CN110324991A - A kind of preparation method of composite circuit board - Google Patents
A kind of preparation method of composite circuit board Download PDFInfo
- Publication number
- CN110324991A CN110324991A CN201910617582.0A CN201910617582A CN110324991A CN 110324991 A CN110324991 A CN 110324991A CN 201910617582 A CN201910617582 A CN 201910617582A CN 110324991 A CN110324991 A CN 110324991A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- preparation
- conductive ink
- composite circuit
- insulating sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to wiring board technology fields, more particularly to a kind of preparation method of composite circuit board, comprising the following steps: (1) place mat insulating sheet material；(2) utilize laser on insulating sheet material according to circuit cutting, punching；(3) electrically conductive ink is squeezed out along respective path using extrusion device；(4) curing conductive ink；(5) 1-4 step is repeated, until completing all layers of production；(6) above-mentioned all plates are bonded as by circuit board by pressure sintering, not only simplify manufacture craft, save Production Time, when also improve the storeroom of composite multi-layer material, the bonding strength of interlayer.
Description
Technical field
The present invention relates to wiring board technology fields, more particularly to a kind of preparation method of composite circuit board.
Background technique
The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and English name is (Printed Circuit Board)
PCB, (Flexible Printed Circuit board) (FPC wiring board is also known as flexible circuitry board flexible circuit to FPC wiring board
Plate is that have height reliability, excellent pliable printed circuit using polyimides or polyester film as one kind made of substrate
Plate.Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good.) and Rigid Flex (reechas, Soft and
Hard combination plate)-FPC and PCB birth and development, expedited the emergence of this new product of Rigid Flex.Therefore,
Rigid Flex is exactly that flexible circuit board and rigid wiring board are combined by related process requirement one by processes such as pressings
It rises, the wiring board with FPC characteristic and PCB characteristic of formation；3D printing is usually that digital technology file printing machine is used to come in fact
Existing.Often be used for modeling in fields such as mold manufacture, industrial designs, after be gradually available for the direct manufactures of some products,
Have using components made of the printing of this technology.The technology is in jewelry, footwear, industrial design, building, engineering and construction
(AEC), automobile, aerospace, dentistry and medical industries, education, GIS-Geographic Information System, civil engineering, gun and other necks
It is all applied in domain.
But existing composite circuit board, in the process of production, not only complex method replicates, and preparation process is cumbersome, together
When can also there is a problem of that the storeroom of composite multi-layer material, the bonding strength of interlayer are weaker.
Summary of the invention
A kind of preparation side of composite circuit board is provided it is an object of the invention to avoid shortcoming in the prior art
Method, the method for the composite manufacturing circuit board, not only simplifies manufacture craft, saves Production Time, when also improve it is compound more
The bonding strength of the storeroom of layer material, interlayer.
The purpose of the present invention is achieved through the following technical solutions:
A kind of preparation method of composite circuit board, comprising the following steps:
(1) place mat insulating sheet material；
(2) utilize laser on insulating sheet material according to circuit cutting, punching；
(3) electrically conductive ink is squeezed out along respective path using extrusion device；
(4) curing conductive ink；
(5) 1-4 step is repeated, until completing all layers of production；
(6) above-mentioned all plates are bonded as by circuit board by pressure sintering.
Further, in step (1), the insulating sheet material is PP, PPO, PTFE, any one plate in POM plate.
Further, in step (2), the laser is the picosecond laser of ultrashort pulse.
Further, in step (2), the laser grooving path is consistent with this layer of circuit configuration.
Further, in step (3), the electrically conductive ink is liquid nanometer ag material, copper wire material, spun gold material, filamentary silver material
In any one.
Further, in step (3), the movement routine of the extrusion device is consistent with this layer of circuit configuration.
Further, in step (4), the curing mode is cooling.
The utility model has the advantages that in due to the preparation process of the composite circuit board, by using laser or machine on insulating sheet material
Circuit is portrayed in tool processing, is then successively coated electrically conductive ink using extrusion device, is finally hot pressed into circuit board, therefore this compound
The method for manufacturing circuit board, not only simplifies manufacture craft, while also improving the company of the storeroom of composite multi-layer material, interlayer
Connect intensity.
Detailed description of the invention
Invention is described further using attached drawing, but the embodiments in the accompanying drawings do not constitute any limitation to the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to the following drawings
Its attached drawing.
Fig. 1 is a kind of process flow chart of the preparation method of composite circuit board of the invention.
Specific embodiment
The invention will be further described with the following Examples.
As shown in Figure 1, the present embodiment provides a kind of preparation methods of composite circuit board, comprising the following steps:
(1) place mat insulating sheet material；
(2) utilize laser on insulating sheet material according to circuit cutting, punching；
(3) electrically conductive ink is squeezed out along respective path using extrusion device；
(4) curing conductive ink；
(5) 1-4 step is repeated, until completing all layers of production；
(6) above-mentioned all plates are bonded as by circuit board by pressure sintering.
In a preferred embodiment, in step (1), the insulating sheet material is PP, PPO, PTFE, any one in POM plate
Plate, the insulation board of the material, insulation effect are best.
In a preferred embodiment, in step (2), the laser is the picosecond laser of ultrashort pulse, passes through ultrashort pulse
The engraving slot effect that picosecond laser carves out is best.
In a preferred embodiment, in step (2), the laser grooving path is consistent with this layer of circuit configuration, guarantees engraving
Slot is consistent with the arragement direction of circuit.
In a preferred embodiment, in step (3), the electrically conductive ink is liquid nanometer ag material, copper, appointing in gold, silver
It anticipates a kind of metal wire material, the electrically conductive ink of the material, conductive effect is optimal.
In a preferred embodiment, in step (3), the movement routine of the extrusion device is consistent with this layer of circuit configuration, protects
It is consistent with electric wire arragement direction to demonstrate,prove the electrically conductive ink squeezed out.
In a preferred embodiment, in step (4), the curing mode is cooling, and the curing mode is not only simple, convenient,
It does not need to provide external substance, energy conservation and environmental protection simultaneously.
Embodiment 1
The present embodiment provides a kind of preparation methods of composite circuit board, comprising the following steps:
(1) place mat insulating sheet material, insulating sheet material are PP plate；
(2) using laser on insulating sheet material according to circuit cutting, punching, concrete technology is: using ultrashort pulse picosecond swash
Light cutting, punching on insulating sheet material, laser cutting path is consistent with this layer of circuit configuration, and gained groove or hole location are conduction
The blank of route；
(3) electrically conductive ink is squeezed out along respective path using extrusion device, concrete technology is: electrically conductive ink is squeezed out by extrusion device
Molding, electrically conductive ink are liquid nanometer ag material, and extruder head is by heating or ultrasonic vibration allows material molten, to be extruded into
Type, extrusion device movement routine is consistent with this layer of circuit configuration, also consistent with groove and hole location；
(4) curing conductive ink, concrete technology are: electrically conductive ink fills and leads up groove and hole after squeezing out, and makes electrically conductive ink by cooling
Solidification；
(5) 1-4 step is repeated, until completing all layers of production；
(6) above-mentioned all plates are bonded as by circuit board by pressure sintering.
Embodiment 2
The present embodiment provides a kind of preparation methods of composite circuit board, comprising the following steps:
(1) place mat insulating sheet material, insulating sheet material are PPO plate；
(2) using laser on insulating sheet material according to circuit cutting, punching, concrete technology is: using ultrashort pulse picosecond swash
Light cutting, punching on insulating sheet material, laser cutting path is consistent with this layer of circuit configuration, and gained groove or hole location are conduction
The blank of route；
(3) electrically conductive ink is squeezed out along respective path using extrusion device, concrete technology is: electrically conductive ink is squeezed out by extrusion device
Molding, electrically conductive ink are copper metal silk material, and extruder head allows material molten to squeeze so as to extrusion molding by heating or ultrasonic vibration
Device movement routine is consistent with this layer of circuit configuration out, also consistent with groove and hole location；
(4) curing conductive ink, concrete technology are: electrically conductive ink fills and leads up groove and hole after squeezing out, and makes electrically conductive ink by cooling
Solidification；
(5) 1-4 step is repeated, until completing all layers of production；
(6) above-mentioned all plates are bonded as by circuit board by pressure sintering.
Embodiment 3
The present embodiment provides a kind of preparation methods of composite circuit board, comprising the following steps:
(1) place mat insulating sheet material, insulating sheet material are PTFE plate；
(2) using laser on insulating sheet material according to circuit cutting, punching, concrete technology is: using ultrashort pulse picosecond swash
Light cutting, punching on insulating sheet material, laser cutting path is consistent with this layer of circuit configuration, and gained groove or hole location are conduction
The blank of route；
(3) electrically conductive ink is squeezed out along respective path using extrusion device, concrete technology is: electrically conductive ink is squeezed out by extrusion device
Molding, electrically conductive ink are silver metal silk material, and extruder head allows material molten to squeeze so as to extrusion molding by heating or ultrasonic vibration
Device movement routine is consistent with this layer of circuit configuration out, also consistent with groove and hole location；
(4) curing conductive ink, concrete technology are: electrically conductive ink fills and leads up groove and hole after squeezing out, and makes electrically conductive ink by cooling
Solidification；
(5) 1-4 step is repeated, until completing all layers of production；
(6) above-mentioned all plates are bonded as by circuit board by pressure sintering.
Beneficial effects of the present invention: in the preparation process of the composite circuit board, by being used on insulating sheet material
Circuit is portrayed in laser or machining, is then successively coated electrically conductive ink using extrusion device, is finally hot pressed into circuit board, therefore
The method of this composite manufacturing circuit board, not only simplifies manufacture craft, at the same also improve composite multi-layer material storeroom,
The bonding strength of interlayer.
Finally it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than the present invention is protected
The limitation of range is protected, although explaining in detail referring to preferred embodiment to the present invention, those skilled in the art are answered
Work as understanding, it can be with modification or equivalent replacement of the technical solution of the present invention are made, without departing from the reality of technical solution of the present invention
Matter and range.
Claims (7)
1. a kind of preparation method of composite circuit board, it is characterised in that: the following steps are included:
(1) place mat insulating sheet material；
(2) utilize laser on insulating sheet material according to circuit cutting, punching；
(3) electrically conductive ink is squeezed out along respective path using extrusion device；
(4) curing conductive ink；
(5) 1-4 step is repeated, until completing all layers of production；
(6) above-mentioned all plates are bonded as by circuit board by pressure sintering.
2. a kind of preparation method of composite circuit board as described in claim 1, it is characterised in that: in step (1), the insulation
Plate is PP, PPO, PTFE, any one plate in POM plate.
3. a kind of preparation method of composite circuit board as described in claim 1, it is characterised in that: in step (2), the laser
For the picosecond laser of ultrashort pulse.
4. a kind of preparation method of composite circuit board as described in claim 1, it is characterised in that: in step (2), the laser
Groove path is consistent with this layer of circuit configuration.
5. a kind of preparation method of composite circuit board as described in claim 1, it is characterised in that: in step (3), the conduction
Ink is liquid nanometer ag material, copper wire material, spun gold material, any one in filamentary silver material.
6. a kind of preparation method of composite circuit board as described in claim 1, it is characterised in that: in step (3), the extrusion
The movement routine of device is consistent with this layer of circuit configuration.
7. a kind of preparation method of composite circuit board as described in claim 1, it is characterised in that: in step (4), the solidification
Mode is cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910617582.0A CN110324991A (en) | 2019-07-10 | 2019-07-10 | A kind of preparation method of composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910617582.0A CN110324991A (en) | 2019-07-10 | 2019-07-10 | A kind of preparation method of composite circuit board |
Publications (1)
| Publication Number | Publication Date |
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| CN110324991A true CN110324991A (en) | 2019-10-11 |
Family
ID=68123142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910617582.0A Pending CN110324991A (en) | 2019-07-10 | 2019-07-10 | A kind of preparation method of composite circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113133208A (en) * | 2021-04-13 | 2021-07-16 | 深圳市三维电路科技有限公司 | Circuit processing method based on laser etching |
| WO2022006789A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | Method for preparing composite circuit board |
| CN113932699A (en) * | 2021-09-23 | 2022-01-14 | 浦江荣达量具有限公司 | Manufacturing process of digital display caliper capacitive grating sensor |
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| US20110168439A1 (en) * | 2010-01-13 | 2011-07-14 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic circuit board and method of manufacturing the same |
| CN102811562A (en) * | 2011-05-30 | 2012-12-05 | 乾坤科技股份有限公司 | Ceramic substrate and method for manufacturing same |
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| US20140176282A1 (en) * | 2012-12-21 | 2014-06-26 | Samsung Electro-Mechanics Co., Ltd. | Electromagnetic induction module for wireless charging element and method of manufacturing the same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022006789A1 (en) * | 2020-07-08 | 2022-01-13 | 广东工业大学 | Method for preparing composite circuit board |
| CN113133208A (en) * | 2021-04-13 | 2021-07-16 | 深圳市三维电路科技有限公司 | Circuit processing method based on laser etching |
| CN113932699A (en) * | 2021-09-23 | 2022-01-14 | 浦江荣达量具有限公司 | Manufacturing process of digital display caliper capacitive grating sensor |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191011 |
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| RJ01 | Rejection of invention patent application after publication |