JPH11214235A - Laminated ceramic electronic component and their manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method by which highly reliable laminated ceramic electronic components can be manufactured efficiently without requiring any process for forming external electrodes after a laminated body is baked. SOLUTION: In a manufacturing method, a laminated body is formed by repeatedly performing a ceramic layer forming process for a ceramic layer so that no ceramic layer may be formed at prescribed positions which become the end sections of a ceramic element, an external electrode pattern forming process for external electrode patterns 13a-13d having prescribed shapes by forming conductive paste at the prescribed positions where no ceramic layer is formed, and an internal electrode pattern forming process for internal electrode patterns. Then external electrodes are formed by integrally sintering the external electrode patterns 13a-13d laminated upon another in the end sections of the laminated body by baking the laminated body.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic electronic component, and more particularly to a ceramic electronic component having a structure in which an external electrode is formed on a surface of a ceramic element in which an electrode (internal electrode) is provided. The present invention relates to a multilayer ceramic electronic component such as a multilayer inductor, a multilayer ceramic capacitor, a multilayer LC composite component, and a method of manufacturing the same.

[0002]

2. Description of the Related Art One of the typical multilayer electronic components is a multilayer inductor as shown in FIG. This multilayer inductor is formed by disposing external electrodes 53a and 53b connected to both ends 52a and 52b of the coil 52 at both ends of the ceramic element 51 in which the multilayer coil 52 is formed. I have.

[0003] The above-mentioned multilayer inductor is conventionally manufactured by, for example, a method shown in FIG.

[0004] First, a ceramic layer 61a (FIG. 7 (a)) made of a magnetic ceramic material is prepared, and a dummy electrode 63a for connection to an extraction electrode 62 and an external electrode 53a (FIG. 6) is provided on the surface thereof. Is printed (FIG. 7B).

After a ceramic layer 61b is formed on the left half of the surface by printing (FIG. 7C), a coil pattern (internal electrode pattern) 64a and a dummy electrode 63b are formed on the ceramic layers 61a and 61b. (FIG. 7
(d)).

Next, a ceramic layer 6 is provided on the right half of the surface.
1c is formed (FIG. 7E), and a coil pattern 64b and a dummy electrode 63c are formed (FIG. 7F). then,
A ceramic layer 61d is formed on the left half (FIG. 7 (g)), and a dummy electrode 63d and an extraction electrode 65 are formed (FIG. 7 (g)).
(h)), a ceramic layer 61e is formed on the entire surface (FIG. 7 (i)).

After firing the laminate thus formed, a ceramic element 51 (FIG. 6) is obtained.
Both ends 52a, 52 of the coil 52 exposed on both end surfaces thereof
By forming the external electrodes 53a and 53b so as to be connected to "b", a multilayer inductor as shown in FIG. 6 is obtained.

In the case of this conventional laminated inductor, the external electrodes 53a and 53b are connected to both ends 5 of the coil 52.
By connecting to not only 2a and 52b but also to the dummy electrodes 63 exposed at both ends of the ceramic element 51, it is configured such that a sufficient fixing force to the ceramic element 51 can be obtained.

However, according to the above-described conventional method for manufacturing a multilayer inductor, a step of forming external electrodes on a ceramic element obtained after firing is required, and further improvement in productivity is desired.

The above problems are not limited to multilayer inductors, but include various multilayer ceramics such as multilayer inductors, multilayer ceramic capacitors, and multilayer LC composite parts having external electrodes that conduct to internal electrodes. This also applies to electronic components.

The present invention solves the above-mentioned problems, and eliminates the need for a step of forming an external electrode after firing a laminate, and enables a multilayer ceramic electronic component to be efficiently manufactured. It is an object of the present invention to provide a manufacturing method of the present invention, and a multilayer ceramic electronic component manufactured by the manufacturing method, which is excellent in economic efficiency and has high reliability.

[0012]

In order to achieve the above-mentioned object, a method of manufacturing a multilayer ceramic electronic component according to the present invention (claim 1) includes a method of manufacturing a ceramic element having electrodes (internal electrodes) provided therein. A method for manufacturing a multilayer ceramic electronic component on which an external electrode that conducts with an internal electrode is formed,
(a) a ceramic layer forming step of forming a ceramic layer of a predetermined pattern so that a ceramic layer is not formed at a predetermined position serving as an end of the ceramic element where an external electrode pattern is formed; The end of the
Forming an external electrode pattern having a predetermined shape by forming a conductive paste at a predetermined position where the ceramic layer is not formed; and (c) forming an internal electrode pattern having a predetermined shape by forming the conductive paste. By performing a series of steps including an internal electrode pattern forming step at least once, a laminate having a structure in which the external electrode patterns are stacked at predetermined positions at the ends is formed, and the laminate is fired. Thereby, the stacked external electrode patterns are integrally sintered to form external electrodes at predetermined positions of the ceramic element.

A ceramic layer forming step of forming a ceramic layer so that a ceramic layer is not formed at a predetermined position where an external electrode pattern is formed; and forming a conductive paste at a predetermined position where the ceramic layer is not formed by forming a conductive paste. A series of steps including an external electrode pattern forming step of forming a pattern and an internal electrode pattern forming step of forming a conductive paste to form an internal electrode pattern is performed at least once (that is, the series of steps are required). By repeatedly forming the external electrode pattern in a predetermined position at the end of the laminate, firing the laminate and integrally sintering the laminated external electrode pattern. The external electrodes can be efficiently formed at predetermined positions of the ceramic element. Therefore, the step of forming the external electrodes after the sintering of the laminate is not required, so that the manufacturing process can be simplified and the cost can be reduced.

It is possible to arbitrarily select which of the ceramic layer forming step, the external electrode pattern forming step, and the internal electrode pattern forming step is performed first. After the formation, a ceramic layer may be formed on a portion where the external electrode pattern is not formed, or after forming a predetermined cut or a ceramic layer without a ceramic layer or a ceramic layer such as a window, the cut is formed. An external electrode pattern or an internal electrode pattern may be formed at a predetermined position such as a portion where no ceramic layer is formed or a window portion.

In the ceramic layer forming step, the ceramic layer may be formed by forming a ceramic layer having a notch for exposing an external electrode pattern at a predetermined position or a window for exposing a part of the internal electrode pattern. Can be used, and a method of printing a ceramic paste at a position where an external electrode pattern is not formed or at a position other than a window portion can be used, and the specific method is not particularly limited.

The method for forming the external electrode pattern and the internal electrode pattern is not particularly limited, and various methods can be used. Further, the external electrode pattern and the internal electrode pattern can be formed simultaneously, or can be formed sequentially.

According to a second aspect of the present invention, in the method of manufacturing a multilayer ceramic electronic component, a conductive paste having a higher adhesive strength to a ceramic element than the conductive paste for forming the internal electrodes is used as the conductive paste for forming the external electrodes. It is characterized by:

By using a conductive paste having a higher adhesion to the ceramic element than the conductive paste for forming the internal electrodes as the conductive paste for forming the external electrodes, a laminated ceramic electronic component having high connection reliability after mounting is obtained. It becomes possible to make the present invention effective.

According to a third aspect of the present invention, in the method of manufacturing a multilayer ceramic electronic component, after firing the laminate, external electrodes are formed so as to extend from both end surfaces of the ceramic element to both upper and lower surfaces. The pattern shape of the ceramic layer and the external electrode pattern is adjusted.

By adjusting the pattern shapes of the ceramic layer and the external electrode pattern so that the external electrodes extend to the upper and lower surfaces of the ceramic element, the mounting work can be facilitated and the connection reliability can be improved. become.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a multilayer ceramic electronic component, comprising: a portion of an external electrode extending to both upper and lower surfaces of a ceramic element; The pattern shape of the ceramic layer and the external electrode pattern is adjusted so that the distance is larger than the thickness of the external electrode formed at the end of the ceramic element.

By adjusting the pattern shapes of the ceramic layer and the external electrode pattern, the distance from the edge of the ceramic element to the portion of the external electrode that extends to both the upper and lower surfaces of the ceramic element can be adjusted. When the thickness is made larger than the thickness of the external electrode formed in the portion, it is possible to connect to a land or the like of the circuit board in a wide area, and it is possible to further improve the connection reliability at the time of mounting.

According to a fifth aspect of the present invention, the width of the external electrode is narrower than the width of the ceramic element, and only the external electrode is recessed from the end face of the ceramic element and from both side edges of the upper and lower surfaces. Is formed, and the pattern shapes of the ceramic layer and the external electrode pattern are adjusted so that substantially only the surface of the external electrode is exposed on the surface of the ceramic element.

The width of the external electrode is made smaller than the width of the ceramic element by adjusting the pattern shapes of the ceramic layer and the external electrode pattern. Is formed, and when substantially only the surface of the external electrode is exposed to the surface of the ceramic element, the external electrode is securely held by the ceramic element, and the reliability is improved. It becomes possible. Moreover, since the external electrodes can be prevented from protruding from the ceramic element, the dimensional accuracy of the ceramic electronic component is improved. When the external electrodes are only formed on the surface of the ceramic element, the external electrodes are easily peeled off, and there is a surface lacking reliability.

A multilayer ceramic electronic component according to the present invention (claim 6) is a multilayer ceramic electronic component manufactured by the method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 5. At least, an external electrode made of a laminated and integrated conductor is formed at an end of the ceramic element.

The multilayer ceramic electronic component to which the manufacturing method of the present invention is applied is manufactured without the need for a step of forming an external electrode after firing the laminate, so that it is excellent in economical efficiency and reliable. It is very useful practically because of its high property.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described, and features thereof will be described in more detail.
In the following embodiments of the present invention, a laminated inductor in which a coil is provided in a magnetic ceramic and a method of manufacturing the same will be described as an example. FIG. 1 is a perspective view showing a multilayer inductor according to an embodiment of the present invention, and FIG. 2 is a sectional view thereof.

The laminated inductor according to this embodiment is shown in FIG.
As shown in FIG. 2, external electrodes 3 a and 3 b connected to both ends 2 a and 2 b of the coil 2 are provided at both ends of the ceramic element 1 in which a laminated coil (internal electrode) 2 is formed.
Are formed. The external electrodes 3 a and 3 b are formed so as to extend to both upper and lower surfaces of the ceramic element 1.

The distance T1 (FIG. 2) from the end of the ceramic element 1 to the tip of the part of the external electrodes 3a, 3b extending to both the upper and lower surfaces of the ceramic element 1 is equal to the end of the ceramic element 1. External electrodes 3a, 3b formed in portions
Is configured to be larger than the thickness T2 (FIG. 2). The external electrodes 3a and 3b have a width W1 (FIG. 1).
Is formed only up to a position which is smaller than the width W2 (FIG. 1) of the ceramic element 1 and is set back from both ends of the end face and upper and lower surfaces of the ceramic element 1, and substantially comprises the external electrodes 3a and 3a.
It is configured such that only the surface of 3b is exposed on the surface of the ceramic element 1.

In the laminated inductor of this embodiment, a magnetic ceramic is used as the ceramic constituting the ceramic element 1. However, the ceramic constituting the ceramic element 1 is not limited to a magnetic ceramic, and various materials such as a glass ceramic can be used.

In the laminated inductor of this embodiment, the coil (internal electrode) 2 and the external electrode 3
Ag, Cu, or the like is used as a material constituting a and 3b. However, not only Ag and Cu, but also various other electrode materials can be used.

Further, in this embodiment, in consideration of the fixing force of the external electrodes 3a and 3b to the ceramic element 1, the conductive paste for the external electrode is different from the conductive paste for forming the coil (internal electrode). Is used. Specifically, Ag or Cu containing glass frit or the like is used as a conductive paste for forming an external electrode, and as a conductive paste for forming a coil (internal electrode),
Ag or Cu was used.

Next, a method of manufacturing the above-mentioned laminated inductor will be described. First, as shown in FIG. 3A, a ceramic layer 12a in which a notch 11a having a shape corresponding to the external electrode pattern is formed at a predetermined position serving as an end of the ceramic element 1 (FIG. 1). . The ceramic layer may be a green sheet or a ceramic paste formed by printing. The same applies to the ceramic layer hereinafter. The depth D1 of the notch 11a is substantially the same as the distance T1 of the external electrodes 3a and 3b (FIGS. 1 and 2) to the upper and lower surfaces.

Then, as shown in FIG. 3B, the notch 11a is filled with a conductive paste for forming an external electrode pattern to form an external electrode pattern 13a. Next, a ceramic layer 12b in which a notch 11b smaller in size than the notch 11a of the ceramic layer 12a is formed (FIG. 3C). The depth D2 of the notch 11b is substantially the same as the thickness T2 of the external electrodes 3a and 3b (FIGS. 1 and 2).

Then, as shown in FIG.
1b is filled with a conductive paste to form an external electrode pattern 13b.
After forming the internal electrode pattern 14a for coil formation by printing, as shown in FIG. 3E, the notch 11 having the same size as the notch 11b is formed so as to cover the left half.
The ceramic layer 12c on which c is formed is formed.

Next, as shown in FIG.
c to form an external electrode pattern 13c by filling a conductive paste, and a conductive paste for an internal electrode to form an internal electrode pattern 14b. Then, as shown in FIG. A ceramic layer 12d having a notch 11d of the same size as the notch 11b is formed. Next, as shown in FIG. 3H, the notch 11d is filled with a conductive paste to form the external electrode pattern 13c and the internal electrode pattern 14c.

Then, as shown in FIG. 3 (i), the dimensions are larger than the notches 11b, 11c, 11d at the predetermined positions which are the ends of the ceramic element 1 (FIG. 1), and are the same as those of the notch 11a. After forming the ceramic layer 12e in which the notch 11f having the dimensions is formed, as shown in FIG. 3J, the notch 11f is filled with a conductive paste to form an external electrode pattern 13d.

FIG. 4 schematically shows a cross-sectional structure of the laminate thus formed. As shown in FIG. 4, in the laminate 1a, the external electrode patterns 13a, 13a
b, 13c, 13d have a structure in which they are stacked at predetermined positions on the ends and integrated.

Then, the laminate 1a is fired, and the ceramic layers 12a to 12e and the external electrode pattern 13 are baked.
By sintering a, 13b, 13c, and 13d integrally, a laminated inductor as shown in FIGS. 1 and 2 is obtained.

In this embodiment, as described above, a ceramic layer forming step, an external electrode pattern forming step of forming an external electrode pattern of a predetermined shape, and an internal electrode pattern forming step of forming an internal electrode pattern are required. An external electrode is formed by forming a laminate in which the external electrode pattern is stacked at a predetermined position on the end, firing the laminate, and integrally sintering the external electrode pattern. Therefore, the step of forming the external electrodes after sintering the laminate can be omitted. Note that, in the present invention, it does not prevent formation of a plating film on the external electrode formed by sintering.

In the above-described embodiment, the case where the shape of the notches 11a to 11f of the ceramic layer is rectangular has been described. For example, as shown in FIG.
May be formed in a zigzag shape to improve the fixing force of the external electrode to the ceramic element.

In the above embodiment, the multilayer inductor is described as an example. However, the present invention is not limited to the multilayer inductor, but may be a multilayer ceramic having an external electrode formed on the surface of a ceramic element and conducting with an internal electrode. It can be applied to various multilayer ceramic electronic components such as capacitors and multilayer LC composite components.

The invention of the present application has, in still other respects,
The present invention is not limited to the above embodiment, but relates to the type of ceramic constituting the ceramic element, the specific pattern of the internal electrodes constituting the coil, the number of turns of the coil, the specific pattern of the external electrode, and the like. Within the range, various applications and modifications can be made.

[0044]

As described above, the method for manufacturing a multilayer ceramic electronic component according to the present invention comprises the steps of forming a ceramic layer, forming a conductive paste at a predetermined position where a ceramic layer is not formed, and forming an external electrode pattern having a predetermined shape. The external electrode pattern forming step and the internal electrode pattern forming step are repeatedly performed to form a laminate in which the external electrode patterns are stacked at the ends, and the laminated body is fired to form the stacked external electrodes. Since the external electrode is formed by sintering the electrode pattern integrally,
The step of forming an external electrode after sintering the laminate is not required, so that the manufacturing process can be simplified and the cost can be reduced.

Further, as in the method for manufacturing a multilayer ceramic electronic component according to the second aspect, as the conductive paste for forming the external electrodes, a conductive paste having a higher adhesive force to the ceramic element than the conductive paste for forming the internal electrodes is used. In this case, it is possible to obtain a multilayer ceramic electronic component having high connection reliability after mounting, and the present invention can be made effective.

Further, as in the method for manufacturing a multilayer ceramic electronic component according to the third aspect, the pattern shapes of the ceramic layer and the external electrode pattern are adjusted so that the external electrodes extend to the upper and lower surfaces of the ceramic element. In this case, the mounting operation can be facilitated, and the connection reliability can be improved.

Further, by adjusting the pattern shapes of the ceramic layer and the external electrode pattern as in the method of manufacturing a multilayer ceramic electronic component of claim 4,
The part of the ceramic element that wrapped around the upper and lower sides
If the distance from the end of the ceramic element is made larger than the thickness of the external electrode formed at the end of the ceramic element, it is possible to connect to the land of the circuit board in a large area, Can be further improved in connection reliability.

Further, the width of the external electrode is made smaller than the width of the ceramic element by adjusting the pattern shapes of the ceramic layer and the external electrode pattern. When the external electrode is formed only to the position retreated from the end surface of the element and both side ends of the upper and lower surfaces, and substantially only the surface of the external electrode is exposed to the surface of the ceramic element, the external electrode Is reliably held by the ceramic element, so that not only the reliability can be improved, but also the dimensional accuracy of the electronic component can be improved.

Further, since the multilayer ceramic electronic component to which the manufacturing method of the present invention is applied does not require a step of forming an external electrode after firing the laminate, it is economical, and Because of its high reliability, it is extremely useful in practice.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a multilayer inductor (multilayer ceramic electronic component) according to an embodiment of the present invention.

FIG. 2 is a sectional view of a multilayer inductor according to one embodiment of the present invention.

FIG. 3 is a diagram illustrating a method of manufacturing a multilayer inductor according to an embodiment of the present invention.

FIG. 4 is a diagram schematically showing a cross-sectional structure of a laminate formed by the method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention.

FIG. 5 is a view showing a shape of a notch in a ceramic layer used in the multilayer inductor according to one embodiment of the present invention.

FIG. 6 is a perspective view showing a conventional multilayer ceramic electronic component (multilayer inductor).

FIG. 7 is a view illustrating a method for manufacturing a conventional multilayer ceramic electronic component (multilayer inductor).

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Ceramic element 1a Laminated body 2 Coil (internal electrode) 2a, 2b Both ends of coil 3a, 3b External electrode 11a, 11b, 11c, 11d, 11e, 11f
Notches 12a, 12b, 12c, 12d, 12e Ceramic layers 13a, 13b, 13c, 13d External electrode patterns 14a, 14b, 14c Internal electrode patterns D1, D2 Notch depth T1 On both upper and lower sides of ceramic element of external electrode Distance of wraparound part T2 Thickness of external electrode W1 Width of external electrode W2 Width of ceramic element

Claims (6)

[Claims] 1. A method for manufacturing a multilayer ceramic electronic component comprising a ceramic element having an electrode (internal electrode) provided therein and an external electrode electrically connected to the internal electrode formed on a surface of the ceramic element. A ceramic layer forming step of forming a ceramic layer having a predetermined pattern so that the ceramic layer is not formed at a predetermined position which is an end of the ceramic element where the pattern is formed; and (b) forming an end of the ceramic element. Forming an external electrode pattern of a predetermined shape by forming a conductive paste at a predetermined position where a ceramic layer is not formed; and (c) forming an internal electrode pattern of a predetermined shape by forming a conductive paste. By performing a series of steps including an internal electrode pattern forming step at least once, a structure in which the external electrode patterns are stacked at predetermined positions at the ends is obtained. Forming a laminated body, and firing the laminated body to integrally sinter the stacked external electrode patterns to form external electrodes at predetermined positions of the ceramic element. The method of manufacturing the part. 2. The multilayer ceramic electronic device according to claim 1, wherein the conductive paste for forming the external electrodes is a conductive paste having a higher adhesion to a ceramic element than the conductive paste for forming the internal electrodes. The method of manufacturing the part. 3. The pattern shape of the ceramic layer and the external electrode pattern is adjusted so that after firing the laminate, external electrodes extending from both end surfaces of the ceramic element to both upper and lower surfaces are formed. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein: 4. The external electrode formed at the end of the ceramic element has a distance from the end of the ceramic element to the tip of the part of the external electrode that extends to both the upper and lower surfaces of the ceramic element. So that it is larger than the thickness of the electrode
The method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 3, wherein a pattern shape of the ceramic layer and the external electrode pattern is adjusted. 5. The width of the external electrode is smaller than the width of the ceramic element, and the external electrode is formed only up to a position retracted from both ends of the end face and upper and lower surfaces of the ceramic element, and
The pattern shape of the ceramic layer and the external electrode pattern is adjusted so that substantially only the surface of the external electrode is exposed to the surface of the ceramic element, according to any one of claims 1 to 4, A method for manufacturing the multilayer ceramic electronic component according to the above. 6. A multilayer ceramic electronic component manufactured by the method for manufacturing a multilayer ceramic electronic component according to any one of claims 1 to 5, wherein the multilayer ceramic electronic component is laminated and integrated at least at an end of the ceramic element. A multilayer ceramic electronic component comprising an external electrode formed of a conductor.