upper and lower insulating layers 11A, and the upper and lower coil portions 12C, respectively. Is formed as a spiral coil extending in the vertical direction by a plurality of coil portions 12C and the through-hole conductor 12D as a whole.

  The external electrodes 13A and 13B are integrally formed with connection expansion portions 15A and 15B extending from the inner surfaces along the upper surfaces of the corresponding extraction electrodes 12A and 12B. The electrical connection area between the electrodes 13A and 13B and the extraction electrodes 12A and 12B is expanded, and the external electrodes 13A and 13B and the extraction electrodes 12A and 12B are more reliably electrically connected to increase connection reliability. . These connection expansion portions 15A and 15B can be formed simultaneously with the external electrodes 13A and 13B, as will be described later.

Thus, the insulating layer 11A can be formed from, for example, a photosensitive insulating paste containing ceramic powder. The ceramic powder is not particularly limited, but the ceramic powder includes, for example, K ₂ O—B ₂ O ₃ —SiO ₂ glass powder as a main component and Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ as a subcomponent. What contains a system glass powder can be used. Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass powder, which is an accessory component, has a softening point of 450 to 550 ° C. and a lower melting point than K ₂ O—B ₂ O ₃ —SiO ₂ glass powder. Therefore, in the present invention, a glass powder having a melting point lower than that of the main component of the ceramic powder is defined as a low melting point glass powder.

The conductor pattern 12, the external electrodes 13A and 13B, the terminal electrodes 14A and 14B, and the connection extension portions 15A and 15B can all be formed from a photosensitive conductor paste containing metal powder. The metal powder is not particularly limited, and for example, silver powder, copper powder, or the like can be used as the metal powder. In addition to the above-mentioned K ₂ O—B ₂ O ₃ —SiO ₂ glass powder, the ceramic powder may be appropriately combined with two or more ceramic glass powders that can be fired simultaneously with metal powder such as silver powder and copper powder. May be used.

  Next, an embodiment of a method for manufacturing an electronic component of the present invention will be described with reference to FIGS. 2 (a) to 2 (f) and FIG. 3 (a) to (c). The electronic component 10 of this embodiment can be manufactured using, for example, a photolithography method.

In this embodiment, a carrier film is prepared in advance as a base substrate for producing the laminate 11. Moreover, as the photosensitive conductor paste, for example, a paste containing silver powder is prepared, and as the photosensitive insulating paste, for example, a paste containing ceramic powder is prepared. The ceramic powder contains, for example, K ₂ O—B ₂ O ₃ —SiO ₂ glass powder as a main component and Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass powder as a subcomponent.

  When the electronic component 10 is manufactured, a plurality of electronic components 10 are manufactured simultaneously. Although only one electronic component is shown in FIGS. 2 and 3, actually, a plurality of these are manufactured as an aggregate substrate, and the aggregate substrate is divided into individual chip sizes before firing.

  For example, as shown in FIG. 2A, a carrier film 100 is arranged, and a conductor paste is applied in a predetermined pattern by screen printing on the carrier film 100 to form terminal electrode portions 114A and 114B. Subsequently, a photosensitive insulating paste is applied to the upper surface of the carrier film 100 to cover the terminal electrode portions 114A and 114B, and then the entire surface is irradiated with light such as ultraviolet rays to cure the photosensitive insulating paste to form the insulating layer portion 111A. Form. At this time, the outer end surfaces of the terminal electrode portions 114A and 114B are formed to substantially coincide with the end surface of the insulating layer portion 111A.

Thereafter, a photosensitive conductive paste is applied to the entire surface of the insulating layer 111A to form a photosensitive conductive paste layer, and then a photomask (not shown) having through holes corresponding to the lead electrode 12A and the spiral conductive pattern 12C. Is disposed above the insulating layer portion 111A, the photosensitive conductor paste layer is irradiated with light through a photomask, and the lead electrode portion 112A and the conductor pattern portion 112C are integrated as shown in FIG. The uncured portion is removed by a development process, and the lead electrode portion 112A and the conductor pattern portion 121C are formed simultaneously and the insulating layer portion 111A is exposed.

  As shown in FIG. 2C, a photosensitive resin layer 120 is formed by applying a photosensitive resin paste to the entire upper surface of the insulating layer portion 111A, the lead electrode portion 112A, and the conductive pattern portion 112C, and then the photomask 200 is formed. Deploy. As shown in the figure, the photomask 200 has an opening 200A at the end of the upper surface of the extraction electrode 112A. After the photomass 200 is disposed, the photosensitive resin layer 120 is irradiated with light through the opening 200A of the photomask 200 to be cured, and an uncured portion is removed by development processing. As shown, the cured resin layer 120A remains on the lead electrode 112A and the insulating layer portion 111A is exposed.

  Subsequently, a photosensitive insulating paste is applied to the entire exposed portions of the cured resin layer 120A, the extraction electrode portion 112A, and the insulating layer portion 111A to form an insulating paste layer portion, and then light is transmitted through a photomask to a predetermined pattern. As shown in FIG. 2E, an insulating layer portion 111A having a through hole H is formed. Thereafter, a photosensitive conductor paste is applied, exposed and developed to form a conductor pattern portion 112C and a through-hole conductor portion 112D as shown in FIG. Further, the required number of layers are alternately laminated in this order on the insulating layer portions and the conductor pattern portions. Then, after integrally forming the uppermost conductive pattern layer portion 112C and the lead electrode portion 112B, a cured resin layer is formed so that the end face is aligned with the upper surface of the lead electrode portion 112B in the same manner as described above. An insulating layer portion is formed on the uppermost layer to obtain an aggregate substrate in which a plurality of unfired laminates are aggregated.

  After the carrier film 100 is removed from the aggregate substrate and the aggregate substrate is cut into a predetermined size so as to become individual multilayer inductors, a plurality of unfired multilayer bodies 111 shown in FIG. 3A are obtained. When each unfired laminated body 111 is fired at a predetermined temperature, the cured resin layer 120A burns and disappears, and voids 15′A and 15′B are formed in the portions, as shown in FIG. A laminate 11 is obtained.

  Next, a conductive paste is applied to both side surfaces of the multilayer body 11 to form external electrodes 13A and 13B, and the conductive paste is filled in the gaps 15′A and 15′B, followed by baking at a predetermined temperature, thereby The electrodes 13A and 13B are formed, and the connection extending portions 15A and 15B are formed by the conductor paste in the gaps 15′A and 15′B of the multilayer body 11. The connection expansion portions 15A and 15B are integrated with the external electrodes 13A and 13B and joined to the respective extraction electrodes 12A and 12B. As a result, the connection area between the external electrodes 13A and 13B and the lead electrodes 12A and 12B is expanded, and the connection reliability between the two is improved. Thereafter, the external electrodes 13A and 13B can be plated as necessary.

  In this example, an inductor having a size of 0.6 mm × 0.3 mm × 0.3 mm was produced as Example Product 1 in the manner described above. In addition, an inductor without a connection extension was produced as Comparative Example Product 1. The number of coil stages was six.

  The connection rate and barrel time of these inductors were measured, and the results are shown in Table 1. According to the results shown in Table 1, in Example Product 1, the connection rate was improved and the barrel time was shortened.

  As described above, according to the present embodiment, the step of forming the unfired lead electrode portion 112A on the unfired insulating layer portion 111A formed on the carrier film 100, the unfired lead electrode portion 112A, A step of forming a cured resin layer 120A having an end disposed on the connection portion side with the external electrodes 13A and 13B, and an unfired extraction electrode portions 112A and 112C and an unfired layer on the cured resin layer 120A. Insulating layer portion 111A, unfired conductor pattern portion 112C, and through-hole conductor portion 112D are alternately laminated to produce unfired laminate 111, and unfired laminate 111 is fired to form cured resin layer 120A. , 120A is eliminated by combustion to form voids 15′A and 15′B. Therefore, the voids 15 are formed together with the external electrodes 13A and 13B. A and 15'B can be integrally formed with the connection expansion portions 15A and 15B, and the external electrodes 13A and 13B and the lead electrodes 12A and 12B can be more reliably connected to improve connection reliability. be able to.

  Further, according to the present embodiment, when the external electrodes 13A and 13B are formed, the connection expansion portions 15A and 15B that expand the connection with the extraction electrodes 12A and 12B in the gaps 15′A and 15′B are provided as the external electrodes 13A and 15B. Since the outer electrodes 13A and 13B can be formed integrally with the lead electrodes 12A and 12B through the connection expansion portions 15A and 15B in addition to the end surfaces of the lead electrodes 12A and 12B even if the conditions for barrel polishing are relaxed. It can be joined to the flat portion, and the form of the electronic component 10 is not impaired by barrel polishing.

  In the above embodiment, the cured resin layer 120A is formed using a photosensitive resin paste. However, a thermosetting resin paste other than the photosensitive resin paste can be used as the resin paste. When a thermosetting resin paste is used, the resin layer may be formed in a predetermined pattern by screen printing or the like. In the above embodiment, the case where the multilayer inductor is manufactured as the electronic component has been described. However, other surface mounting electronic components may be used.

  INDUSTRIAL APPLICABILITY The present invention can be suitably used for electronic components such as multilayer inductors used for mobile phones and electronic devices.

It is sectional drawing which shows one Embodiment of the electronic component of this invention. (A)-(f) is sectional drawing which shows the principal part of the manufacturing method of the electronic component shown in FIG. (A)-(c) is sectional drawing which shows the post process of the process shown in FIG. 2 in order of a process, respectively. It is a perspective view which shows an example of the conventional electronic component. (A)-(d) is sectional drawing which shows the principal part of the manufacturing method of the electronic component shown in FIG. 4, respectively in order of a process. (A)-(c) is sectional drawing which shows the post process of the process shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component 11 Laminated body 11A Insulating layer 12A, 12B Lead electrode part (internal electrode)
13A, 13B External electrode 15A, 15B Connection expansion part (part of external electrode)
100 Carrier film 111 Unsintered laminated body 111A Insulating layer part 112A, 112B Lead electrode part (unsintered internal electrode)
115A, 115B gap 120A cured resin layer

Claims (5)

An internal electrode formed in a laminate in which a plurality of insulating layers are laminated, an external electrode connected to an end of the internal electrode exposed from the end face of the laminate, and formed on the end face of the laminate, In a method of manufacturing an electronic component comprising:
Forming a green internal electrode connected to the external electrode on the green insulating layer formed on the substrate;
Forming a resin layer having an end disposed on the unfired internal electrode and on the connection portion side with the external electrode;
A step of alternately stacking unfired insulating layers and unfired other internal electrodes on the unfired internal electrodes and the resin layer to produce unfired laminates;
And firing the unfired laminate to eliminate the resin layer to form voids. A method for producing an electronic component, comprising:   The method for manufacturing an electronic component according to claim 1, further comprising a step of forming an external electrode that fills the gap by applying a conductive paste to an end face of the laminate.   The method of manufacturing an electronic component according to claim 1, wherein the resin layer is formed using a photosensitive resin paste.   The method for manufacturing an electronic component according to claim 1, wherein the resin layer is formed using a non-photosensitive resin paste.   An internal electrode formed in a laminate in which a plurality of insulating layers are laminated, an external electrode connected to an end of the internal electrode exposed from the end face of the laminate, and formed on the end face of the laminate, An electronic component comprising: the external electrode, wherein a part of the external electrode protrudes inward from the end face of the laminate and is joined to the internal electrode.

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