JP5668370B2 - Ceramic electronic component and manufacturing method thereof - Google Patents

Description

  The present invention relates to a ceramic electronic component and a manufacturing method thereof.

  With the improvement in performance and miniaturization of electronic devices on which electronic components are mounted, not only miniaturization of electronic components but also reduction of the mounting area is required. In accordance with such a request, a technique of adopting an LGA (Land Grid Array) type terminal electrode is employed for mounting electronic components. When adopting the LGA type, it is necessary to take care not to generate a bridge between adjacent terminal electrodes. Also, care must be taken not to cause chip standing due to solder voids or deterioration of bonding reliability.

  A chip-shaped ceramic electronic component having an LGA type terminal electrode can be manufactured by the following procedure. First, a groove is formed by cutting a main surface of a mother substrate in which a plurality of ceramic layers and a plurality of internal electrodes are stacked. Then, a terminal electrode is formed on the main surface of the mother substrate so as to cross the groove. Then, a chip-like ceramic electronic component can be obtained by dividing the mother substrate along the groove by dicing or the like. As described above, by forming the terminal electrodes before the division, it is possible to omit the step of arranging the ceramic electronic components before performing the characteristic measurement, and to simplify the manufacturing process.

  The terminal electrodes provided on such ceramic electronic components are formed by printing electrode paste, etc., baking or mask sputtering, and then forming a plating layer on the electrode layer It is obtained by doing. For example, Patent Document 1 proposes forming a nickel plating film by barrel plating after forming an electrode by mask sputtering.

JP 2007-165477 A

  As described above, when the terminal electrode is formed so as to cross the groove on the mother substrate, if the mother substrate is cut by dicing along the groove, the plating may be extended to generate burrs. . If such burrs exist, problems such as bridging may occur at the time of mounting. Therefore, it is necessary to perform a process of removing the burrs separately, which causes a reduction in productivity. In addition, in the LGA type, since the voiding property of the solder is poor, there is a problem that the chip standing and the bonding reliability are lowered at the time of mounting. For this reason, it is required to establish a technique capable of reducing the mounting area of the ceramic electronic component and improving the reliability.

  This invention is made | formed in view of the said situation, and it aims at providing the manufacturing method of the ceramic electronic component which can manufacture the ceramic electronic component with a small mounting area easily. It is another object of the present invention to provide a ceramic electronic component that can reduce the mounting area and has excellent reliability.

In order to achieve the above object, according to the first aspect of the present invention, a ceramic body having a plurality of ceramic layers and internal electrodes embedded between adjacent ceramic layers, and a main body of the ceramic body. A method of manufacturing a ceramic electronic component comprising a terminal electrode electrically connected to an internal electrode on a surface,
A notch is formed in one main surface of a green laminate having a plurality of ceramic green sheets and a conductor embedded between adjacent ceramic green sheets to form a groove having an inclined surface with respect to the main surface. And a process of
Forming an electrode pattern on the green laminate so as to continuously cover a part of the main surface side of the slope of the groove and a part of the main surface;
Firing a green laminate and an electrode pattern to obtain a mother substrate having a ceramic body and an electrode layer on the ceramic body;
Providing a plating layer on the electrode layer and forming a terminal electrode having the electrode layer and the plating layer;
The mother substrate is cut along the groove so that the slope of the ceramic body and a part of the main surface of the ceramic body together with the extension of the side surface of the ceramic body perpendicular to the main surface are not exceeded. A method for producing a ceramic electronic component comprising: a step of obtaining a ceramic electronic component comprising a terminal electrode that covers a portion on a main surface side.

  In the above-described method for manufacturing a ceramic electronic component, the electrode pattern is formed so as to cover only the portion on the main surface side of the slope of the groove. For this reason, since the terminal electrode is not formed at the bottom of the groove, the mother substrate can be separated without cutting the terminal electrode when the mother substrate is cut. Therefore, the generation of burrs due to the extension of plating due to cutting is suppressed, the step of removing burrs can be omitted, and a ceramic electronic component having excellent reliability can be easily manufactured. Further, since the generation of burrs is suppressed, the generation of bridges can be suppressed during mounting. Since the solder is formed on the slope, the void of the solder becomes good, the occurrence of chip standing can be suppressed, and the joining reliability can be improved. Furthermore, since the terminal electrode provided on the ceramic body is formed so as not to exceed the extension line of the side surface perpendicular to the main surface of the ceramic body, the mounting area of the ceramic electronic component can be reduced. it can.

  In the above-described method for manufacturing a ceramic electronic component, the green laminate and the electrode pattern are simultaneously fired to form the mother substrate and the electrode layer. Therefore, a manufacturing process can be simplified compared with the case where a green laminated body and an electrode pattern are baked separately.

According to the present invention, in the second aspect, the ceramic body having a plurality of ceramic layers and internal electrodes embedded between adjacent ceramic layers, and the internal electrodes and the electrical electrodes on the main surface of the ceramic body. A terminal electrode connected to a ceramic electronic component comprising:
A notch is formed in one main surface of a green laminate having a plurality of ceramic green sheets and a conductor embedded between adjacent ceramic green sheets to form a groove having an inclined surface with respect to the main surface. And a process of
Firing the green laminate to obtain a mother substrate having a ceramic body;
Forming an electrode layer on the mother substrate so as to continuously cover a part of the main surface side of the slope of the groove and a part of the main surface;
Providing a plating layer on the electrode layer and forming a terminal electrode having the electrode layer and the plating layer;
The mother substrate is cut along the groove so that the slope of the ceramic body and a part of the main surface of the ceramic body together with the extension of the side surface of the ceramic body perpendicular to the main surface are not exceeded. A method for producing a ceramic electronic component comprising: a step of obtaining a ceramic electronic component comprising a terminal electrode that covers a portion on a main surface side.

  In this method of manufacturing a ceramic electronic component, the electrode pattern is formed so as to cover only the main surface side portion of the inclined surface of the groove. For this reason, since the terminal electrode is not formed at the bottom of the groove, the mother substrate can be separated without cutting the terminal electrode when the mother substrate is cut. Therefore, the generation of burrs due to the extension of plating due to cutting is suppressed, the step of removing burrs can be omitted, and a ceramic electronic component having excellent reliability can be easily manufactured. Further, since the generation of burrs is suppressed, the generation of bridges can be suppressed during mounting. Since the solder is formed on the slope, the void of the solder becomes good, the occurrence of chip standing can be suppressed, and the joining reliability can be improved. Furthermore, since the terminal electrode provided on the ceramic body is formed so as not to exceed the extension line of the side surface perpendicular to the main surface of the ceramic body, the mounting area of the ceramic electronic component can be reduced. it can.

  According to the present invention, in the third aspect, a ceramic body having a plurality of ceramic layers and internal electrodes embedded between adjacent ceramic layers, and the internal electrodes and the electrical electrodes on the main surface of the ceramic body. A ceramic body having a slope inclined with respect to the main surface between the main surface and a side surface perpendicular to the main surface, and the terminal electrode Provides a ceramic electronic component that covers a part of the main surface side of the slope so as not to exceed the extension line of the side surface together with a part of the main surface.

  Since this ceramic electronic component is formed so as to cover the main surface side portion of the slope of the ceramic body so that the terminal electrode does not exceed the extension line of the side surface of the ceramic body, the mounting area is reduced. The occurrence of chip standing and bridging can be suppressed. Further, as compared with the ceramic electronic component in which the terminal electrode is formed even on the side surface side of the inclined surface, the plating does not extend at the time of cutting, and the generation of burrs can be suppressed. As a result, the step of removing burrs can be omitted, and productivity is improved. Further, void void of the solder is improved as compared with a normal LGA terminal. Thereby, a highly reliable ceramic electronic component can be obtained.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the ceramic electronic component which can manufacture the ceramic electronic component with a small mounting area easily can be provided. In addition, the mounting area can be reduced, and a highly reliable ceramic electronic component can be provided.

It is a perspective view which shows typically suitable embodiment of the ceramic electronic component of this invention. It is an expanded sectional view which shows a part of cross section along the II-II line of the ceramic electronic component shown in FIG. It is a schematic diagram of the green laminated body used for one Embodiment of the manufacturing method of the ceramic electronic component of this invention. It is a side view for demonstrating one process of the manufacturing method of the ceramic electronic component of this invention. It is a perspective view which shows typically another embodiment of the ceramic electronic component of this invention.

  In the following, preferred embodiments of the present invention will be described with reference to the drawings as the case may be. In the drawings, the same or equivalent elements are denoted by the same reference numerals, and redundant description is omitted. Unless otherwise specified, the positional relationship such as up / down / left / right is based on the positional relationship of the drawings.

<First Embodiment>
FIG. 1 is a perspective view schematically showing a first embodiment of a ceramic electronic component of the present invention. The ceramic electronic component 100 includes a ceramic body 10 and strip-shaped terminal electrodes 21, 25, and 29 on the main surface 12 of the ceramic body 10. In this specification, the surface of the ceramic body 10 including the terminal electrodes and the surface facing the surface are referred to as “main surface”, and the surface perpendicular to the main surface is referred to as “side surface”. The terminal electrodes 21, 25, 29 arranged on the main surface 12 of the ceramic body 10 are parallel to and separated from each other, and are arranged in this order.

  The ceramic body 10 has a main surface 12 and a slope 16 inclined with respect to the side surface 13 between the main surface 12 and a side surface 13 perpendicular to the main surface 12. In addition, the ceramic body 10 includes a main surface 12 and an inclined surface 18 inclined with respect to the side surface 14 between the main surface 12 and a side surface 14 perpendicular to the main surface 12. That is, the ceramic body 10 has such a shape that a peripheral ridge portion on one surface of a rectangular parallelepiped is cut off.

  The band-shaped terminal electrode 29 is provided at the end of the main surface 12 on the side of the inclined surface 16, passes through the main surface 12 from the inclined surface 16, and is separated from the inclined surface 16 by the main surface 12, that is, a side surface. 13 extends toward a slope (not shown) provided on the side facing the side 13. One end of the strip-shaped terminal electrode 29 covers a portion of the inclined surface 16 on the main surface 12 side, and the other end of the terminal electrode 29 covers a portion of the other inclined surface on the main surface 12 side. Further, the side portion of the terminal electrode 29 covers a portion of the inclined surface 18 on the main surface 12 side.

  The band-shaped terminal electrode 21 is provided at the end of the main surface 12 opposite to the terminal electrode 29, and, like the terminal electrode 29, passes through the main surface 12 from the inclined surface 16, and the inclined surface 16 by the main surface 12. It extends toward another slope separated from the side face, that is, a slope (not shown) provided on the side facing the side face 13. One end of the band-shaped terminal electrode 21 covers a portion of the inclined surface 16 on the main surface 12 side, and the other end of the terminal electrode 21 covers a portion of the other inclined surface on the main surface 12 side. Further, the side portion of the terminal electrode 21 covers a portion on the main surface 12 side of an inclined surface (not shown) on the opposite side to the inclined surface 18 across the main surface 12. Although one terminal electrode 25 is provided in FIG. 1, a plurality of terminal electrodes 25 may be provided.

  The band-shaped terminal electrode 25 is disposed between the terminal electrodes 21 and 29, crosses the central portion of the main surface 12 from the inclined surface 16, and is separated from the inclined surface 16 by the main surface 12, that is, a side surface. 13 extends toward a slope (not shown) provided on the side facing the side 13. One end of the belt-like terminal electrode 25 covers a portion of the inclined surface 16 on the main surface 12 side, and the other end of the terminal electrode 25 covers a portion of the other inclined surface on the main surface 12 side.

  FIG. 2 is an enlarged cross-sectional view schematically showing a part of a cross section taken along line II-II of the ceramic electronic component 100 of FIG. The ceramic body 10 is a laminated body and includes a plurality of ceramic layers 40 and internal electrodes 42 embedded between adjacent ceramic layers 40. That is, the ceramic body 10 is configured by laminating a plurality of ceramic layers 40 and a plurality of internal electrodes 42 alternately.

  In FIG. 2, the number of laminated ceramic layers 40 and internal electrodes 42 is set to a number that can be easily seen on the drawing. However, the number of laminated ceramic layers 40 and internal electrodes 42 is appropriately changed according to desired electrical characteristics. May be. As for the number of layers, for example, the ceramic layer 40 and the internal electrode 42 may each be several tens of layers or about 100 to 500 layers. Moreover, the ceramic layer 40 may be integrated to such an extent that the boundary between each other cannot be visually recognized.

  As shown in FIG. 2, the terminal electrode 29 covers a portion of the inclined surface 18 on the main surface 12 side. On the other hand, the terminal electrode 29 is not provided on the side surface 14 side of the slope 18. The terminal electrode 29 does not exceed the extension line L1 of the side surface 14 in the cross section perpendicular to the main surface 12 and the side surface 14 of the ceramic body 10 as shown in FIG. It is provided so as not to protrude to the side opposite to the element body 10.

  The terminal electrode 29 is provided so as not to protrude from the extension of the side surface 13 to the opposite side of the ceramic body 10 in a cross section perpendicular to the main surface 12 and the side surface 13 of the ceramic body 10. Similarly to the terminal electrode 29, the other terminal electrodes 21 and 25 are provided so as not to protrude from the extension line of the side surface to the opposite side of the ceramic body 10 in the cross section perpendicular to the main surface 12 and the side surface. Yes. The terminal electrodes 21, 25 and 29 (hereinafter, collectively referred to as “terminal electrode 20” in some cases) cover only the main surface side portion of the slope and do not exceed the extension line of the side surface. The mounting area of the ceramic electronic component 100 (= equal to the projected area of the ceramic body 10 itself) can be reduced and the reliability can be improved.

  Since the terminal electrode having the above-described shape can smoothly eliminate voids in the solder when the ceramic electronic component 100 is soldered for mounting, the reliability of the ceramic electronic component 100 can be improved. Moreover, when individualizing into the ceramic electronic component 100, it is not necessary to cut the terminal electrode 20, and the occurrence of plating elongation can be suppressed. Therefore, generation | occurrence | production of a bridge | bridging is suppressed and the reliability of the ceramic electronic component 100 can be improved.

  The terminal electrode 20 is electrically connected via the internal electrode 42 and the through-hole electrode 41. The through-hole electrode 41 is formed so as to be exposed on the main surface 12, and the terminal electrode 20 is electrically connected to the internal electrode 20 by being in direct contact with the through-hole electrode 41.

  In the cross section shown in FIG. 2, the angle θ formed by the extension line L3 of the main surface 12 and the inclined surface 18 is preferably 10 to 80 °, and more preferably 30 to 60 °. When the angle θ is less than 10 ° or more than 80 °, when the ceramic electronic component 100 is connected by soldering, it tends to be difficult to smoothly eliminate voids in the solder. Further, if the angle θ is less than 10 °, the mother substrate tends to be difficult to cut. If the angle θ exceeds 80 °, the terminal is set so as not to exceed the extension line L1 of the side surface 14 of the ceramic body 10. It becomes difficult to form the electrode 29.

  In the cross section shown in FIG. 2, the ratio (L2 / L4) of the length L2 on the slope 18 of the terminal electrode 20 to the length L4 of the slope 18 of the ceramic body 10 is preferably 0.1 to 0.8. Yes, more preferably 0.2 to 0.7. If the ratio is less than 0.1, the composition of the terminal electrode 20 or the ceramic body 10 tends to impair the fixing force between the terminal electrode 20 and the ceramic body 10 or reduce the void void of the solder. It is in. If the ratio exceeds 0.8, it is necessary to reduce the thickness of the terminal electrode 20 in order to obtain a structure that does not exceed the extension line L1, and the manufacturing tends to be difficult. The terminal electrode 20 has a thickness of 10 to 50 μm, for example.

  The terminal electrode 20 preferably has a laminated structure in which an electrode layer formed by baking a conductive paste containing a metal component and a plating layer formed by plating are sequentially laminated from the ceramic body 10 side. . The electrode layer preferably contains a metal or an alloy containing at least one selected from Cu, Ag, Pd, Au, Pt, Fe, Zn, Al, Sn and Ni as a metal component. The electrode layer preferably contains a glass component in addition to the metal component. Thereby, a ceramic electronic component with higher reliability can be obtained.

  The plating layer provided on the electrode layer contains, for example, a metal or alloy containing at least one selected from Pd, Au, Ni, and Sn. As the plating layer, a layer in which a Ni layer (nickel layer) and a Sn layer (tin layer) are sequentially laminated is preferable. The plating layer can be formed using a normal plating solution.

  The internal electrode 42 preferably contains a metal or an alloy containing at least one selected from Cu, Ag, Pd, Au, Pt, Fe, Zn, Al, Sn and Ni as a metal component. The internal electrode 42 may contain a glass component.

  The ceramic electronic component 100 is, for example, a chip-shaped multilayer ceramic capacitor. In this case, the ceramic body 10 has a dielectric layer as the ceramic layer 40. The dielectric layer contains, for example, barium titanate as a main component. The ceramic electronic component 100 may be a chip-shaped varistor. In this case, the ceramic body 10 has a varistor layer as the ceramic layer 40. The varistor layer contains, for example, zinc oxide as a main component.

Next, a preferred embodiment of the method for producing a ceramic electronic component of the present invention will be described. The method for manufacturing a ceramic electronic component of the present embodiment (first manufacturing method) is as follows:
(I) a first step of forming a green laminate having a plurality of ceramic green sheets and a conductor embedded between adjacent ceramic green sheets;
(Ii) a second step of forming a groove having a slope inclined with respect to the main surface by cutting into the main surface of the green laminate;
(Iii) a third step of forming an electrode pattern on the green laminate so as to continuously cover the main surface side portion of the slope of the groove and a part of the main surface;
(Iv) a fourth step of firing the green laminate and the electrode pattern to obtain a mother substrate having the ceramic body and the electrode layer on the ceramic body;
(V) a fifth step in which a plating layer is provided on the electrode layer to form a terminal electrode having the electrode layer and the plating layer; and (vi) the mother substrate is cut along the groove to obtain a ceramic body. And a terminal electrode that covers a part of the main surface side of the inclined surface so as not to exceed an extension of the side surface perpendicular to the main surface together with a part of the main surface of the ceramic body. 6th process. Hereinafter, details of each process will be described.

  The first step is a step of forming a green laminate. When producing a varistor, for example, zinc oxide, rare earth metal oxide, calcium oxide, silicon oxide, and other components are weighed, and then each component is mixed to prepare a varistor raw material. The varistor raw material and the organic vehicle are kneaded to obtain a varistor layer forming slurry. An organic vehicle is obtained by dissolving an organic binder in an organic solvent. Examples of the organic binder include ethyl cellulose and polyvinyl butyral. Examples of the organic solvent include terpineol, butyl carbitol, acetone, and toluene.

  The above slurry is applied on a film made of, for example, polyethylene terephthalate by a known method such as a doctor blade method, and then dried to form a film having a thickness of about 30 μm. The film thus obtained is peeled from the film to obtain a ceramic green sheet. Through holes are formed at predetermined positions of the obtained ceramic green sheet by laser processing or the like.

  Next, an electrode pattern (conductor) corresponding to the internal electrode 42 embedded in the ceramic body 10 (varistor body) is formed on the ceramic green sheet. This electrode pattern is formed, for example, by applying a conductive paste in which various metal powders, glass frit, oxide powder, an organic binder and an organic solvent are mixed by a screen printing method and drying. Examples of the organic binder include ethyl cellulose and polyvinyl butyral. Examples of the organic solvent include terpineol, butyl carbitol, acetone, and toluene.

  Next, ceramic green sheets on which various desired electrode patterns are formed are stacked in a predetermined order. Further, a ceramic green sheet on which no electrode pattern is formed may be appropriately inserted and stacked. In this way, a green laminate having a plurality of ceramic green sheets and a conductor embedded between adjacent ceramic green sheets can be obtained.

  The second step is a step of forming a groove having an inclined surface with respect to the main surface by cutting into the main surface of the green laminate using a cutting blade or the like. Here, the “main surface” is a surface of the green laminate that is orthogonal to the lamination direction of the ceramic green sheets.

  FIG. 3 is a schematic diagram of a green laminated body in which grooves are formed on a pair of opposed main surfaces. In FIG. 3, in order to explain the internal structure of the green laminated body 50, a cross-sectional structure of a side surface when the green laminated body 50 is cut in the thickness direction is shown. The green laminate 50 is a laminate in which ceramic green sheets 55 serving as ceramic layers and conductors 54 serving as internal electrodes are alternately stacked. On the main surface 50a of the green laminate 50, grooves 52 having a V-shaped longitudinal cross-sectional shape are formed in a lattice shape. In FIG. 3, the groove 52 is formed only on one main surface 50 a side of the green laminate 50, but may be formed on both main surfaces 50 a and 50 b of the green laminate 50. Thereby, the warp of the mother substrate can be suppressed.

  The depth of the groove 52 is preferably less than or equal to half the thickness of the green laminate 50 from the viewpoint of maintaining the high rigidity of the mother substrate obtained. The vertical cross-sectional shape of the groove 52 is not limited to the V shape, and may be a trapezoidal shape, for example.

  The third step is a step of forming an electrode pattern on the green laminate 50 so as to continuously cover the main surface 50a side portion of the slope of the groove 52 and the main surface 50a portion.

  The electrode pattern can be formed, for example, by applying a conductive paste by screen printing and then drying. The conductive paste can be prepared by mixing metal powder, glass frit, oxide powder, organic binder and organic solvent. The organic solvent and the organic binder can be the same as those used for preparing the conductive paste for forming the internal electrode.

  The conductive paste is applied in a strip shape in parallel to each other and on the main surface 50a of the green laminate 50 with a predetermined interval. At this time, the conductive paste is not applied to the bottom of the groove 52 but is applied only to the upper portion of the slope 16 of the groove 52. An electrode pattern can be formed by drying the electrode paste thus applied.

  FIG. 4 is an enlarged side view showing a part of the green laminated body 50 on which the electrode pattern is formed. The electrode pattern 56 is formed so as to cover a portion on the groove 52 side of the main surface 50 a of the green laminated body 50 and a portion on the upper edge side of the groove 52 of the inclined surface 16. The electrode pattern 56 is formed so as not to exceed the extension line L1 perpendicular to the main surface 50a passing through the bottom 17 of the groove 52. By forming the electrode pattern in such a shape, it is possible to suppress the occurrence of plating elongation when the mother substrate is cut along the groove 52 in a later step. The electrode pattern 58 is formed so as to cover a part of the main surface 50a and a portion on the upper edge side of the groove of the slope (not shown).

  The fourth step is a step of firing the green laminate 50 and the electrode pattern to obtain a mother substrate having a ceramic element body and an electrode layer on the ceramic element body. The firing conditions are, for example, a firing temperature of 850 to 1300 ° C. and a firing time of 0.5 to 24 hours. When the electrode pattern contains a base metal such as copper as a main component, firing is preferably performed in a nitrogen atmosphere. On the other hand, when the electrode pattern contains a noble metal such as palladium or silver as a main component, it is preferably fired in the air. In addition, it is preferable to perform a binder removal which heats at 180-400 degreeC for 0.5 to 24 hours before baking.

  The mother substrate has the same shape as the green laminate 50 and the electrode patterns 56 and 58 shown in FIG. Since the mother substrate has grooves on both main surfaces, the occurrence of warpage is sufficiently suppressed. The mother substrate integrally includes a plurality of ceramic element bodies 10. An electrode layer is formed on the main surface of each ceramic body 10.

  The fifth step is a step of forming a terminal electrode having an electrode layer and a plating layer by providing a plating layer on the electrode layer formed on the ceramic body 10. The plating layer can be formed by an electrolytic plating method, an electroless plating method, or the like.

  In the sixth step, the mother substrate is cut along the groove 52, and the ceramic electronic component 100 including the ceramic element body 10 and the band-shaped terminal electrodes 20 on the main surface 12 of the ceramic element body 10 is obtained. It is a process to obtain. Specifically, the mother substrate is cut at a groove 52 formed on the main surface of the mother substrate using a cutting blade (blade). Thereby, a plurality of individual ceramic electronic components 100 can be obtained. At the time of cutting, the cutting blade is inserted into the groove 52 along the extension line L1 shown in FIG. 4, and the mother substrate is cut. In the mother substrate of the present embodiment, since the terminal electrode 20 is provided so as not to exceed the extension line L1, the mother substrate can be cut without cutting the terminal electrode 20 with a cutting blade. Therefore, it is possible to avoid the occurrence of plating elongation. As a result, it is not necessary to perform a step of eliminating burrs that occur as the plating extends, so that the manufacturing process can be simplified. Also, the reliability of the ceramic electronic component 100 can be improved.

Next, another embodiment of the method for producing a ceramic electronic component of the present invention will be described. The method for manufacturing a ceramic electronic component of the present embodiment (second manufacturing method)
(I) a first step of forming a green laminate having a plurality of ceramic green sheets and a conductor embedded between adjacent ceramic green sheets;
(Ii) a second step of forming a groove having a slope inclined with respect to the main surface by cutting into the main surface of the green laminate;
(Iii) a third step of firing the green laminate to obtain a mother substrate having a ceramic body;
(Iv) a fourth step of forming an electrode layer on the mother substrate so as to continuously cover the main surface side portion of the slope of the groove and a part of the main surface;
(V) a fifth step in which a plating layer is provided on the electrode layer to form a terminal electrode having the electrode layer and the plating layer; and (vi) the mother substrate is cut along the groove to obtain a ceramic body. And a terminal electrode that covers a part of the main surface side of the slope so as not to exceed an extension line of a side surface perpendicular to the main surface together with a part of the main surface of the ceramic body. 6th process.

  Of the above-described second manufacturing method, the first step, the second step, the fifth step, and the sixth step are the same as the above-described first manufacturing method. Therefore, here, the third step and the fourth step of the second manufacturing method will be described.

  The third step is a step of firing the green laminate 50 obtained in the second step to obtain a mother substrate having a plurality of ceramic bodies. The firing conditions of the green laminate 50 shown in FIG. 3 are, for example, a firing temperature of 850 to 1300 ° C. and a firing time of 0.5 to 24 hours. Firing is preferably performed in the air when the conductor 54 embedded in the green laminate 50 contains a noble metal such as palladium or silver as a main component. On the other hand, when the conductor 54 contains a base metal such as nickel or copper as a main component, it is preferably performed in an inert atmosphere. Before firing, it is preferable to perform binder removal by heating the green laminate 50 at 180 to 400 ° C. for 0.5 to 24 hours.

  The fourth step is a step of forming an electrode layer on the mother substrate so as to continuously cover the main surface side portion of the slope of the groove provided on the mother substrate and a part of the main surface. The electrode layer can be formed by the following procedure. First, a conductive paste is prepared. The conductive paste can be prepared by mixing metal powder, glass frit, oxide powder, organic binder and organic solvent. The organic solvent and the organic binder can be the same as those used for preparing the conductive paste for forming the internal electrode.

  The conductive paste is applied so as to be applied to the slope of the groove 52 formed on the main surface of the mother substrate. At this time, the conductive paste is not applied to the bottom portion 17 of the groove 52, but is applied only to the upper portion of the slope 16 of the groove 52. The conductive paste can be applied by screen printing. An electrode pattern can be formed by drying the electrode paste thus applied.

  FIG. 4 is an enlarged side view showing a part of the mother substrate 60 on which the electrode pattern is formed. The electrode pattern 56 is formed so as to cover the groove 52 side portion of the main surface 60 a of the mother substrate 60 and the upper edge side portion of the groove 52 of the inclined surface 16. The electrode pattern 56 is formed so as not to pass through the extension line L1 perpendicular to the main surface 60a through the bottom 17 of the groove 52. By forming the electrode pattern in such a shape, it is possible to suppress the occurrence of plating extension when the mother substrate 60 is cut along the groove 52 in a later step. The electrode pattern 58 is formed so as to cover a part of the main surface 60a and a part on the upper edge side of a groove of a slope (not shown).

  The electrode patterns 56 and 58 thus formed are baked at 500 to 1300 ° C. to form strip-shaped electrode layers arranged in parallel on the main surface 60 a of the mother substrate 60.

  The method for forming the electrode layer is not limited to the above-described method, and for example, the electrode layer may be formed by a mask sputtering method. In this case, the electrode layer can be formed using a mask having a slit having a predetermined shape. The mask used here has a slit shaped so that no electrode layer is formed on the bottom 17 of the groove 52.

  In the fifth step, a plating layer is provided on the electrode layer to form a terminal electrode having the electrode layer and the plating layer. Further, in the sixth step, the mother substrate 60 is cut along the groove 52 so as not to exceed the extension lines of the ceramic element body 10 and the side surfaces 13 and 14 perpendicular to the main surface 12 of the ceramic element body 10. A ceramic electronic component comprising a terminal electrode 20 covering a main surface side portion of the slope is obtained. The fifth step and the sixth step are the same as in the above embodiment.

  In the manufacturing method of this embodiment, after the green laminated body 50 is fired to obtain the mother substrate 60, the electrode layer is formed. For this reason, the freedom degree of selection of the material of a terminal electrode improves. It is also possible to use a conductive material, a resin electrode, or the like that can be fired at a low temperature.

  The first and second manufacturing methods described above are not limited to the varistor manufacturing method, and can also be applied to a multilayer ceramic capacitor manufacturing method. When producing a multilayer ceramic capacitor, a slurry for forming a dielectric layer is used instead of the slurry for forming a varistor layer. The slurry for forming the dielectric layer can be prepared by adding and mixing an organic solvent and a plasticizer to a dielectric material mainly composed of barium titanate.

Second Embodiment
FIG. 5 is a perspective view schematically showing a second embodiment of the ceramic electronic component of the present invention. The ceramic electronic component 110 includes a ceramic body 10 and six terminal electrodes 20 on the main surface 12 of the ceramic body 10. The ceramic electronic component 110 of the present embodiment includes the six terminal electrodes 22, 23, 24, 26, 27, and 28 on the main surface 12 of the ceramic body 10, and the ceramic electronic component of the first embodiment. It is different from 100.

  Of the six terminal electrodes, the terminal electrodes 22, 24, 26, 28 are provided at the four corners of the main surface 12. The terminal electrodes 22 and 26 are disposed so as to face one end of the main surface 12 (the side facing the side 14) in a direction perpendicular to the side 13. The terminal electrodes 24 and 28 are disposed opposite to the other end portion (side surface 14 side) of the main surface 12 in a direction perpendicular to the side surface 13. Further, the terminal electrodes 23 and 27 are disposed opposite to each other in the direction perpendicular to the side surface 13 at the center in the direction perpendicular to the side surface 14 of the main surface 12.

  The terminal electrode 24 includes a part of the main surface 12, a portion on the main surface 12 side of the inclined surface 16 between the main surface 12 and the side surface 13, and a main surface of the inclined surface 18 between the main surface 12 and the side surface 14. It is provided so as to cover a portion on the surface 12 side. Similarly to the terminal electrode 24, the terminal electrodes 22, 26, and 28 provided at the corners of the main surface 12 are provided so as to cover portions of the two adjacent inclined surfaces on the main surface 12 side.

  The terminal electrode 23 is provided so as to cover a part of the main surface 12 and a portion on the main surface 12 side of the inclined surface 16 between the main surface 12 and the side surface 13. Similarly to the terminal electrode 23, the terminal electrode 27 is provided so as to cover the main surface 12 and a portion on the main surface 12 side of a slope (not shown) on the opposite side of the slope 16 across the main surface 12. Yes.

  The ceramic body 10 in the ceramic electronic component 110 has the same configuration as the ceramic electronic component 100 in the first embodiment. The ceramic electronic component 110 can be manufactured in the same manner as the ceramic electronic component 100 in the first embodiment.

  In the ceramic electronic components 100 and 110 according to the first and second embodiments, the slope 18 (on the inclined surface 18) of the ceramic body 10 is set so that the terminal electrode 20 does not exceed the extension line L1 of the side surface 14 (side surface 13) of the ceramic body 10. Since it is formed so as to cover the main surface 12 side of the slope 16), the mounting area can be reduced. Moreover, the plating elongation at the time of cutting does not occur, and the generation of burrs can be suppressed. As a result, the step of removing burrs can be omitted, and productivity is improved. Further, void void of the solder is improved as compared with a normal LGA terminal. Therefore, the ceramic electronic components 100 and 110 have excellent reliability.

  The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment. The ceramic electronic component of the present invention may have a resistor and a glass layer on the surface opposite to the main surface 12 of the ceramic body 10. In the above embodiment, the ceramic electronic component 100 is described as a varistor or a multilayer ceramic capacitor, but the present invention is not limited to these. The ceramic electronic component of the present invention may be an inductor or LCR (a composite electronic component of an inductor, a capacitor, and a resistor). The ceramic body 10 may have a magnetic layer instead of a varistor layer or a dielectric layer as a ceramic layer.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the ceramic electronic component which can manufacture the ceramic electronic component with a small mounting area easily can be provided. In addition, the mounting area can be reduced, and a highly reliable ceramic electronic component can be provided.

  DESCRIPTION OF SYMBOLS 10 ... Ceramic body, 12 ... Surface (main surface), 13, 14 ... Side, 16, 18 ... Slope, 17 ... Bottom, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29 ... Terminal electrode, 40 ceramic layer, 41 ... through-hole electrode, 42 ... internal electrode, 50 ... green laminate, 50a, 50b ... main surface, 52 ... groove, 54 ... conductor, 55 ... ceramic green sheet, 56,58 ... electrode Pattern, 60 ... Mother substrate, 60a, 60b ... Main surface, 100, 110 ... Ceramic electronic component.

Claims (1)

A ceramic body having a plurality of ceramic layers and an internal electrode embedded between adjacent ceramic layers; and a terminal electrode electrically connected to the internal electrode on a main surface of the ceramic body. A ceramic electronic component comprising:
  The ceramic body has a slope inclined with respect to the main surface between the main surface and a side surface perpendicular to the main surface;
  The said terminal electrode is a ceramic electronic component which covers the part by the side of the said main surface of the said slope so that it may not exceed the extended line of the said side surface with a part of said main surface.

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