JPH0945830A - Chip electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form the external electrodes of a chip-electronic component only in regions of the minimum of a necessity on the outer surface of a component main body and to lessen the coating amount of solder at the time when the electrodes are mounted in the electronic component as little as possible. SOLUTION: Notches 24 and 25 are respectively provided in each one part of the end surfaces 15 and 16 of a rectangular parallelepiped-shaped component main body 11 and external electrodes 13 and 14 are respectively formed of these notches 24 and 25 within a specified region.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component, and more particularly to the structure of external electrodes of the chip-shaped electronic component.

[0002]

2. Description of the Related Art Electronic components such as multilayer capacitors, filters and resistors are often constructed as chip-shaped electronic components. FIG. 8 shows the appearance of a conventional typical chip-shaped electronic component 1. The chip-shaped electronic component 1 includes a component body 2 in which an internal conductor (not shown) is formed. The component body 2 is usually in the shape of a rectangular parallelepiped, and has external electrodes 3 electrically connected to the internal conductors at both ends thereof.
And 4 are formed. The external electrodes 3 and 4 are formed, for example, by applying a metal paste containing Ag, Ag / Pd, or the like on the end faces of the component body 2 that face each other, and firing the metal paste. Therefore, the external electrodes 3 and 4 thus formed are in a state of extending not only on the end faces of the component body 2 but also to a part of the faces adjacent to these end faces.

[0003]

In order to achieve the desired electrical connection with the inner conductor, it is sufficient for the above-mentioned external electrodes 3 and 4 to be formed only on the opposite end faces of the component body 2. Is. Further, as the regions of the external electrodes 3 and 4 to be soldered when the chip-shaped electronic component 1 is mounted on the circuit board, the regions on the respective end faces of the component body 2 are sufficient. Nevertheless, as described above, if the external electrodes 3 and 4 are formed not only on the end faces of the component body 2 but also on a part of the faces adjacent to these end faces, the following problems occur. Come across.

Ag and Ag contained in the external electrodes 3 and 4
A metal such as / Pd is expensive, and the amount of such expensive metal used is large, so that the cost of the chip-shaped electronic component 1 is high. Further, when the chip-shaped electronic component 1 is mounted on the circuit board, the solder adheres so as to cover almost all the respective regions of the external electrodes 3 and 4, so that the amount of solder used increases and the cost increases.

Therefore, the land area of the wiring on the circuit board becomes large, which hinders the improvement of the mounting density. Also,
When the circuit board is bent, the stress concentrates on the side of the chip-shaped electronic component 1 rather than on the soldered portion with the circuit substrate, which may lead to fatal defects such as cracks in the component body 2. . This tendency becomes more remarkable especially when the chip-shaped electronic component 1 is a ceramic electronic component.

Therefore, an object of the present invention is to provide a structure of a chip-shaped electronic component capable of solving the above-mentioned problems.

[0007]

According to the present invention, there is provided a component body having an internal conductor formed therein, and an external electrode electrically connected to the internal conductor and formed on an outer surface of the component body. In order to solve the above-mentioned technical problem, the notch is provided in a part of the outer surface of the component body, and the external electrode is defined by the notch. It is characterized in that it is formed in the region.

In a typical embodiment of the present invention, the component body has a rectangular parallelepiped shape, and the notch is provided in a part of one surface of the rectangular parallelepiped component body. In addition, the component body may have a rectangular parallelepiped shape, and a plurality of the notches may be provided on a part of one surface of the rectangular parallelepiped component body.

[0009]

According to the present invention, the region where the external electrode is formed is defined by the notch provided on the outer surface of the component body. Therefore, the formation region of the external electrode can be easily limited, the amount of material used for the external electrode can be reduced, and the cost of the chip-shaped electronic component can be reduced.

As a result, when the chip-shaped electronic component is mounted on the circuit board, the amount of solder attached to the external electrodes can be reduced, which is effective for cost reduction and material saving. Further, the land area of the wiring on the circuit board can be reduced, which can contribute to the improvement of the mounting density. Further, when the circuit board is bent, the stress can be prevented from concentrating on the chip-shaped electronic component side, and a fatal defect such as a crack occurring in the component body can be prevented.

According to the present invention, it is easy to limit the region where the external electrode is formed by the notches. Therefore, as described above, a plurality of notches are provided on a part of one surface of the rectangular parallelepiped component body. As a result, the plurality of external electrodes can be formed on one surface of the component body without interfering with each other. By forming the external electrodes in this way, the distance between the external electrodes can be shortened even if the component body is made relatively large. Therefore, it is advantageous to cause a fatal defect such as a crack on the component body side due to the stress generated by the difference in the thermal expansion amount due to the temperature difference when the heat shock or the like is applied to the circuit board. It can be prevented. Further, in the state of being mounted on the circuit board, the breaking limit value in the board bending resistance test can be further increased.

[0012]

1 to 4 are for explaining a first embodiment of the present invention. In FIG.
The external appearance of the chip-shaped electronic component 11 according to this embodiment is shown in a perspective view. More specifically, this chip-shaped electronic component 11 is a monolithic ceramic capacitor.

As shown in FIG. 1, the chip-shaped electronic component 11 is provided with a rectangular parallelepiped component body 12, and two external electrodes 13 and 14 are formed on the outer surface of the component body 12. The regions where the external electrodes 13 and 14 are formed respectively occupy only a part of the opposite end faces 15 and 16 of the component body 12. The component body 12 is manufactured through the steps shown in FIGS. As shown in FIG. 2, the first and second inner electrodes 17 and 18 serving as inner conductors are respectively formed by screen-printing a paste such as Pd, Ag / Pd, Cu, or Ni. A plurality of first ceramic green sheets 19 and a plurality of second ceramic green sheets 20 containing ceramic are prepared. The first internal electrode 17 on the first ceramic green sheet 19 forms a recess 21 on the right edge in FIG. 2, while the second internal electrode 18 on the second ceramic green sheet 20 is A recess 22 is formed at the left edge of FIG.

As shown in FIG. 2, the first and second ceramic green sheets 19 and 20 are alternately stacked and pressed to form a rectangular parallelepiped structure 23 as shown in FIG. . Usually, in order to efficiently obtain a plurality of rectangular parallelepiped structures 23, mother ceramic green sheets to be the ceramic green sheets 19 and 20 shown later when cut are prepared, and these mother ceramic green sheets are stacked. Then, after pressing, cutting is performed to obtain individual rectangular parallelepiped structures 23.

Next, the rectangular parallelepiped structure 23 is fired. The fired rectangular parallelepiped structure 23 is then polished to make it round at its ridge, and further, as shown in FIG. 4, a cutout 24 is formed so as to penetrate through each part of the end faces 15 and 16 in the stacking direction. And 25 are respectively formed to form the component body 12. Notches 24 and 25 are
For example, by arranging a plurality of rectangular parallelepiped structures 23 in the stacking direction and forming a groove using a dicer in this state, the structure can be formed easily and efficiently.

In FIG. 2, the positions where the cutouts 24 and 25 are formed are indicated by a chain line. As can be seen from FIG. 2, in the component body 12 obtained as described above, the first internal electrode 17 is exposed on the wall surface defining the notch 24, but the second internal electrode 18 is a concave portion. 22
Not exposed due to the presence of. On the other hand, the second internal electrode 18 is exposed on the wall surface defining the notch 25, but the first internal electrode 17 is not exposed due to the presence of the recess 21. Further, none of the internal electrodes is exposed on the outer surface of the component body 12 other than the wall surfaces that define the notches 24 and 25, respectively. Therefore, if the notch 24 or 25
If the internal electrode 17 or 18 is exposed in a region other than the above, it means that the position of the internal electrode 17 or 18 is undesirably deviated, so that the positional deviation of the internal electrode 17 or 18 can be easily detected. Can be done.

External electrodes 13 and 14 are formed in the regions defined by the notches 24 and 25 of the component body 12, respectively. Thereby, the chip-shaped electronic component 11 shown in FIG. 1 is obtained. The external electrode 13 has a notch 2
4 is electrically connected to the inner electrode 17 on the wall surface defining 4, while the outer electrode 14 is electrically connected to the inner electrode 18 on the wall surface defining the notch 25. External electrode 13
The formation of and 14 can be performed, for example, by applying a conductive paste into the cutouts 24 and 25 by printing or transfer, and baking it. Further, the external electrodes 13 and 14 may be formed by plating. It should be noted that, for manufacturing reasons and the like, it is pointed out that the non-substantial portions of the external electrodes 13 and / or 14 are within the scope of the present invention even if they extend beyond the notches 24 and / or 25. Keep it.

In the above embodiment, the rectangular parallelepiped structure 23
Although the notches 24 and 25 were formed after firing, the notches 24 and 25 may be formed before firing the rectangular parallelepiped structure 23, and then firing may be performed. Before firing the rectangular parallelepiped structure 23, the notches 24 and 25 are formed.
In the case of forming, the conductive paste for the external electrodes 13 and 14 may be applied before the firing of the rectangular parallelepiped structure 23, and the baking of the conductive paste may be simultaneously performed in the firing process of the rectangular parallelepiped structure 23. . Further, as described above, the cutouts 24 and 25 are formed as through holes in the state of the mother ceramic green sheets or in the state where they are stacked, and the cutouts 24 are cut when cut.
And 25 may be set. In this case, the through holes may be filled with a conductive paste and used as the conductive paste for the external electrodes 13 and 14.

5 to 7 are for explaining the second embodiment of the present invention. FIG. 5 is a perspective view showing the external appearance of the chip-shaped electronic component 31 according to this embodiment. This chip-shaped electronic component 31 is also a monolithic ceramic capacitor, like the chip-shaped electronic component 11 described above. As shown in FIG. 5, the chip-shaped electronic component 31 includes a rectangular parallelepiped component body 32, and one surface 33 of the component body 32.
A plurality of, for example, two external electrodes 34 and 35 are formed side by side on a part of the. The component body 32 has a shape as shown in FIG.

In order to obtain the component main body 32, as shown in FIG. 7, a plurality of first ceramic green sheets 38 having a plurality of first and second internal electrodes 36 and 37 as internal conductors and a plurality of first ceramic green sheets 38, respectively. 2 and the ceramic green sheet 39 are prepared. The first internal electrode 36 on the first ceramic green sheet 38 forms a recess 40 at a position offset to the left of the front edge of FIG. 7, while the second internal electrode 36 on the second ceramic green sheet 39 is formed. The internal electrode 37 has a recess 41 formed at a position offset to the right of the front edge of FIG.

The first and second ceramic green sheets 38 and 39 are alternately stacked and pressed as shown in FIG.
A rectangular parallelepiped structure having an appearance similar to that of the rectangular parallelepiped structure 23 shown in FIG. Also in this case, the ceramic green sheets 38 and 39 shown in the figure when cut later.
Prepare mother ceramic green sheets that will be, stack these mother ceramic green sheets, press, and then cut to obtain individual rectangular parallelepiped structures,
Such a step may be adopted.

Next, the rectangular parallelepiped structure is fired,
Then, the edges are polished to give a roundness, and as shown in FIG. 6, notches 42 and 43 are respectively formed on a part of the surface 33, thereby forming the component main body 32. In FIG. 7, the positions where the notches 42 and 43 are formed are shown by a chain line. As can be seen from FIG. 7, the component body 32 obtained as described above.
In, the first internal electrode 36 is exposed on the wall surface defining the notch 42, but the second internal electrode 37 is formed in the recess 4
Not exposed due to the presence of 1. On the other hand, the second internal electrode 37 is exposed on the wall surface defining the notch 43, but the first internal electrode 36 is not exposed due to the presence of the recess 40. In addition, none of the internal electrodes is exposed on the outer surface of the component body 32 other than the wall surfaces that define the notches 42 and 43, respectively. Therefore, as in the case of the above-described embodiment, the internal electrode 36 is formed in a region other than the cutout 42 or 43.
Or by seeing if 37 is exposed,
The displacement of the internal electrodes 36 or 37 can be easily detected.

External electrodes 34 and 35 are formed in the regions defined by the notches 42 and 43 of the component body 32, respectively. Thereby, the chip-shaped electronic component 31 shown in FIG. 5 is obtained. The external electrode 34 has a notch 4
2 is electrically connected to the inner electrode 36 on the wall surface defining 2 and the outer electrode 35 is electrically connected to the inner electrode 37 on the wall surface defining the notch 43.

Regarding the formation of the cutouts 42 and 43 and the formation of the external electrodes 34 and 35, the cutouts 24 and 25 and the external electrode 13 in the above-described embodiment are described.
As in cases 14 and 14, various methods can be applied. Thus, the chip-shaped electronic component 31 shown in FIG.
According to this, since both the external electrodes 34 and 35 are formed on one surface 33 of the rectangular parallelepiped component main body 32, the external electrodes between the external electrodes are different from those formed on the opposite end faces of the component main body. The distance can be shortened. Therefore,
The stress resulting from the difference in the coefficient of thermal expansion when the chip-shaped electronic component 31 is mounted on the circuit board can be further reduced, and, for example, higher crack resistance can be exhibited in the heat shock test. Further, even in the substrate bending resistance test, the chip-shaped electronic component 31 shown in FIG. 5 can exhibit higher fracture resistance. This is because, in addition to the shorter distance between the external electrodes, the stress exerted on the external electrodes when the substrate is bent is substantially a tensile stress when the external electrodes are formed on both ends of the component body. On the other hand, in the case of the chip-shaped electronic component 31 shown in FIG. 5, the shear stress is substantially generated.

As described above, the present invention has been described in relation to the illustrated embodiment.
Various embodiments are possible. For example, as the position where the external electrode, that is, the notch is formed, if desired,
Any position on the outer surface of the component body can be chosen.
The present invention can be applied not only to the monolithic ceramic capacitor but also to other monolithic ceramic electronic components, ceramic electronic components other than the monolithic type, and electronic components other than the ceramic electronic components.

[Brief description of drawings]

FIG. 1 is a perspective view showing an appearance of a chip-shaped electronic component 11 according to a first embodiment of the present invention.

2 is a perspective view showing ceramic green sheets 19 and 20 prepared for obtaining a component body 12 of the chip-shaped electronic component 11 shown in FIG.

3 is a perspective view showing a rectangular parallelepiped structure 23 obtained by laminating the ceramic green sheets 19 and 20 shown in FIG.

4 is a cutout 24 formed in the rectangular parallelepiped structure 23 shown in FIG.
It is a perspective view which shows the component main body 12 obtained by forming and.

FIG. 5 is a perspective view showing an external appearance of a chip-shaped electronic component 31 according to a second embodiment of the present invention.

6 is a perspective view showing a component body 32 of the chip-shaped electronic component 31 shown in FIG.

7 is a perspective view showing ceramic green sheets 38 and 39 prepared to obtain the component body 32 shown in FIG.

FIG. 8 is a perspective view showing an appearance of a conventional chip-shaped electronic component 1.

[Explanation of symbols]

 11, 31 Chip-shaped electronic component 12, 32 Component body 13, 14, 34, 35 External electrode 15, 16 End face 17, 18, 36, 37 Internal electrode 24, 25, 42, 43 Notch 33 One face

Claims (3)

[Claims] 1. A chip-shaped electronic component comprising: a component body having an internal conductor formed therein; and an external electrode electrically connected to the internal conductor and formed on an outer surface of the component body. A chip-shaped electronic component, wherein a notch is provided in a part of an outer surface of the component body, and the external electrode is formed in a region defined by the notch. 2. The chip-shaped electronic component according to claim 2, wherein the component body has a rectangular parallelepiped shape, and the notch is provided on a part of one surface of the rectangular parallelepiped component body. 3. The chip-shaped electronic component according to claim 1, wherein the component body has a rectangular parallelepiped shape, and a plurality of the notches are provided on a part of one surface of the rectangular parallelepiped component body.