JP2000114100A - Multiple electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multiple electronic part wherein a strength of a circuit board and solder bonding is high when solder-mounting is done on the circuit board. SOLUTION: Related to a multiple laminating ceramic capacitor l wherein, with a main body 9 in which at least three function elements such as laminating ceramic capacitors 5a-5d are provided side by side for integration provided, input/output external electrodes 4a-4d corresponding to the laminating ceramic capacitors 5a-5d are formed on both side surfaces of the main body 9, the width of the external electrodes 4a and 4d of the laminating ceramic capacitors 5a and 5d is wider than that of the external electrodes 4b and 4c of the laminating ceramic capacitors 5b and 5c which exist inside, with the external electrodes 4a and 4b so formed as to infringe the end surface part of the main body 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple-type electronic component having a combination of similar functional elements and different functional elements used in electronic equipment.

[0002]

2. Description of the Related Art With the high-density mounting of functional elements on electronic equipment, a product of multiple electronic parts in which a plurality of passive electronic parts having a large number of members are frequently used in the same electronic equipment and formed in one body. Development is proceeding, and this type of multiple electronic component has a configuration in which a plurality of pairs of input / output external electrodes corresponding to respective functional elements are formed on the side surface of the main body.

A conventional multiple-type electronic component will be described using a quadruple-type multilayer ceramic capacitor as shown in FIG.
In the figure, four multilayer ceramic capacitors 15 a to 15 d are provided inside a quadruple-type multilayer ceramic capacitor 11.
Are integrated in parallel.

First, a known multilayer ceramic capacitor manufacturing method is applied to form a green laminate (not shown) in which a plurality of green sheets serving as dielectric layers 12 and internal electrodes 13 are alternately laminated in the same body. After cutting so that the four multilayer ceramic capacitors 15a to 15d are formed in a parallel direction, firing is performed at a predetermined temperature.

Next, external electrodes 14a to 14d are respectively formed on the internal electrodes 13 of the multilayer ceramic capacitors 15a to 15d exposed on the side surfaces of the sintered body, and the quadruple-type multilayer ceramic capacitor 11 shown in FIG. Finalize.

[0006]

When the conventional quadruple-type multilayer ceramic capacitor 11 is solder-mounted on a circuit board (not shown), the quadruple-type multilayer ceramic capacitor 11
However, there is a problem that the solder bonding strength between the external electrodes 14a to 14d formed on the side surfaces and the circuit board is low. That is,
When the width of four pairs of external electrodes 14a to 14d formed on the side surface of the quadruple-type multilayer ceramic capacitor 11 is increased, the external electrodes 14a and 14b, 14b and 14c, 14c and 14d of the adjacent multilayer ceramic capacitors 15a to 15d are increased.
Between the external electrodes 14
The width of a to 14d is small. As a result, the soldering area between the external electrodes 14a to 14d and the circuit board is reduced, and the solder bonding strength is reduced.

According to the present invention, when a multiple electronic component such as a quadruple multilayer ceramic capacitor is mounted on a circuit board by soldering,
It is an object of the present invention to provide a multiple-part electronic component having high soldering strength between an external electrode and a circuit board and having excellent reliability.

[0008]

In order to achieve this object, the present invention provides a main body in which at least three or more functional elements are integrated in parallel, and a plurality of pairs corresponding to each functional element on both sides of the main body. And the width of the external electrodes of both outermost functional elements of the main body is made wider than the width of the external electrodes of the inner functional elements.

By increasing the width of the outer electrodes of the outermost functional elements as described above, even when the width of the outer electrodes of the inner functional element is reduced, the main body is not soldered when mounted on a circuit board. The wide external electrodes formed at the four corners are firmly soldered to the circuit board, so that the solder bonding strength after mounting can be ensured. Also, the external electrode on the inner side is
It suffices that at least the strength of the functional element corresponding to the electrical connection with the land of the circuit board be maintained.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention described in claim 1 of the present invention is directed to a main body in which at least three or more functional elements are integrated in parallel, and a housing corresponding to each of the functional elements on both sides of the main body. In the multiple electronic component having an output external electrode formed therein, the multiple external electronic component in which the width of the external electrodes of both outermost functional elements in the main body is wider than the width of the external electrode of the inner functional element. is there. By increasing the width of the outer electrodes of the outermost functional elements, even if the widths of the outer electrodes of the functional elements are reduced inward, the wider outer electrodes formed at the four corners of the The external electrodes are firmly soldered to the circuit board, so that the solder bonding strength after mounting can be ensured. Further, it is sufficient that the inner external electrode has at least enough strength to keep the corresponding functional element electrically connected to the land of the circuit board.

According to a second aspect of the present invention, there is provided the multiple electronic component according to the first aspect, wherein the outer electrodes of the outermost functional elements are formed so as to extend around the end face of the main body. is there. By forming the external electrodes of both outermost functional elements around the end face of the main body, wider external electrodes are formed at the four corners of the main body without reducing the width of the inner external electrodes. This makes it possible to further increase the solder bonding strength after mounting on the circuit board.

According to a third aspect of the present invention, the external electrodes of each functional element are formed so as to extend around the upper and lower surfaces of the main body, and both ends of the external electrodes are formed in an arc shape. Or a multiple electronic component according to claim 2. By forming the external electrodes on the side of the main body so as to extend around the upper and lower surfaces, the wide external electrodes at the four corners of the main body are more securely fixed to the circuit board by soldering, and the inner external electrodes are electrically connected to the lands on the circuit board. Connection is more secure. In addition, by wrapping the external electrodes around the upper and lower surfaces, it is possible to eliminate the directionality when mounting multiple electronic components, and to avoid the concentration of electric charges by making the external electrode terminal end arc-shaped. It is.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings, taking a quadruple-type multilayer ceramic capacitor as the conventional example as an example.

FIG. 1 is a partially cutaway perspective view of a quadruple-type multilayer ceramic capacitor of the present invention. In the drawing, reference numeral 1 denotes a quadruple-type multilayer ceramic capacitor having a structure in which four multilayer ceramic capacitors 5a to 5d are integrated in a parallel direction.

First, by applying a conventional manufacturing method of a multilayer ceramic capacitor, a predetermined number of green sheets serving as dielectric layers 2 mainly containing barium titanate and internal electrodes 3 mainly containing palladium are alternately stacked in a predetermined number. The green laminate (not shown) was cut so that four multilayer ceramic capacitors 5a to 5d were formed in parallel in the same body, and then fired at a predetermined temperature. The main body 9 made of the obtained sintered body has a configuration in which the internal electrodes 3 of each of the multilayer ceramic capacitors 5a to 5d are alternately exposed on both side surfaces of the main body 9 alternately with the dielectric layer 2 interposed therebetween. I have.

Next, after the main body 9 is barrel-polished to completely expose the respective internal electrodes 3 on the side surfaces thereof, the multilayer ceramic capacitors 5a to 5
d of four pairs of external electrodes 4a to 4
4d paste was applied and baked at a temperature of 800 ° C. to form external electrodes 4a to 4d. The external electrodes 4a, 4d of the multilayer ceramic capacitors 5a, 5d on both outer sides of the main body 9 are wide so as to go around the end face of the main body 9 as shown in FIG. The external electrodes 4b and 4c of the multilayer ceramic capacitors 5b and 5c on the inner side are slightly wider than the width of the exposed internal electrodes 3 and are adjacent to the external electrodes 4a and 4c.
The gaps b, 4b and 4c are sufficiently wide so as not to cause an electrical short circuit between 4c and 4d. Further, the external electrodes 4a to 4d were formed such that the terminal ends thereof were arcuate.

As shown in FIG. 2, an external electrode material such as Ag or Cu paste is placed on the flat plate 6, and the inner external electrode portion has a width of 0.2 mm and a height of 0.2 mm. , The outer external electrode part is 0.6 mm wide and 0.2 m high
An m-shaped groove is scraped off by a squeegee 7 provided at equal intervals to form an electrode paste layer 8 having a predetermined thickness. On the electrode paste layer 8 thus formed, a main body 9 made of a sintered body is formed.
And the paste is transferred to form the external electrodes 4.
a to 4d are formed.

The transfer position corresponds to the position where the internal electrode 3 of the main body 9 is exposed, and the electrode paste layer having a width of 0.6 mm is applied to the outer multilayer ceramic capacitors 5a and 5d. Are in contact with the multilayer ceramic capacitors 5b and 5c on the inner side. Thereafter, the external electrodes are baked at a temperature of about 800 ° C., and the surfaces of the external electrodes 4a to 4d are Ni, SnP
By forming the plating layer b, a quadruple-type multilayer ceramic capacitor 1 as shown in FIG. 1 was completed.

After the obtained quadruple-type multilayer ceramic capacitor 1 and the conventional quadruple-type multilayer ceramic capacitor 11 are solder-mounted on a circuit board, the external electrodes 4a to 4d and 14a to 14d are connected to the circuit board. The adhesive strength was compared and the results are shown in (Table 1).

[0020]

[Table 1]

As shown in Table 1, it is clear that the tensile strength of the external electrodes 4a to 4d of the quadruple-type multilayer ceramic capacitor 1 of the present invention is higher than that of the conventional product. This is because the total area of the external electrodes 4a to 4d is large,
In particular, since the areas of the external electrodes 4a and 4d are large, the bonding strength is also increased in proportion thereto. Therefore, the area of the portion soldered at the time of solder mounting on the circuit board also becomes large, and when a mechanical stress is applied to the quadruple-type multilayer ceramic capacitor 1, the stress is dispersed, so that high reliability is obtained. It will be. The external electrode 4a
4d around the upper and lower surfaces of the main body 9 to facilitate solder mounting on the circuit board and to form the external electrodes 4a to 4d.
Since the end portion of 4d is formed in an arc shape, there is also an effect that concentration of charges can be avoided.

Although the present embodiment has been described using a multilayer ceramic capacitor, a similar effect can be obtained with other functional elements or a composite multiple electronic component with other functional elements.

[0023]

As described above, according to the present invention, the area of the external electrodes of the functional elements located on both outer sides in the multiple-type electronic component is made larger than the width of the external electrodes of the functional elements located on the inner side. In addition, the external electrodes are wrapped around the top and bottom surfaces of the sintered body, and the total area of the external electrodes is increased, so that multiple electronic components can be soldered to the circuit board. The workability during mounting is improved, and the mechanical bonding strength after mounting and the effect of dispersing the mechanical stress can be improved to achieve high reliability.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a multiple electronic component according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram of the external electrode forming method.

FIG. 3 is a partially cutaway perspective view of a conventional multiple-type electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multiple electronic component 2 Dielectric layer 3 Internal electrode 4a-4d External electrode 5a-5d Multilayer ceramic capacitor 6 Flat plate 7 Squeegee 8 Electrode paste layer 9 Main body

Claims (3)

[Claims] 1. A multiple electronic component comprising at least three or more functional elements integrated in parallel and an input / output external electrode corresponding to each of the functional elements on both sides of the main body. A multiple electronic component in which the outer electrodes of the outermost functional elements in the body are wider than the outer electrodes of the inner functional elements. 2. The multiple electronic component according to claim 1, wherein the external electrodes of the outermost functional elements are formed so as to extend around the end face of the main body. 3. The multiple electron device according to claim 1, wherein the external electrodes of each of the functional elements are formed so as to extend around the upper and lower surfaces of the main body, and both terminal portions of the external electrodes are formed in an arc shape. parts.