JPH0917635A - Multilayer type electronic component and its manufacture - Google Patents

Abstract

PURPOSE: To obtain a small-sized multilayer type electronic component wherein unacceptable form and lamination deviation are scarcely generated, the number of processes is little, and the term necessary for production is short. CONSTITUTION: Trenches for inner electrodes and holes for through holes are formed in insulating sheets 121 -12n , by using a means like laser working. Conductive paste is spread and buried in the trenches for inner electrodes and the holes for through holes by a printing means. The conductive paste buried in the trenches for inner electrodes is turned into inner electrodes 131 -13n . The conductive paste buried in the holes for through holes is turned into through holes 201 , 202 , 203 .... The insulating sheets 121 -12n in which the inner electrodes 131 -13n and the through holes 201 , 202 ... are formed are laminated and baked to be unified in a body.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component, for example, a laminated electronic component such as a laminated inductor and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional laminated type electronic component will be explained, taking an inductor as an example. As shown in FIG. 5, an insulating sheet 51 having internal electrodes 52 to 56 on its surface is stacked to form a laminated body. The internal electrodes 52 to 5 through the through holes 57a to 57d provided in the insulating sheet 51.
The coil was formed by electrically connecting 6 in series.

Alternatively, as shown in FIG. 6, after forming the internal electrode 71 on the surface of the insulating film 61 (see FIG. 6A), the tip portion 71a of the internal electrode 71 is exposed. The insulating film 62 is formed on the left half of the insulating film 61.
Are formed (see FIG. 6B). Next, after the internal electrode 72 is formed on the right half of the insulating film 61 (see FIG. 6C), the tip 72a of the internal electrode 72 is exposed to insulate the approximately right half of the insulating film 61. The film 63 is formed (see FIG. 6D). Further, the internal electrodes 73 are formed on the surfaces of the insulating films 62 and 63 (see FIG. 6E). As described above, the coil is formed by alternately forming the insulating film and the internal electrode.

[0004]

In the former of those described in the prior art, in order to secure the Q characteristic, when it is desired to increase the cross-sectional area of the internal electrodes 52 to 56 to reduce the resistance, the internal electrode 52 is reduced. Since increasing the width of ~ 56 increases the product size, the internal electrodes 52 to 56 are usually made thicker to increase the cross-sectional area. However, when the internal electrodes become thicker than the thickness of the insulating sheet 51, the thickness of the laminated body in the portion where the internal electrodes 52 to 56 are provided and the internal electrodes 52 to 56 are not provided. The thickness of the laminated body of the portion is greatly different. As a result, the product shape becomes a drum shape and cannot be mounted on the printed circuit board, and the stacking of the insulating sheets 51 is likely to occur, making it difficult to narrow the inductance value of the coil. Had the problem.

In the latter case, although the thickness of the internal electrodes 71 to 73 is increased to secure the Q characteristic, the product shape does not become a drum shape, but the insulating films 61 to 63 and the internal electrodes 71 to 71. Since 73 is alternately laminated on the right or left half of the inductor, the number of steps is large, and the period required for production is long. Furthermore, the insulating films 61 to 63 and the internal electrode 71
Nos. 73 to 73 are formed by printing, but there is a problem that it is difficult to thin the internal electrodes 71 to 73 due to the accuracy limitation of thick film printing, and it is not possible to cope with the reduction in product size.

Therefore, an object of the present invention is to provide a small-sized laminated electronic component which is less likely to cause shape defects and stacking misalignment, and has a small number of steps and a short production period, and a manufacturing method thereof.

[0007]

In order to achieve the above object, a laminated electronic component according to the present invention is provided with an internal electrode groove filled with a conductive material and a bottom surface of the internal electrode groove. And a plurality of insulating sheets having through-holes filled with a conductive material are stacked, and the conductive materials filled in the internal electrode grooves are filled with each other in the through-hole holes. It is characterized in that it is electrically connected through a material.

In the method of manufacturing a laminated electronic component according to the present invention, (a) a step of providing a groove for an internal electrode on the insulating sheet and a hole for a through hole on the bottom surface of the groove for an internal electrode, (B) filling the groove for internal electrode and the hole for through hole with a conductive material, and (c) stacking a plurality of the insulating sheets, and filling the conductive material in the groove for internal electrode with each other. And a step of electrically connecting via a conductive material filled in the through hole.

[0009]

The conductive material filled in the groove for the internal electrode provided on the insulating sheet is used as the internal electrode, and the conductive material filled in the hole for the through hole provided in the bottom surface of the groove for the internal electrode is used as the through hole. . Since these internal electrodes and through holes are provided in the insulating sheet, the surface of the insulating sheet is flat. Therefore, the insulating sheets can be stacked with a uniform thickness even if the number of laminated sheets is large.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a laminated electronic component and a manufacturing method thereof according to the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1 (a), an insulating sheet 2 lined with a resin film 1 such as polyethylene terephthalate.
Prepare As a material for the insulating sheet 2, for example, a ceramic such as ferrite, a dielectric, or an insulator is used. The thickness T1 of the insulating sheet 2 is set to a dimension including a thickness T2 of an internal electrode described later and a thickness T3 necessary for insulation between adjacent internal electrodes.

Next, as shown in FIG. 1B, the insulating sheet 2 is subjected to laser processing to form the internal electrode grooves 3 having a predetermined shape. The depth of the internal electrode groove 3 is equal to the desired thickness T2 of the internal electrode. Furthermore, FIG. 1 (c)
As shown in, a through hole 4 is formed at a predetermined position of the internal electrode groove 3 by laser processing. The through hole 4 is also formed in the resin film 1. By doing so, when the conductive paste is filled in the internal electrode grooves 3 and the through hole holes 4 in a later step, no air pool is generated in the internal electrode grooves 3 and the through hole holes 4, and The electrode paste 3 and the through-hole 4 are reliably filled with the conductive paste.

Next, after covering the upper surface of the insulating sheet 2 with a print pattern mask, as shown in FIG. 1 (d), Ag,
A conductive paste 5 of Pd, Ag-Pd, Cu or the like is applied to the internal electrode groove 3 and the through hole hole 4 by a printing method, filled and dried. In this way, the conductive paste 5 filled in the internal electrode groove 3 becomes an internal electrode, and the conductive paste 5 filled in the through hole hole 4 becomes a through hole. The distance from the bottom surface of the internal electrode groove 3 to the lower surface of the insulating sheet 2 corresponds to the thickness T3 required for insulation between adjacent internal electrodes.

Thereafter, as shown in FIG. 1 (e), the resin film 1 is peeled off. The obtained insulating sheet 2 contains internal electrodes and through holes, and its surface is flat. FIG.
Is a laminate in which a plurality of insulating sheets thus obtained are laminated to form a coil. Each insulating sheet 12 ₁ , 1
2 ₂ , 12 ₃ , ... 12 _n are internal electrodes 13 ₁ , 1 respectively
3 ₂ , 13 ₃ , ... 13 _n and through holes 20 ₁ , 20 ₂ ,
20 ₃ , ... Are built in. One end 13a of the internal electrode 13 ₁ is exposed on the left end surface of the insulating sheet 12 ₁ , and one end 13b of the internal electrode 13 _n is exposed on the right end surface of the insulating sheet 12 _n . Then, the insulating sheet 12 ₁ to
When 12 _n are stacked, the internal electrodes 13 _{1 to} 13 _n are electrically connected in series via the through holes 20 ₁ , 20 ₂ , ... Forming a coil.

Next, as shown in FIG. 3, the insulating protective sheets 2 are placed above and below the stacked insulating sheets 12 _{1 to} 12 _n.
2 are provided. And the laminated insulating sheet 12
_{After 1 to} 12 _n and the insulating protective sheet 22 are integrally fired, external electrodes 25 and 26 are formed on both left and right ends by means such as sputtering, vapor deposition, or printing. External electrode 25 is electrically connected to the end portion 13a of the internal electrode 13 _1, the external electrode 26 is electrically connected to an end 13b of the inner electrode 13 _n.

The laminated inductor 11 thus obtained
Since the surfaces of the insulating sheets 12 _{1 to} 12 _n are flat, even if the number of laminated insulating sheets 12 _{1 to} 12 _n increases or the thickness of the internal electrodes 13 _{1 to} 13 _n increases. Can be stacked to a uniform thickness. As a result,
The outer shape of the product does not have a drum shape unlike the conventional multilayer inductor, and mounting defects on the printed circuit board can be reduced. Further, it is possible to suppress the stacking deviation of the insulating sheets 12 _{1 to} 12 _n , and it is possible to narrow the inductance value of the coil. Furthermore, the internal electrodes 13 _{1 to} 13 _n and the through holes 2
If 0 ₁ , 20 ₂ ... Are formed in the insulating sheets 12 _{1 to} 12 _n in the same step, the number of steps is reduced and the period required for production can be shortened.

The laminated electronic component and the method for manufacturing the same according to the present invention are not limited to the above-mentioned embodiment, but can be variously modified within the scope of the gist thereof. As means for forming the internal electrode grooves and the through hole holes in the insulating sheet, sandblasting, dicing or the like may be adopted in addition to laser processing. Alternatively, a resist film is formed on a predetermined portion of the surface of the insulating sheet by a photolithography method, and then the portion of the insulating sheet exposed from the resist film is melted with a solvent to form grooves for internal electrodes and holes for through holes. Good.

Further, as shown in FIG. 4, the resin film 1
Laser processing may be performed from the side to form the internal electrode groove 3 and the through hole hole 4. By doing so, when the conductive paste is applied to the internal electrode grooves 3 and the through-hole holes 4 by the printing method, a printing pattern mask is not required, so that the manufacturing cost can be further reduced. Furthermore, the multilayer electronic component may be a capacitor, a resistor, or the like other than the inductor.

[0018]

As is apparent from the above description, according to the present invention, since the internal electrodes and the through holes are built in the insulating sheet, the surface of the insulating sheet becomes flat. Therefore, the insulating sheets can be stacked to have a uniform thickness even if the number of laminated sheets increases or the thickness of the internal electrodes increases, and the product has a drum-shaped outer shape like a conventional laminated electronic component. Therefore, mounting defects on the printed circuit board can be reduced. Further, it is possible to suppress the stacking deviation of the insulating sheets, and it is possible to narrow the deviation of the inductance value of the coil.

If the internal electrodes and the through holes are formed in the insulating sheet in the same step, the number of steps is reduced,
The time required for production can be shortened, and the laminated electronic component can be manufactured at low cost. Furthermore, since the internal electrodes are formed in the insulating sheet, the thickness of the internal electrodes can be easily increased. In particular, in the case of a laminated inductor, a small one having excellent Q characteristics can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining one embodiment of a method for manufacturing a multilayer electronic component according to the present invention.

FIG. 2 is an exploded perspective view showing an embodiment of a laminated electronic component according to the present invention.

FIG. 3 is a sectional view of the multilayer electronic component shown in FIG.

FIG. 4 is a sectional view showing another embodiment.

FIG. 5 is an exploded perspective view showing a conventional laminated electronic component.

FIG. 6 is a perspective view showing a procedure for manufacturing another conventional laminated electronic component.

[Explanation of symbols]

2 ... insulating sheet 3 ... internal electrode groove 4 ... through hole hole 5 ... conductive paste 11 ... laminated inductor 12 ₁ to 12 _n ... insulating sheet 13 ₁ to 13 _n ... internal electrode 20 ₁ to 20 ₃ ... Through hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shingo Okuyama 2-10-10 Tenjin, Tenjin, Nagaokakyo, Kyoto Murata Manufacturing Co., Ltd.

Claims (2)

[Claims] 1. A plurality of insulating sheets having internal electrode grooves filled with a conductive material and through-holes provided in the bottom surface of the internal electrode grooves and filled with a conductive material. A laminated electronic component, wherein the conductive materials filled in the grooves for internal electrodes are electrically connected to each other through the conductive material filled in the holes for through holes. 2. A step of providing a groove for an internal electrode in an insulating sheet and providing a hole for a through hole in a bottom surface of the groove for an internal electrode, and filling the groove for the internal electrode and the hole for the through hole with a conductive material. And a step of stacking a plurality of the insulating sheets, electrically connecting the conductive materials filled in the internal electrode grooves with each other through the conductive material filled in the through-hole holes, A method of manufacturing a multilayer electronic component, comprising: