JP2003332132A - Laminated chip component and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated chip component for forming flat a correspond ing layer with a properly viscous insulating paste by excellently stably forming through-holes connecting the upper and lower layer conductor patterns, and to provide its manufacturing method. <P>SOLUTION: A laminated inductor 10 laminates insulating film layers 1 and conductor patterns 2 in an appropriate order, forms a chip body 3 incorporating a coil spirally connecting the conductor pattern 2 to the corresponding inside, and forms outside electrodes 4 and 4 on the two opposite faces. The insulating film layer 1 making each layer is formed so as to uniformly cover the whole region of the corresponding face with an appropriately viscous insulating paste. An interlayer conductor part 5 which is a through hole is provided on an interlayer insulating film layer 1, and mutually connects the upper and lower layer conductor patterns 2. In forming the interlayer conductor part 5, a small-piece like conductor base 50 is provided on a lower layer side by the high viscous conductive paste, the insulating film layer 1 is formed on the corresponding circumference to make a hole part 6, and then the hole part 6 is filled with a low viscous conductive paste 51. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated chip component and a method of manufacturing the same, and more specifically, to an interlayer conductor of a laminated chip component having an electrode body in which conductor patterns are connected between layers in a chip body. Regarding the improvement of the part.

[0002]

BACKGROUND OF THE INVENTION As is well known, electronic components called multilayer chip components are miniaturized into small pieces by eliminating lead terminals for use in surface mounting, and one of them is a multilayer inductor which is an inductance element. .

In a laminated inductor, an insulating film such as ceramic and a conductor pattern are laminated in an appropriate order to form a rectangular chip body containing a coil in which the conductor pattern is spirally connected, and the chip is further formed. External electrodes that are connected to both ends of the built-in coil are provided on two opposing surfaces of the main body.

As a method for forming the chip body (laminate), a sheet laminating method in which a conductor pattern is formed on an insulating sheet and stacking it, a printing laminating method in which an insulating paste and a conductive paste are alternately coated and stacked, etc. In any case, a coil pattern and a lead-out pattern thereof that are spirally connected are formed inside the laminated body.

For connecting the conductor patterns of the upper and lower layers, there is a structure in which the surface is partially covered with a mask layer and the conductor pattern of the next layer is laid out.
There is a problem of stacking being distorted. Therefore, each insulating film may uniformly cover the entire area of the corresponding surface, and so-called through holes may be formed in the insulating film layers between the layers to electrically connect the upper and lower patterns. .

According to the sheet laminating method, the through holes are formed in the insulating sheet by using a laser, a mold or the like, so that the process is complicated and the production cost is increased. On the other hand, in the printing and laminating method, all the steps may be simple print-out and recoating work using a screen plate, and production can be performed in simple steps, which is advantageous in terms of cost.

For example, FIG. 1 is a cross-sectional view for explaining the formation of a through hole by the printing and laminating method. For the formation of the through hole, the conductor pattern 2 is formed on the lower layer (FIG. 1).
(A)), an insulating paste is applied using a screen plate having a pattern having islands to be hole positions to form an insulating film layer 1 with a predetermined thickness, and recessed holes 6 are obtained at hole positions (Fig. 1 (b)).

Thereafter, the hole portion 6 is filled with a conductive paste 7 to form a through hole 8 penetrating the layer (see FIG. 1).
(C)), the conductor pattern 2 of the next layer is formed on the through hole 8 by fine printing (FIG. 1 (d)).

However, there is a problem that the insulating paste is bleeding when the printing lamination method is applied to the formation of the through holes. That is, in the formation of the hole portion 6, since the size of the hole portion is reduced in diameter, the peripheral insulating paste easily flows into the hole position to cause a bleeding defect, and since the size is small, the influence of bleeding is large. As shown in (), there is a problem that it is difficult to stably form a small through hole because a defect in which the hole 6 is filled occurs.

This is because the shape printed on the screen plate cannot be maintained as it is because of the fluidity of the insulating paste, and some sagging occurs. Measures to improve sex can be considered. However, if the insulating paste has a high viscosity, the filling may be incomplete, and it will be difficult to fill the irregularities on the relevant surface to obtain a flat surface. Is necessary and the viscosity cannot be unnecessarily increased.

The present invention has been made in view of the above background, and an object thereof is to solve the above problems and to stably form through holes for connecting upper and lower conductor patterns without defects. It is an object of the present invention to provide a laminated chip component capable of forming a corresponding layer flat with an insulating paste having an appropriate viscosity and a method for manufacturing the same.

[0012]

In order to achieve the above object, in a laminated chip component according to the present invention, an insulating film such as a ceramic and a conductor pattern are laminated in an appropriate order so that the conductor pattern is In a laminated chip component that includes a chip body containing an electrode body connected between layers, and an external electrode connected to the electrode body is provided on the outer surface of the chip body, the insulating film layer is penetrated through the layer to form upper and lower layers. An interlayer conductor portion for connecting a conductor pattern is provided, the interlayer conductor portion is provided with a small piece-shaped conductor base on a lower layer side, and an insulating film layer is formed around the periphery to form a hole portion, and then the hole portion is formed in the hole portion. It is configured to be filled with a conductive paste (first invention).

Further, in forming the interlayer conductor, a small piece-shaped conductor base is provided on the lower layer side with a conductive paste having a high viscosity, and an insulating film layer is formed around the conductor base to form a hole,
The hole may be filled with a conductive paste having a low viscosity.

In addition, the insulating film layer has an interlayer conductor portion that penetrates the layer and connects the conductor patterns of the upper and lower layers, and the interlayer conductor portion is provided with an annular frame portion with an insulating paste, and the frame portion is provided in the frame portion. You may comprise so that it may be filled with a conductive paste (2nd invention). Further, in forming the interlayer conductor portion,
It is preferable to provide an annular frame portion with an insulating paste having a high viscosity and fill the frame portion with the conductive paste. In each of the above-mentioned configurations, the electrode body may be a coil in which conductor patterns are spirally connected in the chip body.

Therefore, in the first aspect of the invention, since the small-piece-shaped conductor base is first provided on the lower layer side in the formation of the through-hole inter-layer conductor portion, the insulating film layer is formed on the lower layer side when forming the insulating film layer on the periphery. Connection is secured in advance, and by appropriately setting the height of the conductor base, it is possible to prevent a defect in which the hole is filled. At this time, a conductive paste having a high viscosity may be used for the conductor base, and the shape can be maintained. Further, the conductive paste with which the hole is filled may have a low viscosity, so that the filling can be prevented from being defective. Then, as the insulating paste forming the insulating film layer, an appropriate one having a low viscosity can be used.

In the second aspect of the invention, in forming the inter-layer conductor portion, by providing the annular frame portion with the insulating paste, the frame portion serves as a barrier, so that the insulating paste forming the insulating film layer is inside the frame portion. Does not flow into. At this time,
An insulating paste having a high viscosity may be used as the insulating paste for forming the frame, and the shape can be maintained. In addition, the conductive paste to be filled in the frame portion may have a low viscosity,
It is possible to prevent defective filling. Then, as the insulating paste forming the insulating film layer, an appropriate one having a low viscosity can be used.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 shows a first embodiment of the present invention. In the present embodiment, a laminated inductor 10 as a laminated chip component has a coil built in a chip body 3 formed in a substantially rectangular shape, and two opposing faces of the chip body 3 are connected to both ends of the built-in coil. The external electrodes 4 and 4 are provided.
Is formed on two opposing surfaces along the axis of the built-in coil, and is a so-called vertical winding type.

In the chip body 3, an insulating film layer 1 made of an insulating film such as ceramics and a conductor pattern 2 are laminated in an appropriate order, thereby forming a coil in which the conductor pattern 2 is spirally connected, and laminated. After completing the above, sintering is performed at a predetermined temperature.

The external electrodes 4 and 4 are formed by dipping. That is, the chip body 3 is placed in a conductive paste such as silver.
The external electrodes 4 and 4 are formed by immersing the corresponding portions of the above, and are formed so that the conductive films are also covered in a predetermined manner on the four surfaces adjacent to the electrode surfaces, and the peripheral electrodes 40 wrap around the adjacent four surfaces. Becomes Therefore, it can be surface-mounted regardless of which of the four adjacent surfaces is down, and there is basically no limit to the mounting posture. However, in the vertical winding type, the coil axis also collapses when it is laid sideways. Since it is facing, attention must be paid to mounting where there is a restriction on the substrate regarding the direction of the magnetic field.

The insulating film layer 1 forming each layer is formed so as to uniformly cover the entire area of the corresponding surface, and no conventional mask layer partially covering the surface is provided. For connecting the upper and lower conductor patterns 2, an interlayer conductor portion 5 which is a so-called through hole is provided in the interlayer insulating film layer 1 to electrically connect the upper and lower patterns.

That is, the inter-layer conductor portion 5 is provided with a small piece-shaped conductor base 50 on the lower layer side, the insulating film layer 1 is formed around the conductor base 50 to form the hole portion 6, and then the hole portion 6 is made of a conductive material having a low viscosity. It is formed by filling the paste 51, and the conductor patterns 2 in the upper and lower layers are connected to each other by penetrating the layer.

The conductor base 50 is formed of a conductive paste having a high viscosity, and its shape and size may be set appropriately. The height is set by the thickness of the insulating film layer 1 and the viscosity of the insulating paste forming the same. In consideration of the above, the insulating paste is set so as not to soak and flow into the upper surface of the conductor base 50 when the layer is formed.

(Manufacturing Method) In the formation of the chip body 3 which is a laminated body, in the printing lamination method, an insulating paste made of a ceramic material and a conductive paste made of a conductive material are alternately screen-printed. After being printed (painted) once, the thickness becomes, for example, 10 μm, and this is applied, dried, and stacked. In the production of chip components, a work laminate having a size of a plurality of chip components is manufactured from the viewpoint of productivity, and the work laminate is sufficiently dried and then cut into individual pieces and baked.

As the ceramic material, for example, low temperature sintered dielectric ceramics (non-magnetic ceramics) to which glass is added is used. For example, a dielectric material prepared by mixing borosilicate glass with alumina in a volume ratio of 70:30 is used, and a mixture of ethyl cellulose, terpineol, a dispersant, and a plasticizer as a vehicle is mixed and kneaded, followed by printing. Can be an insulating paste for. In addition, magnetic ceramics such as ferrite may be used as the ceramic material. Further, the binder may be other than ethyl cellulose, and may be PVB, methyl cellulose or acrylic resin.

A silver paste is used as the conductive paste and is mixed with the vehicle described above. The conductive paste may be silver palladium. Then, the dispersant and the plasticizer are appropriately added in consideration of improvement in printability and handling during production.

To form the inter-layer conductor portion 5, the process procedure shown in FIG. 3 is adopted. First, a conductive paste having a high viscosity is applied using a screen plate having a predetermined pattern to form the lower conductor pattern 2.
A conductor base 50 is formed on the top (FIG. 3A).

Next, using an inversion pattern screen plate, an insulating paste is applied to fill the periphery of the conductor base 50,
The insulating film layer 1 is formed around the periphery, and the recessed hole portion 6 is obtained in the portion of the conductor base 50 (FIG. 3B).

After that, the hole 6 is filled with the conductive paste 51 having a low viscosity, and the formation of the interlayer conductor 5 penetrating the layer is completed (FIG. 3C). Then, the conductor pattern 2 of the next layer is formed on the interlayer conductor portion 5 by fine printing (FIG. 3D).

It is also easy to stack the interlayer conductors 5 in multiple layers. As shown in FIG. 4, a conductor base 50 of the next layer is formed (FIG. 4A), and the periphery of the conductor base 50 is filled. To form an insulating film layer 1 around the periphery (FIG. 4B),
The hole portion 6 is filled with the conductive paste 51 having a low viscosity, and the formation of the interlayer conductor portion 5 of the next layer is completed (FIG. 4C).

As described above, in the formation of the inter-layer conductor portion 5 to be the through hole, the small piece-shaped conductor base 50 is first provided on the lower layer side. Since the connection is secured in advance and the height of the conductor base 50 is set appropriately, the defect in which the hole 6 is filled can be prevented. At this time, since the conductive paste having a high viscosity is used for the conductor base 50, the shape can be maintained. Moreover, since the conductive paste 51 with which the hole 6 is filled has a low viscosity, it is possible to prevent the filling from becoming defective. Therefore, the through holes connecting the conductor patterns 2 in the upper and lower layers can be stably formed without any defect.

Further, the insulating paste for forming the insulating film layer 1 can be an appropriate one having a low viscosity, so that the corresponding layer can be formed flat. Then, as the conductive paste, those having characteristics corresponding to the applied portion are used respectively, that is, the conductive base 50 is formed by the conductive paste having a high viscosity, and the conductive paste 51 having a low viscosity is filled in the hole portion 6. Further, since the upper and lower conductor patterns 2 are formed by using the conductive paste for fine printing, it is possible to form the optimum conductor portions. As a result, a high quality laminated chip component can be obtained.

FIG. 5 shows a second embodiment of the present invention. In the second embodiment, attention is paid to the insulating paste forming the surrounding insulating film layer 1 with respect to the formation of the inter-layer conductor portion 5, and the inter-layer conductor portion 5 is made of an insulating paste having a high viscosity to form an annular frame portion 9. Is provided and the frame portion 9 is filled with the conductive paste.

That is, in the present embodiment, the interlayer conductor portion 5 is formed by the process procedure shown in FIG. 5. First, a screen plate having a predetermined pattern is used to apply an insulating paste having a high viscosity, and the lower conductor pattern 2 is formed. An annular frame portion 9 is formed (see FIG. 5).
(A), (d)).

Next, using an inversion pattern screen plate, an insulating paste is applied to fill the periphery of the frame portion 9, the insulating film layer 1 is formed around the periphery, and the recessed hole portion 6 is formed in the frame portion 9. Is obtained (FIG. 5 (b)). After that, the hole portion 6 is filled with a conductive paste 51 having a low viscosity, and the interlayer conductor portion 5 penetrating the layer.
Formation is completed (FIGS. 5C and 5E).

Then, a conductor pattern of the next layer is formed on the interlayer conductor portion 5 by fine printing.

As described above, since the annular frame portion 9 is provided with the insulating paste having high viscosity, the frame portion 9 serves as a barrier when the insulating film layer 1 is formed, and the insulating paste forming the insulating film layer 1 is It does not flow into the frame 9. At this time,
Since an insulating paste having a high viscosity is used for forming the frame portion 9, the shape can be maintained. Further, since the conductive paste 51 with which the frame portion 9 is filled has a low viscosity, it is possible to prevent defective filling. Therefore, similarly to the first embodiment, the through holes connecting the conductor patterns 2 in the upper and lower layers can be stably formed without any defect.

Further, the insulating paste for forming the insulating film layer 1 can be a proper one having a low viscosity, so that the corresponding layer can be formed flat. Then, as the conductive paste, the one having the characteristic corresponding to the applied portion is used, and the optimum conductor portion can be formed. As a result, a high quality laminated chip component can be obtained.

[0038]

As described above, in the laminated chip component according to the present invention, the small-piece-shaped conductor base is first provided on the lower layer side in the formation of the interlayer conductor portion to be the through hole, so that the insulating film layer is formed around the conductor base. When forming the, the connection with the lower layer side is secured in advance, and by appropriately setting the height of the conductor base, it is possible to prevent a defect in which the hole is filled. At this time, since the conductive paste having a high viscosity is used for the conductor base, the shape can be maintained, and since the conductive paste having a low viscosity is used for filling the hole portion, it is possible to prevent the filling failure.

On the other hand, since the annular frame portion is provided by the insulating paste having high viscosity, the frame portion serves as a barrier when forming the insulating film layer, and the insulating paste forming the insulating film layer does not flow into the frame portion. Absent. At this time, since the insulating paste that forms the frame has a high viscosity, the shape can be maintained, and the conductive paste that fills the frame has a low viscosity, preventing the filling from becoming defective. it can. Therefore, in any case, the through holes connecting the upper and lower conductor patterns can be stably formed without any defect.

Further, as the insulating paste for forming the insulating film layer, an appropriate one having a low viscosity can be used, so that the corresponding layer can be formed flat. And the conductive paste is
Since the ones having the characteristics corresponding to the applied portions are used, the optimum conductor portions can be formed. As a result, a high quality laminated chip component can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a conventional example of a layered chip component and showing in sequence a manufacturing process of a through hole portion for connecting conductor patterns of upper and lower layers.

FIG. 2 is a side view of the laminated inductor showing the first embodiment.

3A to 3D are cross-sectional views sequentially showing a manufacturing process of an interlayer conductor portion that connects conductor patterns of upper and lower layers.

4A to 4C are cross-sectional views sequentially showing a manufacturing process of an interlayer conductor portion.

5A to 5C are cross-sectional views (a) to (c) and a plan view (d) showing another embodiment of the interlayer conductor part and showing the manufacturing process in order.
(E).

[Explanation of symbols]

1 Insulating film layer 2 conductor pattern 3 chip body 4 external electrodes 5 Interlayer conductor 6 holes 7 Conductive paste 8 through holes 9 frame 10 Multilayer inductor 40 Edge 50 conductor base 51 Conductive paste

Continued front page    (72) Inventor Tatsuhiko Nawa             F-de, 5-36-1 Shimbashi, Minato-ku, Tokyo             K.K Co., Ltd. F-term (reference) 5E062 DD04                 5E070 AA01 AB02 CB13 CB17

Claims (5)

[Claims] 1. A chip body having an electrode body in which the conductor pattern is connected between layers is provided by laminating an insulating film such as ceramics and a conductor pattern in an appropriate order, and an outer surface of the chip body is provided. In a multilayer chip component provided with an external electrode connected to the electrode body, the insulating film layer has an interlayer conductor portion that connects the conductor patterns of upper and lower layers, and the interlayer conductor portion is small on the lower layer side. A laminated chip component having a configuration in which a strip-shaped conductor base is provided, an insulating film layer is formed around the strip-shaped conductor base to form a hole, and then the hole is filled with a conductive paste. 2. A chip body having an electrode body in which the conductor pattern is connected between layers is provided by laminating an insulating film such as ceramics and a conductor pattern in an appropriate order, and an outer surface of the chip body is provided. In a multilayer chip component provided with an external electrode connected to the electrode body, the insulating film layer has an interlayer conductor part that connects the conductor patterns of upper and lower layers, and the interlayer conductor part is formed of an insulating paste by a ring shape. 2. A layered chip component, wherein the frame portion is provided and the frame portion is filled with a conductive paste. 3. The interlayer conductor is formed by forming a small piece-shaped conductor base on a lower layer side with a conductive paste having a high viscosity, forming an insulating film layer around the conductor base to form a hole, and then forming the hole. The method for manufacturing a layered chip component according to claim 1, wherein the part is filled with a conductive paste having a low viscosity. 4. The multilayer chip component according to claim 2, wherein in forming the interlayer conductor portion, an annular frame portion is provided with an insulating paste having a high viscosity, and the conductive paste is filled in the frame portion. Manufacturing method. 5. The layered chip component according to claim 1, wherein the electrode body is a coil in which conductor patterns are spirally connected in the chip body.